Parallel NOR Flash Embedded Memory
JS28F256M29EWxx, PC28F256M29EWxx, RC28F256M29EWxx
JS28F512M29EWxx, PC28F512M29EWxx, RC28F512M29EWxx
JS28F00AM29EWxx, PC28F00AM29EWxx, RC28F00AM29EWxx
PC28F00BM29EWxx, RC28F00BM29EWxx
Features
2Gb = stacked device (two 1Gb die)
Supply voltage
VCC = 2.7–3.6V (program, erase, read)
VCCQ = 1.65–3.6V (I/O buffers)
Asynchronous random/page read
Page size: 16 words or 32 bytes
Page access: 25ns
Random access: 100ns (Fortified BGA);
110ns (TSOP)
Buffer program: 512-word program buffer
Program time
0.88µs per byte (1.14 MB/s) TYP when using full
512-word buffer size in buffer program
Memory organization
Uniform blocks: 128-Kbytes or 64-Kwords each
Program/erase controller
Embedded byte/word program algorithms
Program/erase suspend and resume capability
Read from any block during a PROGRAM SUS-
PEND operation
Read or program another block during an ERASE
SUSPEND operation
BLANK CHECK operation to verify an erased block
Unlock bypass, block erase, chip erase, and write to
buffer capability
Fast buffered/batch programming
Fast block/chip erase
VPP/WP# pin protection
Protects first or last block regardless of block
protection settings
Software protection
Volatile protection
Nonvolatile protection
Password protection
Password access
Extended memory block
128-word (256-byte) block for permanent, secure
identification
Programmed or locked at the factory or by the
customer
Low power consumption: Standby mode
JESD47H-compliant
100,000 minimum ERASE cycles per block
Data retention: 20 years (TYP)
65nm multilevel cell (MLC) process technology
Fortified BGA and TSOP packages
Green packages available
RoHS-compliant
Halogen-free
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Features
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Products and specifications discussed herein are subject to change by Micron without notice.
Part Numbering Information
Available with extended memory block prelocked by Micron. Devices are shipped from the factory with memory
content bits erased to 1. For available options, such as packages or high/low protection, or for further information,
contact your Micron sales representative. Part numbers can be verified at www.micron.com. Feature and specifica-
tion comparison by device type is available at www.micron.com/products. Contact the factory for devices not
found.
Table 1: Part Number Information
Part Number
Category Category Details Notes
Package JS = 56-pin TSOP, 14mm x 20mm, lead-free, halogen-free, RoHS-compliant
PC = 64-ball Fortified BGA, 11mm x 13mm, lead-free, halogen-free, RoHS-compliant
RC = 64-ball Fortified BGA, 11mm x 13mm, leaded
Product designator 28F = NOR parallel interface
Density 256 = 256Mb
512 = 512Mb
00A = 1Gb
00B = 2Gb
Device type M29EW = Embedded Flash memory (3V core, page, uniform block)
Device function H = Highest block protected by VPP/WP# 1
L = Lowest block protected by VPP/WP#
Features A/B/D/E or an asterisk (*) = Combination of features, including packing media, special
features, and specific customer request information
Note: 1. For 2Gb device, H also indicates protection of the lowest block by VPP/WP#.
Table 2: Standard Part Numbers by Density, Medium, and Package
Density Medium
Package
JS PC RC
256Mb Tray JS28F256M29EWHA PC28F256M29EWHA RC28F256M29EWHA
JS28F256M29EWLA PC28F256M29EWLA RC28F256M29EWLA
Tape and Reel JS28F256M29EWHB PC28F256M29EWHB RC28F256M29EWHB
JS28F256M29EWLB PC28F256M29EWLB
512Mb Tray JS28F512M29EWHA PC28F512M29EWHD RC28F512M29EWHA
JS28F512M29EWLA PC28F512M29EWLA RC28F512M29EWLA
Tape and Reel JS28F512M29EWHB PC28F512M29EWHB RC28F512M29EWHB
JS28F512M29EWLB PC28F512M29EWLB
1Gb Tray JS28F00AM29EWHA PC28F00AM29EWHA RC28F00AM29EWHA
JS28F00AM29EWLA PC28F00AM29EWLA RC28F00AM29EWLA
Tape and Reel JS28F00AM29EWHB PC28F00AM29EWHB RC28F00AM29EWHB
2Gb Tray PC28F00BM29EWHA RC28F00BM29EWHA
Note: 1. For security features and part numbers, contact your local Micron sales representative.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Features
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Contents
General Description ......................................................................................................................................... 7
Device Configurability .................................................................................................................................. 8
Signal Assignments ........................................................................................................................................... 9
Signal Descriptions ......................................................................................................................................... 11
Memory Organization .................................................................................................................................... 12
Memory Configuration ............................................................................................................................... 12
Memory Map – 256Mb–2Gb Density ........................................................................................................... 12
Bus Operations ............................................................................................................................................... 13
Read .......................................................................................................................................................... 13
Write .......................................................................................................................................................... 13
Standby ..................................................................................................................................................... 13
Output Disable ........................................................................................................................................... 14
Reset .......................................................................................................................................................... 14
Registers ........................................................................................................................................................ 15
Status Register ............................................................................................................................................ 15
Lock Register .............................................................................................................................................. 20
Standard Command Definitions – Address-Data Cycles .................................................................................... 23
READ and AUTO SELECT Operations .............................................................................................................. 25
READ/RESET Command ............................................................................................................................ 25
READ CFI Command .................................................................................................................................. 25
AUTO SELECT Command ........................................................................................................................... 25
Bypass Operations .......................................................................................................................................... 27
UNLOCK BYPASS Command ...................................................................................................................... 27
UNLOCK BYPASS RESET Command ............................................................................................................ 27
Program Operations ....................................................................................................................................... 28
PROGRAM Command ................................................................................................................................ 28
UNLOCK BYPASS PROGRAM Command ..................................................................................................... 28
WRITE TO BUFFER PROGRAM Command .................................................................................................. 28
UNLOCK BYPASS WRITE TO BUFFER PROGRAM Command ....................................................................... 30
WRITE TO BUFFER PROGRAM CONFIRM Command .................................................................................. 31
BUFFERED PROGRAM ABORT AND RESET Command ................................................................................ 31
PROGRAM SUSPEND Command ................................................................................................................ 31
PROGRAM RESUME Command .................................................................................................................. 32
Erase Operations ............................................................................................................................................ 32
CHIP ERASE Command .............................................................................................................................. 32
UNLOCK BYPASS CHIP ERASE Command ................................................................................................... 32
BLOCK ERASE Command ........................................................................................................................... 33
UNLOCK BYPASS BLOCK ERASE Command ................................................................................................ 33
ERASE SUSPEND Command ....................................................................................................................... 34
ERASE RESUME Command ........................................................................................................................ 34
BLANK CHECK Operation .............................................................................................................................. 34
BLANK CHECK Commands ........................................................................................................................ 34
Block Protection Command Definitions – Address-Data Cycles ........................................................................ 36
Protection Operations .................................................................................................................................... 39
LOCK REGISTER Commands ...................................................................................................................... 39
PASSWORD PROTECTION Commands ....................................................................................................... 39
NONVOLATILE PROTECTION Commands .................................................................................................. 39
NONVOLATILE PROTECTION BIT LOCK BIT Commands ............................................................................ 42
VOLATILE PROTECTION Commands .......................................................................................................... 42
EXTENDED MEMORY BLOCK Commands .................................................................................................. 42
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Features
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EXIT PROTECTION Command .................................................................................................................... 43
Device Protection ........................................................................................................................................... 44
Hardware Protection .................................................................................................................................. 44
Software Protection .................................................................................................................................... 44
Volatile Protection Mode ............................................................................................................................. 45
Nonvolatile Protection Mode ...................................................................................................................... 45
Password Protection Mode .......................................................................................................................... 45
Password Access ......................................................................................................................................... 46
Common Flash Interface ................................................................................................................................ 47
Power-Up and Reset Characteristics ................................................................................................................ 51
Absolute Ratings and Operating Conditions ..................................................................................................... 53
DC Characteristics .......................................................................................................................................... 55
Read AC Characteristics .................................................................................................................................. 57
Write AC Characteristics ................................................................................................................................. 60
Accelerated Program, Data Polling/Toggle AC Characteristics ........................................................................... 67
Program/Erase Characteristics ........................................................................................................................ 69
Package Dimensions ....................................................................................................................................... 70
Additional Resources ...................................................................................................................................... 72
Revision History ............................................................................................................................................. 73
Rev. A – 04/12 ............................................................................................................................................. 73
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Features
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List of Figures
Figure 1: Logic Diagram ................................................................................................................................... 7
Figure 2: 2Gb Configuration ............................................................................................................................ 8
Figure 3: 56-Pin TSOP (Top View) .................................................................................................................... 9
Figure 4: 64-Ball Fortified BGA ....................................................................................................................... 10
Figure 5: Data Polling Flowchart .................................................................................................................... 17
Figure 6: Toggle Bit Flowchart ........................................................................................................................ 18
Figure 7: Status Register Polling Flowchart ..................................................................................................... 19
Figure 8: Lock Register Program Flowchart ..................................................................................................... 21
Figure 9: Boundary Condition of Program Buffer Size ..................................................................................... 29
Figure 10: WRITE TO BUFFER PROGRAM Flowchart ...................................................................................... 30
Figure 11: Program/Erase Nonvolatile Protection Bit Algorithm ...................................................................... 41
Figure 12: Software Protection Scheme .......................................................................................................... 46
Figure 13: Power-Up Timing .......................................................................................................................... 51
Figure 14: Reset AC Timing – No PROGRAM/ERASE Operation in Progress ...................................................... 52
Figure 15: Reset AC Timing During PROGRAM/ERASE Operation .................................................................... 52
Figure 16: AC Measurement Load Circuit ....................................................................................................... 54
Figure 17: AC Measurement I/O Waveform ..................................................................................................... 54
Figure 18: Random Read AC Timing (8-Bit Mode) ........................................................................................... 58
Figure 19: Random Read AC Timing (16-Bit Mode) ......................................................................................... 58
Figure 20: BYTE# Transition Read AC Timing .................................................................................................. 59
Figure 21: Page Read AC Timing (16-Bit Mode) ............................................................................................... 59
Figure 22: WE#-Controlled Program AC Timing (8-Bit Mode) .......................................................................... 61
Figure 23: WE#-Controlled Program AC Timing (16-Bit Mode) ......................................................................... 62
Figure 24: CE#-Controlled Program AC Timing (8-Bit Mode) ........................................................................... 64
Figure 25: CE#-Controlled Program AC Timing (16-Bit Mode) ......................................................................... 65
Figure 26: Chip/Block Erase AC Timing (8-Bit Mode) ...................................................................................... 66
Figure 27: Accelerated Program AC Timing ..................................................................................................... 67
Figure 28: Data Polling AC Timing .................................................................................................................. 67
Figure 29: Toggle/Alternative Toggle Bit Polling AC Timing (8-Bit Mode) .......................................................... 68
Figure 30: 56-Pin TSOP – 14mm x 20mm ........................................................................................................ 70
Figure 31: 64-Ball Fortified BGA – 11mm x 13mm ........................................................................................... 71
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Features
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List of Tables
Table 1: Part Number Information ................................................................................................................... 2
Table 2: Standard Part Numbers by Density, Medium, and Package ................................................................... 2
Table 3: Signal Descriptions ........................................................................................................................... 11
Table 4: Blocks[2047:0] .................................................................................................................................. 12
Table 5: Bus Operations ................................................................................................................................. 13
Table 6: Status Register Bit Definitions ........................................................................................................... 15
Table 7: Operations and Corresponding Bit Settings ........................................................................................ 16
Table 8: Lock Register Bit Definitions ............................................................................................................. 20
Table 9: Block Protection Status ..................................................................................................................... 20
Table 10: Standard Command Definitions – Address-Data Cycles, 8-Bit and 16-Bit ........................................... 23
Table 11: Read Electronic Signature ............................................................................................................... 26
Table 12: Block Protection ............................................................................................................................. 26
Table 13: Block Protection Command Definitions – Address-Data Cycles, 8-Bit and 16-Bit ................................ 36
Table 14: Extended Memory Block Address and Data ...................................................................................... 42
Table 15: VPP/WP# Functions ......................................................................................................................... 44
Table 16: Query Structure Overview ............................................................................................................... 47
Table 17: CFI Query Identification String ........................................................................................................ 47
Table 18: CFI Query System Interface Information .......................................................................................... 48
Table 19: Device Geometry Definition ............................................................................................................ 48
Table 20: Primary Algorithm-Specific Extended Query Table ........................................................................... 49
Table 21: Power-Up Specifications ................................................................................................................. 51
Table 22: Reset AC Specifications ................................................................................................................... 52
Table 23: Absolute Maximum/Minimum Ratings ............................................................................................ 53
Table 24: Operating Conditions ...................................................................................................................... 53
Table 25: Input/Output Capacitance .............................................................................................................. 54
Table 26: DC Current Characteristics .............................................................................................................. 55
Table 27: DC Voltage Characteristics .............................................................................................................. 56
Table 28: Read AC Characteristics .................................................................................................................. 57
Table 29: WE#-Controlled Write AC Characteristics ......................................................................................... 60
Table 30: CE#-Controlled Write AC Characteristics ......................................................................................... 63
Table 31: Accelerated Program and Data Polling/Data Toggle AC Characteristics .............................................. 67
Table 32: Program/Erase Characteristics ........................................................................................................ 69
Table 33: Technical Notes .............................................................................................................................. 72
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Features
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General Description
The M29EW is an asynchronous, uniform block, parallel NOR Flash memory device
manufactured on 65nm multilevel cell (MLC) technology. READ, ERASE, and PROGRAM
operations are performed using a single low-voltage supply. Upon power-up, the device
defaults to read array mode.
The main memory array is divided into uniform blocks that can be erased independent-
ly so that valid data can be preserved while old data is purged. PROGRAM and ERASE
commands are written to the command interface of the memory. An on-chip program/
erase controller simplifies the process of programming or erasing the memory by taking
care of all special operations required to update the memory contents. The end of a
PROGRAM or ERASE operation can be detected and any error condition can be identi-
fied. The command set required to control the device is consistent with JEDEC stand-
ards.
CE#, OE#, and WE# control the bus operation of the device and enable a simple con-
nection to most microprocessors, often without additional logic.
The M29EW supports asynchronous random read and page read from all blocks of the
array. It also features an internal program buffer that improves throughput by program-
ming 512 words via one command sequence. The device contains a 128-word extended
memory block which overlaps addresses with array block 0. The user can program this
additional space and then protect it to permanently secure the contents. The device al-
so features different levels of hardware and software protection to secure blocks from
unwanted modification.
Figure 1: Logic Diagram
VCC VCCQ
A[MAX:0]
WE#
VPP/WP#
DQ[14:0]
DQ15/A-1
VSS
15
CE#
OE#
RST#
BYTE#
RY/BY#
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
General Description
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Device Configurability
Figure 2: 2Gb Configuration
OE#
WE#
RY/BY#
BYTE#
A[26:0]
CE#
RST#
VCC
VCCQ
VSS
DQ[14:0]
DQ15/A-1
Upper die
(1Gb)
Lower die
(1Gb)
VPP WP#/
Note: 1. A[26] = VIH selects the upper die; A[26] = VIL selects the lower die.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
General Description
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Signal Assignments
Figure 3: 56-Pin TSOP (Top View)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
A23
A22
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
WE#
RST#
A21
VPP/WP#
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
RFU
RFU
A24
A25
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
RFU
VCCQ
Notes: 1. A-1 is the least significant address bit in x8 mode.
2. A23 is valid for 256Mb and above; otherwise, it is RFU.
3. A24 is valid for 512Mb and above; otherwise, it is RFU.
4. A25 is valid for 1Gb and above; otherwise, it is RFU.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Signal Assignments
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Figure 4: 64-Ball Fortified BGA
A
B
C
D
E
F
G
H
A
B
C
D
E
F
G
H
1
RFU
A26
RFU
RFU
RFU
VCCQ
RFU
RFU
2
A3
A4
A2
A1
A0
CE#
OE#
VSS
3
A7
A17
A6
A5
D0
D8
D9
D1
4
RY/BY#
VPP/WP#
A18
A20
D2
D10
D11
D3
4
RY/BY#
VPP/WP#
A18
A20
D2
D10
D11
D3
5
WE#
RST#
A21
A19
D5
D12
VCC
D4
5
WE#
RST#
A21
A19
D5
D12
VCC
D4
6
A9
A8
A10
A11
D7
D14
D13
D6
6
A9
A8
A10
A11
D7
D14
D13
D6
7
A13
A12
A14
A15
A16
BYTE#
D15/A-1
VSS
7
A13
A12
A14
A15
A16
BYTE#
D15/A-1
VSS
8
RFU
A22
A23
VCCQ
VSS
A24
A25
RFU
8
RFU
A22
A23
VCCQ
VSS
A24
A25
RFU
3
A7
A17
A6
A5
D0
D8
D9
D1
2
A3
A4
A2
A1
A0
CE#
OE#
VSS
1
RFU
A26
RFU
RFU
RFU
VCCQ
RFU
RFU
Fortified BGA
Top view – ball side down
Fortified BGA
Bottom view – ball side up
Notes: 1. A-1 is the least significant address bit in x8 mode.
2. A23 is valid for 256Mb and above; otherwise, it is RFU.
3. A24 is valid for 512Mb and above; otherwise, it is RFU.
4. A25 is valid for 1Gb and above; otherwise, it is RFU.
5. A26 is valid for 2Gb only; otherwise it is RFU.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Signal Assignments
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Signal Descriptions
The signal description table below is a comprehensive list of signals for this device fami-
ly. All signals listed may not be supported on this device. See Signal Assignments for in-
formation specific to this device.
Table 3: Signal Descriptions
Name Type Description
A[MAX:0] Input Address: Selects the cells in the array to access during READ operations. During WRITE oper-
ations, they control the commands sent to the command interface of the program/erase con-
troller.
CE# Input Chip enable: Activates the device, enabling READ and WRITE operations to be performed.
When CE# is HIGH, the device goes to standby and data outputs are at HIGH-Z.
OE# Input Output enable: Controls the bus READ operation.
WE# Input Write enable: Controls the bus WRITE operation of the command interface.
VPP/WP# Input VPP/Write Protect: Provides WRITE PROTECT function and VPPH function. These functions
protect the lowest or highest block and enable the device to enter unlock bypass mode, re-
spectively. (Refer to Hardware Protection and Bypass Operations for details.)
BYTE# Input Byte/word organization select: Switches between x8 and x16 bus modes. When BYTE# is
LOW, the device is in x8 mode; when HIGH, the device is in x16 mode.
RST# Input Reset: Applies a hardware reset to the device, which is achieved by holding RST# LOW for at
least tPLPX. After RST# goes HIGH, the device is ready for READ and WRITE operations (after
tPHEL or tRHEL, whichever occurs last). See RESET AC Specifications for more details.
DQ[7:0] I/O Data I/O: Outputs the data stored at the selected address during a READ operation. During
WRITE operations, they represent the commands sent to the command interface of the inter-
nal state machine.
DQ[14:8] I/O Data I/O: Outputs the data stored at the selected address during a READ operation when
BYTE# is HIGH. When BYTE# is LOW, these pins are not used and are High-Z. During WRITE
operations, these bits are not used. When reading the status register, these bits should be ig-
nored.
DQ15/A-1 I/O Data I/O or address input: When the device operates in x16 bus mode, this pin behaves as
data I/O, together with DQ[14:8]. When the device operates in x8 bus mode, this pin behaves
as the least significant bit of the address.
Except where stated explicitly otherwise, DQ15 = data I/O (x16 mode); A-1 = address input (x8
mode).
RY/BY# Output Ready busy: Open-drain output that can be used to identify when the device is performing
a PROGRAM or ERASE operation. During PROGRAM or ERASE operations, RY/BY# is LOW,
and is High-Z during read mode, auto select mode, and erase suspend mode. After a hard-
ware reset, READ and WRITE operations cannot begin until RY/BY# goes High-Z (see RESET
AC Specifications for more details).
The use of an open-drain output enables the RY/BY# pins from several devices to be connec-
ted to a single pull-up resistor to VCCQ. A low value will then indicate that one (or more) of
the devices is (are) busy. A 10K Ohm or bigger resistor is recommended as pull-up resistor to
achieve 0.1V VOL.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Signal Descriptions
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Table 3: Signal Descriptions (Continued)
Name Type Description
VCC Supply Supply voltage: Provides the power supply for READ, PROGRAM, and ERASE operations.
The command interface is disabled when VCC <= VLKO. This prevents WRITE operations from
accidentally damaging the data during power-up, power-down, and power surges. If the pro-
gram/erase controller is programming or erasing during this time, then the operation aborts
and the contents being altered will be invalid.
A 0.1μF capacitor should be connected between VCC and VSS to decouple the current surges
from the power supply. The PCB track widths must be sufficient to carry the currents required
during PROGRAM and ERASE operations (see DC Characteristics).
VCCQ Supply I/O supply voltage: Provides the power supply to the I/O pins and enables all outputs to be
powered independently from VCC.
VSS Supply Ground: All VSS pins must be connected to the system ground.
RFU Reserved for future use: RFUs should be not connected.
Memory Organization
Memory Configuration
The main memory array is divided into 128KB or 64KW uniform blocks.
Memory Map – 256Mb–2Gb Density
Table 4: Blocks[2047:0]
Block
Block
Size
Address Range (x8) Block
Size
Address Range (x16)
Start End Start End
2047 128KB FFE 0000h FFF FFFFh 64KW 7FF 0000h 7FF FFFFh
1023 7FE 0000h 7FF FFFFh 3FF 0000h 3FF FFFFh
511 3FE 0000h 3FF FFFFh 1FF 0000h 1FF FFFFh
255 1FE 0000h 1FF FFFFh 0FF 0000h 0FF FFFFh
127 0FE 0000h 0FF FFFFh 07F 0000h 07F FFFFh
63 07E 0000h 07F FFFFh 03F 0000h 03F FFFFh
0 000 0000h 001 FFFFh 000 0000h 000 FFFFh
Note: 1. 256Mb device = blocks 0–255; 512Mb device = blocks 0–511; 1Gb device = blocks 0–1023;
2Gb device = blocks 0–2047, including upper and lower die.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Memory Organization
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Bus Operations
Table 5: Bus Operations
Notes 1 and 2 apply to entire table
Operation CE# OE# WE# RST# VPP/WP#
8-Bit Mode 16-Bit Mode
A[MAX:0],
DQ15/A-1 DQ[14:8] DQ[7:0] A[MAX:0]
DQ15/A-1,
DQ[14:0]
READ L L H H X Cell address High-Z Data output Cell address Data output
WRITE L H L H H3Command
address
High-Z Data input4Command
address
Data input4
STANDBY H X X H H X High-Z High-Z X High-Z
OUTPUT
DISABLE
L H H H X X High-Z High-Z X High-Z
RESET X X X L X X High-Z High-Z X High-Z
Notes: 1. Typical glitches of less than 3ns on CE#, WE#, and RST# are ignored by the device and do
not affect bus operations.
2. H = Logic level HIGH (VIH); L = Logic level LOW (VIL); X = HIGH or LOW.
3. If WP# is LOW, then the highest or the lowest block remains protected, depending on
line item.
4. Data input is required when issuing a command sequence or when performing data
polling or block protection.
Read
Bus READ operations read from the memory cells, registers, or CFI space. To accelerate
the READ operation, the memory array can be read in page mode where data is inter-
nally read and stored in a page buffer.
Page size is 16 words (32 bytes) and is addressed by address inputs A[3:0] in x16 bus
mode and A[3:0] plus DQ15/A-1 in x8 bus mode. The extended memory blocks and CFI
area do not support page read mode.
A valid bus READ operation involves setting the desired address on the address inputs,
taking CE# and OE# LOW, and holding WE# HIGH. The data I/Os will output the value.
(See AC Characteristics for details about when the output becomes valid.)
Write
Bus WRITE operations write to the command interface. A valid bus WRITE operation
begins by setting the desired address on the address inputs. The address inputs are
latched by the command interface on the falling edge of CE# or WE#, whichever occurs
last. The data I/Os are latched by the command interface on the rising edge of CE# or
WE#, whichever occurs first. OE# must remain HIGH during the entire bus WRITE oper-
ation. (See AC Characteristics for timing requirement details.)
Standby
Driving CE# HIGH in read mode causes the device to enter standby, and data I/Os to be
High-Z. To reduce the supply current to the standby supply current (ICC2), CE# must be
held within VCC ±0.3V. (See DC Characteristics.)
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Bus Operations
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During PROGRAM or ERASE operations the device will continue to use the program/
erase supply current (ICC3) until the operation completes.
Output Disable
Data I/Os are High-Z when OE# is HIGH.
Reset
During reset mode the device is deselected and the outputs are High-Z. The device is in
reset mode when RST# is LOW. The power consumption is reduced to the standby level,
independently from CE#, OE#, or WE# inputs.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Bus Operations
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Registers
Status Register
Table 6: Status Register Bit Definitions
Note 1 applies to entire table
Bit Name Settings Description Notes
DQ7 Data polling
bit
0 or 1, depending on
operations
Monitors whether the program/erase controller has successful-
ly completed its operation, or has responded to an ERASE SUS-
PEND operation.
2, 3, 4
DQ6 Toggle bit Toggles: 0 to 1; 1 to 0;
and so on
Monitors whether the program/erase controller has successful-
ly completed its operations, or has responded to an ERASE
SUSPEND operation. During a PROGRAM/ERASE operation,
DQ6 toggles from 0 to 1, 1 to 0, and so on, with each succes-
sive READ operation from any address.
3, 4, 5
DQ5 Error bit 0 = Success
1 = Failure
Identifies errors detected by the program/erase controller. DQ5
is set to 1 when a PROGRAM, BLOCK ERASE, or CHIP ERASE op-
eration fails to write the correct data to the memory, or when
a BLANK CHECK operation fails.
4, 6
DQ3 Erase timer
bit
0 = Erase not in progress
1 = Erase in progress
Identifies the start of program/erase controller operation dur-
ing a BLOCK ERASE command. Before the program/erase con-
troller starts, this bit set to 0, and additional blocks to be
erased can be written to the command interface.
4
DQ2 Alternative
toggle bit
Toggles: 0 to 1; 1 to 0;
and so on
Monitors the program/erase controller during ERASE opera-
tions. During CHIP ERASE, BLOCK ERASE, and ERASE SUSPEND
operations, DQ2 toggles from 0 to 1, 1 to 0, and so on, with
each successive READ operation from addresses within the
blocks being erased.
3, 4
DQ1 Buffered
program
abort bit
1 = Abort Indicates a BUFFER PROGRAM operation abort. The BUFFERED
PROGRAM ABORT and RESET command must be issued to re-
turn the device to read mode (see WRITE TO BUFFER PRO-
GRAM command).
Notes: 1. The status register can be read during PROGRAM, ERASE, or ERASE SUSPEND operations;
the READ operation outputs data on DQ[7:0].
2. For a PROGRAM operation in progress, DQ7 outputs the complement of the bit being
programmed. For a READ operation from the address previously programmed success-
fully, DQ7 outputs existing DQ7 data. For a READ operation from addresses with blocks
to be erased while an ERASE SUSPEND operation is in progress, DQ7 outputs 0; upon
successful completion of the ERASE SUSPEND operation, DQ7 outputs 1. For an ERASE or
BLANK CHECK operation in progress, DQ7 outputs 0; upon either operation's successful
completion, DQ7 outputs 1.
3. After successful completion of a PROGRAM, ERASE, or BLANK CHECK operation, the de-
vice returns to read mode.
4. During erase suspend mode, READ operations to addresses within blocks not being
erased output memory array data as if in read mode. A protected block is treated the
same as a block not being erased. See the Toggle Flowchart for more information.
5. During erase suspend mode, DQ6 toggles when addressing a cell within a block being
erased. The toggling stops when the program/erase controller has suspended the ERASE
operation. See the Toggle Flowchart for more information.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Registers
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6. When DQ5 is set to 1, a READ/RESET command must be issued before any subsequent
command.
Table 7: Operations and Corresponding Bit Settings
Note 1 applies to entire table
Operation Address DQ7 DQ6 DQ5 DQ3 DQ2 DQ1 RY/BY# Notes
PROGRAM Any address DQ7# Toggle 0 No toggle 0 0 2
PROGRAM during
ERASE SUSPEND
Any address DQ7# Toggle 0 0
PROGRAM
SUSPEND
Programming Invalid operation High-Z
Nonprogramming Outputs memory array data as if in read mode High-Z
BUFFERED
PROGRAM ABORT
Any address DQ7# Toggle 0 1 0 2
PROGRAM error Any address DQ7# Toggle 1 High-Z
CHIP ERASE Any address 0 Toggle 0 1 Toggle 0
BLOCK ERASE
before time-out
Erasing block 0 Toggle 0 0 Toggle 0
Non-erasing block 0 Toggle 0 0 No toggle 0
BLOCK ERASE/
Blank check
Erasing/verifying
block
0 Toggle 0 1 Toggle 0
Non-erasing/
verifying block
0 Toggle 0 1 No toggle 0
BLOCK ERASE/
Blank check
suspend
Erasing/verifying
block
1 No toggle 0 Toggle High-Z
Non-erasing/
verifying block
Outputs memory array data as if in read mode High-Z
BLOCK ERASE/
Blank check error
Any address 0 Toggle 1 1 Toggle High-Z
Notes: 1. Unspecified data bits should be ignored.
2. DQ7# for buffer program is related to the last address location loaded.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Registers
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Figure 5: Data Polling Flowchart
Start
DQ7 = Data
DQ5 = 1
DQ1 = 1
DQ7 = Data
No
No
No
No
Yes
Yes
Yes
Yes
Read DQ7, DQ5, and DQ1
at valid address1
Read DQ7 at valid address
SuccessFailure2
Notes: 1. Valid address is the address being programmed or an address within the block being
erased or on which a BLANK CHECK operation has been executed.
2. Failure results: DQ5 = 1 indicates an operation error; DQ1 = 1 indicates a WRITE TO BUF-
FER PROGRAM ABORT operation.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Registers
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Figure 6: Toggle Bit Flowchart
DQ6 = Toggle
DQ5 = 1
DQ6 = Toggle
No
No
Yes
Yes
Yes
Start
Read DQ6 at valid address
Read DQ6, DQ5, and DQ1
at valid address
Read DQ6 (twice) at valid address
SuccessFailure1
DQ1 = 1
No
Yes
No
Note: 1. Failure results: DQ5 = 1 indicates an operation error; DQ1 = 1 indicates a WRITE TO BUF-
FER PROGRAM ABORT operation.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Registers
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Figure 7: Status Register Polling Flowchart
WRITE TO BUFFER
PROGRAM
Start
DQ7 = Valid data
DQ5 = 1
Yes
No
No
Yes
Yes
DQ6 = Toggling Yes
No No
No
Yes
PROGRAM operation
No
No
DQ6 = Toggling
No
DQ2 = Toggling
Yes
Yes
Yes
DQ1 = 1
Read 3 correct data?
No
Yes
Read 1
Read 2
Read 2
Read 3
Device busy: Repolling
Device busy: Repolling
Read 3
PROGRAM operation
complete
PROGRAM operation
failure
WRITE TO BUFFER
PROGRAM
abort
Timeout failure
ERASE operation
complete
Erase/suspend mode
Device error
Read2.DQ6 = Read3.DQ6
Read2.DQ2 = Read3.DQ2
Read1.DQ6 = Read2.DQ6
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Registers
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Lock Register
Table 8: Lock Register Bit Definitions
Note 1 applies to entire table
Bit Name Settings Description Notes
DQ2 Password
protection
mode lock bit
0 = Password protection
mode enabled
1 = Password protection
mode disabled (Default)
Places the device permanently in password protection mode. 2
DQ1 Nonvolatile
protection
mode lock bit
0 = Nonvolatile protection
mode enabled with pass-
word protection mode
permanently disabled
1 = Nonvolatile protection
mode enabled (Default)
Places the device in nonvolatile protection mode with pass-
word protection mode permanently disabled. When shipped
from the factory, the device will operate in nonvolatile protec-
tion mode, and the memory blocks are unprotected.
2
DQ0 Extended
memory
block
protection bit
0 = Protected
1 = Unprotected (Default)
If the device is shipped with the extended memory block un-
locked, the block can be protected by setting this bit to 0. The
extended memory block protection status can be read in auto
select mode by issuing an AUTO SELECT command.
Notes: 1. The lock register is a 16-bit, one-time programmable register. DQ[15:3] are reserved and
are set to a default value of 1.
2. The password protection mode lock bit and nonvolatile protection mode lock bit cannot
both be programmed to 0. Any attempt to program one while the other is programmed
causes the operation to abort, and the device returns to read mode. The device is ship-
ped from the factory with the default setting.
Table 9: Block Protection Status
Nonvolatile
Protection Bit
Lock Bit1
Nonvolatile
Protection Bit2
Volatile
Protection Bit3
Block
Protection
Status Block Protection Status
1 1 1 00h Block unprotected; nonvolatile protection bit changea-
ble.
1 1 0 01h Block protected by volatile protection bit; nonvolatile
protection bit changeable.
1 0 1 01h Block protected by nonvolatile protection bit; nonvola-
tile protection bit changeable.
1 0 0 01h Block protected by nonvolatile protection bit and vola-
tile protection bit; nonvolatile protection bit changea-
ble.
0 1 1 00h Block unprotected; nonvolatile protection bit un-
changeable.
0 1 0 01h Block protected by volatile protection bit; nonvolatile
protection bit unchangeable.
0 0 1 01h Block protected by nonvolatile protection bit; nonvola-
tile protection bit unchangeable.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Registers
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Table 9: Block Protection Status (Continued)
Nonvolatile
Protection Bit
Lock Bit1
Nonvolatile
Protection Bit2
Volatile
Protection Bit3
Block
Protection
Status Block Protection Status
0 0 0 01h Block protected by nonvolatile protection bit and vola-
tile protection bit; nonvolatile protection bit unchange-
able.
Notes: 1. Nonvolatile protection bit lock bit: when cleared to 1, all nonvolatile protection bits are
unlocked; when set to 0, all nonvolatile protection bits are locked.
2. Block nonvolatile protection bit: when cleared to 1, the block is unprotected; when set
to 0, the block is protected.
3. Block volatile protection bit: when cleared to 1, the block is unprotected; when set to 0,
the block is protected.
Figure 8: Lock Register Program Flowchart
Start
Done?
DQ5 = 1
No
No
Yes
Yes
ENTER LOCK REGISTER COMMAND SET
Address-data (unlock) cycle 1
Address-data (unlock) cycle 2
Address-data cycle 3
PROGRAM LOCK REGISTER
Address-data cycle 1
Address-data cycle 2
Polling algorithm
Success:
EXIT PROTECTION COMMAND SET
(Returns to device read mode)
Address-data cycle 1
Address-data cycle 2
Failure:
READ/RESET
(Returns device to read mode)
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Registers
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Notes: 1. Each lock register bit can be programmed only once.
2. See the Block Protection Command Definitions table for address-data cycle details.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Registers
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Standard Command Definitions – Address-Data Cycles
Table 10: Standard Command Definitions – Address-Data Cycles, 8-Bit and 16-Bit
Note 1 applies to entire table
Command and
Code/Subcode
Bus
Size
Address and Data Cycles
Notes
1st 2nd 3rd 4th 5th 6th
A D A D A D A D A D A D
READ and AUTO SELECT Operations
READ/RESET (F0h) x8 X F0
AAA AA 555 55 X F0
x16 X F0
555 AA 2AA 55 X F0
READ CFI (98h) x8 AA 98
x16 55
AUTO SELECT (90h) x8 AAA AA 555 55 AAA 90 Note
2
Note
2
2, 3, 4
x16 555 2AA 555
BYPASS Operations
UNLOCK BYPASS (20h) x8 AAA AA 555 55 AAA 20
x16 555 2AA 555
UNLOCK BYPASS
RESET (90h/00h)
x8 X 90 X 00
x16
PROGRAM Operations
PROGRAM (A0h) x8 AAA AA 555 55 AAA A0 PA PD
x16 555 2AA 555
UNLOCK BYPASS
PROGRAM (A0h)
x8 X A0 PA PD 5
x16
WRITE TO BUFFER
PROGRAM (25h)
x8 AAA AA 555 55 BAd 25 BAd N PA PD 6, 7, 8
x16 555 2AA
UNLOCK BYPASS
WRITE TO BUFFER
PROGRAM (25h)
x8 BAd 25 BAd N PA PD 5
x16
WRITE TO BUFFER
PROGRAM CONFIRM
(29h)
x8 BAd 29
x16
BUFFERED PROGRAM
ABORT and RESET (F0h)
x8 AAA AA 555 55 AAA F0
x16 555 2AA 555
PROGRAM SUSPEND
(B0h)
x8 X B0
x16
PROGRAM RESUME
(30h)
x8 X 30
x16
ERASE Operations
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Standard Command Definitions – Address-Data Cycles
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Table 10: Standard Command Definitions – Address-Data Cycles, 8-Bit and 16-Bit (Continued)
Note 1 applies to entire table
Command and
Code/Subcode
Bus
Size
Address and Data Cycles
Notes
1st 2nd 3rd 4th 5th 6th
A D A D A D A D A D A D
CHIP ERASE (80/10h) x8 AAA AA 555 55 AAA 80 AAA AA 555 55 AAA 10
x16 555 2AA 555 555 2AA 555
UNLOCK BYPASS
CHIP ERASE (80/10h)
x8 X 80 X 10 5
x16
BLOCK ERASE (80/30h) x8 AAA AA 555 55 AAA 80 AAA AA 555 55 BAd 30 9
x16 555 2AA 555 555 2AA
UNLOCK BYPASS
BLOCK ERASE (80/30h)
x8 X 80 BAd 30 5
x16
ERASE SUSPEND (B0h) x8 X B0
x16
ERASE RESUME (30h) x8 X 30
x16
BLANK CHECK Operations
BLANK CHECK
SETUP (EB/76h)
x8 AAA AA 555 55 BAd EB BAd 76 BAd 00 BAd 00
x16 555 2AA
BLANK CHECK CONFIRM
and READ (29h)
x8 BAd 29 BAd Note
2
2
x16
Notes: 1. A = Address; D = Data; X = "Don't Care;" BAd = Any address in the block; N = Number of
bytes to be programmed; PA = Program address; PD = Program data; Gray shading = Not
applicable. All values in the table are hexadecimal. Some commands require both a com-
mand code and subcode. For the 2Gb device, the set-up command must be issued for
each selected die.
2. These cells represent READ cycles (versus WRITE cycles for the others).
3. AUTO SELECT enables the device to read the manufacturer code, device code, block pro-
tection status, and extended memory block protection indicator.
4. AUTO SELECT addresses and data are specified in the Electronic Signature table and the
Extended Memory Block Protection table.
5. For any UNLOCK BYPASS ERASE/PROGRAM command, the first two UNLOCK cycles are
unnecessary.
6. BAd must be the same as the address loaded during the WRITE TO BUFFER PROGRAM
3rd and 4th cycles.
7. WRITE TO BUFFER PROGRAM operation: maximum cycles = 261 (x8) and 517 (x16). UN-
LOCK BYPASS WRITE TO BUFFER PROGRAM operation: maximum cycles = 259 (x8), 515
(x16). WRITE TO BUFFER PROGRAM operation: N + 1 = bytes to be programmed; maxi-
mum buffer size = 256 bytes (x8) and 1024 bytes (x16).
8. For x8, A[MAX:7] address pins should remain unchanged while A[6:0] and A-1 pins are
used to select a byte within the N + 1 byte page. For x16, A[MAX:9] address pins should
remain unchanged while A[8:0] pins are used to select a word within the N+1 word
page.
9. BLOCK ERASE address cycles can extend beyond six address-data cycles, depending on
the number of blocks to erase.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Standard Command Definitions – Address-Data Cycles
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READ and AUTO SELECT Operations
READ/RESET Command
The READ/RESET (F0h) command returns the device to read mode and resets the errors
in the status register. One or three bus WRITE operations can be used to issue the
READ/RESET command.
To return the device to read mode, this command can be issued between bus WRITE
cycles before the start of a PROGRAM or ERASE operation. If the READ/RESET com-
mand is issued during the timeout of a BLOCK ERASE operation, the device requires up
to 10μs to abort, during which time no valid data can be read.
This command will not abort an ERASE operation while in erase suspend.
READ CFI Command
The READ CFI (98h) command puts the device in read CFI mode and is only valid when
the device is in read array or auto select mode. One bus WRITE cycle is required to issue
the command.
Once in read CFI mode, bus READ operations will output data from the CFI memory
area (Refer to the Common Flash Interface for details). A READ/RESET command must
be issued to return the device to the previous mode (read array or auto select ). A sec-
ond READ/RESET command is required to put the device in read array mode from auto
select mode.
AUTO SELECT Command
At power-up or after a hardware reset, the device is in read mode. It can then be put in
auto select mode by issuing an AUTO SELECT (90h) command. Auto select mode ena-
bles the following device information to be read:
Electronic signature, which includes manufacturer and device code information as
shown in the Electronic Signature table.
Block protection, which includes the block protection status and extended memory
block protection indicator, as shown in the Block Protection table.
Electronic signature or block protection information is read by executing a READ opera-
tion with control signals and addresses set, as shown in the Read Electronic Signature
table or the Block Protection table, respectively. In addition, this device information can
be read or set by issuing an AUTO SELECT command.
Auto select mode can be used by the programming equipment to automatically match a
device with the application code to be programmed.
Three consecutive bus WRITE operations are required to issue an AUTO SELECT com-
mand. The device remains in auto select mode until a READ/RESET or READ CFI com-
mand is issued.
The device cannot enter auto select mode when a PROGRAM or ERASE operation is in
progress (RY/BY# LOW). However, auto select mode can be entered if the PROGRAM or
ERASE operation has been suspended by issuing a PROGRAM SUSPEND or ERASE SUS-
PEND command.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
READ and AUTO SELECT Operations
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Auto select mode is exited by performing a reset. The device returns to read mode un-
less it entered auto select mode after an ERASE SUSPEND or PROGRAM SUSPEND
command, in which case it returns to erase or program suspend mode.
Table 11: Read Electronic Signature
Note 1 applies to entire table
Read Cycle CE# OE# WE#
Address Input Data Input/Output
8-Bit/16-Bit 8-Bit Only 8-Bit Only 16-Bit Only
A[MAX:4] A3 A2 A1 A0 DQ[15]/A-1 DQ[14:8] DQ[7:0]
DQ[15]/A-1,
DQ[14:0]
Manufacturer code L L H L L L L L X X 89h 0089h
Device code 1 L L H L L L L H X X 7Eh 227Eh
Device
code 2
256Mb L L H L H H H L X X 22h 2222h
512Mb L L H L H H H L X X 23h 2223h
1Gb L L H L H H H L X X 28h 2228h
2Gb L L H L H H H L X X 48h 2248h
Device code 3 L L H L H H H H X X 01h 2201h
Note: 1. H = Logic level HIGH (VIH); L = Logic level LOW (VIL); X = HIGH or LOW.
Table 12: Block Protection
Note 1 applies to entire table
Read Cycle CE# OE# WE#
Address Input Data Input/Output
8-Bit/16-Bit 8-Bit Only 8-Bit Only 16-Bit Only
A[MAX:16] A[15:2] A1 A0 DQ[15]/A-1 DQ[14:8] DQ[7:0]
DQ[15]/A-1,
DQ[14:0]
Extended
memory
Block
protection
indicator
(DQ7)
M29EWL L L H L L H H X X 89h20089h2
09h30009h3
M29EWH L L H L L H H X X 99h20099h2
19h30019h3
Block protection
status
L L H Block base
address
L H L X X 01h40001h4
00h50000h5
Notes: 1. H = Logic level HIGH (VIH); L = Logic level LOW (VIL); X = HIGH or LOW.
2. Micron-prelocked (permanent).
3. Customer-lockable.
4. Protected: 01h (in x8 mode) is output on DQ[7:0]; indicates that the extended memory
block is permanently prelocked by Micron.
5. Unprotected: 00h (in x8 mode) is output on DQ[7:0]; indicates that the extended memo-
ry block can be locked by customer.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
READ and AUTO SELECT Operations
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Bypass Operations
UNLOCK BYPASS Command
The UNLOCK BYPASS (20h) command is used to place the device in unlock bypass
mode. Three bus WRITE operations are required to issue the UNLOCK BYPASS com-
mand.
When the device enters unlock bypass mode, the two initial UNLOCK cycles required
for a standard PROGRAM or ERASE operation are not needed, thus enabling faster total
program or erase time.
The UNLOCK BYPASS command is used in conjunction with UNLOCK BYPASS PRO-
GRAM or UNLOCK BYPASS ERASE commands to program or erase the device faster
than with standard PROGRAM or ERASE commands. When the cycle time to the device
is long, considerable time savings can be gained by using these commands. When in
unlock bypass mode, only the following commands are valid:
The UNLOCK BYPASS PROGRAM command can be issued to program addresses
within the device.
The UNLOCK BYPASS BLOCK ERASE command can then be issued to erase one or
more memory blocks.
The UNLOCK BYPASS CHIP ERASE command can be issued to erase the whole mem-
ory array.
The UNLOCK BYPASS WRITE TO BUFFER PROGRAM command can be issued to
speed up programming operation.
The UNLOCK BYPASS RESET command can be issued to return the device to read
mode.
In unlock bypass mode, the device can be read as if in read mode.
In addition to the UNLOCK BYPASS command, when VPP/WP# is raised to VPPH, the de-
vice automatically enters unlock bypass mode. When V PP/WP# returns to VIH or VIL, the
device is no longer in unlock bypass mode and normal operation resumes. The transi-
tions from VIH to VPPH and from VPPH to VIH must be slower than tVHVPP (see the Accel-
erated Program, Data Polling/Toggle AC Characteristics).
Note: Micron recommends the user enter and exit unlock bypass mode using ENTER
UNLOCK BYPASS and UNLOCK BYPASS RESET commands rather than raising VPP/WP#
to VPPH. VPP/WP# should never be raised to VPPH from any mode except read mode; oth-
erwise, the device may be left in an indeterminate state.
UNLOCK BYPASS RESET Command
The UNLOCK BYPASS RESET (90/00h) command is used to return to read/reset mode
from unlock bypass mode. Two bus WRITE operations are required to issue the UN-
LOCK BYPASS RESET command. The READ/RESET command does not exit from un-
lock bypass mode.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Bypass Operations
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Program Operations
PROGRAM Command
The PROGRAM (A0h) command can be used to program a value to one address in the
memory array. The command requires four bus WRITE operations, and the final WRITE
operation latches the address and data in the internal state machine and starts the pro-
gram/erase controller. After programming has started, bus READ operations output the
status register content.
Programming can be suspended and then resumed by issuing a PROGRAM SUSPEND
command and a PROGRAM RESUME command, respectively.
If the address falls in a protected block, the PROGRAM command is ignored, and the
data remains unchanged. The status register is not read, and no error condition is given.
After the PROGRAM operation has completed, the device returns to read mode, unless
an error has occurred. When an error occurs, bus READ operations to the device contin-
ue to output the status register. A READ/RESET command must be issued to reset the
error condition and return the device to read mode.
The PROGRAM command cannot change a bit set to 0 back to 1, and an attempt to do
so is masked during a PROGRAM operation. Instead, an ERASE command must be used
to set all bits in one memory block or in the entire memory from 0 to 1.
The PROGRAM operation is aborted by performing a reset or by powering-down the de-
vice. In this case, data integrity cannot be ensured, and it is recommended that the
words or bytes that were aborted be reprogrammed.
UNLOCK BYPASS PROGRAM Command
When the device is in unlock bypass mode, the UNLOCK BYPASS PROGRAM (A0h)
command can be used to program one address in the memory array. The command re-
quires two bus WRITE operations instead of four required by a standard PROGRAM
command; the final WRITE operation latches the address and data and starts the pro-
gram/erase controller (The standard PROGRAM command requires four bus WRITE op-
erations). The PROGRAM operation using the UNLOCK BYPASS PROGRAM command
behaves identically to the PROGRAM operation using the PROGRAM command. The
operation cannot be aborted. A bus READ operation to the memory outputs the status
register.
WRITE TO BUFFER PROGRAM Command
The WRITE TO BUFFER PROGRAM (25h) command makes use of the 512-word pro-
gram buffer to speed up programming. A maximum of 512 words can be loaded into the
program buffer. The WRITE TO BUFFER PROGRAM command dramatically reduces
system programming time compared to the standard non-buffered PROGRAM com-
mand.
When issuing a WRITE TO BUFFER PROGRAM command, V PP/WP# can be either held
HIGH or raised to VPPH. Also, it can be held LOW if the block is not the lowest or highest
block, depending on the part number. The following successive steps are required to is-
sue the WRITE TO BUFFER PROGRAM command:
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Program Operations
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First, two UNLOCK cycles are issued. Next, a third bus WRITE cycle sets up the WRITE
TO BUFFER PROGRAM command. The set-up code can be addressed to any location
within the targeted block. Then, a fourth bus WRITE cycle sets up the number of words/
bytes to be programmed. Value n is written to the same block address, where n + 1 is the
number of words/bytes to be programmed. Value n + 1 must not exceed the size of the
program buffer, or the operation will abort. A fifth cycle loads the first address and data
to be programmed. Last, n bus WRITE cycles load the address and data for each word/
byte into the program buffer. Addresses must lie within the range from the start address
+1 to the start address + (n - 1).
Optimum programming performance and lower power usage are achieved by aligning
the starting address at the beginning of a 512-word boundary (A[8:0] = 0x000h). Any
buffer size smaller than 512 words is allowed within a 512-word boundary, while all ad-
dresses used in the operation must lie within the 512-word boundary. In addition, any
crossing boundary buffer program will result in a program abort. For a x8 device, maxi-
mum buffer size is 256 bytes; for a x16 device, the maximum buffer size is 1024 bytes.
To program the content of the program buffer, this command must be followed by a
WRITE TO BUFFER PROGRAM CONFIRM command.
If an address is written several times during a WRITE TO BUFFER PROGRAM operation,
the address/data counter will be decremented at each data load operation, and the data
will be programmed to the last word loaded into the buffer.
Invalid address combinations or the incorrect sequence of bus WRITE cycles will abort
the WRITE TO BUFFER PROGRAM command.
The status register bits DQ1, DQ5, DQ6, DQ7 can be used to monitor the device status
during a WRITE TO BUFFER PROGRAM operation.
The WRITE BUFFER PROGRAM command should not be used to change a bit set to 0
back to 1, and an attempt to do so is masked during the operation. Rather than the
WRITE BUFFER PROGRAM command, the ERASE command should be used to set
memory bits from 0 to 1.
Figure 9: Boundary Condition of Program Buffer Size
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Program Operations
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Figure 10: WRITE TO BUFFER PROGRAM Flowchart
Abort
WRITE TO BUFFER
Write buffer data,
start address
Start
X = n
Write n,1
block address
WRITE TO BUFFER
and PROGRAM
aborted2
Write to a different
block address
X = 0
Write next data,3
program address pair
WRITE TO BUFFER
confirm, block address
X = X - 1
Yes
No
Yes
No
DQ7 = Data
No
Yes
DQ5 = 1
Yes
No
DQ1 = 1 No
Yes
WRITE TO BUFFER
command,
block address
Read status register
(DQ1, DQ5, DQ7) at
last loaded address
DQ7 = Data4
No
Yes
Check status register
(DQ5, DQ7) at
last loaded address
Fail or
abort5End
First three cycles of the
WRITE TO BUFFER
PROGRAM command
Notes: 1. n + 1 is the number of addresses to be programmed.
2. The BUFFERED PROGRAM ABORT and RESET command must be issued to return the de-
vice to read mode.
3. When the block address is specified, any address in the selected block address space is
acceptable. However, when loading program buffer address with data, all addresses
must fall within the selected program buffer page.
4. DQ7 must be checked because DQ5 and DQ7 may change simultaneously.
5. If this flowchart location is reached because DQ5 = 1, then the WRITE TO BUFFER PRO-
GRAM command failed. If this flowchart location is reached because DQ1 = 1, then the
WRITE TO BUFFER PROGRAM command aborted. In both cases, the appropriate RESET
command must be issued to return the device to read mode: A RESET command if the
operation failed; a WRITE TO BUFFER PROGRAM ABORT AND RESET command if the op-
eration aborted.
6. See the Standard Command Definitions – Address-Data Cycles, 8-Bit and 16-Bit table for
details about the WRITE TO BUFFER PROGRAM command sequence.
UNLOCK BYPASS WRITE TO BUFFER PROGRAM Command
When the device is in unlock bypass mode, the UNLOCK BYPASS WRITE TO BUFFER
(25h) command can be used to program the device in fast program mode. The com-
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Program Operations
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mand requires two bus WRITE operations fewer than the standard WRITE TO BUFFER
PROGRAM command.
The UNLOCK BYPASS WRITE TO BUFFER PROGRAM command behaves the same way
as the WRITE TO BUFFER PROGRAM command: the operation cannot be aborted, and
a bus READ operation to the memory outputs the status register.
The WRITE TO BUFFER PROGRAM CONFIRM command is used to confirm an UN-
LOCK BYPASS WRITE TO BUFFER PROGRAM command and to program the n + 1
words/bytes loaded in the program buffer by this command.
WRITE TO BUFFER PROGRAM CONFIRM Command
The WRITE TO BUFFER PROGRAM CONFIRM (29h) command is used to confirm a
WRITE TO BUFFER PROGRAM command and to program the n + 1 words/bytes loaded
in the program buffer by this command.
BUFFERED PROGRAM ABORT AND RESET Command
A BUFFERED PROGRAM ABORT AND RESET (F0h) command must be issued to reset
the device to read mode when the BUFFER PROGRAM operation is aborted. The buffer
programming sequence can be aborted in the following ways:
Load a value that is greater than the page buffer size during the number of locations
to program in the WRITE TO BUFFER PROGRAM command.
Write to an address in a different block than the one specified during the WRITE BUF-
FER LOAD command.
Write an address/data pair to a different write buffer page than the one selected by
the starting address during the program buffer data loading stage of the operation.
Write data other than the CONFIRM command after the specified number of data
load cycles.
The abort condition is indicated by DQ1 = 1, DQ7 = DQ7# (for the last address location
loaded), DQ6 = toggle, and DQ5 = 0 (all of which are status register bits). A BUFFERED
PROGRAM ABORT and RESET command sequence must be written to reset the device
for the next operation.
Note: The full three-cycle BUFFERED PROGRAM ABORT and RESET command se-
quence is required when using buffer programming features in unlock bypass mode.
PROGRAM SUSPEND Command
The PROGRAM SUSPEND (B0h) command can be used to interrupt a program opera-
tion so that data can be read from any block. When the PROGRAM SUSPEND command
is issued during a program operation, the device suspends the operation within the pro-
gram suspend latency time and updates the status register bits.
After the program operation has been suspended, data can be read from any address.
However, data is invalid when read from an address where a program operation has
been suspended.
The PROGRAM SUSPEND command may also be issued during a PROGRAM operation
while an erase is suspended. In this case, data may be read from any address not in
erase suspend or program suspend mode. To read from the extended memory block
area (one-time programmable area), the ENTER/EXIT EXTENDED MEMORY BLOCK
command sequences must be issued.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Program Operations
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The system may also issue the AUTO SELECT command sequence when the device is in
program suspend mode. The system can read as many auto select codes as required.
When the device exits auto select mode, the device reverts to program suspend mode
and is ready for another valid operation.
The PROGRAM SUSPEND operation is aborted by performing a device reset or power-
down. In this case, data integrity cannot be ensured, and it is recommended that the
words or bytes that were aborted be reprogrammed.
PROGRAM RESUME Command
The PROGRAM RESUME (30h) command must be issued to exit a program suspend
mode and resume a PROGRAM operation. The controller can use DQ7 or DQ6 status
bits to determine the status of the PROGRAM operation. After a PROGRAM RESUME
command is issued, subsequent PROGRAM RESUME commands are ignored. Another
PROGRAM SUSPEND command can be issued after the device has resumed program-
ming.
Erase Operations
CHIP ERASE Command
The CHIP ERASE (80/10h) command erases the entire chip. Six bus WRITE operations
are required to issue the command and start the program/erase controller.
Protected blocks are not erased. If all blocks are protected, the CHIP ERASE operation
appears to start, but will terminate within approximately100μs, leaving the data un-
changed. No error is reported when protected blocks are not erased.
During the CHIP ERASE operation, the device ignores all other commands, including
ERASE SUSPEND. It is not possible to abort the operation. All bus READ operations dur-
ing CHIP ERASE output the status register on the data I/Os. See the Status Register sec-
tion for more details.
After the CHIP ERASE operation completes, the device returns to read mode, unless an
error has occurred. If an error occurs, the device will continue to output the status regis-
ter. A READ/RESET command must be issued to reset the error condition and return to
read mode.
The CHIP ERASE command sets all of the bits in unprotected blocks of the device to 1.
All previous data is lost.
The operation is aborted by performing a reset or by powering-down the device. In this
case, data integrity cannot be ensured, and it is recommended that the entire chip be
erased again.
UNLOCK BYPASS CHIP ERASE Command
When the device is in unlock bypass mode, the UNLOCK BYPASS CHIP ERASE (80/10h)
command can be used to erase all memory blocks at one time. The command requires
only two bus WRITE operations instead of six using the standard CHIP ERASE com-
mand. The final bus WRITE operation starts the program/erase controller.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Erase Operations
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The UNLOCK BYPASS CHIP ERASE command behaves the same way as the CHIP
ERASE command: the operation cannot be aborted, and a bus READ operation to the
memory outputs the status register.
BLOCK ERASE Command
The BLOCK ERASE (80/30h) command erases a list of one or more blocks. It sets all of
the bits in the unprotected selected blocks to 1. All previous data in the selected blocks
is lost.
Six bus WRITE operations are required to select the first block in the list. Each addition-
al block in the list can be selected by repeating the sixth bus WRITE operation using the
address of the additional block. After the command sequence is written, a block erase
timeout occurs. During the timeout period, additional block addresses and BLOCK
ERASE commands can be written. After the program/erase controller has started, it is
not possible to select any more blocks. Each additional block must therefore be selected
within the timeout period of the last block. The timeout timer restarts when an addi-
tional block is selected. After the sixth bus WRITE operation, a bus READ operation out-
puts the status register. See the WE#-Controlled Program waveforms for details on how
to identify if the program/erase controller has started the BLOCK ERASE operation.
After the BLOCK ERASE operation completes, the device returns to read mode, unless
an error has occurred. If an error occurs, bus READ operations will continue to output
the status register. A READ/RESET command must be issued to reset the error condi-
tion and return to read mode.
If any selected blocks are protected, they are ignored, and all the other selected blocks
are erased. If all of the selected blocks are protected, the BLOCK ERASE operation ap-
pears to start, but will terminate within approximately100μs, leaving the data un-
changed. No error condition is given when protected blocks are not erased.
During the BLOCK ERASE operation, the device ignores all commands except the
ERASE SUSPEND command and the READ/RESET command, which is accepted only
during the timeout period. The operation is aborted by performing a reset or powering-
down the device. In this case, data integrity cannot be ensured, and it is recommended
that the aborted blocks be erased again.
UNLOCK BYPASS BLOCK ERASE Command
When the device is in unlock bypass mode, the UNLOCK BYPASS BLOCK ERASE
(80/30h) command can be used to erase one or more memory blocks at a time. The
command requires two bus WRITE operations instead of six using the standard BLOCK
ERASE command. The final bus WRITE operation latches the address of the block and
starts the program/erase controller.
To erase multiple blocks (after the first two bus WRITE operations have selected the first
block in the list), each additional block in the list can be selected by repeating the sec-
ond bus WRITE operation using the address of the additional block.
The UNLOCK BYPASS BLOCK ERASE command behaves the same way as the BLOCK
ERASE command: the operation cannot be aborted, and a bus READ operation to the
memory outputs the status register. See the BLOCK ERASE Command section for de-
tails.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Erase Operations
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ERASE SUSPEND Command
The ERASE SUSPEND (B0h) command temporarily suspends a BLOCK ERASE opera-
tion. One bus WRITE operation is required to issue the command. The block address is
"Don't Care."
The program/erase controller suspends the ERASE operation within the erase suspend
latency time of the ERASE SUSPEND command being issued. However, when the
ERASE SUSPEND command is written during the block erase timeout, the device im-
mediately terminates the timeout period and suspends the ERASE operation. After the
program/erase controller has stopped, the device operates in read mode, and the erase
is suspended.
During an ERASE SUSPEND operation, it is possible to read and execute PROGRAM op-
erations or WRITE TO BUFFER PROGRAM operations in blocks that are not suspended.
Both READ and PROGRAM operations behave normally on these blocks. Reading from
blocks that are suspended will output the status register. If any attempt is made to pro-
gram in a protected block or in the suspended block, the PROGRAM command is ignor-
ed, and the data remains unchanged. In this case, the status register is not read, and no
error condition is given.
It is also possible to issue AUTO SELECT, READ CFI, and UNLOCK BYPASS commands
during an ERASE SUSPEND operation. The READ/RESET command must be issued to
return the device to read array mode before the RESUME command will be accepted.
During an ERASE SUSPEND operation, a bus READ operation to the extended memory
block will output the extended memory block data. After the device enters extended
memory block mode, the EXIT EXTENDED MEMORY BLOCK command must be issued
before the ERASE operation can be resumed.
An ERASE SUSPEND command is ignored if it is written during a CHIP ERASE opera-
tion.
If the ERASE SUSPEND operation is aborted by performing a device reset or power-
down, data integrity cannot be ensured, and it is recommended that the suspended
blocks be erased again.
ERASE RESUME Command
The ERASE RESUME (30h) command restarts the program/erase controller after an
ERASE SUSPEND operation.
The device must be in read array mode before the RESUME command will be accepted.
An erase can be suspended and resumed more than once.
BLANK CHECK Operation
BLANK CHECK Commands
Two commands are required to execute a BLANK CHECK operation: BLANK CHECK
SETUP (EB/76h) and BLANK CHECK CONFIRM AND READ (29h).
The BLANK CHECK operation determines whether a specified block is blank (that is,
completely erased). It can also be used to determine whether a previous ERASE opera-
tion was successful, including ERASE operations that might have been interrupted by
power loss.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
BLANK CHECK Operation
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The BLANK CHECK operation checks for cells that are programmed or over-erased. If it
finds any, it returns a failure status, indicating that the block is not blank. If it returns a
passing status, the block is guaranteed blank (all 1s) and is ready to program.
Before executing, the ERASE operation initiates a BLANK CHECK operation, and if the
target block is blank, the ERASE operation is skipped, benefitting overall cycle perform-
ance; otherwise, the ERASE operation continues.
The BLANK CHECK operation can occur in only one block at a time, and during its exe-
cution, reading the status register is the only other operation allowed. Reading from any
address in the device enables reading the status register to monitor blank check pro-
gress or errors. Operations such as READ (array data), PROGRAM, ERASE, and any sus-
pended operation are not allowed.
After the BLANK CHECK operation has completed, the device returns to read mode un-
less an error has occurred. When an error occurs, the device continues to output status
register data. A READ/RESET command must be issued to reset the error condition and
return the device to read mode.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
BLANK CHECK Operation
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Block Protection Command Definitions – Address-Data Cycles
Table 13: Block Protection Command Definitions – Address-Data Cycles, 8-Bit and 16-Bit
Notes 1 and 2 apply to entire table
Command and
Code/Subcode
Bus
Size
Address and Data Cycles
Notes
1st 2nd 3rd 4th
nth
A D A D A D A D A D
LOCK REGISTER Commands
ENTER LOCK REGISTER
COMMAND SET (40h)
x8 AAA AA 555 55 AAA 40 3
x16 555 AA 2AA 55 555
PROGRAM LOCK REGISTER
(A0h)
x8 X A0 X Data 5
x16
READ LOCK REGISTER x8 X Data 4, 5, 6
x16
PASSWORD PROTECTION Commands
ENTER PASSWORD
PROTECTION COMMAND
SET (60h)
x8 AAA AA 555 55 AAA 60 3
x16 555 AA 2AA 55 555
PROGRAM PASSWORD
(A0h)
x8 X A0 PWAn PWDn 7
x16
READ PASSWORD x8 00 PWD0 01 PWD1 02 PWD2 03 PWD3 07 PWD7 4, 6, 8,
9
x16 00 PWD0 01 PWD1 02 PWD2 03 PWD3
UNLOCK PASSWORD
(25h/03)
x8 00 25 00 03 00 PWD0 01 PWD1 00 29 8, 10
x16
NONVOLATILE PROTECTION Commands
ENTER NONVOLATILE
PROTECTION COMMAND
SET (C0h)
x8 AAA AA 555 55 AAA C0 3
x16 555 AA 2AA 55 555
PROGRAM NONVOLATILE
PROTECTION BIT (A0h)
x8 X A0 BAd 00 11
x16
READ NONVOLATILE
PROTECTION BIT STATUS
x8 BAd READ(0) 4, 6,
11
x16
CLEAR ALL NONVOLATILE
PROTECTION BITS (80/30h)
x8 X 80 00 30 12
x16
NONVOLATILE PROTECTION BIT LOCK BIT Commands
ENTER NONVOLATILE
PROTECTION BIT LOCK BIT
COMMAND SET (50h)
x8 AAA AA 555 55 AAA 50 3
x16 555 AA 2AA 55 555
PROGRAM NONVOLATILE
PROTECTION BIT LOCK BIT
(A0h)
x8 X A0 X 00 11
x16
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Block Protection Command Definitions – Address-Data Cycles
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Table 13: Block Protection Command Definitions – Address-Data Cycles, 8-Bit and 16-Bit (Continued)
Notes 1 and 2 apply to entire table
Command and
Code/Subcode
Bus
Size
Address and Data Cycles
Notes
1st 2nd 3rd 4th
nth
A D A D A D A D A D
READ NONVOLATILE
PROTECTION BIT LOCK BIT
STATUS
x8 X READ(0) 4, 6,
11
x16
VOLATILE PROTECTION Commands
ENTER VOLATILE
PROTECTION COMMAND
SET (E0h)
x8 AAA AA 555 55 AAA E0 3
x16 555 AA 2AA 55 555
PROGRAM VOLATILE
PROTECTION BIT (A0h)
x8 X A0 BAd 00 11
x16
READ VOLATILE
PROTECTION BIT STATUS
x8 BAd READ(0) 4, 6
x16
CLEAR VOLATILE
PROTECTION BIT (A0h)
x8 X A0 BAd 01 11
x16
EXTENDED MEMORY BLOCK Commands
ENTER EXTENDED
MEMORY BLOCK (88h)
x8 AAA AA 555 55 AAA 88 3
x16 555 AA 2AA 55 555
EXIT EXTENDED
MEMORY BLOCK (90/00h)
x8 AAA AA 555 55 AAA 90 X 00
x16 555 AA 2AA 55 555
EXIT PROTECTION Commands
EXIT PROTECTION
COMMAND SET (90/00h)
x8 X 90 X 00 3
x16
Notes: 1. Key: A = Address and D = Data; X = "Don’t Care;" BAd = any address in the block; PWDn
= password bytes 0 to 7; PWAn = password address, n = 0 to 7; Gray = not applicable. All
values in the table are hexadecimal.
2. DQ[15:8] are "Don’t Care" during UNLOCK and COMMAND cycles. A[MAX:16] are
"Don’t Care" during UNLOCK and COMMAND cycles, unless an address is required.
3. The ENTER command sequence must be issued prior to any operation. It disables READ
and WRITE operations from and to block 0. READ and WRITE operations from and to
any other block are allowed. Also, when an ENTER COMMAND SET command is issued,
an EXIT PROTECTION COMMAND SET command must be issued to return the device to
READ mode.
4. READ REGISTER/PASSWORD commands have no command code; CE# and OE# are driven
LOW and data is read according to a specified address.
5. Data = Lock register content.
6. All address cycles shown for this command are READ cycles.
7. Only one portion of the password can be programmed or read by each PROGRAM PASS-
WORD command.
8. Each portion of the password can be entered or read in any order as long as the entire
64-bit password is entered or read.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Block Protection Command Definitions – Address-Data Cycles
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9. For the x8 READ PASSWORD command, the nth (and final) address cycle equals the 8th
address cycle. From the 5th to the 8th address cycle, the values for each address and da-
ta pair continue the pattern shown in the table as follows: for x8, address and data = 04
and PWD4; 05 and PWD5; 06 and PWD6; 07 and PWD7.
10. For the x8 UNLOCK PASSWORD command, the nth (and final) address cycle equals the
11th address cycle. From the 5th to the 10th address cycle, the values for each address
and data pair continue the pattern shown in the table as follows: address and data = 02
and PWD2; 03 and PWD3; 04 and PWD4; 05 and PWD5; 06 and PWD6; 07 and PWD7.
For the x16 UNLOCK PASSWORD command, the nth (and final) address cycle equals the
7th address cycle. For the 5th and 6th address cycles, the values for the address and data
pair continue the pattern shown in the table as follows: address and data = 02 and
PWD2; 03 and PWD3.
11. Both nonvolatile and volatile protection bit settings are as follows: Protected state = 00;
Unprotected state= 01.
12. The CLEAR ALL NONVOLATILE PROTECTION BITS command programs all nonvolatile pro-
tection bits before erasure. This prevents over-erasure of previously cleared nonvolatile
protection bits.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Block Protection Command Definitions – Address-Data Cycles
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Protection Operations
Blocks can be protected individually against accidental PROGRAM, ERASE, or READ op-
erations on both 8-bit and 16-bit configurations. The block protection scheme is shown
in the Software Protection Scheme figure.
Memory block and extended memory block protection is configured through the lock
register (see Lock Register section).
LOCK REGISTER Commands
After the ENTER LOCK REGISTER COMMAND SET (40h) command has been issued, all
bus READ or PROGRAM operations can be issued to the lock register.
The PROGRAM LOCK REGISTER (A0h) command allows the lock register to be config-
ured. The programmed data can then be checked with a READ LOCK REGISTER com-
mand by driving CE# and OE# LOW with the appropriate address data on the address
bus.
PASSWORD PROTECTION Commands
After the ENTER PASSWORD PROTECTION COMMAND SET (60h) command has been
issued, the commands related to password protection mode can be issued to the device.
The PROGRAM PASSWORD (A0h) command is used to program the 64-bit password
used in the password protection mode. To program the 64-bit password, the complete
command sequence must be entered eight times at eight consecutive addresses selec-
ted by A[1:0] plus DQ15/A-1 in 8-bit mode, or four times at four consecutive addresses
selected by A[1:0] in 16-bit mode. By default, all password bits are set to 1. The password
can be checked by issuing a READ PASSWORD command.
Note: To use the password protection feature on the 2Gb device, the password must be
programmed to both upper die and lower die.
The READ PASSWORD command is used to verify the password used in password pro-
tection mode. To verify the 64-bit password, the complete command sequence must be
entered eight times at eight consecutive addresses selected by A[1:0] plus DQ15/A-1 in
8-bit mode, or four times at four consecutive addresses selected by A[1:0] in 16-bit
mode. If the password mode lock bit is programmed and the user attempts to read the
password, the device will output FFh onto the I/O data bus.
The UNLOCK PASSWORD (25/03h) command is used to clear the nonvolatile protec-
tion bit lock bit, allowing the nonvolatile protection bits to be modified. The UNLOCK
PASSWORD command must be issued, along with the correct password, and requires a
1μs delay between successive UNLOCK PASSWORD commands in order to prevent
hackers from cracking the password by trying all possible 64-bit combinations. If this
delay does not occur, the latest command will be ignored. Approximately 1μs is required
for unlocking the device after the valid 64-bit password has been provided.
NONVOLATILE PROTECTION Commands
After the ENTER NONVOLATILE PROTECTION COMMAND SET (C0h) command has
been issued, the commands related to nonvolatile protection mode can be issued to the
device.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Protection Operations
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A block can be protected from program or erase by issuing a PROGRAM NONVOLATILE
PROTECTION BIT (A0h) command, along with the block address. This command sets
the nonvolatile protection bit to 0 for a given block.
The status of a nonvolatile protection bit for a given block or group of blocks can be
read by issuing a READ NONVOLATILE MODIFY PROTECTION BIT command, along
with the block address.
The nonvolatile protection bits are erased simultaneously by issuing a CLEAR ALL
NONVOLATILE PROTECTION BITS (80/30h) command. No specific block address is re-
quired. If the nonvolatile protection bit lock bit is set to 0, the command fails.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Protection Operations
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Figure 11: Program/Erase Nonvolatile Protection Bit Algorithm
No
No
Yes
Yes
DQ6 = Toggle
ENTER Nonvolatile
Protection
COMMAND SET
Start
PROGRAM Nonvolatile
Protection Bit
Addr = BAd
Fail
Read byte twice
Addr = BAd
Read byte twice
Addr = BAd
No
No
Yes
Yes
DQ6 = Toggle
Reset
DQ5 = 1
EXIT PROTECTION
COMMAND SET
DQ0 =
1 (erase)
0 (program)
Read byte twice
Addr = BAd
Wait 500µs
Pass
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Protection Operations
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NONVOLATILE PROTECTION BIT LOCK BIT Commands
After the ENTER NONVOLATILE PROTECTION BIT LOCK BIT COMMAND SET (50h)
command has been issued, the commands that allow the nonvolatile protection bit lock
bit to be set can be issued to the device.
The PROGRAM NONVOLATILE PROTECTION BIT LOCK BIT (A0h) command is used to
set the nonvolatile protection bit lock bit to 0, thus locking the nonvolatile protection
bits and preventing them from being modified.
The READ NONVOLATILE PROTECTION BIT LOCK BIT STATUS command is used to
read the status of the nonvolatile protection bit lock bit.
VOLATILE PROTECTION Commands
After the ENTER VOLATILE PROTECTION COMMAND SET (E0h) command has been
issued, commands related to the volatile protection mode can be issued to the device.
The PROGRAM VOLATILE PROTECTION BIT (A0h) command individually sets a vola-
tile protection bit to 0 for a given block. If the nonvolatile protection bit for the same
block is set, the block is locked regardless of the value of the volatile protection bit. (See
the Block Protection Status table.)
The status of a volatile protection bit for a given block can be read by issuing a READ
VOLATILE PROTECTION BIT STATUS command along with the block address.
The CLEAR VOLATILE PROTECTION BIT (A0h) command individually clears (sets to 1)
the volatile protection bit for a given block. If the nonvolatile protection bit for the same
block is set, the block is locked regardless of the value of the volatile protection bit. (See
the Block Protection Status table.)
EXTENDED MEMORY BLOCK Commands
The device has one extra 128-word extended memory block that can be accessed only
by the ENTER EXTENDED MEMORY BLOCK (88h) command. The extended memory
block is 128 words (x16) or 256 bytes (x8). It is used as a security block to provide a per-
manent 128-bit security identification number or to store additional information. The
device can be shipped with the extended memory block prelocked permanently by Mi-
cron, including the 128-bit security identification number. Or, the device can be ship-
ped with the extended memory block unlocked, enabling customers to permanently
program and lock it. (See Lock Register, the AUTO SELECT command, and the Block
Protection table.)
Table 14: Extended Memory Block Address and Data
Address Data
x8 x16 Micron prelocked Customer Lockable
000000h–00000Fh 000000h–000007h Secure ID number Determined by customer Secure ID number
000010h–0000FFh 000008h–00007Fh Protected and
unavailable
Determined by customer
After the ENTER EXTENDED MEMORY BLOCK command has been issued, the device
enters the extended memory block mode. All bus READ or PROGRAM operations are
conducted on the extended memory block, and the extended memory block is ad-
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Protection Operations
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dressed using the addresses occupied by block 0 in the other operating modes (see the
Memory Map table).
In extended memory block mode, ERASE, CHIP ERASE, ERASE SUSPEND, and ERASE
RESUME commands are not allowed. The extended memory block cannot be erased,
and each bit of the extended memory block can only be programmed once.
The extended memory block is protected from further modification by programming
lock register bit 0. Once invoked, this protection cannot be undone.
The device remains in extended memory block mode until the EXIT EXTENDED MEM-
ORY BLOCK (90/00h) command is issued, which returns the device to read mode, or
until power is removed from the device. After a power-up sequence or hardware reset,
the device will revert to reading memory blocks in the main array.
EXIT PROTECTION Command
The EXIT PROTECTION COMMAND SET (90/00h) command is used to exit the lock
register, password protection, nonvolatile protection, volatile protection, and nonvola-
tile protection bit lock bit command set modes and return the device to read mode.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Protection Operations
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Device Protection
Hardware Protection
The VPP/WP# function provides a hardware method of protecting the highest or lowest
block. When V PP/WP# is LOW, PROGRAM and ERASE operations on either of these
blocks is ignored to provide protection. When V PP/WP# is HIGH, the device reverts to
the previous protection status for the highest or lowest block. PROGRAM and ERASE
operations can modify the data in this block unless the block is protected using block
protection.
Note: Micron highly recommends driving VPP/WP# HIGH or LOW. If a system needs to
float the VPP/WP# pin, without a pull-up/pull-down resistor and no capacitor, then an
internal pull-up resistor is enabled.
Table 15: VPP/WP# Functions
VPP/WP# Settings Function
VIL Highest or lowest block is protected; for a 2Gb device, both the highest and the lowest
blocks are hardware-protected (block 0 and block 2047).
VIH Highest or lowest block is unprotected unless software protection is activated.
Software Protection
Four software protection modes are available:
Volatile protection
Nonvolatile protection
Password protection
Password access
The device is shipped with all blocks unprotected. On first use, the device defaults to
the nonvolatile protection mode but can be activated in either the nonvolatile protec-
tion or password protection mode.
The desired protection mode is activated by setting either the nonvolatile protection
mode lock bit or the password protection mode lock bit of the lock register (see the Lock
Register section). Both bits are one-time-programmable and nonvolatile; therefore, af-
ter the protection mode has been activated, it cannot be changed, and the device is set
permanently to operate in the selected protection mode. It is recommended that the
desired software protection mode be activated when first programming the device.
For the lowest and highest blocks, a higher level of block protection can be achieved by
locking the blocks using nonvolatile protection mode and holding VPP /WP# LOW.
Blocks with volatile protection and nonvolatile protection can coexist within the memo-
ry array. If the user attempts to program or erase a protected block, the device ignores
the command and returns to read mode.
The block protection status can be read by performing a read electronic signature or by
issuing an AUTO SELECT command (see the Block Protection table).
Refer to the Block Protection Status table and the Software Protection Scheme figure for
details on the block protection scheme. Refer to the Protection Operations section for a
description of the command sets.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Device Protection
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Volatile Protection Mode
Volatile protection enables the software application to protect blocks against inadver-
tent change and can be disabled when changes are needed. Volatile protection bits are
unique for each block and can be individually modified. Volatile protection bits control
the protection scheme only for unprotected blocks whose nonvolatile protection bits
are cleared to 1. Issuing a PROGRAM VOLATILE PROTECTION BIT or CLEAR VOLATILE
PROTECTION BIT command sets to 0 or clears to 1 the volatile protection bits and pla-
ces the associated blocks in the protected (0) or unprotected (1) state, respectively. The
volatile protection bit can be set or cleared as often as needed.
When the device is first shipped, or after a power-up or hardware reset, the volatile pro-
tection bits default to 1 (unprotected).
Nonvolatile Protection Mode
A nonvolatile protection bit is assigned to each block. Each of these bits can be set for
protection individually by issuing a PROGRAM NONVOLATILE PROTECTION BIT com-
mand. Also, each device has one global volatile bit called the nonvolatile protection bit
lock bit; it can be set to protect all nonvolatile protection bits at once. This global bit
must be set to 0 only after all nonvolatile protection bits are configured to the desired
settings. When set to 0, the nonvolatile protection bit lock bit prevents changes to the
state of the nonvolatile protection bits. When cleared to 1, the nonvolatile protection
bits can be set and cleared using the PROGRAM NONVOLATILE PROTECTION BIT and
CLEAR ALL NONVOLATILE PROTECTION BITS commands, respectively.
No software command unlocks the nonvolatile protection bit lock bit unless the device
is in password protection mode; in nonvolatile protection mode, the nonvolatile protec-
tion bit lock bit can be cleared only by taking the device through a hardware reset or
power-up.
Nonvolatile protection bits cannot be cleared individually; they must be cleared all at
once using a CLEAR ALL NONVOLATILE PROTECTION BITS command. They will re-
main set through a hardware reset or a power-down/power-up sequence.
If one of the nonvolatile protection bits needs to be cleared (unprotected), additional
steps are required: First, the nonvolatile protection bit lock bit must be cleared to 1, us-
ing either a power-cycle or hardware reset. Then, the nonvolatile protection bits can be
changed to reflect the desired settings. Finally, the nonvolatile protection bit lock bit
must be set to 0 to lock the nonvolatile protection bits. The device now will operate nor-
mally.
To achieve the best protection, the PROGRAM NONVOLATILE PROTECTION LOCK BIT
command should be executed early in the boot code, and the boot code should be pro-
tected by holding VPP/WP# LOW.
Nonvolatile protection bits and volatile protection bits have the same function when
VPP/WP# is HIGH or when VPP/WP# is at the voltage for program acceleration (VPPH ).
Password Protection Mode
The password protection mode provides a higher level of security than the nonvolatile
protection mode by requiring a 64-bit password to unlock the nonvolatile protection bit
lock bit. In addition to this password requirement, the nonvolatile protection bit lock
bit is set to 0 after power-up and reset to maintain the device in password protection
mode.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Device Protection
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Executing the UNLOCK PASSWORD command by entering the correct password clears
the nonvolatile protection bit lock bit, enabling the block nonvolatile protection bits to
be modified. If the password provided is incorrect, the nonvolatile protection bit lock
bit remains locked, and the state of the nonvolatile protection bits cannot be modified.
To place the device in password protection mode, the following two steps are required:
First, before activating the password protection mode, a 64-bit password must be set
and the setting verified. Password verification is allowed only before the password pro-
tection mode is activated. Next, password protection mode is activated by program-
ming the password protection mode lock bit to 0. This operation is irreversible. After the
bit is programmed, it cannot be erased, the device remains permanently in password
protection mode, and the 64-bit password can be neither retrieved nor reprogrammed.
In addition, all commands to the address where the password is stored are disabled.
Note: There is no means to verify the password after password protection mode is ena-
bled. If the password is lost after enabling the password protection mode, there is no
way to clear the nonvolatile protection bit lock bit.
Password Access
Password access is a security enhancement that protects information stored in the main
array blocks by preventing content alteration or reads until a valid 64-bit password is
received. Password access may be combined with nonvolatile and/or volatile protection
to create a multi-tiered solution. Contact your Micron sales representative for further
details.
Figure 12: Software Protection Scheme
1 = unprotected (default)
0 = protected
1 = unprotected
0 = protected
(Default setting depends on the product order option)
Volatile protection bit Nonvolatile protection bit
1 = unlocked (default, after power-up or hardware reset)
0 = locked
Nonvolatile protection bit lock bit (volatile)
Nonvolatile protection
mode
Password protection
mode
Volatile
protection
Nonvolatile
protection
Array block
Notes: 1. Volatile protection bits are programmed and cleared individually. Nonvolatile protection
bits are programmed individually and cleared collectively.
2. Once programmed to 0, the nonvolatile protection bit lock bit can be reset to 1 only by
taking the device through a power-up or hardware reset.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Device Protection
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Common Flash Interface
The common Flash interface (CFI) is a JEDEC-approved, standardized data structure
that can be read from the Flash memory device. It allows a system's software to query
the device to determine various electrical and timing parameters, density information,
and functions supported by the memory. The system can interface easily with the de-
vice, enabling the software to upgrade itself when necessary.
When the READ CFI command is issued, the device enters CFI query mode and the data
structure is read from memory. The following tables show the addresses (A-1, A[7:0])
used to retrieve the data. The query data is always presented on the lowest order data
outputs (DQ[7:0]), and the other data outputs (DQ[15:8]) are set to 0.
Table 16: Query Structure Overview
Note 1 applies to the entire table
Address
Subsection Name Descriptionx16 x8
10h 20h CFI query identification string Command set ID and algorithm data offset
1Bh 36h System interface information Device timing and voltage information
27h 4Eh Device geometry definition Flash device layout
40h 80h Primary algorithm-specific extended query table Additional information specific to the primary al-
gorithm (optional)
Note: 1. Query data are always presented on the lowest order data outputs (DQ[7:0]). DQ[15:8]
are set to 0.
Table 17: CFI Query Identification String
Note 1 applies to the entire table
Address
Data Description Valuex16 x8
10h 20h 0051h Query unique ASCII string "QRY" "Q"
11h 22h 0052h "R"
12h 24h 0059h "Y"
13h
14h
26h
28h
0002h
0000h
Primary algorithm command set and control interface ID code 16-bit ID
code defining a specific algorithm
15h
16h
2Ah
2Ch
0040h
0000h
Address for primary algorithm extended query table (see the Primary Algo-
rithm-Specific Extended Query Table)
P = 40h
17h
18h
2Eh
30h
0000h
0000h
Alternate vendor command set and control interface ID code second ven-
dor-specified algorithm supported
19h
1Ah
32h
34h
0000h
0000h
Address for alternate algorithm extended query table
Note: 1. Query data are always presented on the lowest order data outputs (DQ[7:0]). DQ[15:8]
are set to 0.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Common Flash Interface
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Table 18: CFI Query System Interface Information
Note 1 applies to the entire table
Address
Data Description Valuex16 x8
1Bh 36h 0027h VCC logic supply minimum program/erase voltage
Bits[7:4] BCD value in volts
Bits[3:0] BCD value in 100mV
2.7V
1Ch 38h 0036h VCC logic supply maximum program/erase voltage
Bits[7:4] BCD value in volts
Bits[3:0] BCD value in 100mV
3.6V
1Dh 3Ah 00B5h VPPH (programming) supply minimum program/erase voltage
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
11.5V
1Eh 3Ch 00C5h VPPH (programming) supply maximum program/erase voltage
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 10mV
12.5V
1Fh 3Eh 0009h Typical timeout for single byte/word program = 2nμs 512µs
20h 40h 000Ah Typical timeout for maximum size buffer program = 2nμs 1024µs
21h 42h 000Ah Typical timeout per individual block erase = 2nms 1s
22h 44h 0012h Typical timeout for full chip erase = 2nms 256Mb: 262s
0013h 512Mb: 524s
0014h 1Gb: 1048s
0015h 2Gb: 2097s
23h 46h 0001h Maximum timeout for byte/word program = 2n times typical 1024µs
24h 48h 0002h Maximum timeout for buffer program = 2n times typical 4096µs
25h 4Ah 0002h Maximum timeout per individual block erase = 2n times typical 4s
26h 4Ch 0002h Maximum timeout for chip erase = 2n times typical 256Mb: 1048s
0002h 512Mb: 2096s
0002h 1Gb: 4194s
0002h 2Gb: 8388s
Note: 1. The values in this table are valid for both packages.
Table 19: Device Geometry Definition
Address
Data Description Valuex16 x8
27h 4Eh 0019h Device size = 2n in number of bytes 32MB
001Ah 64MB
001Bh 128MB
001Ch 256MB
28h
29h
50h
52h
0002h
0000h
Flash device interface code description x8, x16
asynchronous
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Common Flash Interface
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Table 19: Device Geometry Definition (Continued)
Address
Data Description Valuex16 x8
2Ah
2Bh
54h
56h
000Ah
0000h
Maximum number of bytes in multi-byte program or page =
2n
10241
2Ch 58h 0001h Number of erase block regions. It specifies the number of
regions containing contiguous erase blocks of the same size.
1
2Dh
2Eh
5Ah
5Ch
00FFh
0000h
Erase block region 1 information
Number of identical-size erase blocks = 00FFh + 1 / 01FFh +
1 / 03FFh + 1 / 07FFh + 1
256
00FFh
0001h
512
00FFh
0003h
1024
00FFh
0007h
2048
2Fh
30h
5Eh
60h
0000h
0002h
Erase block region 1 information
Block size in region 1 = 0200h × 256 bytes
128KB
31h
32h
33h
34h
62h
64h
66h
68h
0000h
0000h
0000h
0000h
Erase block region 2 information 0
35h
36h
37h
38h
6Ah
6Ch
6Eh
70h
0000h
0000h
0000h
0000h
Erase block region 3 information 0
39h
3Ah
3Bh
3Ch
72h
74h
76h
78h
0000h
0000h
0000h
0000h
Erase block region 4 information 0
Note: 1. For x16/x8 mode, the maximum buffer size is 1024/256 bytes, respectively.
Table 20: Primary Algorithm-Specific Extended Query Table
Note 1 applies to the entire table
Address
Data Description Valuex16 x8
40h 80h 0050h Primary algorithm extended query table unique ASCII string “PRI” "P"
41h 82h 0052h "R"
42h 84h 0049h "I"
43h 86h 0031h Major version number, ASCII "1"
44h 88h 0033h Minor version number, ASCII "3"
45h 8Ah 0018h Address sensitive unlock (bits[1:0]):
00 = Required
01 = Not required
Silicon revision number (bits[7:2])
Required
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Common Flash Interface
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Table 20: Primary Algorithm-Specific Extended Query Table (Continued)
Note 1 applies to the entire table
Address
Data Description Valuex16 x8
46h 8Ch 0002h Erase suspend:
00 = Not supported
01 = Read only
02 = Read and write
2
47h 8Eh 0001h Block protection:
00 = Not supported
x = Number of blocks per group
1
48h 90h 0000h Temporary block unprotect:
00 = Not supported
01 = Supported
Not supported
49h 92h 0008h Block protect/unprotect:
08 = M29EWH/M29EWL
8
4Ah 94h 0000h Simultaneous operations:
Not supported
4Bh 96h 0000h Burst mode:
00 = Not supported
01 = Supported
Not supported
4Ch 98h 0003h Page mode:
00 = Not supported
01 = 8-word page
02 = 8-word page
03 = 16-word page
16-word page
4Dh 9Ah 00B5h VPPH supply minimum program/erase voltage:
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
11.5V
4Eh 9Ch 00C5h VPPH supply maximum program/erase voltage:
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
12.5V
4Fh 9Eh 00xxh Top/bottom boot block flag:
xx = 04h: Uniform device, HW protection for lowest block
xx = 05h: Uniform device, HW protection for highest block
Uniform +
VPP/WP# protect-
ing highest or
lowest block
50h A0h 0001h Program suspend:
00 = Not supported
01 = Supported
Supported
Note: 1. The values in this table are valid for both packages.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Common Flash Interface
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Power-Up and Reset Characteristics
Table 21: Power-Up Specifications
Parameter
Symbol
Min Unit NotesLegacy JEDEC
VCC HIGH to VCCQ HIGH tVCHVCQH 0 µs 1
VCC HIGH to rising edge of RST# tVCS tVCHPH 300 µs 2
VCCQ HIGH to rising edge of RST# tVIOS tVCQHPH 0 µs 2
RST# HIGH to chip enable LOW tRH tPHEL 50 ns
RST# HIGH to write enable LOW tPHWL 150 ns
Notes: 1. VCC and VCCQ ramps must be synchronized during power-up.
2. If RST# is not stable for tVCS or tVIOS, the device will not allow any READ or WRITE oper-
ations, and a hardware reset is required.
Figure 13: Power-Up Timing
tRH
tVIOS
tVCS
tPHWL
tVCHVCQH
VCCQ
VCC
CE#
RST#
WE#
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Power-Up and Reset Characteristics
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Table 22: Reset AC Specifications
Condition/Parameter
Symbol
Min Max Unit NotesLegacy JEDEC
RST# LOW to read mode during program or
erase
tREADY tPLRH 32 µs 1
RST# pulse width tRP tPLPH 100 ns
RST# HIGH to CE# LOW, OE# LOW tRH tPHEL, tPHGL 50 ns 1
RST# LOW to standby mode during read mode tRPD 10 µs
RST# LOW to standby mode during program or
erase
50 µs
RY/BY# HIGH to CE# LOW, OE# LOW tRB tRHEL, tRHGL 0 ns 1
Note: 1. Sampled only; not 100% tested.
Figure 14: Reset AC Timing – No PROGRAM/ERASE Operation in Progress
tRH
RY/BY#
CE#, OE#
RST#
tRP
Figure 15: Reset AC Timing During PROGRAM/ERASE Operation
tRB
RY/BY#
CE#, OE#
RST#
tRP
tRH
tREADY
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Power-Up and Reset Characteristics
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Absolute Ratings and Operating Conditions
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at these or any other condi-
tions outside those indicated in the operational sections of this specification is not im-
plied. Exposure to absolute maximum rating conditions for extended periods may ad-
versely affect reliability.
Table 23: Absolute Maximum/Minimum Ratings
Parameter Symbol Min Max Unit Notes
Temperature under bias TBIAS –50 125 °C
Storage temperature TSTG –65 150 °C
Input/output voltage VIO –0.6 VCC + 0.6 V 1, 2
Supply voltage VCC –0.6 4 V
Input/output supply voltage VCCQ –0.6 4 V
Program voltage VPPH –0.6 14.5 V 3
Notes: 1. During signal transitions, minimum voltage may undershoot to −2V for periods less than
20ns.
2. During signal transitions, maximum voltage may overshoot to VCC + 2V for periods less
than 20ns.
3. VPPH must not remain at 12V for more than 80 hours cumulative.
Table 24: Operating Conditions
Parameter Symbol Min Max Unit
Supply voltage VCC 2.7 3.6 V
Input/output supply voltage (VCCQ VCC) VCCQ 1.65 3.6 V
Program voltage VPP –2.0 12.5 V
Ambient operating temperature TA–40 85 °C
Load capacitance CL30 pF
Input rise and fall times 10 ns
Input pulse voltages 0 to VCCQ V
Input and output timing reference voltages VCCQ/2 V
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Absolute Ratings and Operating Conditions
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Figure 16: AC Measurement Load Circuit
CL
VCCQ
25kΩ
Device
under
test
0.1µF
VCC
25kΩ
Note: 1. CL includes jig capacitance.
Figure 17: AC Measurement I/O Waveform
VCCQ
0V
VCCQ/2
Table 25: Input/Output Capacitance
Parameter Symbol Test Condition Min Max Unit
Input capacitance for 256Mb and 512Mb CIN VIN = 0V 3 8 pF
Input capacitance for 1Gb 4 9 pF
Input capacitance for 2Gb 8 18 pF
Output capacitance COUT VOUT = 0V 3 6 pF
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Absolute Ratings and Operating Conditions
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DC Characteristics
Table 26: DC Current Characteristics
Parameter Symbol Conditions Min Typ Max Unit Notes
Input leakage current ILI 0V VIN VCC ±1 µA 1
Output leakage current ILO 0V VOUT VCC ±1 µA
VCC read
current
Random read ICC1 CE# = VIL, OE# = VIH,
f = 5 MHz
26 31 mA
Page read CE# = VIL, OE# = VIH,
f = 13 MHz
12 16 mA
VCC standby
current
256Mb ICC2 CE# = VCCQ ±0.2V,
RST# = VCCQ ±0.2V
65 210 µA
512Mb 70 225 µA
1Gb 75 240 µA
2Gb 150 480 µA
VCC program/erase/blank
check current
ICC3 Program/
erase
controller
active
VPP/WP# = VIL
or VIH
35 50 mA 2
VPP/WP# =
VPPH
35 50 mA
VPP current Read IPP1 VPP/WP# VCC 0.2 5 µA
Standby 2 15 µA
Reset IPP2 RST# = VSS ±0.2V 0.2 5 µA
PROGRAM operation
ongoing
IPP3 VPP/WP# = 12V ±5% 0.05 0.10 mA
VPP/WP# = VCC 0.05 0.10 mA
ERASE operation
ongoing
IPP4 VPP/WP# = 12V ±5% 0.05 0.10 mA
VPP/WP# = VCC 0.05 0.10 mA
Notes: 1. The maximum input leakage current is ±5µA on the VPP/WP# pin.
2. Sampled only; not 100% tested.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
DC Characteristics
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Table 27: DC Voltage Characteristics
Parameter Symbol Conditions Min Typ Max Unit Notes
Input LOW voltage VIL VCC 2.7V –0.5 0.8 V
Input HIGH voltage VIH VCC 2.7V 0.7VCCQ VCCQ + 0.4 V
Output LOW voltage VOL IOL = 100µA,
VCC = VCC,min,
VCCQ = VCCQ,min
0.15VCCQ V
Output HIGH voltage VOH IOH = 100µA,
VCC = VCC,min,
VCCQ = VCCQ,min
0.85VCCQ V
Voltage for VPP/WP# program
acceleration
VPPH 11.5 12.5 V
Program/erase lockout supply
voltage
VLKO 2.3 V 1
Note: 1. Sampled only; not 100% tested.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
DC Characteristics
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Read AC Characteristics
Table 28: Read AC Characteristics
Parameter
Symbol
Condition Package Min Max Unit NotesLegacy JEDEC
Address valid to next address valid tRC tAVAV CE# = VIL,
OE# = VIL
Fortified BGA 100 ns
TSOP 110 ns
Address valid to output valid tACC tAVQV CE# = VIL,
OE# = VIL
Fortified BGA 100 ns
TSOP 110 ns
Address valid to output valid
(page)
tPAGE tAVQV1 CE# = VIL,
OE# = VIL
Fortified BGA 25 ns
TSOP 25 ns
CE# LOW to output transition tLZ tELQX OE# = VIL Fortified BGA 0 ns 1
TSOP 0 ns 1
CE# LOW to output valid tEtELQV OE# = VIL Fortified BGA 100 ns
TSOP 110 ns
OE# LOW to output transition tOLZ tGLQX CE# = VIL Fortified BGA 0 ns 1
TSOP 0 ns 1
OE# LOW to output valid tOE tGLQV CE# = VIL Fortified BGA 25 ns
TSOP 25 ns
CE# HIGH to output High-Z tHZ tEHQZ OE# = VIL Fortified BGA 20 ns 1
TSOP 20 ns 1
OE# HIGH to output High-Z tDF tGHQZ CE# = VIL Fortified BGA 15 ns 1
TSOP 15 ns 1
CE#, OE#, or address transition to
output transition
tOH tEHQX,
tGHQX,
tAXQX
Fortified BGA 0 ns
TSOP 0 ns
CE# to BYTE# LOW tELFL tELBL Fortified BGA 10 ns
TSOP 10 ns
CE# to BYTE# HIGH tELFH tELBH Fortified BGA 10 ns
TSOP 10 ns
BYTE# LOW to output valid tFLQV tBLQV Fortified BGA 1 µs
TSOP 1 µs
BYTE# HIGH to output valid tFHQV tBHQV Fortified BGA 1 µs
TSOP 1 µs
Note: 1. Sampled only; not 100% tested.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Read AC Characteristics
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Figure 18: Random Read AC Timing (8-Bit Mode)
Valid
Valid
tACC
tRC
tOH
tE
tELFL
tLZ
tOH
tHZ
tOLZ tOH
tOE tDF
A[MAX:0]/A-1
CE#
OE#
DQ[7:0]
BYTE#
Figure 19: Random Read AC Timing (16-Bit Mode)
Valid
Valid
tACC
tRC
tOH
tE
tELFH
tLZ
tOH
tHZ
tOLZ tOH
tOE tDF
A[MAX:0]
CE#
OE#
DQ[15:0]
BYTE#
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Read AC Characteristics
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Figure 20: BYTE# Transition Read AC Timing
Data-out
Data-out
Valid
Valid
tACC tOH
tFHQV
tBLQX
High-Z
A[MAX:0]
A–1
BYTE#
DQ[7:0]
DQ[15:8]
Figure 21: Page Read AC Timing (16-Bit Mode)
Valid
Valid Valid Valid ValidValid Valid Valid
tACC
tE
tPAGE
tOH
tHZ
tOH
tOE
tDF
A[MAX:4]
A[3:0]
CE#
OE#
DQ[15:0] Valid Valid Valid Valid Valid Valid Valid
Note: 1. Page size is 16 words (32 bytes) and is addressed by address inputs A[3:0] in x16 bus
mode and A[3:0] plus DQ15/A−1 in x8 bus mode.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Read AC Characteristics
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Write AC Characteristics
Table 29: WE#-Controlled Write AC Characteristics
Parameter Symbol Package Min Typ Max Unit Notes
Legacy JEDEC
Address valid to next address valid tWC tAVAV Fortified BGA 100 ns
TSOP 110 ns
CE# LOW to WE# LOW tCS tELWL Fortified BGA 0 ns
TSOP 0 ns
WE# LOW to WE# HIGH tWP tWLWH Fortified BGA 35 ns
TSOP 35 ns
Input valid to WE# HIGH tDS tDVWH Fortified BGA 30 ns 1
TSOP 30 ns 1
WE# HIGH to input transition tDH tWHDX Fortified BGA 0 ns
TSOP 0 ns
WE# HIGH to CE# HIGH tCH tWHEH Fortified BGA 0 ns
TSOP 0 ns
WE# HIGH to WE# LOW tWPH tWHWL Fortified BGA 20 ns
TSOP 20 ns
Address valid to WE# LOW tAS tAVWL Fortified BGA 0 ns
TSOP 0 ns
WE# LOW to address transition tAH tWLAX Fortified BGA 45 ns
TSOP 45 ns
OE# HIGH to WE# LOW tGHWL Fortified BGA 0 ns
TSOP 0 ns
WE# HIGH to OE# LOW tOEH tWHGL Fortified BGA 0 ns
TSOP 0 ns
Program/erase valid to RY/BY# LOW tBUSY tWHRL Fortified BGA 30 ns 2
TSOP 30 ns 2
VCC HIGH to CE# LOW tVCS tVCHEL Fortified BGA 300 µs
TSOP 300 µs
WRITE BUFFER PROGRAM operation
(512 words)
tWHWH1 tWHWH1 Fortified BGA 900 µs
TSOP 900 µs
PROGRAM operation (single word or
byte)
Fortified BGA 210 µs
TSOP 210 µs
Notes: 1. The user's write timing must comply with this specification. Any violation of this write
timing specification may result in permanent damage to the NOR Flash device.
2. Sampled only; not 100% tested.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Write AC Characteristics
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Figure 22: WE#-Controlled Program AC Timing (8-Bit Mode)
AAAh PA PA
3rd Cycle 4th Cycle READ CycleData Polling
tWC tWC
tAS
tWP
tDS
tWHWH1 tDF
tWPH
tAH
tE
tCS
tGHWL tOE
tDH
tOH
tCH
A[MAX:0]/A-1
CE#
OE#
WE#
DQ[7:0] AOh PD DQ7# DOUT DOUT
Notes: 1. Only the third and fourth cycles of the PROGRAM command are represented. The PRO-
GRAM command is followed by checking of the status register data polling bit and by a
READ operation that outputs the data (DOUT) programmed by the previous PROGRAM
command.
2. PA is the address of the memory location to be programmed. PD is the data to be pro-
grammed.
3. DQ7 is the complement of the data bit being programmed to DQ7 (See Data Polling Bit
[DQ7]).
4. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Write AC Characteristics
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Figure 23: WE#-Controlled Program AC Timing (16-Bit Mode)
555h PA PA
3rd Cycle 4th Cycle READ CycleData Polling
tWC tWC
tAS
tWP
tDS
tDF
tWHWH1
tWPH
tAH
tE
tCS
tGHWL tOE
tDH
tOH
tCH
A[MAX:0]
CE#
OE#
WE#
DQ[15:0] AOh PD DQ7# DOUT DOUT
Notes: 1. Only the third and fourth cycles of the PROGRAM command are represented. The PRO-
GRAM command is followed by checking of the status register data polling bit and by a
READ operation that outputs the data (DOUT) programmed by the previous PROGRAM
command.
2. PA is the address of the memory location to be programmed. PD is the data to be pro-
grammed.
3. DQ7 is the complement of the data bit being programmed to DQ7 (See Data Polling Bit
[DQ7]).
4. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Write AC Characteristics
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Table 30: CE#-Controlled Write AC Characteristics
Parameter Symbol Package Min Typ Max Unit Notes
Legacy JEDEC
Address valid to next address valid tWC tAVAV Fortified BGA 100 ns
TSOP 110 ns
WE# LOW to CE# LOW tWS tWLEL Fortified BGA 0 ns
TSOP 0 ns
CE# LOW to CE# HIGH tCP tELEH Fortified BGA 35 ns
TSOP 35 ns
Input valid to CE# HIGH tDS tDVEH Fortified BGA 30 ns 1
TSOP 30 ns 1
CE# HIGH to input transition tDH tEHDX Fortified BGA 0 ns
TSOP 0 ns
CE# HIGH to WE# HIGH tWH tEHWH Fortified BGA 0 ns
TSOP 0 ns
CE# HIGH to CE# LOW tCPH tEHEL Fortified BGA 20 ns
TSOP 20 ns
Address valid to CE# LOW tAS tAVEL Fortified BGA 0 ns
TSOP 0 ns
CE# LOW to address transition tAH tELAX Fortified BGA 45 ns
TSOP 45 ns
OE# HIGH to CE# LOW tGHEL Fortified BGA 0 ns
TSOP 0 ns
WRITE BUFFER PROGRAM operation
(512 words)
tWHWH1 tWHWH1 Fortified BGA 900 µs
TSOP 900 µs
PROGRAM operation (single word or
byte)
Fortified BGA 210 µs
TSOP 210 µs
Note: 1. The user's write timing must comply with this specification. Any violation of this write
timing specification may result in permanent damage to the NOR Flash device.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Write AC Characteristics
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Figure 24: CE#-Controlled Program AC Timing (8-Bit Mode)
AAAh PA PA
3rd Cycle 4th Cycle Data Polling
tWC
tAS
tCP
tDS
tWHWH1
tCPH
tAH
tWS
tGHEL
tDH
tWH
A[MAX:0]/A-1
WE#
OE#
CE#
DQ[7:0] AOh PD DQ7# DOUT
Notes: 1. Only the third and fourth cycles of the PROGRAM command are represented. The PRO-
GRAM command is followed by checking of the status register data polling bit.
2. PA is the address of the memory location to be programmed. PD is the data to be pro-
grammed.
3. DQ7 is the complement of the data bit being programmed to DQ7 (See Data Polling Bit
[DQ7]).
4. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Write AC Characteristics
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Figure 25: CE#-Controlled Program AC Timing (16-Bit Mode)
555h PA PA
3rd Cycle 4th Cycle Data Polling
tWC
tAS
tCP
tDS
tWHWH1
tCPH
tAH
tWS
tGHEL
tDH
tWH
A[MAX:0]
WE#
OE#
CE#
DQ[15:0] AOh PD DQ7# DOUT
Notes: 1. Only the third and fourth cycles of the PROGRAM command are represented. The PRO-
GRAM command is followed by checking of the status register data polling bit.
2. PA is the address of the memory location to be programmed. PD is the data to be pro-
grammed.
3. DQ7 is the complement of the data bit being programmed to DQ7 (See Data Polling Bit
[DQ7]).
4. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Write AC Characteristics
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Figure 26: Chip/Block Erase AC Timing (8-Bit Mode)
555h
tWC
tAS
tWP
tDS
tWPH
tAH
tCS
tGHWL
tDH
tCH
A[MAX:0]/
A–1
CE#
OE#
WE#
DQ[7:0] AAh
2AAh 555h 555h
BAh1
2AAh555h
55h 55hAAh80h 10h/
30h
Notes: 1. For a CHIP ERASE command, the address is 555h, and the data is 10h; for a BLOCK ERASE
command, the address is BAd, and the data is 30h.
2. BAd is the block address.
3. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Write AC Characteristics
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Accelerated Program, Data Polling/Toggle AC Characteristics
Table 31: Accelerated Program and Data Polling/Data Toggle AC Characteristics
Parameter
Symbol
Min Max UnitLegacy JEDEC
VPP/WP# rising or falling time tVHVPP 250 ns
Address setup time to OE# LOW during toggle bit polling tASO tAXGL 15 ns
Address hold time from OE# during toggle bit polling tAHT tGHAX, tEHAX 0 ns
CE# HIGH during toggle bit polling tEPH tEHEL2 30 ns
Output hold time during data and toggle bit polling tOEH tWHGL2,
tGHGL2
20 ns
Program/erase valid to RY/BY# LOW tBUSY tWHRL 90 ns
Note: 1. Sampled only; not 100% tested.
Figure 27: Accelerated Program AC Timing
tVHVPP
tVHVPP
VPPH
VIL or VIH
VPP/WP#
Figure 28: Data Polling AC Timing
DQ7#Data DQ7# Valid DQ7
Data
Output flagData Output flag
Valid
DQ[6:0] Data
tHZ/tDF
tE
tOE
tCH
tBUSY
tOEH
CE#
OE#
WE#
DQ[6:0]
DQ7
RY/BY#
Notes: 1. DQ7 returns a valid data bit when the PROGRAM or ERASE command has completed.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Accelerated Program, Data Polling/Toggle AC Characteristics
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2. See the following tables for timing details: Read AC Characteristics, Accelerated Pro-
gram and Data Polling/Data Toggle AC Characteristics.
Figure 29: Toggle/Alternative Toggle Bit Polling AC Timing (8-Bit Mode)
Toggle Toggle ToggleData
Stop
toggling
Output
Valid
tBUSY
tOEH tEPH
tOEH
CE#
WE#
OE#
DQ6/DQ2
RY/BY#
tOEH
tAHT tASO
tAHT
tDH
tAS
A[MAX:0]/
A–1
tOE tE
Notes: 1. DQ6 stops toggling when the PROGRAM or ERASE command has completed. DQ2 stops
toggling when the CHIP ERASE or BLOCK ERASE command has completed.
2. See the following tables for timing details: Read AC Characteristics, Accelerated Pro-
gram and Data Polling/Data Toggle AC Characteristics.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Accelerated Program, Data Polling/Toggle AC Characteristics
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Program/Erase Characteristics
Table 32: Program/Erase Characteristics
Notes 1 and 2 apply to the entire table.
Parameter
Buffer
Size Byte Word Min Typ Max Unit Notes
Block erase (128KB) 0.8 4 s
Erase suspend latency time 27 32 µs
Block erase timeout 50 µs
Byte program Single-byte program 210 456 µs
Byte write to buffer program 64 64 270 716 µs
128 128 310 900 µs
256 256 375 1140 µs
Effective write to buffer
program per byte
64 1 4.22 11.2 µs
128 1 2.42 7 µs
256 1 1.46 4.45 µs
Word program Single-word program 210 456 µs
Word write to buffer program 32 32 270 716 µs
64 64 310 900 µs
128 128 375 1140 µs
256 256 505 1690 µs
512 512 900 3016 µs
Effective write to buffer
program per word
32 1 8.44 22.4 µs
64 1 4.84 14.1 µs
128 1 2.93 8.9 µs
256 1 1.97 6.6 µs
512 1 1.76 5.89 µs
Program suspend latency time 27 32 µs
Blank check 3.2 ms
PROGRAM/ERASE cycles (per block) 100,000 cycles
Erase to suspend 500 µs 3
Notes: 1. Typical values measured at room temperature and nominal voltages.
2. Typical and maximum values are sampled, but not 100% tested.
3. Erase to suspend is the typical time between an initial BLOCK ERASE or ERASE RESUME
command and a subsequent ERASE SUSPEND command. Violating the specification re-
peatedly during any particular block erase may cause erase failures.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Program/Erase Characteristics
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Package Dimensions
Figure 30: 56-Pin TSOP – 14mm x 20mm
See Detail A
0.50 TYP
14.00 ±0.10
1.20 MAX
18.40 ±0.10
20.00 ±0.20
1.00 ±0.05
0.22 ± 0.05
Detail A
0.50 ±0.10
3 TYP/
5 MAX
0.10+0.10
-0.05
0.10
0.10 MIN/
0.21 MAX
Pin #1
α
Notes: 1. All dimensions are in millimeters.
2. For the lead width value of 0.22 ±0.05, there is also a legacy value of 0.15 ±0.05.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Package Dimensions
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Figure 31: 64-Ball Fortified BGA – 11mm x 13mm
Seating
plane
0.80 TYP
0.10
13.00 ±0.10
0.60 ±0.05
1.00
TYP
3.00
TYP
A
B
C
D
E
F
G
H
7.00 TYP
1.40 MAX
Ball A1 ID
1.00
TYP
2.00 TYP 0.49 TYP/
0.40 MIN
11.00 ±0.10
7.00 TYP
64X
87654321
Note: 1. All dimensions are in millimeters.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Package Dimensions
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Additional Resources
Table 33: Technical Notes
Visit www.micron.com to access the following documents.
Title
Reference
Number
Password Protecting Flash Memory Blocks TN-12-05
Software Driver for M29EW NOR Flash Memory TN-13-12
Patching the Linux Kernel and U-Boot for Micron® M29 Flash Memory TN-13-07
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Additional Resources
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Revision History
Rev. A – 04/12
Initial Micron brand release
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
www.micron.com/productsupport Customer Comment Line: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Revision History
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