ESD1P0RF... RF ESD Protection Diodes * ESD / transient protection of RF antenna / interfaces or ultra high speed data lines acc. to: IEC61000-4-2 (ESD): 20 kV (contact) IEC61000-4-4 (EFT): 40 A (5/50 ns) IEC61000-4-5 (surge): 10 A (8/20 s) * Ultra low capacitance of 1 pF typ. (0.5 pF per diode) * Low clamping voltage * Pb-free (ROHS compliant) package Applications in anti-parallel configuration * For low RF signal levels without superimposed DC voltage: e.g. GPS, WLAN, Bluetooth Applications in rail-to-rail configuration * For high RF signal levels or low RF signal levels with superimposed DC voltage: e.g. HDMI, S-ATA, Gbit Ethernet ESD1P0RFW ESD1P0RFS $ ! " # , ! , , " , , , ! Type Package Configuration Marking ESD1P0RFS ESD1P0RFW SOT363 SOT323 2 channels 1 channel E6s E6s 1 2011-07-20 ESD1P0RF... Maximum Ratings at TA = 25C, unless otherwise specified Parameter Symbol ESD contact discharge1) VESD 20 kV Peak pulse current (tp = 8 / 20 s)2) Ipp 10 A Operating temperature range Top -55...150 C Storage temperature Tstg -65...150 Value Unit Electrical Characteristics at TA = 25C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Characteristics Reverse working voltage3) VRWM - - 70 V Reverse current IR - - 100 nA VR = 70 V Forward clamping voltage2) VFC V IPP = 3 A, tp = 8/20 s - 4 7 IPP = 10 A, tp = 8/20 s - 12 15 Line capacitance4) pF CT VR = 0 V, f = 1 MHz - 1 1.5 VR = 0 V, f = 1 MHz, for Application example 4 - 0.5 0.75 Series inductance (per diode) LS nH SOT323 - 1.4 - SOT363 - 1.6 - 1V ESD according to IEC61000-4-2, only valid in anti-parallel or rail-to-rail connection. Please refer to the application examples. 2I pp according to IEC61000-4-5, only valid in anti-parallel or rail-to-rail connection. Please refer to the application examples. valid in rail-to-rail configuration VCC VRWM 3Only 4Total capacitance line to ground (2 diodes in parallel) 2 2011-07-20 ESD1P0RF... Forward clamping voltage VFC = (IPP) Reverse current IR = (VR ) tp = 8 / 20 s TA = Parameter in rail-to-rail configuration 10 -5 A 12 V 125C 10 -6 10 85C 10 -7 8 IR VFC 9 7 10 -8 25C 6 10 -9 5 4 10 -10 3 2 10 -11 -40C 1 0 1 2 3 4 5 6 7 A 8 10 -12 0 10 10 20 30 40 50 Ipp V 70 VR Forward current IF = (VF) Line capacitance CT = (f) TA = Parameter VR = 0 V in anti-parallel configuration 100 3 A pF 60 125C 85C CT IF 40 25C 20 2 -40C 0 -20 1.5 -40C 25C -40 85C 1 125C -60 0.5 -80 -100 -600 -400 -200 0 200 mV 0 0 600 VF 500 1000 MHz 2000 f 3 2011-07-20 ESD1P0RF... Insertion loss |S21 |2 = (f) VR = 0 V, line to ground, Z = 50 0 dB IL -0.25 -0.375 -0.5 -0.625 -0.75 0 250 500 750 1000 1250 1500 MHz 2000 f 4 2011-07-20 ESD1P0RF... 1. Application example ESD1P0RFW 1 channel, anti-parallel configuration 1 protected signal line, superimposed DC voltage up to VF (diode forward voltage) ESD sensitive circuit I/O 3 Line capacitance to ground = 1 pF 1 2 The protection diode should be placed very close to the location where the ESD or other transients can occur to keep loops and inductances as small as possible. Pins 1 and 2 should be connected in parallel directly to a ground plane on the board. 2. Application example ESD1P0RFW 1 channel, rail-to-rail configuration +Vcc ESD sensitive circuit I/O 1 3 2 1 protected signal line, superimposed DC voltage up to +Vcc (voltage supply) Line capacitance to ground = 1 pF Pin 2 should be connected to the positive supply voltage and pin 1 should be connected directly to a ground plane on the board. Clamped input voltage at I/O port is limited to Vcc + VF at positive transients and 0V VF at negative transients (VF ... diode forward voltage drop). 3. Application example ESD1P0RFS 2 channels, anti-parallel configuration 2 protected signal lines, superimposed DC voltage up to VF (diode forward voltage) 4 3 5 2 6 1 I/O ESD sensitive device Pins 1, 2 and 4, 5 should be connected in parallel directly to a ground plane on the board. Clamped input voltage at I/O port is limited to VCL (clamping voltage) at positive resp. negative transients. I/O Line capacitance to ground = 1 pF 5 2011-07-20 ESD1P0RF... 4. Application example ESD1P0RFS 1 channel, low capacitance anti-parallel configuration 1 protected signal line, superimposed DC voltage up to 2 x VF (diode forward voltage) 4 3 (n.c.) 5 2 (n.c.) 6 1 I/O ESD sensitive device Pins 1 and 4 should be connected directly to a ground plane on the board. Pins 3, 6 are not connected. Clamped input voltage at I/O port is limited to 2 x VCL (clamping voltage) at positive resp. negative transients. Line capacitance to ground = 0.5 pF 6 2011-07-20 Package SOT323 ESD1P0RF... Package Outline 0.9 0.1 2 0.2 0.3 +0.1 -0.05 0.1 MAX. 3x 0.1 M 0.1 A 1 2 1.25 0.1 0.1 MIN. 2.1 0.1 3 0.15 +0.1 -0.05 0.65 0.65 0.2 M A Foot Print 0.8 1.6 0.6 0.65 0.65 Marking Layout (Example) Manufacturer 2005, June Date code (YM) BCR108W Type code Pin 1 Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 0.2 2.3 8 4 Pin 1 2.15 1.1 7 2011-07-20 Package SOT363 ESD1P0RF... Package Outline 2 0.2 0.9 0.1 +0.1 6x 0.2 -0.05 0.1 0.1 MAX. M 0.1 Pin 1 marking 1 2 3 A 1.25 0.1 4 0.1 MIN. 5 2.1 0.1 6 0.15 +0.1 -0.05 0.65 0.65 0.2 M A Foot Print 1.6 0.9 0.7 0.3 0.65 0.65 Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. Manufacturer 2005, June Date code (Year/Month) Pin 1 marking Laser marking BCR108S Type code Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel For symmetric types no defined Pin 1 orientation in reel. 0.2 2.3 8 4 Pin 1 marking 1.1 2.15 8 2011-07-20 ESD1P0RF... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 9 2011-07-20