PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
1 Enterprise, Aliso Viej o, CA 92656, USA; Within the USA: (800) 713-4113, Outside the USA: (949) 221-7100 Fax: (949) 756-0308
1
8 PORTS PSE POE MANAGER
TM
®
WWW.Microsemi .COM
PD69108/F
DESCRIPTION
KEY FEATURES
Microsemi’s PD69108
Power over Ethernet (PoE) Manager
integrates power, analog and state of the art logic
into a single
48 pin, plastic QFN package.
The device is used in Ethernet
switches and Midspans, enabling network devices to share power
and data over the same cable.
The PD69108 device is an 8 ports, mixed-signal, high-voltage PoE
driver. It enables detection of IEEE802.3at-2009 compliant Type 1
and Type 2 PDs (Powered Devices), ensuring safe power feeding
and disconn ection of ports with f ull digit al control and a m inim um of
external components.
The PD69108 executes all real time functions as specified in the
IEEE802.3af-2003 (“AF”) and IEEE802.3at-2009 High Power (“AT”)
standards, inc luding loa d detecti on and “AF ” a nd “ AT clas s if ication .
In addition, the PD69108 features Multiple Classification Attempts
(MCA) port status monitoring, and provides system level activities
such as power manag
ement and MIB support for system
management.
The PoE device is designed to detect and disable disconnected
ports utilizing DC disconnection methods, as specified in the IEEE
802.3af-2003 and IEEE802.3at-2009 standards.
The unit provides PD protection such as over-load, under-load,
over-voltage and short-circuiting.
It supports supply voltages
ranging from 44 to 57 VDC with no need for additional power supply
sources. The chip includes built-in internal thermal protection.
Optionally, the PD69108 can detect legacy/pre-
standard PD
devices.
The PD69108 is a l o w pow er dev ice us in g an int ernal MO SFET and
an external 0.36 Ω sense resistor.
IEEE802.3af-2003 compliant
IEEE802.3at-2009 compliant,
including two-event classification
Supports pre-standard PD detection
Supports Cisco devices detection
Single DC voltage input (44 to 57
VDC)
Input voltage out of range p rotec tio n
Wide temperature range: -10°C to
+85°C
PD69108F version covering -40°C to
+85°C
Over-temperature protection
Low power dissipation (0.36 Ω sense
resistor and 0.3Ω MOSFET Rdson)
Includes Reset command pin
4 x direct address configuration pins
Continuous port monitoring and
system data
Configurable load current setting
Configurable AT/AF modes
Configurable standard and legacy
detection mode
Power soft start mechanism
On-chip thermal protection
Voltage monitoring/protection
Built in 3.3 VDC and 5 VDC regulators
Internal power on reset
RoHS compliant
Emergency power management
supporting four configurable power
bank I/Os
Can be cascaded to up to 12 PoE
devices (96 ports)
IMPORTANT
: For the most current data, consult MICROSEMI’s website: htt p:/ / www.mi c rosem i.com
PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
1 Enterprise, Aliso Viej o, CA 92656, USA; Within the USA: (800) 713-4113, Outside the USA: (949) 221-7100 Fax: (949) 756-0308
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PD69108/F
ABSOLUTE MAXIMUM RATINGS
PACKAGE PIN OUT
Supply Input Voltage (VMAIN)
-0.3 to 74 VDC
Port_Neg[0..7] Pins
-0.3 to 74 VDC
Port_Sense [0. . 7] Pins
-0.3 to 3.6 VDC
QGND, GND Pins
-0.3 to 0.3 VDC
All Other Pins
-0.3 to 3.6 VDC
PD69108 Operating Ambient Temperature
Range
-10° to +85° C
PD69108F Operating Ambient Temperature
Range
-40° to +85° C
Maximum Operating Junction Temperature
+150
°
C
ESD Protection at all I/O Pins
± 2 KV HBM
Storage Temperature Range
-65
°
to +150
°
C
Notes:
Exceeding these ratings can cause damage to the device. All voltages are with
respect to ground. Currents are marked positive when flowing into specified
terminals and marked negative when flowing out of a s pec if ied terminal.
MOSI
23
24
25
26
27
28
29
30
20
19
18
17
16
15
14
13
IREF
AGND
VMAIN
PORT_SENSE3
VPORT_NEG3
PORT_SENSE4
VPORT_NEG4
PORT_SENSE5
VPORT_NEG6
1
2
3
4
5
6
7
8
SCK
44
37
38
39
40
Microsemi LOGO
MSC
PD69108/F
Date Code
PG0
PORT_SENSE6
QGND
DGND
VAUX5
PG1 PG2
PG3
TRIM
DGND
SPI_CS
MISO
32
33
PORT_SENSE2
VPORT_NEG2
9
10
N/C
DRV_VAUX5
42
43
12
VPORT_NEG0
PORT_SENSE0 PORT_SENSE7
VPORT_NEG7
VPORT_NEG1
PORT_SENSE1
11
31
22
41
21
VPORT_NEG5
VAUX3P3
N/C
VAUX3P3_INT
AGND
DVDD
ADDR0
ADDR1
ADDR2
ADDR3
RESET_N
35
36
34
48
46
47
45
N/C N/C
AGND
REG_EN_N
(Top View)
RoHS / Pb-free 100% Matte Tin Finish
PACKAGE ORDER INFO
THERMAL DATA
TA (
°
C)
Plastic 48 pin QFN 8 mm x 8 mm
TYPICAL THERMAL RESISTANCE-JUNCTION TO AMBIENT 25° C/W
RoHS compliant / Pb-free/MSL1
TYPICAL THERMAL RESISTANCE-JUNCTION TO CASE C/W
-10 to +85
PD69108ILQ
Junction Temperature Calcul ation:
TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal
performance of the device/pc-board system. All of the
above assume no ambient airflow.
-40 to +85
PD69108FILQ
Note: Available in Tape and Reel. Append the letters “TR” to
the part number.
POWER DISSIPATION
Rsense Power Dissipation: 0.36 Ω x Iport2
Rds_ON Power Dissipation: 0.3Ω x Iport2
Pport_AF = 15.4 W
==> PRsense = 28.2mW
PRds_ON = 23.4mW
Pport_AT = 30 W
==> PRsense = 107 mW
**
Calculated for Supply input Voltage of 55V
PRds_O N = 88.5mW
INTERNAL 3.3V VOLTAGE REGULATOR IS USED EXTERNAL 3.3V VOLTAGE REGULATOR IS
USED
PD69108 self power dissipation: 1.1 W
PD69108 8 ports AF Application Power dissipation = 1.1 W +
[ 8 x (28.2 mW + 23.4mW) ] = 1.51W
PD69108 8 ports AT Application P o wer diss ip ati on = 1.1 W +
[ 8 x (107 mW + 88.5mW) ] = 2.66W
PD69108 self power dissipation: 0.5 W
PD69108 AF 8 ports Application Power dissipation =
0.5 W + [ 8 x (28.2mW + 23.4mW) ] = 0.91W
PD69108 8 ports AT Application Power dissipation =
0.5 W + [ 8 x (107 mW + 88.5mW) ] = 2.06W
PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
1 Enterprise, Aliso Viej o, CA 92656, USA; Within the USA: (800) 713-4113, Outside the USA: (949) 221-7100 Fax: (949) 756-0308
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®
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PD69108/F
ROHS AND SOLDER REFLOW INFORMATION
RoHS 6/6
Pb-free 100% Matte Tin Finish
Package Peak Temperature for Solder Reflow
(40 seconds maximum exposure)
260°C (+0°C, -5°C)
Notes:
Exceeding these ratings can cause damage to the device.
PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
1 Enterprise, Aliso Viej o, CA 92656, USA; Within the USA: (800) 713-4113, Outside the USA: (949) 221-7100 Fax: (949) 756-0308
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TM
®
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PD69108/F
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, the following specifications apply to the operating ambient temperature.
PARAMETER SYMBOL TEST CONDITIONS /
COMMENT
PD69108 POE
MANAGER UNITS
MIN TYP MAX
POWER SUPPLY
Input Voltage VMAIN
Supports Full IEEE802.3
functionality
44 55 57 V
Power Supp l y Current
@ Operating Mode
VMAIN = 55 VDC 20 mA
5V Output Voltage VAUX5 4.5 5 5.5 VDC
3.3V Output Voltage VAUX3P3 2.97 3.3 3.63 VDC
3.3V Output Current Without external NPN 5 mA
With external NPN transistor
on VAUX5
30 mA
3.3V Input Voltage VAUX3P3 REG_EN_N pin = 3.3V
(internal reg. is dis abl ed)
VAUX3P3_INT=5V
3 3.3 3.6 VDC
DIGITAL I/O ((RESET_N, MISO, MOSI, SCK, CS, PG[0..3], ADD[0..3])
Input Logic High
Threshold
VIH 2.2 V
Input Logic Low
Threshold
VIL 0.8 V
Input Hysteresis
Voltage
0.4 0.6 0.8 V
Input High Current IIH -10 10 uA
Input Low Current IIL -10 10 uA
Output High Voltage VOH For IOH = -1 mA 2.4 V
Output Low Voltage VOL IOH = 1 mA 0.4 V
POE LOAD
CURRENTS
AF Limit Mode AF_LIM
400 425 450 mA
AT Limit AT_LIM
775 850 925
mA
AT Limit Dynamic
Range Configurable by
communication
R
SENSE
= 0.36 Ω 1%
connected at Port_Sense
pin
540 1200 mA
MAIN POWER
SWITCHING FET
On Resistance RDSON 0.3 Ω
Internal Thermal
Protection Threshold
200 °C
PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
1 Enterprise, Aliso Viej o, CA 92656, USA; Within the USA: (800) 713-4113, Outside the USA: (949) 221-7100 Fax: (949) 756-0308
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PD69108/F
Dynamic Characteristics
The PD69108 utilizes three current level thresholds (Imin, Icut, Ilim) and three timers (Tmin, Tcut, Tlim).
Loads that consume Ilim current for more than Tlim are classified as being in 'short circuit state' and are shutdown.
Loads that dissipate more than Icut for longer than Tcut are classified as ‘overloads’ and are automatically shutdown.
If output power is below Imin for more than Tmin, the PD is classified as ‘no-load’ and is shutdown.
Automatic recovery from over-load condition is attempted every TOVLREC periods (typically 1 second). Output power is
limited to Ilim, which is a maximum peak current allowed at the port.
IEEE802.3 AF Mode Parameters
PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Automatic recovery from no-
load shutdown
T
UDLREC
value, measured from port shutdown
point (can be modified through control port)
1 Sec
Cutoff timers accuracy
Typical accuracy of T
cut
2 ms
Inrush current
IInrsh
For t = 50 ms, Cload= 180 uF max.
400
450
mA
Output current operating range
I
port
Continuous operation after startup
period.
10 350 mA
Output power available
operating range
P
port
Continuous operation after startup
period, at port output.
0.57 15.4 W
Off mode current
I
min1
Must disconnect for T greater than
TUVL
0 5 mA
I
min2
May or ma y not disconnect where
T is greater than TUVL
5 7.5 10 mA
PD power maintenance
request drop-out time limit
T
PMDO
Buffer period to handle transitions
300 400 ms
Over-load current detection
range
I
cut
Time limited to T
OVL
350 400 mA
Over load time limit
TOVL
50
75
ms
Turn on rise time
T
rise
From 10% to 90% of V
port
(Specified f or PD load consisting of 100 uF
capacitor in parallel to 200
).
15 us
Turn off time
Toff
From Vport to 2.8 VDC
500
ms
Time maintain power signature
T
MPS
DC modulation time for DC
disconnect
49 ms
PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
1 Enterprise, Aliso Viej o, CA 92656, USA; Within the USA: (800) 713-4113, Outside the USA: (949) 221-7100 Fax: (949) 756-0308
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PD69108/F
IEEE802.3 AT Mode Parameters
PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Automatic recovery from
no-load shutdown TUDLREC value, measured from port shutdown
point (can be modified through control port)
1 s
Cutoff timers accuracy
Typical accuracy of Tcut 2 ms
Inrush current
IInrsh For t = 50 ms, Cload = 180 uF
max. 400 450 mA
Output current operating
range
Iport
Continuous operation after startup
period
10 600 mA
Output power available,
operating range
Pport
Continuous operation after startup
period at port out p ut
0.57 36 W
Off mode current
Imin1
Must disconnect where T is greater
than TUVL
0 5 mA
Imin2
May or ma y not disconnect where
T is greater than TUVL
5 7.5 10 mA
PD power maintenance
request drop-out time limit
TPMDO
Buffer period to handle transitions
300 400 ms
Over-load current
detection range
Icut
Time limited to T
OVL
600 775 mA
Over-load time limit
TOVL
50 75 ms
Turn on rise time
Trise
From 10% to 90% of V
port
(Specified f or PD load consisting of 100 uF
capacitor in parallel to 200 ). 15 us
Turn off time
Toff
From V
port
to 2.8 VDC
500 ms
Time maintain power
signature
TMPS
DC modulation time for DC
disconnect
49 ms
PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
1 Enterprise, Aliso Viej o, CA 92656, USA; Within the USA: (800) 713-4113, Outside the USA: (949) 221-7100 Fax: (949) 756-0308
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PD69108/F
Package Pinout
MOSI
23
24
25
26
27
28
29
30
20
19
18
17
16
15
14
13
IREF
AGND
VMAIN
PORT_SENSE3
VPORT_NEG3
PORT_SENSE4
VPORT_NEG4
PORT_SENSE5
VPORT_NEG6
1
2
3
4
5
6
7
8
SCK
44
37
38
39
40
Microsemi LOGO
MSC
PD69108/F
Date Code
PG0
PORT_SENSE6
QGND
DGND
VAUX5
PG1 PG2
PG3
TRIM
DGND
SPI_CS
MISO
32
33
PORT_SENSE2
VPORT_NEG2
9
10
N/C
DRV_VAUX5
42
43
12
VPORT_NEG0
PORT_SENSE0 PORT_SENSE7
VPORT_NEG7
VPORT_NEG1
PORT_SENSE1
11
31
22
41
21
VPORT_NEG5
VAUX3P3
N/C
VAUX3P3_INT
AGND
DVDD
ADDR0
ADDR1
ADDR2
ADDR3
RESET_N
35
36
34
48
46
47
45
N/C N/C
AGND
REG_EN_N
PD69108 for -10° to +85°C Operating Ambient Temperature Range
PD69108F for -40° to +85°C Operating Ambient Temperature Range
Detailed Pinout Des cripti on
PIN PIN NAME PIN TYPE DESCRIPTION
0 Exposed PAD Analog Gnd
Exposed PAD: Metal plate on the IC bottom side connected to
analog grou nd.
A decent ground plane (about 500 mil inch over 500 mil inch) should
be deployed around this pin whenever possible
1
PG0
Digital Input
Power supply monitoring
2
PG1
Digital Input
Power supply monitoring
3 PORT_SENSE0 Analog Input Sense resistor port input
(Connected to 0.36 Ω, 1% resistor to QGND with ~12 mΩ trace for
measurements accuracy).
4
VPORT_NEG0
Analog I/O
Negative port output
5
PORT_SENSE1
Analog Input
Sense resistor port input
(Connected to 0.36 Ω, 1% resistor to QGND with ~12 mΩ trace for
measurements accuracy).
6
VPORT_NEG1
Analog I/O
Negative port output
PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
1 Enterprise, Aliso Viej o, CA 92656, USA; Within the USA: (800) 713-4113, Outside the USA: (949) 221-7100 Fax: (949) 756-0308
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PD69108/F
PIN PIN NAME PIN TYPE DESCRIPTION
7
AGND
Power
Analog ground
8
N/C
Not Connected
9
PORT_SENSE2
Analog Input
Sense resistor port input
(Connected to 0.36 Ω, 1% resistor to QGND with ~12 mΩ trace for
measurements accuracy).
10
VPORT_NEG2
Analog I/O
Negative port output
11 PORT_SENSE3 Analog Input Sense resistor port input
(Connected to 0.36 Ω, 1% resistor to QGND with ~12 mΩ trace for
measurements accuracy).
12
VPORT_NEG3
Analog I/O
Negative port output
13
N/C
Analog I/O
Test pin for production use only
Keep open, not connected
14
N/C
Analog I/O
15
VMAIN
Power
Supplies voltage for the internal analog circuitry. A lo w ESR 1 uF (or
higher) bypass capacitor, connected to AGND should be placed as
close as possible to this pin through low resistance traces.
16
VAUX5
Power
Regulated 5 VDC output voltage source; it needs to be connected to
a filtering capacitor of 4.7 uF or higher.
If an external NPN is used to regulate the voltage, connect this pin to
the "Emitter" (the "collector" should be conn ected t o Vmain)
17
DRV_VAUX5
Power
Driven outputs for 5 VDC external regulation; if internal regulation is
used, connect to pin 16.
If an external NPN is used to regulate the voltage, connect this pin to
the "Base".
18
AGND
Power
Analog ground
19
VAUX3P3_INT
Power
Connected to VAX3P3 (pin 20) if internal 3.3 VDC regulator is used.
Connect to VAUX5 (pin 16) if external 3.3 VDC regulator is used
20
VAUX3P3
Power
Regulated 3.3v output voltage source. A 4.7 μF or higher filtering
capacitor should be connected between this pin and AGND.
When an external 3.3 VDC regulator is used, connect it to this pin to
supply the chip.
21
QGND
Power
Quiet analog ground.
22
IREF
Analog Input
Reference resistor pin. Connect a 30.1 kΩ 1% resistor to QGND.
23 TRIM Analog Input
Trimming Input for IC production.
Should be connected to VAUX3P3.
24
REG_EN_N REG_EN_N Enable/Disable the intern al 3.3 VDC regulator in case an external
3.3 VDC is used to supply the chip.
GND: Internal regulator enabled
3.3 VDC: Internal regulator disabled
25
VPORT_NEG4
Analog I/O
Negative port output.
26
PORT_SENSE4
Analog Input
Sense resistor port input
(Connected to 0.36 Ω, 1% resistor to QGND with ~12 mΩ trace for
measurements accuracy).
27
VPORT_NEG5
Analog I/O
Negative port output.
28
PORT_SENSE5
Analog Input
Sense resistor port input.
(Connected to 0.36 Ω, 1% resistor to QGND with ~12 mΩ trace for
measurements accuracy).
29
N/C
Not Connected
30
AGND
Power
Analog ground.
31
VPORT_NEG6
Analog I/O
Negative port output.
PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
1 Enterprise, Aliso Viej o, CA 92656, USA; Within the USA: (800) 713-4113, Outside the USA: (949) 221-7100 Fax: (949) 756-0308
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PD69108/F
PIN PIN NAME PIN TYPE DESCRIPTION
32
PORT_SENSE6
Analog Input
Sense resistor port input.
(Connected to 0.36 Ω, 1% resistor to QGND with ~12 mΩ trace for
measurements accuracy).
33
VPORT_NEG7
Analog I/O
Negative port output.
34
PORT_SENSE7
Analog Input
Sense resistor port input.
(Connected to 0.36 Ω, 1% resistor to QGND with ~12 mΩ trace for
measurements accuracy).
35
PG2
Digital Input
Power supply monitoring.
36
PG3
Digital Input
Power supply monitoring.
37
TST
Digital I/O
Test pin for production use onl y.
Keep connected to DGND.
38
RESET_N
Digital Input
Reset input; active low ('0' = reset)
An external 10K pull-up resistor should be connected between this
pin and DVDD.
39
MOSI
Digital Input
SPI bus, Master Data out /sl ave in
40
MISO
Digital Output
SPI bus, Master Data in/s l a ve out
41
SPI_CS
Digital Input
SPI bus, Chip Select
42
DVDD
Power
Digital 3.3 V input. It needs to be connected to filtering capacitor of
1 uF.
43
DGND
Digital I/O
Digital GND
44
SCK
Digital Input
SPI bus, Serial cloc k input
45
ADDR3
Digital Input
Address bus to set SPI address
46
ADDR2
Digital Input
Address bus to set SPI address
47
ADDR1
Digital Input
Address bus to set SPI address
48
ADDR0
Digital Input
Address bus to set SPI address
Address Pi n Description (ADDR<3:0>)
ADDR3 ADDR2 ADDR1 ADDR0 SPI ADDRESS [HEX]
0
0
0
0
0
0
0
0
1
1
0
0
1
0
2
0
0
1
1
3
0
1
0
0
4
0
1
0
1
5
0
1
1
0
6
0
1
1
1
7
1
0
0
0
8
1
0
0
1
9
1
0
1
0
A
1
0
1
1
B
1
1
0
0
C
1
1
0
1
D
1
1
1
0
E Broadcast (See note)
1
1
1
1
F
'1' = DVDD (3.3 V)
'0' = DGND (digital ground)
Note: This address is used for Broadcast. Do not set any PD69108s in the system to this address.
PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
1 Enterprise, Aliso Viej o, CA 92656, USA; Within the USA: (800) 713-4113, Outside the USA: (949) 221-7100 Fax: (949) 756-0308
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PD69108/F
SPI Detailed Timing Information
Name
Min Delay
Max Delay
Description
D1
714ns
SPI clock period
D2 45 55 SPI duty cycle
D3 340 ns
SPI_CS setup to SPI clock Positive Edge (delay after
SPI_CS active signal)
D4 340 ns
SPI_CS hold to SPI clock Positive Edge (d ela y befor e
SPI_CS inactive Signal)
D5 2 spi clock cycles
Delay between las t SC K in eS PI1 frame and first SCK at
adjacent eSPI1 frame
D6
1 spi clock cycles
Between byte 0 (IC addr) and byte 1(addr)
D7 1 spi clock cycles Between byte 1 (addr) and byte 2(data).
D8
1 SPI clock cycles
Between byte 2 (MS data byte) and byte 3(LS data byte).
D9 340 ns MOSI setup time
D10
210 ns
MOSI hold time
D11 140ns MISO tri-state to valid data from clock positive edge
D12
300ns
MISO valid data to tri-s tat e from SPI_CS positive edge
D13 1 SPI clock cycles SPI_CS width (Delay eSPI1 frame to adjacent eSPI1 frame)
D14
60ns
Filtered Glitch Width
D15 D3 + 15.5 SPI clock
cycles D3+23.75 SPI clock
cycles MISO tri-state from SPI_CS Negati ve Edge to valid data
D3
D4
D1 D2
D7
D6 D8
D9 D10
CS_N
SCK
MOSI
MISO
D5
D11 D12
D2
SPI1 frame
8 SCK clock cycles 8 SCK clock cycles 8 SCK clock cycles
D13
Noise Spike
D14
D15
PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
1 Enterprise, Aliso Viej o, CA 92656, USA; Within the USA: (800) 713-4113, Outside the USA: (949) 221-7100 Fax: (949) 756-0308
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PD69108/F
PACKAGE DESCRIPTION
48-Pin 8x8mm QFN
DIM MILLIMETERS INCHES
MIN MAX MIN MAX
A
0.80
1.00
0.031
0.039
A1
0.00
0.05
0
0.002
A3
0.20 REF
0.008 REF
K
0.20 MIN
0.008 MIN
e
0.50 BSC
0.02 BSC
L
0.30
0.50
0.012
0.02
b
0.18
0.30
0.007
0.012
D2
6.35
6.60
0.250
0.260
E2
6.35
6.60
0.250
0.260
D
8.00 BSC
0.315 BSC
E
8.00 BSC
0.315 BSC
Note:
Dimensions do not include protrusions ; thes e do not exceed 0.155 mm
(.006”) on any side. Lead dimension do not include solder coverage.
e
b
D2
L
E2
K
D
E
A
A3
A1
PD69108/F
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Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
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PD69108/F
PD69108 Internal Block Diagram
The PD69108 is based on two major sections:
A Digital section which controls and monitors the logical PoE functions (state machines, timings etc.)
An Analog section which performs the Front End analog PoE functionality.
Figure 1 illustrates both functions.
PORT 8 Tool Box
PORT 7 Tool Box
PORT 6 Tool Box
PORT 5 Tool Box
PORT 4 Tool Box
PORT 3 Toool Box
PORT 2 Tool Box
CLK
A/D
Voltage
Regulator
Analog
Mesurment
Thermal
Protection
Controlled
Reference
Voltage
Generator for
Line Detection
& Classification
Current Limiter
AGND
Vmain
POR
Sense Resistor
Main MOSFET
SPI
(
SPI Control,
Watch Dog)
CRG
(CPU/Control
Registers)
MSC
(Miscellaneous ,
Power bank,
General counter,
IC ctrl)
sck
cs_n
mosi
miso
PG[3:0]
sync
sync
sync
VCM
(Voltage Current
Measurement)
ADC
Full
RTP
AIR
(Analog
Interface)
ADDR[3:0]
Reg
Table
DGND
Digital Analog
Figure 1: PD69108 Internal Block Diagram
PD69108/F
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Rev. 1.6 Analog Mixed Signal Group
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PD69108/F
Logic Main Control Module
The Logic Main Control Block includes the Digital Timing
Mechanisms and State Machines synchronizing and
activating PoE functions according to MCU contr ol
commands such as:
Real Time Protection (RTP)
Start Up Macro (DVDT)
Load Signature Detection (RES DET)
Classification Macro (CLASS)
Voltage and Current Monitoring Registers (VMC)
ADC Interfacing
Direct Digital Signals with A nal og Block
Line Detection Generator
Upon request from the MCU to the Main Control
Module, four different voltage levels are generated by
the Line Detection Generator to ensure a robust AF / AT
Line Detection functionality.
Classification Generator
Upon request from the MCU to the Main Control
Module, the State Mach ine app lies a regula ted Clas s
Event and Mark Event voltage to the ports, as required
by the IEEE standard.
Current Limiter
This circuit continuously monitors the current of powered
ports and limits the current to a specific value, according
to pre-defined lim it s as set by AF/AT and Current_Set
pins. In cas es wh ere the current exceeds this specific
level, the system starts measuring the elapsed time. If
this time period is greater than a preset threshold, the
port is disconnected.
Main MOSFET
Main power switching FET, used to control PoE current
into the load.
ADC
A 10-Bit Analog to Digital converter, used to convert
analog signals into digital registers for the Logic Control
module.
Power on Reset (POR)
Monitors the internal 3.3 V voltage DC levels; if this
voltage drops below specific thresholds, a reset signal is
generated and the PD69108 is reset.
Voltage Regulator
The voltage regulator generates 3.3 VDC and 5 VDC for
the internal circuitry. These voltages are derived from
the Vmain supply.
To use the internal volta ge regul ator connect:
VAUX5 to DRV_VAUX5
VAUX3 P3 to VAUX3P3_INT
REG_EN_N to AGND.
There are two options to reduce the PD69108 power
dissipation by regulating the voltage outside the chip:
Use an external NPN transistor to regulate the
5 VDC.
In this setup, the configuration of the regulators pins
should be:
DRV_VAUX5 is connected to the NPN BASE
VAUX5 is connected to the NPN EMITTER
(Connect the Collector to VMAIN)
VAUX3P3 is connected to VAUX3P3_INT
REG_EN_N is connected to AGND
Supply the PD69108 with an external 3.3 V voltage
regulator.
In this setup, the configuration of the regulators pins
should be:
VAUX5 is connected to DRV_VAUX5
VAUX3P3_INT is connected to VAUX5
VAUX3P3 is connected to the external 3.3 V
REG_EN_N is c onn ect ed t o VAUX3P3
The above two options can be implemented
simultaneously.
CLK
CLK is an internal 8 MHz clock oscillator.
PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
1 Enterprise, Aliso Viej o, CA 92656, USA; Within the USA: (800) 713-4113, Outside the USA: (949) 221-7100 Fax: (949) 756-0308
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PD69108/F
Theory of Operation
The PD69108 performs IEEE802.3af and IEEE802.3at
functiona lity as well as legacy (capacitor) and Cisco’s
PDs detection and additional protections such as short
circuit and dV/dT protection upon startup.
Line Detection
The Line Detection feature detects a valid AF or AT
load, as specified in the AF / AT standard. The resistor
value should go from 19 kΩ to 26.5 kΩ. Line detection
is based on four different voltage levels generated over
the PD (the load) as illustrated in Figure 2.
v
t
2 Events
Classification Phase
Detection
Phase
Start-Up
(Inrush)
Power
“ON”
Power
“OFF”
Figure 2: Typical PoE Voltage Time Diagram
Legacy (Cap) Detection
In cases wher e legacy is set, the PD69108's Detection
mechanism detects and powers up legacy PDs as well
as AF/AT compliant PDs.
This mechanism is designed to detect and power up
CISCO legacy PD s as well.
Classification
The clas s if ication proc es s takes place immediately after
resistor detection has successfully completed. The goal
of the clas sif ic ati on proc es s is to detect PD class, as
specif ied in the IEEE802.3AF and AT standards.
In the AF mode, classification mechanism is based on a
single voltage level (single finger).
In the AT mode, classification mechanism is based on
two voltage levels (dual finger) as defined in
IEEE802.3at-2009.
Port Start Up
Upon a successful detection and classification process,
power is applied to the load via a controlled Start Up
mechanism.
During this period current is limited to 425 mA for a
typical duration of 65 mS, which allows the PD load to
charge and allow steady state power condition.
Over-Load Detection and Port Shut Down
After power up, the PD69108 automaticall y initial i zes its
internal protection mechanisms utilized to monitor and
disconnect power from the load in cases where extreme
conditions such as over-current or short ports terminals
scenario oc cur , as specified in the IEEE802.3AF/AT
standard.
Disconnect Detection
The PD69108 supports DC Disconnect Function as per
the IEEE802.3AF/AT standard.
This mechanism continuously monitors load current and
disconnects power in cases where load current is below
7.5 mA (typical) for more than 322 mS.
Over-Temperature Protection
The PD69108 has internal temperature sensors that
continuously monitor the main MOSFET junction
temperature and disconnect load power in cases where
PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
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PD69108/F
junction temperature exceeds 200° C. This mechanism
protects the device from extreme events, such as high
ambient temperature or other thermo-mechanical
failures that could damage the PD69108.
VMAIN Out of Range Protection
The PD69108 automatically disconnects port power in
cases where Vmain exceeds 60 VDC. This valuable
mechanism protects the load in cases where main
power source is faulty or damaged.
TYPICAL APPLICATION
This typical application illustrates a simple Power Over Ethernet system Solution for an 8 Ethernet Ports Switch or
Hub.
POSand NEGSignals should be connected to the Switch RJ45 Jack
To
Opto
MISO
SCK
xCS
MOSI
Vmain
DRV_VAUX5
Addr0
Addr1
VAUX5
47nF
0.36?
Vport_Pos0
Vport_Neg0
Vport_Sense0
Vport_Neg7
Vport_Sense7
Vport_Neg7
Vmain
VAUX5
QGND
SPI Communication
Bus
x8
x8
Vport_Neg0
To
Power
Supply
PG0
PG1
PG2
Iref
Addr2
Addr3
PG3
MCU
MISO
SCK
xCS
MOSI
Isolated SPI
Communication
Bus
VAUX3P3
VAUX3P3_INT
Connected to DVDD or
DGND according to
desired address
QGND
QGND
30.1K?
Figure 3: Typical Applicati on
* For detailed application's schem atic s and layout recommendations, contact: sales_AMSG@microsemi.com
PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
1 Enterprise, Aliso Viej o, CA 92656, USA; Within the USA: (800) 713-4113, Outside the USA: (949) 221-7100 Fax: (949) 756-0308
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PD69108/F
Tape and Reel Packaging Information
REEL MECHANICAL DATA
mm. inch
Tape size 16.00 ±0.3 0.630 ±0.012
A max. 330 13”
B max. 1.5 0.059
C 13.0 ±0.20 0.512 ±0.008
D min. 20.2 0.795
N min. 50 1.968
G 16.4+2.0/-0.0 0.645+0.079/-0.0
T max. 29 1.142
BASE QUANTITY 2000 pcs.
PD69108/F
DATASHEET
Copyright © 2013 Microsemi
Rev. 1.6 Analog Mixed Signal Group
1 Enterprise, Aliso Viej o, CA 92656, USA; Within the USA: (800) 713-4113, Outside the USA: (949) 221-7100 Fax: (949) 756-0308
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PD69108/F
The information contained in the document (unless it is publicly available on the Web without access restrictions) is
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the recipient
of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement will also
apply . This document and the information contained herein may not be modified, by any person other than authorized
personn el of Micros em i. No license under any patent, copyright, trade secret or other intellectual property right is
granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,
inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by Microsemi
in writing signed by an officer of Microsemi.
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without
any notice. This product has been subject to limited testing and should not be used in conjunction with life-support or
other missio n-critical equipment or applications. Microsemi assumes no liability whatsoever, and Micros e mi disc la ims
any express or implied warranty, relating to sale and/or use of Microsemi products including liability or warranties relating
to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Any performance specifications believed to be reliable but are not verified and customer or user must conduct and
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customer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the
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Revision History
Re
vision Level /
Date
Para. Affected Description
0.1 / 3-Nov-09
-
Initi al Releas e
0.2 / 10-Jan-10
Power Dissipation
0.3 / 12-Apr-10
Update
0.4 / 12-May-10
Ordering informat i on update
0.4/ 27-Jul-10
Changing catalog numbers met rology
0.5/10-Apr-11
Update/corrections
0.6/1-Aug-11 Add SPI Timing Data
1.2/Oct 2011
Add Theta JC
1.3/Jan 2012
Remove “Confidential ” header and updating F ooter address
1.4/Feb 2012 Updating I lim according to UL and IEEE
1.5/Dec 2012
Adding Tape & Reel Data
1.6/March 2013
Adding full temperature rang P/N
© 2013 Microsemi Corp.
All rights reserved.
For support contact: sales_AMSG@microsemi.com
Visit our web site at: www.microsemi.com Catalo g u e Number DS_PD69108