NXP Semiconductors Data Sheet: Technical Data Document Number: MPX5100 Rev. 14, 12/2018 MPX5100, 0 to 100 kPa, Differential, Gauge, and Absolute, Integrated, Pressure Sensors MPX5100 The MPX5100 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high-level, analog output signal that is proportional to the applied pressure. Unibody packages Features * 2.5% maximum error over 0 to 85 C * Ideally suited for microprocessor or microcontroller-based systems * Patented silicon shear stress strain gauge * Available in absolute, differential and gauge configuration * Durable epoxy unibody element * Easy-to-use chip carrier option MPX5100AP/GP 98ASB42796B MPX5100DP 98ASA42797B Small outline packages Typical applications * * * * * Patient monitoring Process control Pump/motor control Pressure switching White goods MPXV5100DP 98ASA99255D MPXV5100GP 98ASA99303D MPXV5100GC6U 98ASB17757C MPXV5100GC7U 98ASB17759C Ordering information Device name Shipping Package # of Ports None Single Pressure type Dual Gauge Differential Absolute Device marking Unibody Package (MPX5100 Series) MPX5100AP Tray 98ASB42796B MPX5100DP Tray 98ASB42797B MPX5100GP Tray 98ASB42796B * * * * * * MPX5100AP MPX5100DP MPX5100GP Small Outline Package (MPXV5100 Series) MPXV5100DP Tray 98ASA99255D * * MPXV5100GC6U Rail 98ASB17757C * * MPXV5100GC7U Rail 98ASB17759C * * MPXV5100G MPXV5100GP Tray 98ASA99303D * * MPXV5100GP NXP reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. (c) 2018 NXP Semiconductors, B.V. MPXV5100DP MPXV5100G Contents 1 2 3 4 5 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 MPX5100AP/DP/GP Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 MPX5100AP/DP/GP Pinout (Unibody) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 MPXV5100DP/GC6U/GC7U/GP block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.4 MPXV5100DP/GC6U/GC7U/GP pinout (small outline package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.1 Pressure (P1)/Gauge (P2) side identification table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.2 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.3 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Related Documentation The MPX5100 device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the NXP homepage at: http://www.nxp.com/ 2. 3. In the Keyword search box at the top of the page, enter the device number MPX5100. In the Refine Your Result pane on the left, click on the Documentation link. MPX5100 2 Sensors NXP Semiconductors, B.V. 1 General Description 1.1 MPX5100AP/DP/GP Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a unibody package. VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry VOUT Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Figure 1. Integrated pressure sensor block diagram 1.2 MPX5100AP/DP/GP Pinout (Unibody) Figure 2. Device pinout (top view) Table 1. Pin functions Pin Name Function 1 VOUT 2 GND 3 VS 4 DNC Do not connect to external circuitry or ground. 5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. Output voltage Ground Voltage supply MPX5100 Sensors NXP Semiconductors, B.V. 3 1.3 MPXV5100DP/GC6U/GC7U/GP block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a small outline package. VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry VOUT Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Figure 3. Integrated pressure sensor block diagram 1.4 MPXV5100DP/GC6U/GC7U/GP pinout (small outline package) DNC 5 4 VOUT DNC 6 3 GND DNC 7 2 VS DNC 8 1 DNC Figure 4. Device pinout (top view) Table 2. Pin functions Pin Name 1 DNC Function Do not connect to external circuitry or ground. Voltage supply 2 VS 3 GND Ground 4 VOUT Output voltage 5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. MPX5100 4 Sensors NXP Semiconductors, B.V. 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 3. Maximum ratings(1) Symbol Value Unit Maximum pressure Rating Pmax 400 kPa Storage temperature Tstg -40 to +125 C Operating temperature TA -40 to +125 C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.2 Operating characteristics Table 4. Operating characteristics (VS = 5 Vdc, TA = 25 C.) Characteristic Min Typ Max 0 15 -- -- 100 115 VS 4.75 5.0 5.25 VDC IO -- 7.0 10 mAdc Minimum pressure offset , (0 to 85 C) @ VS = 5.0 V VOFF 0.088 0.20 0.313 VDC Full-scale output(4), differential and absolute (0 to 85 C) @ VS = 5.0 V VFSO 4.587 4.700 4.813 VDC Full-scale Span(5), differential and absolute (0 to 85 C) @ VS = 5.0 V VFSS -- 4.500 -- VDC Accuracy(6) -- -- -- 2.5 %VFSS Sensitivity V/P -- 45 -- mV/kPa tR -- 1.0 -- ms Pressure range(1) Gauge, differential: MPX5100G/MPXV5100G Absolute: MPX5100AP Supply voltage(2) Supply current (3) Response time(7) POP Unit kPa IO+ -- 0.1 -- mAdc time(8) -- -- 20 -- ms stability(9) -- -- 0.5 -- %VFSS Output source current at full-scale output Warm-up Offset Symbol 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 4. Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure. 5. Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: Linearity: Temperature hysteresis: Pressure hysteresis: TcSpan: TcOffset: Variation from nominal: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 C. Output deviation over the temperature range of 0 to 85 C, relative to 25 C. Output deviation with minimum pressure applied over the temperature range of 0 to 85 C, relative to 25 C. The variation from nominal values, for offset or full-scale span, as a percent of VFSS at 25 C. 7. Response time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 9. Offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. MPX5100 Sensors NXP Semiconductors, B.V. 5 3 On-chip Temperature Compensation and Calibration Figure 5 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85 C using the decoupling circuit shown in Figure 7. The output will saturate outside of the specified pressure range. Figure 6 illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. Span Range (Typ) MAX 2 TYP 1 110 100 90 80 70 30 20 0 0 10 MIN 60 3 50 Output Voltage (V) 4 VOUT = VS*(0.009*P+0.04) (Pressure Error * Temperature Factor * 0.009 * VS) VS = 5.0 V 0.25 VDC PE = 2.5 TM = 1 TEMP = 0 to 85 C 40 5 Pressure (kPa) Output Range (Typ) The MPX5100 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. (Typ) Offset Figure 5. Output versus pressure differential Fluorosilicone Gel Die Coat Stainless Steel Metal Cover Die Fluorosilicone Gel Die Coat Epoxy Plastic Case Wire Bond Differential/Gauge Element Epoxy Plastic Case Wire Bond Die Bond Lead Frame Stainless Steel Metal Cover Die Lead Frame Absolute Element Die Bond Figure 6. Cross-sectional diagrams (not-to-scale) Figure 7 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. +5.0 V VOUT OUTPUT VS IPS 0.01 F 1.0 F 470 pF GND Figure 7. Recommended power supply decoupling and output filtering (For additional output filtering, please refer to application note AN1646.) MPX5100 6 Sensors NXP Semiconductors, B.V. The following figures show the nominal transfer function, temperature and pressure error over the operating range for the MPX5100D,MPX5100G and MPXV5100G devices. Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.04) (Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V 0.25 V Figure 8. Transfer function (MPX5100D, MPX5100G, MPXV5100G) Break Points Temp 4.0 Multiplier - 40 0 to 85 C +125 C 3.0 3 1 3 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C Note: The Temperature Multiplier is a linear response from 0 to -40 C and from 85 to 125 C. Figure 9. Temperature error multiplier (MPX5100D, MPX5100G, MPXV5100G) Error Limits for Pressure 3.0 Error (kPa) 2.0 1.0 0.0 0 20 40 60 80 100 120 Pressure in kPa -1.0 -2.0 -3.0 Pressure Error (max) 0 to 100 kPa 2.5 kPa Figure 10. Pressure error band (MPX5100D, MPX5100G, MPXV5100G) MPX5100 Sensors NXP Semiconductors, B.V. 7 The following figures show the nominal transfer function, temperature and pressure error over the operating range for the MPX5100AP device. Nominal Transfer Value: VOUT = VS (P x 0.009 - 0.095) (Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V 0.25 V Figure 11. Transfer function (MPX5100AP) Break Points Temp Multiplier 4.0 - 40 0 to 85 C +125 3.0 3 1 3 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 130 140 Temperature in C Note: The Temperature Multiplier is a linear response from 0 to -40 C and from 85 to 125 C. Figure 12. Temperature error multiplier (MPX5100AP) Error Limits for Pressure 3.0 Error (kPa) 2.0 1.0 0.0 0 20 40 60 80 100 130 Pressure in kPa -1.0 -2.0 -3.0 Pressure Error (max) 15 to 115 kPa 2.5 kPa Figure 13. Pressure error band (MPX5100AP) MPX5100 8 Sensors NXP Semiconductors, B.V. 4 Package Information 4.1 Pressure (P1)/Gauge (P2) side identification table NXP designates the two sides of the pressure sensor as the Pressure (P1) side and the Gauge (P2) side. The Pressure (P1) side is the side containing fluoro-silicone gel which protects the die from harsh media. The MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below. Part number Package Pressure (P1) side identifier MPX5100AP, MPX5100GP 98ASB42796B Side with port attached MPX5100DP 98ASB42797B Side with part marking MPXV5100DP 98ASA99255D Side with part marking MPXV5100GC6U 98ASB17757C Side with port attached MPXV5100GC7U 98ASB17759C Side with port attached MPXV5100GP 98ASA99303D Side with port attached 4.2 Minimum recommended footprint for surface mounted applications Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder Figure 14. Small outline package footprint 4.3 Package dimensions This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASB17757C.pdf. MPX5100 Sensors NXP Semiconductors, B.V. 9 -A- D 8 PL 0.25 (0.010) 4 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. S N -B- G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 -T- K M PIN 1 IDENTIFIER SEATING PLANE Case 98ASB17757C, 8-lead small outline package MPX5100 10 Sensors NXP Semiconductors, B.V. This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASB17759C.pdf. FREESCALE D Case 98ASB17759C, 8-lead small outline package MPX5100 Sensors NXP Semiconductors, B.V. 11 This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASB42796B.pdf. Case 98ASB42796B, 6-lead unibody package MPX5100 12 Sensors NXP Semiconductors, B.V. Case 98ASB42796B, 6-lead unibody package MPX5100 Sensors NXP Semiconductors, B.V. 13 This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASB42797B.pdf. Case 98ASB42797B, 6-lead unibody package MPX5100 14 Sensors NXP Semiconductors, B.V. This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASA99255D.pdf. Case 98ASA99255D, 8-lead, dual port, small outline package MPX5100 Sensors NXP Semiconductors, B.V. 15 Case 98ASA99255D, 8-lead, dual port, small outline package MPX5100 16 Sensors NXP Semiconductors, B.V. This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASA99303D.pdf. PAGE 1 OF 2 Case 98ASA99303D, 8-lead, side port, small outline package MPX5100 Sensors NXP Semiconductors, B.V. 17 Case 98ASA99303D, 8-lead, side port, small outline package MPX5100 18 Sensors NXP Semiconductors, B.V. 5 Revision History Table 5. Revision history Revision number 14 Revision date 12/2018 Description of changes * * * * * * * * * Deleted obsolete part numbers MPX5100A and MPX5100D. Changed format to new corporate format. Added pinout for MPX5100AP/DP/GP in Figure 2. Added pin functions for MPX5100AP/DP/GP as Table 1. Added pinout for MPXV5100DP/GC6U/GC7U/GP as Figure 4. Added pin functions for MPXV5100DP/GC6U/GC7U/GP as Table 2. Moved section 5.1, Package dimensions to Section 4.3. Deleted section 5, duplicate Package Information information section. Added revision history as Table 5. MPX5100 Sensors NXP Semiconductors, B.V. 19 How to Reach Us: Information in this document is provided solely to enable system and software Home Page: NXP.com implementers to use NXP products.There are no expressed or implied copyright Web Support: NXP.com/support information in this document. NXP reserves the right to make changes without further licenses granted hereunder to design or fabricate any integrated circuits based on the notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation, consequential or incidental damages. "Typical" parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including "typicals," must be validated for each customer application by the customer's technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address: NXP.com/salestermsandconditions. NXP and the NXP logo are trademarks of NXP Semiconductors, B.V. All other product or service names are the property of their respective owners. (c) NXP Semiconductors, B.V., Inc., 2018. All Rights reserved. Document Number: MPX5100 Rev. 14 12/2018