Product Folder Order Now Support & Community Tools & Software Technical Documents Reference Design LM1117 SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 LM1117 800-mA, Low-Dropout Linear Regulator 1 Features 3 Description * * The LM1117 is a low dropout voltage regulator with a dropout of 1.2 V at 800 mA of load current. 1 * * * * * * For a newer drop-in alternative, see the TLV1117 Available in 1.8 V, 2.5 V, 3.3 V, 5 V, and Adjustable Versions Space-saving SOT-223 and WSON packages Current limiting and thermal protection Output current: 800 mA Line regulation: 0.2% (maximum) Load regulation: 0.4% (maximum) Temperature range: - LM1117: 0C to 125C - LM1117I: -40C to 125C 2 Applications * * * * * AC drive power stage modules Merchant network and server PSU Industrial AC/DC Ultrasound scanners Servo drive control modules The LM1117 is available in an adjustable version, which can set the output voltage from 1.25 to 13.8 V with only two external resistors. In addition, it is available in five fixed voltages, 1.8 V, 2.5 V, 3.3 V, and 5 V. The LM1117 offers current limiting and thermal shutdown. Its circuit includes a Zener trimmed bandgap reference to assure output voltage accuracy to within 1%. A minimum of 10-F tantalum capacitor is required at the output to improve the transient response and stability. Device Information(1) PART NUMBER LM1117, LM1117I PACKAGE BODY SIZE (NOM) SOT-223 (4) 6.50 mm x 3.50 mm TO-220 (3) 14.986 mm x 10.16 mm TO-252 (3) 6.58 mm x 6.10 mm WSON (8) 4.00 mm x 4.00 mm TO-263 (3) 10.18 mm x 8.41 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Adjustable Output Regulator 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM1117 SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8 1 1 1 2 3 4 5 Absolute Maximum Ratings ...................................... 5 ESD Ratings.............................................................. 5 Recommended Operating Conditions....................... 5 Thermal Information .................................................. 5 LM1117 Electrical Characteristics............................. 5 LM1117I Electrical Characteristics............................ 8 Typical Characteristics ............................................ 10 Detailed Description ............................................ 12 8.1 Overview ................................................................. 12 8.2 Functional Block Diagram ....................................... 12 8.3 Feature Description................................................. 12 8.4 Device Functional Modes........................................ 14 9 Application and Implementation ........................ 15 9.1 Application Information............................................ 15 9.2 Typical Application .................................................. 15 9.3 System Examples ................................................... 17 10 Power Supply Recommendations ..................... 18 11 Layout................................................................... 18 11.1 Layout Guidelines ................................................. 18 11.2 Layout Example .................................................... 22 12 Device and Documentation Support ................. 23 12.1 12.2 12.3 12.4 12.5 12.6 Documentation Support ........................................ Receiving Notification of Documentation Updates Support Resources ............................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 23 23 23 23 23 23 13 Mechanical, Packaging, and Orderable Information ........................................................... 23 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision N (January 2016) to Revision O Page * Added alternative device Features bullet .............................................................................................................................. 1 * Changed Applications section ............................................................................................................................................... 1 * Added Device Comparison Table .......................................................................................................................................... 3 * Added Related Documentation section ................................................................................................................................ 23 Changes from Revision M (March 2013) to Revision N Page * Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 * Removed LM1117-N-2.85 option after part became inactive................................................................................................. 1 * Removed TO-263 Pinout Side View image ........................................................................................................................... 4 Changes from Revision L (July 2012) to Revision M * 2 Page Changed layout of National Data Sheet to TI format ........................................................................................................... 17 Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 5 Device Comparison Table IOUT 800 mA PARAMETER LM1117 TLV1117 Input voltage range (max) 15 15 UNIT V Load regulation accuracy 1.6 1.6 % dB PSRR (120 Hz) 75 75 Recommended operating temperature 0 - 125 -40 - 125 C SOT-223 TJA 61.6 104.3 C/W TO-220 TJA 23.8 30.1 C/W TO-252 TJA 45.1 50.9 C/W TO-263 TJA 41.3 27.5 C/W WSON-8 TJA 39.3 38.3 C/W Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 3 LM1117 SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 www.ti.com 6 Pin Configuration and Functions DCY Package 4-Pin SOT Top View KTT Package 3-Pin TO-263 Top View NDE Package 3-Pin TO-220 Top View NDP Package 3-Pin TO-252 Top View NGN Package 8-Pin WSON Top View ADJ/GND 1 VIN 2 8 NOT CONNECTED 7 VOUT VOUT VIN 3 6 VOUT VIN 4 5 VOUT When using the WSON package Pins 2, 3 and 4 must be connected together and Pins 5, 6 and 7 must be connected together Pin Functions PIN NAME I/O DESCRIPTION TO-252 WSON SOT-223 TO-263 TO-220 ADJ/GND 1 1 1 1 1 -- VIN 3 2, 3, 4 3 3 3 I Input voltage pin for the regulator 2 , TAB 5, 6, 7, TAB 2, 4 2, TAB 2, TAB O Output voltage pin for the regulator VOUT 4 Adjust pin for adjustable output option. Ground pin for fixed output option. Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN Maximum Input Voltage (VIN to GND) Power Dissipation (2) Storage Temperature, Tstg (2) UNIT 20 V Internally Limited Junction Temperature (TJ) (2) (1) MAX -65 150 C 150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The maximum power dissipation is a function of TJ(max) , RJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)-TA)/RJA. All numbers apply for packages soldered directly into a PCB. 7.2 ESD Ratings V(ESD) (1) Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) Electrostatic discharge VALUE UNIT 2000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as 2000 V may actually have higher performance. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX Input Voltage (VIN to GND) Junction Temperature (TJ) (1) (1) UNIT 15 V C LM1117 0 125 LM1117I -40 125 The maximum power dissipation is a function of TJ(max) , RJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)-TA)/RJA. All numbers apply for packages soldered directly into a PCB. 7.4 Thermal Information LM1117, LM1117I THERMAL METRIC (1) DCY (SOT-223) NDE (TO-220) NDP (TO-252) NGN (WSON) KTT (TO-263) UNIT 4 PINS 3 PINS 3 PINS 8 PINS 3 PINS RJA Junction-to-ambient thermal resistance 61.6 23.8 45.1 39.3 41.3 C/W RJC(top) Junction-to-case (top) thermal resistance 42.5 16.6 52.1 31.4 44.1 C/W RJB Junction-to-board thermal resistance 10.4 5.3 29.8 16.5 24.2 C/W JT Junction-to-top characterization parameter 2.9 3.1 4.5 0.3 10.9 C/W JB Junction-to-board characterization parameter 10.3 5.3 29.4 16.7 23.2 C/W RJC(bot) Junction-to-case (bottom) thermal resistance -- 1.5 1.3 5.6 1.3 C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report. 7.5 LM1117 Electrical Characteristics unless otherwise specified, TJ = 25C. PARAMETER TEST CONDITIONS LM1117-ADJ IOUT = 10 mA, VIN - VOUT = 2 V, TJ = 25C VREF (1) (2) Reference Voltage LM1117-ADJ 10 mA IOUT 800 mA, 1.4 V VIN - VOUT 10 V MIN (1) TYP (2) MAX (1) 1.238 1.25 1.262 TJ = 25C over the junction temperature range 0C to 125C 1.25 1.225 UNIT V 1.27 All limits are ensured by testing or statistical analysis. Typical Values represent the most likely parametric normal. Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 5 LM1117 SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 www.ti.com LM1117 Electrical Characteristics (continued) unless otherwise specified, TJ = 25C. PARAMETER TEST CONDITIONS LM1117-1.8 IOUT = 10 mA, VIN = 3.8 V, TJ = 25C LM1117-1.8 0 IOUT 800 mA, 3.2 V VIN 10 V VOUT Output Voltage TJ = 25C LM1117-ADJ VIN - VOUT = 3 V, 10 IOUT 800 mA LM1117-1.8 VIN = 3.2 V, 0 IOUT 800 mA VOUT Load Regulation (3) LM1117-2.5 VIN = 3.9 V, 0 IOUT 800 mA LM1117-3.3 VIN = 4.75 V, 0 IOUT 800 mA LM1117-5.0 VIN = 6.5 V, 0 IOUT 800 mA (3) 6 V 2.5 2.525 V 2.55 3.3 3.333 3.3 3.235 V 3.365 5 5.05 5 over the junction temperature range 0C to 125C UNIT 1.854 2.45 4.95 LM1117-ADJ IOUT = 10mA, 1.5V VIN-VOUT 13.75V LM1117-5.0 IOUT = 0 mA, 6.5 V VIN 15 V 1.746 3.267 TJ = 25C LM1117-3.3 IOUT = 0 mA, 4.75 V VIN 15 V 1.818 2.5 over the junction temperature range 0C to 125C LM1117-5.0 0 IOUT 800 mA, 6.5 V VIN 12 V LM1117-2.5 IOUT = 0 mA, 3.9 V VIN 10 V 1.8 TJ = 25C LM1117-5.0 IOUT = 10 mA, VIN = 7 V, TJ = 25C Line Regulation (3) 1.782 2.475 TJ = 25C LM1117-3.3 0 IOUT 800 mA, 4.75 V VIN over the junction temperature range 10 V 0C to 125C VOUT MAX (1) 1.8 over the junction temperature range 0C to 125C LM1117-3.3 IOUT = 10 mA, VIN = 5 V TJ = 25C LM1117-1.8 IOUT = 0 mA, 3.2 V VIN 10 V TYP (2) TJ = 25C LM1117-2.5 IOUT = 10 mA, VIN = 4.5 V, TJ = 25C LM1117-2.5 0 IOUT 800 mA, 3.9 V VIN 10 V MIN (1) 4.9 V 5.1 0.035% over the junction temperature range 0C to 125C TJ = 25C 0.2% 1 over the junction temperature range 0C to 125C TJ = 25C 6 mV 1 over the junction temperature range 0C to 125C TJ = 25C 6 mV 1 over the junction temperature range 0C to 125C TJ = 25C 6 mV 1 over the junction temperature range 0C to 125C TJ = 25C 10 mV 0.2% over the junction temperature range 0C to 125C TJ = 25C 0.4% 1 over the junction temperature range 0C to 125C TJ = 25C 10 mV 1 over the junction temperature range 0C to 125C TJ = 25C 10 mV 1 over the junction temperature range 0C to 125C TJ = 25C 10 mV 1 over the junction temperature range 0C to 125C 15 mV Load and line regulation are measured at constant junction room temperature. Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 LM1117 Electrical Characteristics (continued) unless otherwise specified, TJ = 25C. PARAMETER TEST CONDITIONS MIN (1) TJ = 25C IOUT = 100 mA VIN - V over the junction temperature range 0C to 125C OUT IOUT = 500 mA 1.2 1.25 TJ = 25C ILIMIT Current Limit Minimum Load Current (5) Adjust Pin Current Change (5) 10 10 10 TA = 25C, 30-ms pulse 0.01 TJ = 25C 0.1 mA mA %/W dB 60 60 TJ = 25C mA 75 over the junction temperature range 0C to 125C 10 IOUT 80 0mA, 1.4 V VIN - VOUT 10 V mA 5 over the junction temperature range 0C to 125C TJ = 25C mA 5 TJ = 25C over the junction temperature range 0C to 125C mA 5 over the junction temperature range 0C to 125C 120 A 0.2 over the junction temperature range 0C to 125C Temperature Stability (4) 10 TJ = 25C fRIPPLE = 1 20 Hz, VIN - VOUT = 3 V VRIPPLE = 1 VPP V 5 over the junction temperature range 0C to 125C LM1117-5.0 VIN 15 V 1500 5 TJ = 25C LM1117-3.3 VIN 15 V Adjust Pin Current 1200 over the junction temperature range 0C to 125C Quiescent Current V 1.7 TJ = 25C LM1117-2.5 VIN 15 V Ripple Regulation 800 over the junction temperature range 0C to 125C LM1117-1.8 VIN 15 V Thermal Regulation 1.3 TJ = 25C LM1117-ADJ VIN = 15 V V 1.2 over the junction temperature range 0C to 125C VIN - VOUT = 5 V, TJ = 25C UNIT 1.15 over the junction temperature range 0C to 125C IOUT = 800 mA MAX (1) 1.1 TJ = 25C Dropout Voltage (4) TYP (2) 5 A 0.5% Long Term Stability TA = 125C, 1000 Hrs RMS Output Noise (% of VOUT), 10 Hz f 10 kHz 0.3% 0.003% The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is measured when the output voltage has dropped 100 mV from the nominal value obtained at VIN = VOUT + 1.5 V. The minimum output current required to maintain regulation. Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 7 LM1117 SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 www.ti.com 7.6 LM1117I Electrical Characteristics unless otherwise specified, TJ = 25C. PARAMETER TEST CONDITIONS LM1117I-ADJ IOUT = 10 mA, VIN - VOUT = 2 V, TJ = 25C VREF Reference Voltage LM1117I-ADJ 10 mA IOUT 800 mA, 1.4 V VIN - VOUT 10 V VOUT Output Voltage over the junction temperature range -40C to 125C LM1117I-ADJ IOUT = 10 mA, 1.5 V VIN - VOUT 13.75 V Line Regulation (3) LM1117I-3.3 IOUT = 0 mA, 4.75 V VIN 15 V over the junction temperature range -40C to 125C LM1117I-ADJ VIN - VOUT = 3 V, 10 IOUT 800 mA VOUT Load Regulation LM1117I-3.3 VIN = 4.75 V, 0 IOUT 800 mA over the junction temperature range -40C to 125C TJ = 25C (1) (2) (3) 8 1.25 1.2 3.3 3.168 3.333 V 3.432 5 5.05 5 4.8 V 5.2 0.035% 0.3% 1 10 mV 1 over the junction temperature range -40C to 125C 15 mV 0.2% over the junction temperature range -40C to 125C 0.5% 1 over the junction temperature range -40C to 125C over the junction temperature range -40C to 125C V 3.3 over the junction temperature range -40C to 125C TJ = 25C UNIT 1.29 over the junction temperature range -40C to 125C TJ = 25C LM1117I-5.0 VIN = 6.5 V, 0 IOUT 800 mA 1.262 TJ = 25C TJ = 25C (3) 1.25 4.95 TJ = 25C LM1117I-5.0 IOUT = 0 mA, 6.5 V VIN 15 V 1.238 TJ = 25C TJ = 25C VOUT MAX (1) 3.267 LM1117I-5.0 IOUT = 10 mA, VIN = 7 V, TJ = 25C LM1117I-5.0 0 IOUT 800 mA, 6.5 V VIN 12 V TYP (2) TJ = 25C LM1117I-3.3 IOUT = 10 mA, VIN = 5 V, TJ = 25C LM1117I-3.3 0 IOUT 800 mA, 4.75 V VIN 10 V MIN (1) 15 mV 1 20 mV All limits are ensured by testing or statistical analysis. Typical Values represent the most likely parametric normal. Load and line regulation are measured at constant junction room temperature. Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 LM1117I Electrical Characteristics (continued) unless otherwise specified, TJ = 25C. PARAMETER TEST CONDITIONS MIN (1) TJ = 25C 1.3 TJ = 25C VIN-V OUT Dropout Voltage 1.35 TJ = 25C ILIMIT Current Limit VIN - VOUT = 5 V, TJ = 25C 1.4 800 TJ = 25C Minimum Load Current (5) LM1117I-ADJ VIN = 15 V 15 15 Thermal Regulation TA = 25C, 30ms Pulse 0.01 TJ = 25C Adjust Pin Current over the junction temperature range -40C to 125C TJ = 25C (5) mA %/W 120 A 0.2 10 A 0.5% Long Term Stability TA = 125C, 1000 Hrs (4) mA dB 60 over the junction temperature range -40C to 125C Temperature Stability RMS Output Noise 0.1 60 10 IOUT 800 mA, 1.4 V VIN - VOUT 10 V mA 75 over the junction temperature range -40C to 125C TJ = 25C Adjust Pin Current Change mA 5 over the junction temperature range -40C to 125C fRIPPLE = 120 Hz, VIN - VOUT = 3 V VRIPPLE = 1 VPP V 5 TJ = 25C LM1117I-5.0 VIN 15 V 1500 5 over the junction temperature range -40C to 125C Quiescent Current V 1.7 TJ = 25C Ripple Regulation 1200 over the junction temperature range -40C to 125C LM1117I-3.3 VIN 15 V V 1.2 over the junction temperature range -40C to 125C IOUT = 800 mA UNIT 1.15 over the junction temperature range -40C to 125C IOUT = 500 mA MAX (1) 1.1 over the junction temperature range -40C to 125C IOUT = 100 mA (4) TYP (2) 0.3% (% of VOUT), 10 Hz f 10 kHz 0.003% The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is measured when the output voltage has dropped 100 mV from the nominal value obtained at VIN = VOUT + 1.5 V. The minimum output current required to maintain regulation. Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 9 LM1117 SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 www.ti.com 7.7 Typical Characteristics 10 Figure 1. Dropout Voltage (VIN - V OUT) Figure 2. Short-Circuit Current Figure 3. Load Regulation Figure 4. LM1117-ADJ Ripple Rejection Figure 5. LM1117-ADJ Ripple Rejection vs Current Figure 6. Temperature Stability Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 Typical Characteristics (continued) Figure 7. Adjust Pin Current Figure 8. LM1117-5.0 Load Transient Response Figure 9. LM1117-5.0 Line Transient Response Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 11 LM1117 SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 www.ti.com 8 Detailed Description 8.1 Overview The LM1117 adjustable version develops a 1.25V reference voltage, VREF, between the output and the adjust terminal. As shown in Figure 10, this voltage is applied across resistor R1 to generate a constant current I1. The current IADJ from the adjust terminal could introduce error to the output. But since it is very small (60A) compared with the I1 and very constant with line and load changes, the error can be ignored. The constant current I1 then flows through the output set resistor R2 and sets the output voltage to the desired level. For fixed voltage devices, R1 and R2 are integrated inside the devices. Figure 10. Basic Adjustable Regulator 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Load Regulation The LM1117 regulates the voltage that appears between its output and ground pins, or between its output and adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the best load regulation, a few precautions are needed. 12 Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 Feature Description (continued) Figure 11 shows a typical application using a fixed output regulator. The Rt1 and Rt2 are the line resistances. It is obvious that the VLOAD is less than the VOUT by the sum of the voltage drops along the line resistances. In this case, the load regulation seen at the RLOAD would be degraded from the data sheet specification. To improve this, the load should be tied directly to the output terminal on the positive side and directly tied to the ground terminal on the negative side. Figure 11. Typical Application Using Fixed Output Regulator When the adjustable regulator is used (Figure 12), the best performance is obtained with the positive side of the resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops from appearing effectively in series with the reference and degrading regulation. For example, a 5V regulator with 0.05 resistance between the regulator and load will have a load regulation due to line resistance of 0.05 x IL. If R1 (=125) is connected near the load, the effective line resistance will be 0.05 (1+R2/R1) or in this case, it is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to provide remote ground sensing and improve load regulation. Figure 12. Best Load Regulation Using Adjustable Output Regulator Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 13 LM1117 SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 www.ti.com 8.4 Device Functional Modes 8.4.1 Protection Diodes Under normal operation, the LM1117 regulators do not need any protection diode. With the adjustable device, the internal resistance between the adjust and output terminals limits the current. No diode is needed to divert the current around the regulator even with capacitor on the adjust terminal. The adjust pin can take a transient signal of 25V with respect to the output voltage without damaging the device. When a output capacitor is connected to a regulator and the input is shorted to ground, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage of the regulator, and rate of decrease of VIN. In the LM1117 regulators, the internal diode between the output and input pins can withstand microsecond surge currents of 10A to 20A. With an extremely large output capacitor (1000 F), and with input instantaneously shorted to ground, the regulator could be damaged. In this case, an external diode is recommended between the output and input pins to protect the regulator, as shown in Figure 13. Figure 13. Regulator With Protection Diode 14 Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The LM1117 is a versatile and high performance linear regulator with a wide temperature range and tight line/load regulation operation. An output capacitor is required to further improve transient response and stability. For the adjustable option, the ADJ pin can also be bypassed to achieve very high ripple-rejection ratios. The LM1117 is versatile in its applications, including its uses as a post regulator for DC/DC converters, battery chargers, and microprocessor supplies. 9.2 Typical Application Figure 14. 1.25-V to 10-V Adjustable Regulator With Improved Ripple Rejection 9.2.1 Design Requirements The device component count is very minimal, employing two resistors as part of a voltage divider circuit and an output capacitor for load regulation. A 10-F tantalum on the input is a suitable input capacitor for almost all applications. An optional bypass capacitor across R2 can also be used to improve PSRR. See Recommended Operating Conditions for more information. 9.2.2 Detailed Design Procedure The output voltage is set based on the selection of the two resistors, R1 and R2, as shown in Figure 14. For details on capacitor selection, refer to External Capacitors. 9.2.2.1 External Capacitors 9.2.2.1.1 Input Bypass Capacitor An input capacitor is recommended. A 10-F tantalum on the input is a suitable input capacitor for almost all applications. Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 15 LM1117 SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 www.ti.com Typical Application (continued) 9.2.2.1.2 Adjust Terminal Bypass Capacitor The adjust terminal can be bypassed to ground with a bypass capacitor (CADJ) to improve ripple rejection. This bypass capacitor prevents ripple from being amplified as the output voltage is increased. At any ripple frequency, the impedance of the CADJ should be less than R1 to prevent the ripple from being amplified: 1/(2 x fRIPPLE x CADJ) < R1 (1) The R1 is the resistor between the output and the adjust pin. Its value is normally in the range of 100-200. For example, with R1 = 124 and fRIPPLE = 120Hz, the CADJ should be > 11F. 9.2.2.1.3 Output Capacitor The output capacitor is critical in maintaining regulator stability, and must meet the required conditions for both minimum amount of capacitance and equivalent series resistance (ESR). The minimum output capacitance required by the LM1117 is 10 F, if a tantalum capacitor is used. Any increase of the output capacitance will merely improve the loop stability and transient response. The ESR of the output capacitor should range between 0.3 to 22 . In the case of the adjustable regulator, when the CADJ is used, a larger output capacitance (22-F tantalum) is required. 9.2.3 Application Curve As shown in Figure 15, the dropout voltage will vary with output current and temperature. Care should be taken during design to ensure the dropout voltage requirement is met across the entire operating temperature and output current range. Figure 15. Dropout Voltage (VIN - VOUT) 16 Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 9.3 System Examples Several circuits can be realized with the LM1117. The circuit diagrams in this section demonstrate multiple system examples that can be utilized in many applications. Figure 16. Fixed Output Regulator Figure 17. Adjusting Output of Fixed Regulators Figure 18. Regulator With Reference Figure 19. 5-V Logic Regulator With Electronic Shutdown* Figure 20. Battery Backed-Up Regulated Supply Figure 21. Low Dropout Negative Supply Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 17 LM1117 SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 www.ti.com 10 Power Supply Recommendations The input supply to the LM1117 must be kept at a voltage level such that its maximum rating is not exceeded. The minimum dropout voltage must also be met with extra headroom when possible to keep the LM1117 in regulation. An input capacitor is recommended. For more information regarding capacitor selection, refer to External Capacitors. 11 Layout 11.1 Layout Guidelines Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise. Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance and the feedback loop from VOUT to ADJ must be kept as short as possible. To improve PSRR, a bypass capacitor can be placed at the ADJ pin and must be located as close as possible to the IC. In cases when VIN shorts to ground, an external diode must be placed from VOUT to VIN to divert the surge current from the output capacitor and protect the IC. The diode must be placed close to the corresponding IC pins to increase their effectiveness. 11.1.1 Heatsink Requirements When an integrated circuit operates with an appreciable current, its junction temperature is elevated. It is important to quantify its thermal limits in order to achieve acceptable performance and reliability. This limit is determined by summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the operating environment. A one-dimensional steady-state model of conduction heat transfer is demonstrated in Figure 22. The heat generated at the device junction flows through the die to the die attach pad, through the lead frame to the surrounding case material, to the printed circuit board, and eventually to the ambient environment. Below is a list of variables that may affect the thermal resistance and in turn the need for a heatsink. Table 1. Component and Application Variables RJC (COMPONENT VARIABLES) RJA (APPLICATION VARIABLES) Leadframe Size and Material Mounting Pad Size, Material, and Location No. of Conduction Pins Placement of Mounting Pad Die Size PCB Size and Material Die Attach Material Traces Length and Width Molding Compound Size and Material Adjacent Heat Sources Volume of Air Ambient Temperatue Shape of Mounting Pad The case temperature is measured at the point where the leads contact with the mounting pad surface Figure 22. Cross-Sectional View of Integrated Circuit Mounted on a Printed Circuit Board 18 Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 The LM1117 regulators have internal thermal shutdown to protect the device from over-heating. Under all possible operating conditions, the junction temperature of the LM1117 must be within the range of 0C to 125C. A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. To determine if a heatsink is needed, the power dissipated by the regulator, PD , must be calculated: IIN = IL + IG PD = (VIN-VOUT)I L + VINIG (2) (3) Figure 23 shows the voltages and currents which are present in the circuit. Figure 23. Power Dissipation Diagram The next parameter which must be calculated is the maximum allowable temperature rise, TR(max): TR(max) = TJ(max)-TA(max) where * * TJ(max) is the maximum allowable junction temperature (125C) which will be encountered in the application TA(max) is the maximum ambient temperature which will be encountered in the application (4) Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient thermal resistance (RJA) can be calculated: RJA = TR(max)/PD (5) For the maximum allowable value for JA, refer to the Thermal Information table. As a design aid, Table 2 shows the value of the JA of SOT-223 and TO-252 for different heatsink area. Figure 24 and Figure 25 reflects the same test results as what are in the Table 2 Figure 26 and Figure 27 shows the maximum allowable power dissipation vs. ambient temperature for the SOT223 and TO-252 device. Figure 28 and Figure 29 shows the maximum allowable power dissipation vs. copper area (in2) for the SOT-223 and TO-252 devices. Please see AN1028 for power enhancement techniques to be used with SOT-223 and TO-252 packages. The AN-1187 Leadless Leadframe Package (LLP) application note discusses improved thermal performance and power dissipation for the WSON. Table 2. RJA Different Heatsink Area LAYOUT (1) COPPER AREA THERMAL RESISTANCE Top Side (in2) (1) Bottom Side (in2) (JA,C/W) SOT-223 (JA,C/W) TO-252 1 0.0123 0 136 103 2 0.066 0 123 87 3 0.3 0 84 60 4 0.53 0 75 54 5 0.76 0 69 52 6 1 0 66 47 7 0 0.2 115 84 8 0 0.4 98 70 9 0 0.6 89 63 10 0 0.8 82 57 Tab of device attached to topside copper Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 19 LM1117 SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 www.ti.com Table 2. RJA Different Heatsink Area (continued) LAYOUT 20 COPPER AREA THERMAL RESISTANCE 11 0 1 79 57 12 0.066 0.066 125 89 13 0.175 0.175 93 72 14 0.284 0.284 83 61 15 0.392 0.392 75 55 16 0.5 0.5 70 53 Figure 24. RJA vs 1-oz Copper Area for SOT-223 Figure 25. RJA vs 2-oz Copper Area for TO-252 Figure 26. Maximum Allowable Power Dissipation vs Ambient Temperature for SOT-223 Figure 27. Maximum Allowable Power Dissipation vs Ambient Temperature for TO-252 Figure 28. Maximum Allowable Power Dissipation vs 1-oz Copper Area for SOT-223 Figure 29. Maximum Allowable Power Dissipation vs 2-oz Copper Area for TO-252 Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 Figure 30. Top View of the Thermal Test Pattern in Actual Scale Figure 31. Bottom View of the Thermal Test Pattern in Actual Scale Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 21 LM1117 SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 www.ti.com 11.2 Layout Example Figure 32. Layout Example (SOT-223) 22 Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412O - FEBRUARY 2000 - REVISED JUNE 2020 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation see the following: Texas Instruments, AN-1187 Leadless Leadframe Package (LLP) application note 12.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.3 Support Resources TI E2ETM support forums are an engineer's go-to source for fast, verified answers and design help -- straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 12.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.6 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 2000-2020, Texas Instruments Incorporated Product Folder Links: LM1117 23 PACKAGE OPTION ADDENDUM www.ti.com 11-Jan-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM1117DT-1.8/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-1.8 LM1117DT-2.5/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-2.5 LM1117DT-3.3/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-3.3 LM1117DT-5.0/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-5.0 LM1117DT-ADJ/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-ADJ LM1117DTX-1.8/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-1.8 LM1117DTX-2.5/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-2.5 LM1117DTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-3.3 LM1117DTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-5.0 LM1117DTX-ADJ/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-ADJ LM1117IDT-3.3/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-3.3 LM1117IDT-5.0/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-5.0 LM1117IDT-ADJ/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-ADJ LM1117IDTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-3.3 LM1117IDTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-5.0 LM1117IDTX-ADJ/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-ADJ LM1117ILD-ADJ/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1117IAD Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 11-Jan-2021 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM1117IMP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N05B LM1117IMP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N06B LM1117IMP-ADJ/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N03B LM1117IMPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N05B LM1117IMPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N06B LM1117IMPX-ADJ/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N03B LM1117LD-1.8/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-18 LM1117LD-2.5/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-25 LM1117LD-3.3/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-33 LM1117LD-ADJ/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117ADJ LM1117LDX-1.8/NOPB ACTIVE WSON NGN 8 4500 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-18 LM1117LDX-ADJ/NOPB ACTIVE WSON NGN 8 4500 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117ADJ LM1117MP-1.8/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N12A LM1117MP-2.5/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N13A LM1117MP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N05A LM1117MP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N06A LM1117MP-ADJ/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N03A LM1117MPX-1.8/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N12A LM1117MPX-2.5/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N13A LM1117MPX-3.3 ACTIVE SOT-223 DCY 4 2000 Non-RoHS & Green Call TI Call TI LM1117MPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM Addendum-Page 2 N05A 0 to 125 N05A Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 11-Jan-2021 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM1117MPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N06A LM1117MPX-ADJ/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N03A LM1117S-ADJ/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 RoHS-Exempt & Green SN Level-3-245C-168 HR 0 to 125 LM1117S ADJ LM1117SX-3.3/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 RoHS-Exempt & Green SN Level-3-245C-168 HR 0 to 125 LM1117S 3.3 LM1117SX-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 RoHS-Exempt & Green SN Level-3-245C-168 HR 0 to 125 LM1117S 5.0 LM1117SX-ADJ/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 RoHS-Exempt & Green SN Level-3-245C-168 HR 0 to 125 LM1117S ADJ LM1117T-2.5/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM1117T 2.5 LM1117T-3.3/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM1117T 3.3 LM1117T-5.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM1117T 5.0 LM1117T-ADJ/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM1117T ADJ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 11-Jan-2021 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 12-May-2020 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM1117DTX-1.8/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117DTX-2.5/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117DTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117DTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117DTX-ADJ/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117IDTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117IDTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117IDTX-ADJ/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117ILD-ADJ/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1117IMP-3.3/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117IMP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117IMP-ADJ/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117IMPX-3.3/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117IMPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117IMPX-ADJ/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117LD-1.8/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1117LD-2.5/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1117LD-3.3/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-May-2020 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM1117LD-ADJ/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1117LDX-1.8/NOPB WSON NGN 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1117LDX-ADJ/NOPB WSON NGN 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1117MP-1.8/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MP-2.5/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MP-3.3/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MP-ADJ/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MPX-1.8/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MPX-2.5/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MPX-3.3/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MPX-ADJ/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MPX-3.3 LM1117SX-3.3/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM1117SX-5.0/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM1117SX-ADJ/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 12-May-2020 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM1117DTX-1.8/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117DTX-2.5/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117DTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117DTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117DTX-ADJ/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117IDTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117IDTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117IDTX-ADJ/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117ILD-ADJ/NOPB WSON NGN 8 1000 210.0 185.0 35.0 LM1117IMP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117IMP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117IMP-ADJ/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117IMPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117IMPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117IMPX-ADJ/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117LD-1.8/NOPB WSON NGN 8 1000 210.0 185.0 35.0 LM1117LD-2.5/NOPB WSON NGN 8 1000 210.0 185.0 35.0 LM1117LD-3.3/NOPB WSON NGN 8 1000 210.0 185.0 35.0 LM1117LD-ADJ/NOPB WSON NGN 8 1000 210.0 185.0 35.0 LM1117LDX-1.8/NOPB WSON NGN 8 4500 367.0 367.0 35.0 LM1117LDX-ADJ/NOPB WSON NGN 8 4500 367.0 367.0 35.0 LM1117MP-1.8/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MP-2.5/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MP-ADJ/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MPX-1.8/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-2.5/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-3.3 SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-ADJ/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117SX-3.3/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM1117SX-5.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM1117SX-ADJ/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 Pack Materials-Page 3 MECHANICAL DATA NDE0003B www.ti.com MECHANICAL DATA KTT0003B TS3B (Rev F) BOTTOM SIDE OF PACKAGE www.ti.com MECHANICAL DATA MPDS094A - APRIL 2001 - REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 3,70 (0.146) 3,30 (0.130) 7,30 (0.287) 6,70 (0.264) Gauge Plane 1 2 0,84 (0.033) 0,66 (0.026) 2,30 (0.091) 4,60 (0.181) 1,80 (0.071) MAX 3 0-10 0,10 (0.004) M 0,25 (0.010) 0,75 (0.030) MIN 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,08 (0.003) 0,10 (0.0040) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OUTLINE NGN0008A WSON - 0.8 mm max height SCALE 3.000 PLASTIC SMALL OUTLINE - NO LEAD 4.1 3.9 A B PIN 1 INDEX AREA 4.1 3.9 PIN 1 ID DETAIL A PIN 1 ID C 0.8 MAX SEATING PLANE 0.05 0.00 0.08 C 2.2 0.05 EXPOSED THERMAL PAD SYMM (0.2) TYP 6X 0.8 4 5 2X 2.4 SYMM 9 3 0.05 SEE DETAIL A 8 1 8X (0.25) (0.25) PIN 1 ID (0.2) 8X 0.6 0.4 0.35 0.25 0.1 0.05 (0.15) C A B C 4214794/A 11/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT NGN0008A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD (2.2) SYMM 8X (0.5) 1 8 8X (0.3) SYMM 9 (3) (1.25) 6X (0.8) 4 (R0.05) TYP 5 ( 0.2) VIA TYP (0.85) (3.3) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND EXPOSED METAL SOLDER MASK OPENING METAL EXPOSED METAL METAL UNDER SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK OPENING SOLDER MASK DEFINED SOLDER MASK DETAILS 4214794/A 11/2019 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN NGN0008A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 0.59 SYMM 8X (0.5) METAL TYP 1 8 8X (0.3) 4X (1.31) SYMM 9 (0.755) 6X (0.8) 5 4 (R0.05) TYP 4X (0.98) (3.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 9: 78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X 4214794/A 11/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com PACKAGE OUTLINE NDP0003B TO-252 - 2.55 mm max height SCALE 1.500 TRANSISTOR OUTLINE 10.42 9.40 6.22 5.97 B 1.27 0.88 A 5.46 4.96 6.73 6.35 (2.345) 1 (2.5) 2.285 2 4.57 3 0.88 3X 0.64 0.25 C A B 1.02 0.64 PKG OPTIONAL 8 TOP & BOTTOM 8 1.14 0.89 C 2.55 MAX SEATING PLANE 0.17 0.88 0.46 0.60 0.46 0.51 MIN 4.32 MIN 3 2 4 1 4219870/A 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-252. www.ti.com EXAMPLE BOARD LAYOUT NDP0003B TO-252 - 2.55 mm max height TRANSISTOR OUTLINE SEE SOLDER MASK DETAIL 2X (2.15) (5.7) 2X (1.3) 1 4 (4.57) SYMM (5.5) 3 (R0.05) TYP (4.38) (2.285) PKG LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 8X 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND METAL EDGE METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK OPENING SOLDER MASK DEFINED SOLDER MASK DETAIL 4219870/A 03/2018 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004). 5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN NDP0003B TO-252 - 2.55 mm max height TRANSISTOR OUTLINE (1.35) TYP 2X (2.15) 2X (1.3) (0.26) (R0.05) TYP (1.32) TYP (4.57) 16X (1.12) 16X (1.15) (4.38) PKG SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 8X 4219870/A 03/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. 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