MPX5100
Rev 13, 05/2010
Freescale Semiconductor
© Freescale Semiconductor, Inc., 2005-2010. All rights reserved.
Pressure
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPX5100 serie s piezoresistive transducer is a state-of-the-art monolithic
silicon pressure sensor designed for a wid e ran ge of ap plications, but p articula rly
those employing a microcontroller or microprocessor with A/D inputs. This patented,
single element transducer combines advanced micromachining techniques, thin-film
metallization, and bipolar pro c essin g to provide an accurate, high level analog
output signal that is proportional to the app lied pressure.
Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Patented Silicon Shear Stress Strain Gauge
• Available in Absolute, Differential and Gauge Configuration
• Durable Epoxy Unibody Element
• Easy-to-Use Chip Carrier Option
ORDERING INFORMATION
Device Name Case
No. # of Ports Pressure Type Device
Marking
None Single Dual Gauge Differential Absolute
Unibody Package (MPX5100 Series)
MPX5100A 867 • • MPX5100A
MPX5100AP 867B • • MPX5100AP
MPX5100D 867 • • MPX5100D
MPX5100DP 867C • • MPX5100DP
MPX5100GP 867B • • MPX5100GP
Small Outline Package (MPXV5100 Series)
MPXV5100GC6U 482A • • MPXV5100G
MPXV5100GC7U 482C • • MPXV5100G
MPXV5100DP 1351 • • MPXV5100DP
MPXV5100GP 1369 • • MPXV5100GP
MPX5100
0 to 100 kPa (0 to 14.5 psi)
15 to 115 kPa (2.2 to 16.7 psi)
0.2 to 4.7 V Output
MPXV5100
Series
Typical Applications
• Patient Monitoring
• Process Control
• Pump/Motor Control
• Pressure Switching
MPX5100
Sensors
2Freescale Semiconductor
Pressure
SMALL OUTLINE PACKAGES
UNIBODY PACKAGES
MPXV5100GP
CASE 1369-01
MPXV5100DP
CASE 1351-01
MPXV5100GC6U
CASE 482A-01
MPX5100AP/GP
CASE 867B-04 MPX5100DP
CASE 857C-05
MPXV5100GC7U
CASE 482C-03
MPX5100A/D
CASE 867-08
MPX5100
Sensors
Freescale Semiconductor 3
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Deco upling circuit shown in
Figure 5 required to meet electrical specifications.)
Characteristic Symbol Min Typ Max Unit
Pressure Range(1)
Gauge, Differential: MPX5100D/MPX5100G/MPXV5100G
Absolute: MPX5100A
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
POP 0
15 —
—100
115
kPa
Supply Voltage(2)
2. Device is ratiometric within this specified excitation range.
VS4.75 5.0 5.25 VDC
Supply Current IO—7.0 10 mAdc
Minimum Pressure Offset(3) (0 to 85°C)
@ VS = 5.0 V
3. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
VOFF 0.088 0.20 0.313 VDC
Full Scale Output(4) Differential and Absolute (0 to 85°C)
@ VS = 5.0 V
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
VFSO 4.587 4.700 4.813 VDC
Full Scale Span(5) Differential and Absolute (0 to 85°C)
@ VS = 5.0 V
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
VFSS —4.500 — VDC
Accuracy(6)
6. Accuracy (error budget) consists of the following:
• Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25°C.
• TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset: Output deviation with minimum pressure applied over the temperature range of 0° to 85°C, relative to 25°C.
• Variation from Nominal: The variation f r om nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.
— — — ±2.5 %VFSS
Sensitivity V/P —45 —mV/kPa
Response Time(7)
7. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
tR—1.0 —ms
Output Source Current at Full Scale Output IO+ —0.1 —mAdc
Warm-Up Time(8)
8. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
— — 20 —ms
Offset Stability(9)
9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Te st.
— — ±0.5 —%VFSS
MPX5100
Sensors
4Freescale Semiconductor
Pressure
Maximum Ratings
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Unibody Package.
Figure 1. Fully Integrated Pressure Sensor Schematic for Unibody Package Devices
Figure 2 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Small Outline Package.
Figure 2. Fully Integrated Pressure Sensor Schematic for Small Outline Package Devic es
Table 2. Maximum Ratings(1)
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating Symbol Value Unit
Maximum Pressure (P1 > P2) Pmax 400 kPa
Storage Temperature Tstg -40° to +125°°C
Operating Temperature TA-40° to +125°°C
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circui try
VS
Vout
GND Pins 4, 5, and 6 are NO CONNECTS.
3
1
2
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circui try
VS
Vout
GND Pins 1 and 5-8 are NO CONNECTS.
2
4
3
MPX5100
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Freescale Semiconductor 5
Pressure
On-chip Temperature Compensation and Calibration
Figure 3 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 5. The
output will saturate outside of the specified pressure range.
Figure 4 illustrates both the Differential/Gauge and the
Absolute Sensing Chip in the basic chip carrier (Case 867). A
fluorosilicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressu re signal to be
transmitted to the sensor diaphragm.
The MPX5100 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sen so r
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 3. Output vs. Pressure Differential
Figure 4. Cross Sectional Diagrams (not to scale)
Figure 5 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller . Proper decoupling of
the power supply is recommended.
Figure 5. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering , ple ase refer to Application Note AN1646.)
Output Voltage (V)
5
4
3MAX
0
10
20
30
40
50
60
70
80
90
100
2
1
0
110
Span Range (Typ)
Output Range (Typ)
Offset
Pressure (kPa) (Typ)
MIN
TYP
Vout = VS*(0.009*P+0.04)
± (Pressure Error * Temperature Factor * 0.009 * VS)
VS = 5.0 V ± 0.25 Vdc
PE = 2.5
TM = 1
TEMP = 0 to 85°C
Fluorosilicone
Gel Die Coat
Wire Bond
Lead Frame
Die
Epoxy Plastic
Case
Differential/Gauge Element Die Bond
Fluorosilicone Gel
Die Coat
Wire Bond
Lead Frame
Die Stainless Steel
Metal Cover
Epoxy Plastic
Case
Die Bond
Absolute Element
Stainless Steel
Metal Cover
470 pF
Vs
+5.0 V
0.01 μFGND
VOUT
IPS
OUTPUT
1.0 μF
IPS
OUTPUT
MPX5100
Sensors
6Freescale Semiconductor
Pressure
Transfer Function (MPX5100D, MPX5100G, MPXV5100G
Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.04)
± (Pressure Error x Temp. Mult. x 0.009 x VS)
VS = 5.0 V ± 0.25 V
Temper ature Error Multiplier MPX5100D/MPX5100G/MPXV5100G Series
Temp Multiplier
4.0
3.0
2.0
0.0
1.0
-40 -20 0 20 40 60 14012010080
- 40 3
0 to 85°C 1
+125° 3
Break Points
Temperature in °C
Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.
Pressure Error Ba nd
Pressure in kPa
3.0
2.0
1.0
-1.0
-2.0
-3.0
0.0 0 20 40 60 80 100 120
Pressure Error (max)
0 to 100 kPa ± 2.5 kPa
Error (kPa)
Error Limits for Pressure
MPX5100D/MPX5100G/MPXV5100G Series
MPX5100
Sensors
Freescale Semiconductor 7
Pressure
Transfer Functi on (MPX5100A)
Nominal Transfer Value: VOUT = VS (P x 0.009 - 0.095)
± (Pressure Error x Temp. Mult. x 0.009 x VS)
VS = 5.0 V ± 0.25 V
Temper ature Error Multiplier MPX5100A
Temp Multiplier
4.0
3.0
2.0
0.0
1.0
-40 -20 0 20 40 60 13012010080 140
- 40 3
0 to 85°C 1
+125° 3
Break Points
Temperature in °C
Note: The Temperature Mu lti plier is a linear response from 0° to -40°C and from 85° to 125°C.
Series
Pressure Error Ba nd
Pressure in kPa
3.0
2.0
1.0
-1.0
-2.0
-3.0
0.0 0 20 40 60 80 100 130
Pressure Error (max)
15 to 115 kPa ± 2.5 kPa
Error (kPa)
Error Limits for Pressure
MPX5100A Series
MPX5100
Sensors
8Freescale Semiconductor
Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positive di fferential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
tab l e be low.
SURFACE MOUNTING INFORMATION
Minimum Recommended Footprint for Surface Mounted Applications
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommende d to design
boards with a solder mask layer to avoid bridging and
shorting between solder
Figure 6. Small Outline Package Footprint
Part Number Case Type Pressure (P1) Side Identifier
MPX5100A, MPX5100D 867 Stainless Steel Cap
MPX5100DP 867C Side with Part Marking
MPX5100AP, MPX5100GP 867B Side with Port Attached
MPXV5100GC6U 482A Side with Port Attached
MPXV5100GC7U 482C Side with Port Attached
MPXV5100DP 1351 Side with Part Marking
MPXV5100GP 1369 Side with Port Attached
MPX5100
Sensors
Freescale Semiconductor 9
Pressure
PACKAGE DIMENSIONS
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A10.540.4250.415 10.79
B10.540.4250.415 10.79
C12.700.5200.500 13.21
D0.960.0420.038 1.07
G0.100 BSC 2.54 BSC
H0.002 0.010 0.05 0.25
J0.009 0.011 0.23 0.28
K0.061 0.071 1.55 1.80
M0 7 0 7
N0.444 0.448 11.28 11.38
S0.709 0.725 18.01 18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
S
D
G
8 PL
4
5
8
1
S
B
M
0.25 (0.010) A S
T
–A–
–B–
C
M
J
K
PIN 1 IDENTIFIER
H
SEATING
PLANE
–T–
N
V
W
V0.245 0.255 6.22 6.48
W0.115 0.125 2.92 3.17
MILLIMETERSINCHES
0.100 BSC 2.54 BSC
DIM
A
B
C
D
G
J
K
M
N
S
V
W
MIN
0.415
0.415
0.500
0.026
0.009
0.100
0˚
0.444
0.540
0.245
0.115
MAX
0.425
0.425
0.520
0.034
0.011
0.120
15˚
0.448
0.560
0.255
0.125
MIN
10.54
10.54
12.70
0.66
0.23
2.54
0˚
11.28
13.72
6.22
2.92
MAX
10.79
10.79
13.21
0.864
0.28
3.05
15˚
11.38
14.22
6.48
3.17
PIN 1
IDENTIFIER
K
SEATING
PLANE
-T-
W
DETAIL X
S
G
4
5
8
1
-A-
-B-
N
C
V
M
J
D
8 PL
S
B
M
0.25 (0.010) A
S
T
DETAIL X
NOTES:
1.
2.
3.
4.
5.
6.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
MAXIMUM MOLD PROTRUSION 0.15 (0.006).
ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
MPX5100
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10 Freescale Semiconductor
Pressure
CASE 867-08
ISSUE N
UNIBODY PACKAGE
CASE 867C-05
ISSUE F
UNIBODY PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
R
X
123456
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A1.145 1.175 29.08 29.85
B0.685 0.715 17.40 18.16
C0.405 0.435 10.29 11.05
D0.027 0.033 0.68 0.84
F0.048 0.064 1.22 1.63
G0.100 BSC 2.54 BSC
J0.014 0.016 0.36 0.41
K0.695 0.725 17.65 18.42
L0.290 0.300 7.37 7.62
N0.420 0.440 10.67 11.18
P0.153 0.159 3.89 4.04
Q0.153 0.159 3.89 4.04
R0.063 0.083 1.60 2.11
S
U0.910 BSC 23.11 BSC
V0.182 0.194 4.62 4.93
W0.310 0.330 7.87 8.38
X0.248 0.278 6.30 7.06
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PORT #1
PIN 1
PORT #2
POSITIVE
VACUUM
PRESSURE
SEATING
PLANE
SEATING
PLANE
–T– –T–
P
G
C
J
N
B
F
D
W
V
L
U
6 PL
S
K
–Q–
–A–
M
Q
M
0.25 (0.010) T
M
A
M
0.13 (0.005)
PRESSURE (P1)
0.220 0.240 5.59 6.10
(P1)
(P2)
PIN 1
F
G
NL
R
123456
6 PL
D
SEATING
PLANE
-T-
M
A
M
0.136 (0.005) T
POSITIVE PRESSURE
(P1)
C
B
M
J
S
-A-
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
MAX
MILLIMETERSINCHES
16.00
13.56
5.59
0.84
1.63
0.100 BSC 2.54 BSC
0.40
18.42
30˚ NOM 30˚ NOM
12.57
11.43
DIM
A
B
C
D
F
G
J
L
M
N
R
S
MIN
0.595
0.514
0.200
0.027
0.048
0.014
0.695
0.475
0.430
0.090
MAX
0.630
0.534
0.220
0.033
0.064
0.016
0.725
0.495
0.450
0.105
MIN
15.11
13.06
5.08
0.68
1.22
0.36
17.65
12.07
10.92
2.29 2.66
NOTES:
1.
2.
3.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
MPX5100
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Pressure
PACKAGE DIMENSIONS
CASE 867B-04
ISSUE G
UNIBODY PACKAGE
PAGE 1 OF 2
MPX5100
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Pressure PACKAGE DIMENSIONS
CASE 867B-04
ISSUE G
UNIBODY PACKAGE
PAGE 2 OF 2
MPX5100
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Pressure
PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
PAGE 1 OF 2
MPX5100
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14 Freescale Semiconductor
Pressure PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
PAGE 2 OF 2
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Pressure
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
PAGE 1 OF 2
MPX5100
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Pressure PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
PAGE 2 OF 2
MPX5100
Rev. 13
05/2010
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