TBD62387A series TOSHIBA BiCD Integrated Circuit Silicon Monolithic TBD62387APG, TBD62387AFNG 8-ch low active sink type DMOS transistor array TBD62387A series are DMOS transistor arrays with 8 circuits. They incorporate clamp diodes for clamping a back-EMF, which generates during inductive-load drive. Please be careful about thermal conditions during use. TBD62387APG Features * * * Built-in 8 circuits High voltage High current * * * Input voltage (output on) Input voltage (output off) Package : VOUT = 50 V (max) : IOUT = 500 mA/ch (max) DIP20-P-300-2.54A : 0 to VCC-3.5 V : VCC-0.4 V to 5.5 V : PG type DIP20-P-300-2.54A FNG type SSOP20-P-225-0.65A TBD62387AFNG SSOP20-P-225-0.65A Weight DIP20-P-300-2.54A : 1.4 g (typ.) SSOP20-P-225-0.65A : 0.1 g (typ.) Pin Assignment (top view) COMMON O1 NC I1 O2 O3 O4 O5 O6 O7 O8 VCC I2 I3 I4 I5 I6 I7 I8 GND Pin connection may be omitted partially or simplified for explanatory purpose. (c)2017 TOSHIBA Corporation 1 2017-03-21 TBD62387A series Pin Descriptions Pin No. Pin name Function 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 NC I1 I2 I3 I4 I5 I6 I7 I8 GND VCC O8 O7 O6 O5 O4 O3 O2 O1 COMMON Non connection pin Input pin Input pin Input pin Input pin Input pin Input pin Input pin Input pin Ground pin Power supply pin Output pin Output pin Output pin Output pin Output pin Output pin Output pin Output pin Common pin Basic Circuit COMMON Clamp diode VCC OUTPUT INPUT Basic circuit may be omitted partially or simplified for explanatory purpose. 2 2017-03-21 TBD62387A series Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Power supply voltage VCC -0.5 to 6.0 V Output voltage VOUT 50 V COMMON pin voltage VCOM -0.5 to 50 V Output current (per ch) IOUT 500 mA Input voltage VIN -0.5 to 6.0 V Clamp diode reverse voltage VR 50 V Clamp diode forward current IF 500 mA Power dissipation PG (Note1) FNG (Note2) 1.76 PD 0.96 W Operating temperature Topr -40 to 85 C Storage temperature Tstg -55 to 150 C Note1: On PCB (compliant with JEDEC 2s2p). When Ta exceeds 25C, it is necessary to do the derating with 14.1 mW/C. Note2: On PCB (size: 50 mm x 50 mm x 1.6 mm, Cu area: 40 %, single-side glass epoxy). When Ta exceeds 25C, it is necessary to do the derating with 7.7 mW/C. 3 2017-03-21 TBD62387A series Operating Ranges (Ta = -40 to 85C, unless otherwise specified.) Characteristics Symbol Test conditions Min Typ. Max Unit Power supply voltage VCC 4.5 5.0 5.5 V Output voltage VOUT 50 V 50 V COMMON pin voltage VCOM PG (Note1) Output current IOUT (per ch) FNG (Note2) 0 1 circuit ON, Ta = 25C 0 400 tpw = 25 ms 8 circuits ON Ta = 85C Tj = 120C Duty = 10 % 0 400 Duty = 50 % 0 195 1 circuit ON, Ta = 25C 0 400 tpw = 25 ms 8 circuits ON Ta = 85C Tj = 120C Duty = 10 % 0 320 Duty = 50 % 0 140 0 VCC-3.5 V VCC-0.4 5.5 V 400 mA Input voltage (Output on) VIN (ON) IOUT = 100 mA or more, VOUT = 2 V Input voltage (Output off) VIN (OFF) IOUT = 100 A or less, VOUT = 2 V Clamp diode forward current IF mA Note1: On PCB (compliant with JEDEC 2s2p) Note2: On PCB (size: 50 mm x 50 mm x 1.6 mm, Cu area: 40 %, single-side glass epoxy). Electrical Characteristics (Ta = 25C, unless otherwise specified.) Characteristics Symbol Test Circuit Output leakage current Ileak 1 Output voltage VDS (Output ON-resistance) (RON) 2 Test conditions Min Typ. Max Unit VOUT = 50 V, Ta = 85 C VIN = VCC = 5.5 V 1.0 A IOUT = 350 mA VCC = 5.0 V, VIN = 0 V 0.53 (1.5) 1.14 (3.25) IOUT = 200 mA, VCC = 5.0 V, VIN = 0 V 0.30 (1.5) 0.65 (3.25) IOUT = 100 mA VCC = 5.0 V, VIN = 0 V 0.15 (1.5) 0.325 (3.25) -10 -100 A A V () IIN(ON) 3 VCC = 5.5 V, VIN = 0 V IIN(OFF) 4 VCC = VIN =5.5 V 1.0 Clamp diode reverse current IR 5 VR = 50 V, Ta = 85 C 1.0 A Clamp diode forward voltage VF 6 IF = 350 mA 2.0 V ICC(ON) 3 VCC = 5.5 V, VIN = 0 V 60 200 A ICC(OFF) 4 VCC = 5.5 V, VIN = VCC 1.0 A 7 VCC = 5.0 V, VOUT = 50 V RL = 125 CL = 15 pF 0.6 0.6 Input current Consumption current (per ch) Turn-on delay tON Turn-off delay tOFF 4 s 2017-03-21 TBD62387A series Test Circuit 1. Ileak 2. VDS (RON) VCC OUTPUT INPUT VCC VCC COMMON OUTPUT INPUT Ileak VOUT VIN COMMON VCC IOUT VDS VIN GND GND RON = VDS / IOUT 3. IIN(ON), ICC(ON) 4. IIN(OFF), ICC(OFF) VCC ICC(ON) VCC VCC COMMON OUTPUT INPUT IIN(ON) VIN ICC(OFF) VCC COMMON OUTPUT INPUT IIN(OFF) VIN GND GND 5. IR 6. VF VCC VCC COMMON COMMON IF IR VR INPUT VF INPUT OUTPUT OUTPUT GND GND Test circuits may be omitted partially or simplified for explanatory purpose. 5 2017-03-21 TBD62387A series 7. tON, tOFF tf Input 90% 50% tr 10% tON Output 10% 50 s 50% 90% 50% tOFF VIH VOH 50% VOL Note1: Pulse width 50 s, Duty cycle 10 % Output impedance 50 , tr 5 ns, tf 10 ns, VIH = 5.0 V Note2: CL includes capacitance of the probe and the test board. Test circuits and timing charts may be omitted partially or simplified for explanatory purpose. Precautions for Using This IC does not incorporate built-in protection circuits for excess current or over voltage. Therefore, if the short-circuit between adjacent pins or between outputs, the short-to-power or ground fault has occurred, the current or voltage beyond the absolute maximum rating is impressed, and IC may be destroyed. When designing, please consider enough in power supply line, output line, and GND line. In addition, so as not to continue to flow a current that exceeds the absolute maximum rating of the IC, please insert the appropriate fuse in the power supply line. 6 2017-03-21 TBD62387A series Package Dimensions DIP20-P-300-2.54A Unit: mm Weight: 1.4 g (typ.) 7 2017-03-21 TBD62387A series SSOP20-P-225-0.65A Unit: mm Weight: 0.1 g (typ.) 8 2017-03-21 TBD62387A series Notes on Contents 1. Pin connection Pin connection may be simplified for explanatory purpose. 2. Equivalent Circuits Equivalent circuit may be simplified for explanatory purpose. 3. Timing chart Timing charts may be simplified for explanatory purposes. 4. Test circuit Test circuit may be simplified for explanatory purpose. IC Usage Considerations Notes on handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. (2) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is applied even just once. (3) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To minimize the effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (4) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as from input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly. Points to remember on handling of ICs Heat Radiation Design When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is appropriately radiated, in order not to exceed the specified junction temperature (Tj) at any time or under any condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor's power supply owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 9 2017-03-21 TBD62387A series RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. 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