Walsin Technology Corporation
Page 6 of 7 WW18X Version 10 Jun.-2009
TEST PROCEDURE REQUIREMENT
Temperature Coefficient
of Resistance(T.C.R)
Clause 4.8
Natural resistance change per change in degree centigrade.
( )
6
121
12 10×
−
ttR RR
(ppm/°C) t
1
: 20°C+5°C-1°C
R
1
: Resistance at reference temperature
R
2
: Resistance at test temperature
Refer to
“QUICK REFERENCE DATA”
Short time overload
(S.T.O.L) Clause 4.13 Permanent resistance change after a 5second application of a voltage 2.5 times
RCWV or the maximum overload voltage specified in the above list, whichever
is less. ∆R/R max. ±(2%+0.005Ω)
Resistance to soldering
heat(R.S.H)
IEC 60068-2-58: 2004
Un-mounted chips completely immersed for 10±1second in a SAC solder bath
at 255℃±5ºC no visible damage
∆ R/R max. ±(1%+0.005Ω)
Solderability
IEC 60068-2-58: 2004
Un-mounted chips completely immersed for 3±0.3second in a SAC solder bath
at 245℃±5℃ good tinning (>95% covered)
no visible damage
Temperature cycling
Clause 4.19 30 minutes at -55°C±3°C, 2~3 minutes at 20°C+5°C-1°C, 30 minutes at
+155°C±3°C, 2~3 minutes at 20°C+5°C-1°C, total 5 continuous cycles no visible damage
∆R/R max. ±(1%+0.005Ω)
Load life (endurance)
Clause 4.25 1000 +48/-0 hours, loaded with RCWV or Vmax in chamber controller 70±2ºC,
1.5 hours on and 0.5 hours off ∆R/R max. ±(3%+0.005Ω)
Load life in Humidity
Clause 4.24 1000 +48/-0 hours, loaded with RCWV or Vmax in humidity chamber controller
at 40°C±2°C and 90~95% relative humidity, 1.5hours on and 0.5 hours off ∆R/R max. ±(3%+0.005Ω)
Bending strength
Clause 4.33 Resistors mounted on a 90mm glass epoxy resin PCB(FR4); bending : 2 mm,
once for 10 seconds ∆R/R max. ±(1%+0.005Ω)
Adhesion
Clause 4.32 Pressurizing force: 5N, Test time: 10±1sec. No remarkable damage or
removal of the terminations
Insulation Resistance
JISC5201-1:1998
Clause 4.6
Apply the maximum overload voltage (DC) for 1minutes R≧10GΩ
Dielectric Withstand
Voltage
JISC5201-1:1998
Clause 4.7
Apply the maximum overload voltage (AC) for 1 minutes
No breakdown or flashover