Power Management IC Series for Automotive Body Control High Voltage LDO Regulators BD3570FP, BD3570HFP, BD3571FP, BD3571HFP, BD3572FP, BD3572HFP BD3573FP, BD3573HFP, BD3574FP, BD3574HFP, BD3575FP, BD3575HFP No.11036EBT02 Description BD357XFP/HFP SERIES regulators feature a high 50 V withstand-voltage and are suitable for use with onboard vehicle microcontrollers. They offer the output current of 500 mA while limiting the quiescent current to 30A (TYP).With these devices, a ceramic capacitor can be selected at the output for stable operation, the output tolerance is within 2% over the wide ambient temperature range (-40 to 125), and the short circuit protection is folded-type to minimize generation of heat during malfunction. These devices are developed to offer most robust power-supply design under the harsh automotive environment. The BD357XFP/HFP Series provide ideal solutions to lower the current consumption as well as to simplify the use with battery direct-coupled systems. Features 1) Ultra-low quiescent current: 30A (TYP.) 2) Low-saturation voltage type P-channel DMOS output transistors 3) High output voltage precision: 2%Iomax = 500 mA 4) Low-ESR ceramic capacitors can be used as output capacitors. 5) Vcc power supply voltage = 50 V 6) Built-in overcurrent protection circuit and thermal shutdown circuit 7) TO252-3, TO252-5, HRP5 Package Applications Onboard vehicle devices (body-control, car stereos, satellite navigation systems, etc.) Line up matrix BD3570FP/HFP BD3571FP/HFP BD3572FP/HFP BD3573FP/HFP BD3574FP/HFP BD3575FP/HFP Output voltage 3.3V 5.0 V Variable 3.3V 5.0 V Variable Symbol Limit Unit Supply voltage VCC 50 1 Switch Supply voltage VSW 50 2 IO 500 SW function Package FP:TO252-3,TO252-5 HFP:HRP5 Absolute maximum ratings (Ta=25) Parameter Output current V V mA 1.2 (TO252-3) 3 Power dissipation Pd 1.3 (TO252-5) 4 1.6 (HRP5) W 5 Operating temperature range Topr -40 to +125 Storage temperature range Maximum junction temperature Tstg -55 to +150 Tjmax 150 1 2 3 4 5 Not to exceed Pd and ASO. for ON/OFF SW Regulator only TO252-3: Reduced by 9.6 mW/ over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm). TO252-5: Reduced by 10.4 mW/ over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm). HRP5: Reduced by 12.8 mW/ over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm). www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 1/9 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note Operating Conditions Parameter Input voltage Symbol Min. Max. Unit V BD3570,3572,3573,3575FP/HFP VCC 4.5 6 36.0 BD3571,3574FP/HFP VCC 5.5 6 36.0 V Output current IO 500 mA Variable Output Voltage Range VO 2.8 12 V 6 Please consider that the Output voltage would be dropped (Dropout voltage) according to the output current. Electrical CharacteristicsUnless otherwise specified, Ta=-40 to125, VCC=13.2 V, SW=3V 7, VO settings is 5V 8 Parameter Symbol Limit Unit Conditions Min. Typ. Max. lshut 10 A SW=GND Bias current lb 30 50 A IO=0mA Output voltage VO VOx 0.98 VO VOx 1.02 V IO=200mA, VO:Please refer to Product line. VADJ 1.235 1.260 1.285 V IO=200mA Output current IO 0.5 A Dropout voltage Vd 0.25 0.48 V VCC=4.75V,lO=200mA Ripple rejection R.R. 45 55 dB f=120Hz,ein=1Vrms,IO=100mA Line Regulation Reg.I 10 30 mV VCCD10VCC25V IO = 0 mA Load Regulation Reg.L 20 40 mV 0AIO200A Shut Down Current ADJ Terminal voltage 8 Swith Threshold voltage H SWH 2.0 V IO=0 mA Swith Threshold voltage L SWL 0.5 V IO=0 mA SWI 22 60 A Swith Bias current 7 8 9 10 9 SW=5V,lO=0mA BD3573,3574,3575FP/HFP only BD3572,3575FP/HFP only BD3571,3572,3574,3575FP/HFP only BD3570,3573FP/HFP :VCCD=5.5V BD3571,3572,3574,3575FP/HFP :VCCD=6.5V This product is not designed for protection against radio active rays. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 2/9 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note Reference Data: BD3574HFPUnless otherwise specified, Ta=25 30 Ta=125 20 Ta=25 10 6 5 5 4 3 Ta=125 2 Ta=25 1 Ta=-40 Ta=-40 0 0 0 5 10 15 20 25 5 RIPPLE REJECTION:R.R. [dB] 15 20 25 Ta=125 Ta=25 Ta=-40 400 1500 Ta=-40 30 20 10 5 Ta=25 4 Ta=125 3 2 Ta=-40 1 0 10 100 1000 10000 0 100000 1000000 0.5 1 1.5 OUTPUT CURRENT: IO[mA] FREQUENCY: f [Hz] SUPPLY VOLTAGE: VSW [V] Fig. 4 Dropout Voltage Fig. 5 Ripple rejection Fig. 6 Output Voltage VS SW Input Voltage 40 20 200 300 400 4 3 2 1 0 100 0 100 5 OUTPUT VOLTAGE: VO [V] OUTPUT VOLTAGE: VO [V] 60 500 120 140 160 180 5.25 5 4.75 4.5 -40 200 0 40 80 OUTPUT CURRENT: IO[mA] AMBIENT TEMPERATURE: Ta [] AMBIENT TEMPERATURE: Ta [] Fig. 7 Total Supply Current Classified by Load Fig. 8 Thermal Shutdown Circuit Fig. 9 Output Voltage VS Temperature 120 DROPOUT VOLTAGE:Vd [V] Ta=125 60 Ta=25 30 Ta=-40 0 0 5 10 15 20 SUPPLY VOLTAGE: VSW [V] Fig. 10 SW Bias current www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 25 120 50 2 90 2 5.5 6 80 2000 Fig. 3 Output Voltage VS Load Ta=25 40 500 1000 6 50 100 0 500 OUTPUT CURRENT: IO [mA] 0 300 Ta=125 0 CIRCUIT CURRENT: I cc [A] DROPOUT VOLTAGE:Vd[V] 2 200 1 Ta=125 60 0 CIRCUIT CURRENT: I CC [A] 10 70 100 Ta=25 2 Fig. 2 Output Voltage VS Power Supply Voltage 3 0 Ta=-40 3 SUPPLY VOLTAGE: VCC [V] Fig. 1 Total Supply Current 1 4 0 0 SUPPLY VOLTAGE: VCC [V] SW BIAS CURRENT: ISW [A] OUTPUT VOLTAGE: VO [V] OUTPUT VOLTAGE: VO [V] 40 6 OUTPUT VOLTAGE: VO [V] CIRCUIT CURRENT: I CC [A] 50 1.5 1 0.5 0 -40 0 40 80 120 40 30 20 10 0 -40 0 40 80 120 AMBIENT TEMPERATURE: Ta [] AMBIENT TEMPERATURE: Ta [] Fig. 11 Dropout voltage VS Temperature Fig. 12 Total Supply Current Temperature 3/9 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note Block Diagram Vcc Vcc 1 Vcc 1 1 Cin Cin Cin Vref Vref SW Vo Vref Vo 2 5 3 OCP SW Vo 2 OCP Co 5 Co OCP Co 1 2 GND GND 1 Fin Fin Fin 2 3 N.C. N.C. Fig.13 TO252-3 4 1) ) Fig.15 HRP5 Fig.14 TO252-5 I/O Circuit diagram (All resistance values are typical.) 210K TSD 3 4 ADJ (N.C. Vcc 1) ) Vcc Vo 1K ADJ (N.C. 1For Fixed Voltage Regulator only 2For adjustable Voltage Regulator only Cin0.33F1000F Co0.1F1000F SW 2 GND TSD TSD Vo 1992K: BD3570, BD3573 3706K: BD3571, BD3574 200K 150 1250K Fig.17 5PIN[VO] BD3570,3571,3573,3574 Fig.16 2PIN[SW] Pin Assignments Fig.18 4.5PIN[ADJ,VO] BD3572,BD3575 FIN Pin No. TO252-3 1 2 3 Pin name Function 1 VCC Power supply pin 2 N.C. N.C. pin 3 VO Fin GND Voltage output pin GND pin Fig. 19 FIN Pin No. Pin name Function 5 VCC SW N.C. N.C. N.C. ADJ VO Power supply pin VO ON/OFF function pin N.C. pin(BD3572FP only) N.C. pin N.C. pin Output voltage setting pin(BD3572,3575FP only) Voltage output pin Fin GND GND pin Pin No. Pin name 1 5 VCC SW N.C. GND N.C. ADJ VO Power supply pin VO ON/OFF function pin (BD3573,3574,3575HFP only) N.C. pin GND pin N.C. pin Output voltage setting pin(BD3572,3575HFP only) Voltage output pin Fin GND GND pin 1 TO252-5 2 3 1 2345 Fig.20 FIN HRP5 4 2 3 1 23 45 Fig. 21 www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 4 4/9 Function 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note Output Voltage Adjustment Vo To set the output voltage insert pull-down resistor R1 between the ADJ and GND pins, and pull-up resistor R2 between the VO and ADJ pins. R2 ADJ Vo = VADJx(R1+R2) / R1 [V] VADJ=1.26V(TYP.) R1 Fig.22 The recommended connection resistor for the ADJ-GND is 30k150k. Setting of Heat TO252-3 TO252-5 HRP5 2.0 2.0 1.2 W 1.2 0.8 0.4 0 IC mounted on a ROHM standard board Substrate size: 70 mm 70 mm 1.6 mm ja = 96.2 (C/W) 1.6 POWER DISSIPATION: Pd [W] IC mounted on a ROHM standard board Substrate size: 70 mm 70 mm 1.6 mm ja = 104.2 (C/W) 1.6 POWER DISSIPATION: Pd [W] POWER DISSIPATION: Pd [W] 2.0 1.3W 1.2 0.8 0.4 25 50 75 100 125 150 1.2 0.8 0.4 0 0 0 IC mounted on a ROHM standard board Substrate size: 70 mm 70 mm 1.6 mm ja = 78.1 (C/W) 1.6 W 1.6 0 25 50 75 100 125 AMBIENT TEMPERATURE: Ta [C] AMBIENT TEMPERATURE: Ta [] Fig. 23 Fig. 24 150 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [C] Fig. 25 Refer to the heat mitigation characteristics illustrated in Figs. 23, 24 and 25 when using the IC in an environment where Ta 25. The characteristics of the IC are greatly influenced by the operating temperature. If the temperature is in excess of the maximum junction temperature Tjmax, the elements of the IC may be deteriorated or damaged. It is necessary to give sufficient consideration to the heat of the IC in view of two points, i.e., the protection of the IC from instantaneous damage and the maintenance of the reliability of the IC in long-time operation. In order to protect the IC from thermal destruction, it is necessary to operate the IC not in excess of the maximum junction temperature Tjmax. Fig. 23 illustrates the power dissipation/heat mitigation characteristics for the TO252 package. Operate the IC within the power dissipation Pd. The following method is used to calculate the power consumption PC (W). Vcc : Input voltage Vo : Output voltage Io : Load current Icc : Total supply current PC=(VCC-VO)xIO+VCCxICC Power dissipation PdPC The load current IO is obtained to operate the IC within the power dissipation. Pd-VCCxICC Io (For more information about ICC, see page 12.) VCC-VO The maximum load current Iomax for the applied voltage VCC can be calculated during the thermal design process. Calculation example Example: BD3571FP VCC = 12 V and VO = 5 V at Ta = 85 IO 0.624-12xICC IO89mA 12-5 ja=104.2/W-9.6mAW/ 25=1.2W85=0.624W (ICC=30A) Make a thermal calculation in consideration of the above so that the whole operating temperature range will be within the power dissipation. The power consumption Pc of the IC in the event of shorting (i.e., if the VO and GND pins are shorted) will be obtained from the following equation. Pc=VCCx(ICC+Ishort) www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. Ishort = Short current 5/9 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note Peripheral Settings for Pins and Precautions 1) VCC pins Insert capacitors with a capacitance of 0.33F to 1000F between the VCC and GND pins. The capacitance varies with the application. Be sure to design the capacitance with a sufficient margin. 2) Capacitors for stopping oscillation for output pins Capacitors for stopping oscillation must be placed between each output pin and the GND pin. Use a capacitor within a capacitance range between 0.1F and 1000F. Since oscillation does not occur even for ESR values from 0.001 to 100, a ceramic capacitor can be used. Abrupt input voltage and load fluctuations can affect output voltages. Output capacitor capacitance values should be determined after sufficient testing of the actual application. Operation Notes 1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2) GND potential Ensure a minimum GND pin potential in all operating conditions. 3) Setting of heat Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin short and mistake fitting Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by the presence of a foreign object may result in damage to the IC. 5) Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. 6) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Be sure to turn power off when mounting or dismounting jigs at the inspection stage. Furthermore, for countermeasures against static electricity, ground the equipment at the assembling stage and pay utmost attention at the time of transportation or storing the product. 7) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. PN junction is formed by the P layer and the N layer of each element, and a variety of parasitic elements will be constituted. For example, when a resistor and transistor are connected to pins as shown in Fig. 19, the P/N junction functions as a parasitic diode when GND>Pin A for the resistor or GND>Pin B for the transistor (NPN). Similarly, when GNDPin B for the transistor (NPN), the parasitic diode described above combines with the N layer of other adjacent elements to operate as a parasitic NPN transistor. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 6/9 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will trigger the operation of parasitic elements, such as by the application of voltages lower than the GND (P substrate) voltage to input pins. Resistor Transistor (NPN) (Pin B) B (Pin B) (Pin A) C E B C E P P+ P+ P P+ N N P N N Parasitic element GND GND P+ N Parasitic element or transistor Parasitic element or transistor N P substr t GND (Pin A) Parasitic elements Fig. 26 Example of a Simple Monolithic IC Architecture 8) Ground wiring patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external parts, either. 9) SW Pin Do not apply the voltage to SW pin when the VCC is not applied. And when the VCC is applied, the voltage of SW pin must not exceed VCC. 10) Thermal shutdown circuit (TSD) This IC incorporates a built-in thermal shutdown circuit for the protection from thermal destruction. The IC should be used within the specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power dissipation limits, the attendant rise in the chip's temperature Tj will trigger the thermal shutdown circuit to turn off all output power elements. The circuit automatically resets once the chip's temperature Tj drops. The thermal shutdown circuit operates if the IC is under conditions in express of the absolute maximum ratings. Never design sets on the premise of using the thermal shutdown circuit. (See Fig. 8) 11) Overcurrent protection circuit (OCP) The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous operation or transitioning of the protection circuits. At the time of thermal designing, keep in mind that the current capability has negative characteristics to temperatures. (See Fig. 3) www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 7/9 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note Ordering Part Number B D 3 5 7 4 H Part number 35703.3V output no include SW 35715.0V output no include SW 3572variable output no include SW 35733.3V output include SW 35745.0V output include SW 3575variable output include SW F P Package FP TO252-3, TO252-5 HFP HRP5 - T R Packaging and forming specification E2: Embossed tape and reel (TO252-3,TO252-5) TR: Embossed tape and reel (HRP5) TO252-3 <Tape and Reel information> 6.50.2 C0.5 1.50.2 +0.2 5.1 -0.1 Tape Embossed carrier tape Quantity 2000pcs 2.30.2 0.50.1 The direction is the 1pin of product is at the lower left when you hold ( reel on the left hand and you pull out the tape on the right hand 1.5 2 3 0.8 1 0.65 ) 2.5 9.50.5 5.50.2 FIN E2 Direction of feed 0.65 0.50.1 0.75 2.30.2 1.00.2 2.30.2 1pin Reel (Unit : mm) Direction of feed Order quantity needs to be multiple of the minimum quantity. TO252-5 <Tape and Reel information> 2.30.2 6.50.2 C0.5 1.50.2 +0.2 5.1 -0.1 0.50.1 Tape Embossed carrier tape Quantity 2000pcs Direction of feed The direction is the 1pin of product is at the lower left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1.5 4 5 0.8 1 2 3 2.5 9.50.5 5.50.2 FIN E2 0.50.1 0.5 1.27 1.00.2 1pin Reel (Unit : mm) www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 8/9 Direction of feed Order quantity needs to be multiple of the minimum quantity. 2011.03 - Rev.B BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP BD3574FP/HFP, BD3575FP/HFP Technical Note HRP5 <Tape and Reel information> 8.82 0.1 (6.5) 0.080.05 1.2575 1 2 3 4 0.8350.2 1.5230.15 8.00.13 (7.49) 1.9050.1 10.540.13 1.0170.2 9.3950.125 (MAX 9.745 include BURR) Tape Embossed carrier tape Quantity 2000pcs Direction of feed TR direction is the 1pin of product is at the upper right when you hold ( The ) reel on the left hand and you pull out the tape on the right hand 1pin 5 +5.5 4.5-4.5 +0.1 0.27 -0.05 1.72 0.730.1 0.08 S S www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. Direction of feed Reel (Unit : mm) 9/9 Order quantity needs to be multiple of the minimum quantity. 2011.03 - Rev.B Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: ROHM Semiconductor: BD3570HFP-TR BD3575FP-E2 BD3573HFP-TR BD3573FP-E2