L0603150FFWTR - AVX Corporation

Accu-L®

SMD High-Q RF Inductor

ACCU-L®TECHNOLOGY

The Accu-L

SMD Inductor is based on thin-film multilayer

technology. This technology provides a level of control on the

electrical and physical characteristics of the component which

gives consistent characteristics within a lot and lot-to-lot.

The original design provides small size, excellent high-

frequency performance and rugged construction for reliable

automatic assembly.

FEATURES

• High Q

• RF Power Capability

• High SRF

• Low DC Resistance

• Ultra-Tight Tolerance on Inductance

• Standard 0603 and 0805 Chip Size

• Low Profile

• Rugged Construction

• Taped and Reeled

The Accu-L®inductor is particularly suited for the telecom-

munications industry where there is a continuing trend

towards miniaturization and increasing frequencies. The

Accu-L®inductor meets both the performance and tolerance

requirements of present cellular frequencies 450MHz and

900MHz and of future frequencies, such as 1700MHz,

1900MHz and 2400MHz.

APPLICATIONS

• Mobile Communications

• Satellite TV Receivers

• GPS

• Vehicle Locations Systems

• Filters

• Matching Networks

10 nH Inductor (Top View)

Accu-L® 0603 and 0805

SMD High-Q RF Inductor

HOW TO ORDER

Operating/Storage

Temp. Range:

-55°C to +125°C

DIMENSIONS: millimeters (inches) 0603 0805

L1.6±0.10 2.11±0.10

(0.063±0.004) (0.083±0.004)

W0.81±0.10 1.5±0.10

(0.032±0.004) (0.059±0.004)

T0.61±0.10 0.91±0.13

(0.024±0.004) (0.036±0.005)

top: 0.0 +0.3/-0.0 0.25±0.15

B(0.0+0.012) (0.010±0.006)

bottom: 0.35±0.20

(0.014±0.008)

Product

Inductor

0805

Size

0603

0805

4R7

Inductance

Expressed in nH

(2 significant digits +

number of zeros)

for

values <10nH,

letter R denotes

decimal point.

Example:

22nH = 220

4.7nH = 4R7

L ≤4.7nH,

B = ±0.1nH

C = ±0.2nH

D = ±0.5nH

4.7nH<L<10nH,

B = ±0.1nH –

(0603 only)

C = ±0.2nH –

(0603 only)

D = ±0.5nH

L ≥10nH,

F = ±1%

(0603 only)

G = ±2%

J = ±5%

Specification

Code

E = Accu-L®0805

technology

F = Accu-L®0603

technology

Termination

Code

W = Nickel/

solder coated

(Sn 63, Pb 37)

Packaging

Code

TR = Tape and Reel

(3,000/reel)

450 MHz 900 MHz 1900 MHz 2400 MHz IDC max

Test Frequency Test Frequency Test Frequency Test Frequency SRF min RDC max (mA)

Inductance Available QL (nH) QL (nH) QL (nH) Q(MHz) (Ω)

L (nH) Inductance Tolerance Typical Typical Typical Typical (1)

1.2 ±0.1, ±0.2nH 49 1.2 70 1.2 134 1.2 170 10000 0.04 1000

1.5 ±0.1, ±0.2nH 26 1.54 39 1.52 63 1.52 76 10000 0.06 1000

1.8 ±0.1, ±0.2nH 20 1.74 30 1.73 50 1.72 59 10000 0.07 1000

2.2 ±0.1, ±0.2nH 20 2.2 30 2.24 49 2.24 56 10000 0.08 1000

2.7 ±0.1, ±0.2nH 21 2.7 30 2.75 48 2.79 54 9000 0.08 750

3.3 ±0.1, ±0.2, ±0.5nH 24 3.33 35 3.39 56 3.47 64 8400 0.08 750

3.9 ±0.1, ±0.2, ±0.5nH 25 3.9 57 4.06 60 4.21 69 6500 0.10 500

4.7 ±0.1, ±0.2, ±0.5nH 23 4.68 32 4.92 46 5.2 49 5500 0.15 500

5.6 ±0.1, ±0.2, ±0.5nH 26 5.65 36 5.94 54 6.23 60 5000 0.25 300

6.8 ±0.1, ±0.2, ±0.5nH 23 6.9 33 7.3 47 8.1 39 4500 0.30 300

8.2 ±0.1, ±0.2, ±0.5nH 23 8.4 31 10 35 12.1 31 3800 0.35 300

10.0 ±1%, ±2%, ±5% 28 10 39 11.8 47 14.1 41 3500 0.45 300

12.0 ±1%, ±2%, ±5% 28 13.2 38 14.1 30 17.2 20 3000 0.50 300

15.0 ±1%, ±2%, ±5% 28 16.2 38 25.9 30 49.8 15 2500 0.60 300

(1) IDC measured for 15°C rise at 25°C ambient temperature

(2) IDC measured for 70°C rise at 25°C ambient temperature

L, Q, SRF measured on HP 4291A, Boonton 34A and Wiltron 360

Vector Analyzer, RDC measured on Keithley 580 micro-ohmmeter.

ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L®L0603

450 MHz 900 MHz 1700 MHz 2400 MHz IDC max

Test Frequency Test Frequency Test Frequency Test Frequency SRF min RDC max (mA)

Inductance Available QL (nH) QL (nH) QL (nH) Q(MHz) (Ω)∆T = 15°C∆T = 70°C

L (nH) Inductance Tolerance Typical Typical Typical Typical (1) (2)

1.2 ±0.1nH, ±0.2nH, ±0.5nH 60 1.2 92 1.2 122 1.2 92 10000 0.05 1000 2000

1.5 ±0.1nH, ±0.2nH, ±0.5nH 50 1.5 74 1.5 102 1.5 84 10000 0.05 1000 2000

1.8 ±0.1nH, ±0.2nH, ±0.5nH 50 1.8 72 1.8 88 1.9 73 10000 0.06 1000 2000

2.2 ±0.1nH, ±0.2nH, ±0.5nH 42 2.2 62 2.2 82 2.3 72 10000 0.07 1000 2000

2.7 ±0.1nH, ±0.2nH, ±0.5nH 42 2.7 62 2.8 80 2.9 70 10000 0.08 1000 2000

3.3 ±0.1nH, ±0.2nH, ±0.5nH 38 3.3 46 3.4 48 3.5 57 10000 0.11 750 1500

3.9 ±0.1nH, ±0.2nH, ±0.5nH 27 3.9 36 4.0 38 4.1 42 10000 0.20 750 1500

4.7 ±0.1nH, ±0.2nH, ±0.5nH 43 4.8 62 5.3 76 5.8 60 5500 0.10 750 1500

5.6 ±0.5nH 50 5.7 68 6.3 73 7.6 62 4600 0.10 750 1500

6.8 ±0.5nH 43 7.0 62 7.7 71 9.4 50 4500 0.11 750 1500

8.2 ±0.5nH 43 8.5 56 10.0 55 15.2 32 3500 0.12 750 1500

10 ±2%, ±5% 46 10.6 60 13.4 52 – – 2500 0.13 750 1500

12 ±2%, ±5% 40 12.9 50 17.3 40 – – 2400 0.20 750 1500

15 ±2%, ±5% 36 16.7 46 27 23 – – 2200 0.20 750 1000

18 ±2%, ±5% 30 21.9 27 – – – – 1700 0.35 500 1000

22 ±2%, ±5% 36 27.5 33 – – – – 1400 0.40 500 1000

ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L®0805

Tolerance

for

(1)

IDC measured for 15°C rise at 25°C ambient temperature when soldered to FR-4 board. Inductance and Q measured on Agilent 4291B / 4287 using the 16196A test fixture.

Typical Inductance vs. Frequency

L0805

Measured on HP4291A and

Wiltron 360 Vector Analyzer

100

Inductance (nH)

22nH

15nH

10nH

5.6nH

1.8nH

0.01 0.1

Frequency (GHz)

110

200

100

10 3.532.521.510.5

15nH 10nH 6.8nH 4.7nH2.7nH

Current (A)

Temperature rise will typically be no higher than shown by the graph

∆T (°C)

Maximum Temperature Rise

at 25°C ambient temperature (on FR-4)

L0805

Accu-L® L0603/L0805

SMD High-Q RF Inductor

Typical Q vs. Frequency

L0805

Measured on HP4291A and

Boonton 34A Coaxial Line

0.1

100

120

140

22nH

15nH

10nH

5.6nH

1.8nH

1.5nH

1.2nH

Frequency (GHz)

Typical Inductance vs. Frequency

L0603

15nH

8.2nH

6.8nH

4.7nH

3.3nH

2.2nH

1.8nH

1.2nH

100

10 0.5 1 1.5

Frequency (GHz)

L (nH)

2 2.5 3

180

160

140

120

100

0012

Frequency (GHz)

1.2nH

1.5nH

5.6nH

8.2nH

15nH

Typical Q vs. Frequency

L0603

Measured on AGILENT 4291B/4287

using the 16196A test fixture

Measured on AGILENT 4291B/4287

using the 16196A test fixture

L0805

L0603

Accu-L® 0603 and 0805

SMD High-Q RF Inductor

TEST CONDITIONS REQUIREMENT

Solderability Components completely immersed in Terminations to be well tinned.

a solder bath at 235 ± 5°C for 2 secs. No visible damage.

Leach Resistance Components completely immersed in Dissolution of termination faces

a solder bath at 260 ±5°C for 60 secs. ≤15% of area.

Dissolution of termination edges

≤25% of length.

Storage 12 months minimum with components Good solderability

stored in “as received” packaging.

Shear Components mounted to a substrate. No visible damage

A force of 5N applied normal to the

line joining the terminations and in

a line parallel to the substrate.

Rapid Change of Components mounted to a substrate. No visible damage

Temperature 5 cycles -55°C to +125°C.

Tested as shown in diagram

Bend Strength No visible damage

Temperature Component placed in +0 to +125 ppm/°C

Coefficient of environmental chamber (typical)

Inductance -55°C to +125°C.

(TCL) T1= 25°C

FINAL QUALITY INSPECTION

Finished parts are tested for electrical parameters and visual/

mechanical characteristics.

Parts are 100% tested for inductance at 450MHz. Parts are

100% tested for RDC. Each production lot is evaluated on a

sample basis for:

• Q at test frequency

• Static Humidity Resistance: 85°C, 85% RH, 160 hours

• Endurance: 125°C, IR, 4 hours

1mm

deflection

45mm 45mm

TCL = • 106

L2-L1

L1(T2-T1)

ENVIRONMENTAL CHARACTERISTICS

3030

Accu-L® 0805

Application Notes

HANDLING

SMD chips should be handled with care to avoid damage or

contamination from perspiration and skin oils. The use of

plastic tipped tweezers or vacuum pick-ups is strongly

recommended for individual components. Bulk handling

should ensure that abrasion and mechanical shock are min-

imized. For automatic equipment, taped and reeled product

is the ideal medium for direct presentation to the placement

machine.

CIRCUIT BOARD TYPE

All flexible types of circuit boards may be used (e.g. FR-4,

G-10) and also alumina.

For other circuit board materials, please consult factory.

COMPONENT PAD DESIGN

Component pads must be designed to achieve good joints

and minimize component movement during soldering.

Pad designs are given below for both wave and reflow

soldering.

The basis of these designs is:

a. Pad width equal to component width. It is permissible

to decrease this to as low as 85% of component width

but it is not advisable to go below this.

b. Pad overlap about 0.3mm.

c. Pad extension about 0.3mm for reflow.

Pad extension about 0.8mm for wave soldering.

PREHEAT & SOLDERING

The rate of preheat in production should not exceed

4°C/ second. It is recommended not to exceed 2°C/

second.

Temperature differential from preheat to soldering should not

exceed 150°C.

For further specific application or process advice, please

consult AVX.

HAND SOLDERING & REWORK

Hand soldering is permissible. Preheat of the PCB to 100°C

is required. The most preferable technique is to use hot air

soldering tools. Where a soldering iron is used, a tempera-

ture controlled model not exceeding 30 watts should be

used and set to not more than 260°C. Maximum allowed

time at temperature is 1 minute. When hand soldering, the

base side (white side) must be soldered to the board.

COOLING

After soldering, the assembly should preferably be allowed to

cool naturally. In the event of assisted cooling, similar condi-

tions to those recommended for preheating should be used.

CLEANING RECOMMENDATIONS

Care should be taken to ensure that the devices are thor-

oughly cleaned of flux residues, especially the space beneath

the device. Such residues may otherwise become conduc-

tive and effectively offer a lossy bypass to the device. Various

recommended cleaning conditions (which must be optimized

for the flux system being used) are as follows:

Cleaning liquids . . . . . . i-propanol, ethanol, acetylace-

tone, water, and other standard

PCB cleaning liquids.

Ultrasonic conditions . . power – 20w/liter max.

frequency – 20kHz to 45kHz.

Temperature . . . . . . . . 80°C maximum (if not otherwise

limited by chosen solvent system).

Time . . . . . . . . . . . . . . 5 minutes max.

STORAGE CONDITIONS

Recommended storage conditions for Accu-L®prior to use

are as follows:

Temperature . . . . . . . . 15°C to 35°C

Humidity . . . . . . . . . . . ≤65%

Air Pressure . . . . . . . . 860mbar to 1060mbar

RECOMMENDED SOLDERING

PROFILE

For recommended soldering profile see page 23

REFLOW SOLDERING

DIMENSIONS: millimeters (inches)

WAVE SOLDERING

DIMENSIONS: millimeters (inches)

1.2

(0.047)

1.2

(0.047)

1.4

(0.055)

3.8

(0.150)

1.5

(0.059)

0805

Accu-L®

0.7

(0.028)

0.7

(0.028)

1.4

(0.055)

2.8

(0.110)

1.5

(0.059)

0805

Accu-L®

1.30

(0.051)

1.30

(0.051)

0.50

(0.020)

3.1

(0.122)

0.8

(0.031)

0603

Accu-L®

(

0.035

)

(

0.035

)

(

0.020

)

(

0.091

)

(

0.031

)

0603

Accu-L®