Accu-L(R) SMD High-Q RF Inductor 10 nH Inductor (Top View) ACCU-L(R) TECHNOLOGY The Accu-L(R) SMD Inductor is based on thin-film multilayer technology. This technology provides a level of control on the electrical and physical characteristics of the component which gives consistent characteristics within a lot and lot-to-lot. The original design provides small size, excellent highfrequency performance and rugged construction for reliable automatic assembly. The Accu-L(R) inductor is particularly suited for the telecommunications industry where there is a continuing trend towards miniaturization and increasing frequencies. The Accu-L(R) inductor meets both the performance and tolerance requirements of present cellular frequencies 450MHz and 900MHz and of future frequencies, such as 1700MHz, 1900MHz and 2400MHz. FEATURES APPLICATIONS * * * * * * * * * 26 High Q RF Power Capability High SRF Low DC Resistance Ultra-Tight Tolerance on Inductance Standard 0603 and 0805 Chip Size Low Profile Rugged Construction Taped and Reeled * * * * * * Mobile Communications Satellite TV Receivers GPS Vehicle Locations Systems Filters Matching Networks Accu-L(R) 0603 and 0805 SMD High-Q RF Inductor DIMENSIONS: millimeters (inches) 0603 B 1.60.10 (0.0630.004) 0.810.10 (0.0320.004) 0.610.10 (0.0240.004) top: 0.0 +0.3/-0.0 (0.0+0.012) bottom: 0.350.20 (0.0140.008) L W W T T B L HOW TO ORDER L 0805 Product Inductor Operating/Storage Temp. Range: -55C to +125C 0805 2.110.10 (0.0830.004) 1.50.10 (0.0590.004) 0.910.13 (0.0360.005) 0.250.15 (0.0100.006) 4R7 D E W TR Size Inductance 0603 0805 Expressed in nH (2 significant digits + number of zeros) Tolerance for L 4.7nH, L 10nH, Specification Code Termination Code Packaging Code for values <10nH, letter R denotes decimal point. Example: 22nH = 220 4.7nH = 4R7 B = 0.1nH C = 0.2nH D = 0.5nH E = Accu-L(R) 0805 technology F = Accu-L(R) 0603 technology F = 1% (0603 only) G = 2% J = 5% W = Nickel/ TR = Tape and Reel solder coated (3,000/reel) (Sn 63, Pb 37) 4.7nH<L<10nH, B = 0.1nH - (0603 only) C = 0.2nH - (0603 only) D = 0.5nH ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L(R) L0603 450 MHz Test Frequency Available 900 MHz Test Frequency Inductance L (nH) Inductance Tolerance Q Typical 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10.0 12.0 15.0 0.1, 0.2nH 0.1, 0.2nH 0.1, 0.2nH 0.1, 0.2nH 0.1, 0.2nH 0.1, 0.2, 0.5nH 0.1, 0.2, 0.5nH 0.1, 0.2, 0.5nH 0.1, 0.2, 0.5nH 0.1, 0.2, 0.5nH 0.1, 0.2, 0.5nH 1%, 2%, 5% 1%, 2%, 5% 1%, 2%, 5% 49 26 20 20 21 24 25 23 26 23 23 28 28 28 L (nH) 1900 MHz Test Frequency 2400 MHz Test Frequency Q Typical L (nH) Q Typical L (nH) Q Typical 70 39 30 30 30 35 57 32 36 33 31 39 38 38 1.2 1.52 1.73 2.24 2.75 3.39 4.06 4.92 5.94 7.3 10 11.8 14.1 25.9 134 63 50 49 48 56 60 46 54 47 35 47 30 30 1.2 1.52 1.72 2.24 2.79 3.47 4.21 5.2 6.23 8.1 12.1 14.1 17.2 49.8 170 76 59 56 54 64 69 49 60 39 31 41 20 15 1.2 1.54 1.74 2.2 2.7 3.33 3.9 4.68 5.65 6.9 8.4 10 13.2 16.2 (1) IDC measured for 15C rise at 25C ambient temperature when soldered to FR-4 board. SRF min (MHz) RDC max () 10000 10000 10000 10000 9000 8400 6500 5500 5000 4500 3800 3500 3000 2500 0.04 0.06 0.07 0.08 0.08 0.08 0.10 0.15 0.25 0.30 0.35 0.45 0.50 0.60 IDC max (mA) (1) 1000 1000 1000 1000 750 750 500 500 300 300 300 300 300 300 Inductance and Q measured on Agilent 4291B / 4287 using the 16196A test fixture. ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L(R) 0805 Inductance L (nH) 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 (1) IDC measured (2) IDC measured 450 MHz Test Frequency Available Inductance Tolerance 900 MHz 1700 MHz 2400 MHz Test Frequency Test Frequency Test Frequency Q Typical L (nH) 60 1.2 0.1nH, 0.2nH, 0.5nH 50 1.5 0.1nH, 0.2nH, 0.5nH 0.1nH, 0.2nH, 0.5nH 50 1.8 0.1nH, 0.2nH, 0.5nH 42 2.2 0.1nH, 0.2nH, 0.5nH 42 2.7 0.1nH, 0.2nH, 0.5nH 38 3.3 0.1nH, 0.2nH, 0.5nH 27 3.9 0.1nH, 0.2nH, 0.5nH 43 4.8 0.5nH 50 5.7 0.5nH 43 7.0 0.5nH 43 8.5 2%, 5% 46 10.6 2%, 5% 40 12.9 2%, 5% 36 16.7 2%, 5% 30 21.9 2%, 5% 36 27.5 for 15C rise at 25C ambient temperature for 70C rise at 25C ambient temperature Q L (nH) Typical 92 74 72 62 62 46 36 62 68 62 56 60 50 46 27 33 1.2 1.5 1.8 2.2 2.8 3.4 4.0 5.3 6.3 7.7 10.0 13.4 17.3 27 - - Q Typical 122 102 88 82 80 48 38 76 73 71 55 52 40 23 - - L (nH) Q Typical IDC max (mA) SRF min RDC max T = 15C T = 70C (MHz) () (1) (2) 1.2 92 10000 0.05 1000 2000 1.5 84 10000 0.05 1000 2000 1.9 73 10000 0.06 1000 2000 2.3 72 10000 0.07 1000 2000 2.9 70 10000 0.08 1000 2000 3.5 57 10000 0.11 750 1500 4.1 42 10000 0.20 750 1500 5.8 60 5500 0.10 750 1500 7.6 62 4600 0.10 750 1500 9.4 50 4500 0.11 750 1500 15.2 32 3500 0.12 750 1500 - - 2500 0.13 750 1500 - - 2400 0.20 750 1500 - - 2200 0.20 750 1000 - - 1700 0.35 500 1000 - - 1400 0.40 500 1000 L, Q, SRF measured on HP 4291A, Boonton 34A and Wiltron 360 Vector Analyzer, RDC measured on Keithley 580 micro-ohmmeter. 27 Accu-L(R) L0603/L0805 SMD High-Q RF Inductor L0603 Typical Q vs. Frequency L0603 100 1.2nH 15nH L (nH) 180 160 140 120 Q 100 80 60 40 20 0 Typical Inductance vs. Frequency L0603 1.5nH 5.6nH 10 8.2nH 15nH 0 1 2 3 1 Frequency (GHz) Measured on AGILENT 4291B/4287 using the 16196A test fixture 0 0.5 1 1.5 2 Frequency (GHz) 8.2nH 6.8nH 4.7nH 3.3nH 2.2nH 1.8nH 1.2nH 2.5 3 Measured on AGILENT 4291B/4287 using the 16196A test fixture L0805 Typical Inductance vs. Frequency L0805 Typical Q vs. Frequency L0805 140 100 120 1.2nH 100 Inductance (nH) 1.5nH 80 Q 1.8nH 5.6nH 60 10nH 22nH 15nH 10nH 10 5.6nH 40 15nH 20 1.8nH 22nH 1 0 0.1 0.01 0.1 Frequency (GHz) Frequency (GHz) Measured on HP4291A and Boonton 34A Coaxial Line Measured on HP4291A and Wiltron 360 Vector Analyzer Maximum Temperature Rise at 25C ambient temperature (on FR-4) L0805 200 15nH 10nH 6.8nH 4.7nH 2.7nH T (C) 100 10 1 0 0.5 1 1.5 2 Current (A) 2.5 3 Temperature rise will typically be no higher than shown by the graph 28 1 10 1 3.5 10 Accu-L(R) 0603 and 0805 SMD High-Q RF Inductor FINAL QUALITY INSPECTION Finished parts are tested for electrical parameters and visual/ mechanical characteristics. Parts are 100% tested for inductance at 450MHz. Parts are 100% tested for RDC. Each production lot is evaluated on a sample basis for: * Q at test frequency * Static Humidity Resistance: 85C, 85% RH, 160 hours * Endurance: 125C, IR, 4 hours ENVIRONMENTAL CHARACTERISTICS TEST Solderability Leach Resistance Storage Shear Rapid Change of Temperature Bend Strength CONDITIONS Components completely immersed in a solder bath at 235 5C for 2 secs. Components completely immersed in a solder bath at 260 5C for 60 secs. 12 months minimum with components stored in "as received" packaging. Components mounted to a substrate. A force of 5N applied normal to the line joining the terminations and in a line parallel to the substrate. Components mounted to a substrate. 5 cycles -55C to +125C. Tested as shown in diagram No visible damage No visible damage No visible damage 1mm deflection 45mm Temperature Coefficient of Inductance (TCL) REQUIREMENT Terminations to be well tinned. No visible damage. Dissolution of termination faces 15% of area. Dissolution of termination edges 25% of length. Good solderability Component placed in environmental chamber -55C to +125C. 45mm +0 to +125 ppm/C 6 L2-L1 TCL = * 10 (typical) L1 (T2-T1) T1 = 25C 29 Accu-L(R) 0805 Application Notes HANDLING PREHEAT & SOLDERING SMD chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment, taped and reeled product is the ideal medium for direct presentation to the placement machine. The rate of preheat in production should not exceed 4C/ second. It is recommended not to exceed 2C/ second. Temperature differential from preheat to soldering should not exceed 150C. For further specific application or process advice, please consult AVX. HAND SOLDERING & REWORK CIRCUIT BOARD TYPE All flexible types of circuit boards may be used (e.g. FR-4, G-10) and also alumina. For other circuit board materials, please consult factory. COMPONENT PAD DESIGN Component pads must be designed to achieve good joints and minimize component movement during soldering. Pad designs are given below for both wave and reflow soldering. The basis of these designs is: a. Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. b. Pad overlap about 0.3mm. c. Pad extension about 0.3mm for reflow. Pad extension about 0.8mm for wave soldering. WAVE SOLDERING DIMENSIONS: millimeters (inches) 1.30 (0.051) 3.1 (0.122) 1.2 (0.047) 0.50 (0.020) 1.4 3.8 (0.150) (0.055) 1.30 (0.051) 0.8 (0.031) 0603 Accu-L(R) 0805 Accu-L(R) 1.2 (0.047) DIMENSIONS: millimeters (inches) 0.7 (0.028) 0.50 (0.020) CLEANING RECOMMENDATIONS Care should be taken to ensure that the devices are thoroughly cleaned of flux residues, especially the space beneath the device. Such residues may otherwise become conductive and effectively offer a lossy bypass to the device. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: Cleaning liquids . . . . . . i-propanol, ethanol, acetylacetone, water, and other standard PCB cleaning liquids. Ultrasonic conditions . . power - 20w/liter max. frequency - 20kHz to 45kHz. Temperature . . . . . . . . 80C maximum (if not otherwise limited by chosen solvent system). Time . . . . . . . . . . . . . . 5 minutes max. 2.8 1.4 (0.110) (0.055) 0.90 (0.035) 0.8 (0.031) 0603 Accu-L(R) 0805 Accu-L(R) 0.7 (0.028) 1.5 (0.059) 30 After soldering, the assembly should preferably be allowed to cool naturally. In the event of assisted cooling, similar conditions to those recommended for preheating should be used. Recommended storage conditions for Accu-L(R) prior to use are as follows: Temperature . . . . . . . . 15C to 35C Humidity . . . . . . . . . . . 65% Air Pressure . . . . . . . . 860mbar to 1060mbar REFLOW SOLDERING 2.3 (0.091) COOLING STORAGE CONDITIONS 1.5 (0.059) 0.90 (0.035) Hand soldering is permissible. Preheat of the PCB to 100C is required. The most preferable technique is to use hot air soldering tools. Where a soldering iron is used, a temperature controlled model not exceeding 30 watts should be used and set to not more than 260C. Maximum allowed time at temperature is 1 minute. When hand soldering, the base side (white side) must be soldered to the board. RECOMMENDED SOLDERING PROFILE For recommended soldering profile see page 23