Pressure Freescale Semiconductor MPX5100 Rev 13, 05/2010 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPX5100 MPXV5100 Series The MPX5100 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features * * * * * * 2.5% Maximum Error over 0 to 85C Ideally suited for Microprocessor or Microcontroller-Based Systems Patented Silicon Shear Stress Strain Gauge Available in Absolute, Differential and Gauge Configuration Durable Epoxy Unibody Element Easy-to-Use Chip Carrier Option 0 to 100 kPa (0 to 14.5 psi) 15 to 115 kPa (2.2 to 16.7 psi) 0.2 to 4.7 V Output Typical Applications * * * * Patient Monitoring Process Control Pump/Motor Control Pressure Switching ORDERING INFORMATION Case Device Name No. Unibody Package (MPX5100 Series) None MPX5100A 867 * MPX5100AP 867B MPX5100D 867 * MPX5100DP 867C MPX5100GP 867B Small Outline Package (MPXV5100 Series) MPXV5100GC6U MPXV5100GC7U MPXV5100DP MPXV5100GP 482A 482C 1351 1369 # of Ports Single Dual Gauge Pressure Type Differential Absolute * * * * * * * * * * * * * * (c) Freescale Semiconductor, Inc., 2005-2010. All rights reserved. * * Device Marking MPX5100A MPX5100AP MPX5100D MPX5100DP MPX5100GP MPXV5100G MPXV5100G MPXV5100DP MPXV5100GP Pressure UNIBODY PACKAGES MPX5100A/D CASE 867-08 MPX5100AP/GP CASE 867B-04 MPX5100DP CASE 857C-05 SMALL OUTLINE PACKAGES MPXV5100GC6U CASE 482A-01 MPXV5100GC7U CASE 482C-03 MPXV5100DP CASE 1351-01 MPXV5100GP CASE 1369-01 MPX5100 2 Sensors Freescale Semiconductor Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 5 required to meet electrical specifications.) Characteristic Symbol Min Typ Max 0 15 -- -- 100 115 kPa POP Pressure Range(1) Gauge, Differential: MPX5100D/MPX5100G/MPXV5100G Absolute: MPX5100A Unit Supply Voltage(2) VS 4.75 5.0 5.25 VDC Supply Current IO -- 7.0 10 mAdc (0 to 85C) VOFF 0.088 0.20 0.313 VDC Full Scale Output(4) @ VS = 5.0 V Differential and Absolute (0 to 85C) VFSO 4.587 4.700 4.813 VDC Full Scale Span(5) @ VS = 5.0 V Differential and Absolute (0 to 85C) VFSS -- 4.500 -- VDC Accuracy(6) -- -- -- 2.5 %VFSS Sensitivity V/P -- 45 -- mV/kPa Response Time(7) tR -- 1.0 -- ms Output Source Current at Full Scale Output IO+ -- 0.1 -- mAdc Warm-Up Time(8) -- -- 20 -- ms Offset Stability(9) -- -- 0.5 -- %VFSS Minimum Pressure Offset(3) @ VS = 5.0 V 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. 3. 4. 5. 6. 7. 8. 9. Device is ratiometric within this specified excitation range. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25C. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX5100 Sensors Freescale Semiconductor 3 Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg -40 to +125 C Operating Temperature TA -40 to +125 C 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Unibody Package. VS 3 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element 2 GND Gain Stage #2 and Ground Reference Shift Circuitry Vout 1 Pins 4, 5, and 6 are NO CONNECTS. Figure 1. Fully Integrated Pressure Sensor Schematic for Unibody Package Devices Figure 2 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Small Outline Package. VS 2 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element 3 GND Gain Stage #2 and Ground Reference Shift Circuitry Vout 4 Pins 1 and 5-8 are NO CONNECTS. Figure 2. Fully Integrated Pressure Sensor Schematic for Small Outline Package Devices MPX5100 4 Sensors Freescale Semiconductor Pressure On-chip Temperature Compensation and Calibration Figure 3 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in Figure 5. The output will saturate outside of the specified pressure range. Figure 4 illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from Span Range (Typ) 3 MAX 2 TYP 1 110 100 90 80 70 60 40 30 20 10 0 0 MIN 50 Output Voltage (V) 4 Vout = VS*(0.009*P+0.04) (Pressure Error * Temperature Factor * 0.009 * VS) VS = 5.0 V 0.25 Vdc PE = 2.5 TM = 1 TEMP = 0 to 85C Output Range (Typ) 5 the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5100 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. (Typ) Offset Pressure (kPa) Figure 3. Output vs. Pressure Differential Fluorosilicone Gel Die Coat Die Epoxy Plastic Case Wire Bond Lead Frame Fluorosilicone Gel Die Coat Die Stainless Steel Metal Cover Differential/Gauge Element Epoxy Plastic Case Wire Bond Die Bond Lead Frame Stainless Steel Metal Cover Absolute Element Die Bond Figure 4. Cross Sectional Diagrams (not to scale) Figure 5 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. +5.0 V VOUT OUTPUT Vs IPS 1.0 F 0.01 F GND 470 pF Figure 5. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) MPX5100 Sensors Freescale Semiconductor 5 Pressure Transfer Function (MPX5100D, MPX5100G, MPXV5100G Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.04) (Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V 0.25 V Temperature Error Multiplier MPX5100D/MPX5100G/MPXV5100G Series Break Points Temp 4.0 Multiplier - 40 0 to 85C +125 3.0 3 1 3 2.0 1.0 0.0 -40 -20 0 20 40 60 Temperature in C 80 100 120 140 Note: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C. Pressure Error Band MPX5100D/MPX5100G/MPXV5100G Series Error Limits for Pressure 3.0 Error (kPa) 2.0 1.0 0.0 0 20 40 60 80 100 120 Pressure in kPa -1.0 -2.0 -3.0 Pressure Error (max) 0 to 100 kPa 2.5 kPa MPX5100 6 Sensors Freescale Semiconductor Pressure Transfer Function (MPX5100A) Nominal Transfer Value: VOUT = VS (P x 0.009 - 0.095) (Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V 0.25 V Temperature Error Multiplier MPX5100A Series Break Points Temp Multiplier 4.0 - 40 0 to 85C +125 3.0 3 1 3 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 130 140 Temperature in C Note: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C. Pressure Error Band MPX5100A Series Error Limits for Pressure 3.0 Error (kPa) 2.0 1.0 0.0 0 20 40 60 80 100 130 Pressure in kPa -1.0 -2.0 -3.0 Pressure Error (max) 15 to 115 kPa 2.5 kPa MPX5100 Sensors Freescale Semiconductor 7 Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The MPX pressure Part Number MPX5100A, MPX5100D sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below. Case Type 867 Pressure (P1) Side Identifier Stainless Steel Cap MPX5100DP 867C Side with Part Marking MPX5100AP, MPX5100GP 867B Side with Port Attached MPXV5100GC6U 482A Side with Port Attached MPXV5100GC7U 482C Side with Port Attached MPXV5100DP 1351 Side with Part Marking MPXV5100GP 1369 Side with Port Attached SURFACE MOUNTING INFORMATION Minimum Recommended Footprint for Surface Mounted Applications Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and between the board and the package. With the correct shorting between solder Figure 6. Small Outline Package Footprint MPX5100 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S N -B- G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 -T- SEATING PLANE PIN 1 IDENTIFIER M K CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. -A4 5 N -BG 0.25 (0.010) 8 1 M T B D 8 PL S A S DIM A B C D G J K M N S V W DETAIL X S W V PIN 1 IDENTIFIER C -T- INCHES MILLIMETERS MAX MAX MIN MIN 10.79 0.425 10.54 0.415 10.79 0.425 10.54 0.415 13.21 0.520 12.70 0.500 0.864 0.66 0.034 0.026 0.100 BSC 2.54 BSC 0.28 0.23 0.011 0.009 3.05 2.54 0.120 0.100 15 0 15 0 11.38 0.448 11.28 0.444 14.22 0.560 13.72 0.540 6.48 6.22 0.255 0.245 3.17 2.92 0.125 0.115 SEATING PLANE K M J DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPX5100 Sensors Freescale Semiconductor 9 Pressure P 0.25 (0.010) M T Q -A- M U W X R PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. L V PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) N -Q- PORT #2 VACUUM (P2) B PIN 1 1 2 3 4 5 K 6 C SEATING PLANE -T- -T- J S SEATING PLANE D 6 PL G F 0.13 (0.005) M A M DIM A B C D F G J K L N P Q R S U V W X INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06 VOUT GROUND VCC V1 V2 VEX CASE 867-08 ISSUE N UNIBODY PACKAGE C R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30 NOM 30 NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN CASE 867C-05 ISSUE F UNIBODY PACKAGE MPX5100 10 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5100 Sensors Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5100 12 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5100 Sensors Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5100 14 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5100 Sensors Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5100 16 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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