TA8496FL/FLG Toshiba Bipolar Linear Integrated Circuit Silicon Monolithic TA8496FL/FLG Magnetic Head R/W IC This IC enables writing and detection of magnetic recording signals. Features * Operating voltage range: VCC = 3.5 to 7 V VBAT = 1.8 to 7 V * Output current: Iout = 20 mA (max) * Constant current operating function : IOC = (0.25 (V) x 160 (A))/RWR (typ.) Weight: 0.05 g (typ.) TA8496FLG: The TA8496FLG is a Pb-free product. The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature = 230C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245C *dipping time = 5 seconds *the number of times = once *use of R-type flux 1 2006-3-6 TA8496FL/FLG Block Diagram 9 CFIL 10 19 T1 FCNT AOUT2 AIN3 17 16 12 15 14 18 10 k Filter AIN2 100 k 100 COMIN 8 VCC - VF - 0.3 V 316 k 10 k 40 dB 30 k 30 k VREF 24 100 k 10 k HDFB HDOUT 10 k VCC 20 dB 20 dB 30 dB 13 AOUT3 AMP2 HEAD-AMP AMP3 21 AHDIN 20 ACOM COM-AMP 2 VBAT ON/OFF 7 Control circuit 22 HDIN R/W 6 23 COM ENA 5 H-SW control circuit CLK 4 3 1 11 WRCNT WRGND RDGND 2 2006-3-6 TA8496FL/FLG Pin Function Pin Number Symbol 1 WRGND 2 VBAT 3 WRCNT Description GND for write block High-switch control power supply Write output setting pin 4 CLK High-switch operation control signal input 5 ENA High-switch enable signal input 6 R/W Read/write select signal input 7 ON/OFF Chip enable signal input 8 COMIN Internal reference voltage setting (fine adjustment) 9 VCC Power supply input pin 10 CFIL Power supply filter connecting pin (C = 0.1 F) 11 RDGND 12 FCNT 13 AOUT3 14 AIN3 15 AOUT2 Amp 2 output 16 T1 Amp 2 test pin 17 AIN2 18 HDOUT 19 HDFB Head amp feedback input 20 ACOM COM amp output 21 AHDIN Head amp output 22 HDIN Write output 23 COM Write output 24 Vref GND for read block Cut-off frequency setting pin Amp 3 output Amp 3 input Amp 2 input Head amp output VCC filter output (internal power supply) Absolute Maximum Rating (Ta = 25C) Characteristics Symbol Rating Unit VCC 8 V VBAT 8 V VI 6 V Output Current IOUT 20 mA Operating Temperature Topr -20 to 70 C Storage Temperature Tstg -50 to 150 C Symbol Rating Unit VCC 3.5 to 7.0 VBAT 1.8 to 7.0 Power Supply Voltage Input Voltage Recommended Operating Conditions Characteristics Power Supply Voltage 3 V 2006-3-6 TA8496FL/FLG Functions Input ON/OFF Read Unit R/W ENA CLK COM HDin H H/L H/L Enable L H H L H Disable L H L H L Disable L L L L L Disable L L H Disable H/L H/L H/L Disable H L Write Unit : High impedance Electrical Characteristics Interface Block (unless otherwise is specified, VCC = 5 V, VBAT = 3 V, Ta = 25C) Characteristics Input Voltage Input Current Symbol Test Circuit VIN1-Hi VIN1-Lo Min Typ. Max ENA, ON/OFF 2.5 VCC ENA, ON/OFF 1.0 VIN2-Hi CLK, R/W 1.5 VCC VIN2-Lo CLK, R/W 0.5 IIN1-Hi CLK, VIN = 5 V 15 25 IIN1-Lo CLK, VIN = 0 V -85 -120 ENA, VIN = 5 V 85 120 IIN3-Hi R/W, VIN = 5 V 15 25 IIN3-Lo R/W, VIN = 0 V -85 -120 IIN4-Hi ON/OFF, VIN = 5 V 85 120 IIN2-Hi 1 Test Condition 4 Unit V A 2006-3-6 TA8496FL/FLG Read Block (unless otherwise is specified, VCC = 5 V, VBAT = 3 V, Ta = 25C) Characteristics Test Circuit Symbol ICCR 2 ICCO Head amp GH Amp 2 G2 Amp 3 G3 VACOM Head amp VHOS Amp 2 V2OS Amp 3 V3OS Amp 3 Output Voltage Range Low V3OL High V3OH Amp 3 Output Current Output I3OUT Output Offset Voltage Input Max Unit 3.2 4.6 mA 0 1 A 40 40 30 Rg = 0 , fc = 19 kHz 0.33 (0.64)* Rg = 0 , fc = 1.7 kHz 0.15 (0.26)* When chip disabled 3 En2 Reference Voltage Typ. (on/off = low or open) En1 Head Amp Input Conversion Noise Min When read block in operation Current Dissipation Gain Characteristics Test Condition 3 2.0 2.1 -0.1 0.25 +0.7 1.1 +0.1 0.25 0.2 4.1 2.0 0.1 0.2 0.3 3 4 1.9 RL = 10 k 4 I3IN dB Vrms V V V mA *: Guaranteed by design. Determined at design and does not change at manufacturing. Test not conducted. Write Block (unless otherwise is specified, VCC = 5 V, VBAT = 3 V, Ta = 25C) Characteristics Symbol Test Circuit Test Condition 3.7 5.2 ICCe When write enabled 1.9 2.8 ICCB When write in break 4.4 6.1 1.4 1.8 Ibat 2 (RWR = 5 k) IbaB When write in break 1.0 1.6 Ibar During read 0 1 0 1 When chip disabled IOC (on/off = low or open) 5 ENA Output Transfer Time IOC = 10 mA VBAT = 2.0 V 8 10 12 (at VBAT = 2.0 V) VBAT = 5.0 V 11 13 0.1 0 to 90% (Note1) 0.5 TpHL1 0 to 10% (Note1) 0.1 TpHL2 0 to 90% (Note1) 0.5 TpZH1 0 to 10% (Note1) 0.3 6 0 to 90% (Note1) 0.5 TpHZ1 0 to 10% (Note1) 0.3 TpHZ2 0 to 90% (Note1) 0.5 TpZH2 6 mA mA (Note1) TpLH2 Unit A 0 to 10% TpLH1 CLK Output Transfer Time Max During write, CLK = Low/High Ibao Set Output Current Typ. ICCw During write, reactive current Current Dissipation Min s s Note 1: Load RL = 36 , CL = 10 pF 5 2006-3-6 TA8496FL/FLG Input/Output Circuit * CLK pin VREF 1 k 1 k 50 k ENA 5 R/W 6 GND 1.0 V 1.0 V 50 k CLK 4 * GND * ON/OFF pin VREF R/W pin VREF 50 k VREF * ENA pin 50 k * GND AOUT3 pin VCC 50 k GND 13 AOUT3 200 A 50 k ON/OFF 7 GND Secondly L.P.F characteristics (amp 2) Cut-off frequency (-3 dB) (kHz) 30 10 3 1 0.3 0.1 1 3 Control resistance (FCNT) 6 10 30 100 (k) 2006-3-6 TA8496FL/FLG Test Circuit 9 5V IIN4 A 5 ENA 18 17 12 15 14 FCNT AOUT2 AIN3 ACOM 20 AHDIN 21 TA8496FL/FLG A 6 R/W A 7 ON/OFF HDIN 22 COM 23 RDGND CFIL 11 RL = 120 IIN3 4 CLK 19 WRCNT WRGND 10 RWR = 5 k IIN2 A 2 VBAT HDFB HDOUT AIN2 0.1 F IIN1 VCC 0.1 F 10 k 820 pF 0.1 F 3V 5V 1. Input Current (IIN1, IIN2, IIN3, IIN4) 7 3 1 2006-3-6 TA8496FL/FLG 2. Current Consumption (ICCR, ICCO, ICCW, ICCe, ICCB, Ibat, IbaB, Ibar, Ibao) 3V 5V 9 A VCC 2 19 18 0.1 F 10 k 820 pF 0.1 F A 17 VBAT HDFB HDOUT AIN2 12 15 14 FCNT AOUT2 AIN3 ACOM 20 5V 4 CLK AHDIN 21 TA8496FL/FLG SW. 6 R/W HDIN 22 7 ON/OFF COM 23 RDGND CFIL WRCNT WRGND RWR = 3.9 k 10 0.1 F 11 RL = 120 5 ENA 3 1 Input Sequence (H = 5 V, L = 0 V) Current Consumption (VCC, VBAT) ON/OFF R/W ENA CLK ICCR H H L H ICCO L/OPEN H H/L H ICCW H L H H/L ICCe H L L H ICCB H L L L Ibat (Note2) H L H H/L IbaB H L L L Ibar H H H/L H/L Ibao L/OPEN H/L H/L H/L Note 2: SW. OFF 8 2006-3-6 TA8496FL/FLG 9 2 VCC 19 18 V 17 VBAT HDFB HDOUT AIN2 12 15 VAOUT2 VIN3 SW. 10 k 3V 5V V 820 pF VHDOUT VIN2 3. Gain Characteristics (GH, G2, G3), Power Off-Set Voltage (VHOS, V2OS, V3OS) SW. 14 FCNT AOUT2 AIN3 6 R/W AOUT3 13 V VAOUT3 SW. 7 ON/OFF AHDIN 21 5V TA8496FL/FLG WRCNT WRGND RWR = 5 k 10 0.1 F 11 VHDOUT , G2 = 20 log VHDIN VAOUT2 , G3 = 20 log VIN2 3 V 1 VACOM ACOM 20 RDGND CFIL GH = 20 log VHDIN VAOUT3 VIN3 When off-set voltage is measured, SW turns ON. VHOS = |VHDOUT|, V2OS = |VAOUT2|, V3OS = |VAOUT3| 4. Amp 3 Output Voltage Range (V3OL, V3OH), Amp 3 Output Current (I3OUT, I3IN) 2 19 18 17 VBAT HDFB HDOUT AIN2 6 R/W 12 15 100 A 14 V I3IN FCNT AOUT2 AIN3 AOUT3 13 V30L 9 VCC 0.1 F 10 k 820 pF 0.1 F 3V 5V VCC A 5V V V V30H TA8496FL/FLG 10 k VIO 7 ON/OFF 2 mA (Note3) AHDIN 21 ACOM 20 RDGND CFIL WRGND 10 1 0.1 F 11 Note 3: I3OUT must be measured on condition in VIO > = 4.0 V 9 2006-3-6 TA8496FL/FLG 5V 2 V/5 V Set Output Current (IOC) 9 2 VCC VBAT 4 CLK HDIN 22 5 ENA A IOC TA8496FL/FLG 6 R/W RL = 120 5V COM 23 7 ON/OFF RDGND WRCNT WRGND 11 3 1 RWR 5. Set RWR so that IOC = 10 mA (at VBAT = 2 V). At this time, due to fluctuation in samples, IOC fluctuates in the range of 8 to 12 mA. Also, IOC fluctuates depending on the power supply (VBAT) as follows: IOC = 10 mA (at VBAT = 2 V) IOC - 13 mA (at VBAT = 5 V). 10 2006-3-6 TA8496FL/FLG CLK, ENA Output Propagation Time (TpLH1/2, TpHL1/2, TpZH1/2, TpHZ1/2) 9 VCC 2 19 18 0.1 F 10 k 820 pF 0.1 F 3V 5V 6. 17 VBAT HDFB HDOUT AIN2 12 15 14 FCNT AOUT2 AIN3 4 CLK ACOM 20 5 ENA AHDIN 21 Current probe HDIN 22 7 ON/OFF COM 23 5V 6 R/W RDGND CFIL CL = 10 pF WRCNT WRGND 10 3 1 RWR 0.1 F 11 RL = 36 TA8496FL/FLG RWR: IOC is set 10 mA. CLK Input Voltage Waveform Output Current Waveform 50% 50% 90% 90% 10% 10% GND -10 mA TpHL1 TpLH1 TpLH2 ENA Input Voltage Waveform +10 mA TpHL2 50% 50% TpHZ2 TpZH2 TpHZ1 TpZH1 90% 90% 10% 10% 90% 90% 10% GND 10% TpHZ1 +10 mA -10 mA TpZH1 TpZH2 TpHZ2 11 2006-3-6 TA8496FL/FLG 100 k COMIN 24 VCC - VF - 0.3 V 30 k 100 VREF 100 k 316 k 10 k 40 dB 20 dB AD 20 dB 30 dB 13 AMP2 HEAD-AMP 8 AMP3 21 20 COM-AMP 2 ON/OFF CPU R/W ENA AHDIN ACOM VBAT 7 Control block 6 22 23 5 High-switch control block 4 0.25 V (typ.) CLK AOUT3 3 1 WRCNT 1.8 to 7.0 V 10 k Filter 10 k 10 0.1 F HDFB HDOUT AIN2 T1 FCNT AOUT2 AIN3 19 18 17 16 12 15 14 VCC 9 10 k CFIL 820 pF 0.1 F 30 k 0.1 F 3.5 to 7.0 V Example of Application Circuit HDIN COM HEAD 11 WRGND RDGND Note 4: Operating supply voltage range VCC = 3.5 to 7.0 V, VBAT = 1.8 to 7.0 V However, set VCC so that VACOM < = VBAT + 0.5 V. VCC > = VBAT. (VACOM = (VCC - VF - 0.3)/2) By connecting a resistor to the COMIN pin, VACOM can be varied. Note 5: Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins. 12 2006-3-6 TA8496FL/FLG Requests Concerning Use of QON Outline Drawing of Package (Upper surface) (Lower surface) When using QON, please take into account the following items. Caution (1) (2) Do not carry out soldering on the island section in the four corners of the package (the section shown on the lower surface drawing with diagonal lines) with the aim of increasing mechanical strength. The island section exposed on the package surface (the section shown on the upper surface drawing with diagonal lines) must be used as (Note 6) below while electrically insulated from outside. Note 6: Ensure that the island section (the section shown on the lower surface drawing with diagonal lines) does not come into contact with solder from through-holes on the board layout. * When mounting or soldering, take care to ensure that neither static electricity nor electrical overstress is applied to the IC (measures to prevent anti-static, leaks, etc.). * When incorporating into a set, adopt a set design that does not apply voltage directly to the island section. 13 2006-3-6 TA8496FL/FLG Package Dimensions Weight: 0.05 g (typ.) 14 2006-3-6 TA8496FL/FLG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 15 2006-3-6 TA8496FL/FLG Points to remember on handling of ICs (1) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 16 2006-3-6 TA8496FL/FLG 17 2006-3-6