Technical Data 4409 Effective December 2015 Supersedes April 2011 UP5 High power, drum inductors Applications * Buck or boost inductor * Desktop computer * Workstations/servers * DVD Players * Portable power devices * Base stations * Industrial power supplies * Output filter chokes * Test equipment instrumentation Environmental Data Description * 18.54 x 15.24 x 7.11mm maximum surface mount package * Ferrite core material * Inductance range from 1.0H to 1000H * Current range from 0.56 to 20 Amps * Frequency range up to 1MHz * RoHS compliant * Storage temperature range: -40C to +125C * Operating temperature range: -40C to +125C (ambient plus self-temperature rise) * Solder reflow temperature: J-STD-020D compliant HALOGEN Pb HF FREE UP5 High power, drum inductors Technical Data 4409 Effective December 2015 Product Specifications Part Number5 OCL1 H 20% Irms2 (amps) sat3 (amps) @25C SRF MHz typical DCR m @ 20C Maximum K-factor4 UP5-1R0-R 1.0 8.6 20.0 140 9.0 73.61 UP5-1R5-R 1.5 7.5 18.0 110 12.0 60.22 UP5-2R2-R 2.2 7.1 16.0 75.0 14.0 50.96 UP5-3R3-R 3.3 6.2 14.0 70.0 18.0 44.16 UP5-5R6-R 5.6 5.3 12.0 45.0 20.0 31.55 UP5-100-R 10.0 4.3 10.0 21.0 31.0 24.54 UP5-150-R 15.0 4.0 8.0 16.0 36.0 20.07 UP5-220-R 22.0 3.5 7.0 13.0 47.0 16.99 UP5-330-R 33.0 3.0 5.5 11.0 66.0 14.09 UP5-470-R 47.0 2.6 4.5 9.0 86.0 11.62 UP5-680-R 68.0 2.3 3.5 6.5 130 9.60 UP5-101-R 100 1.8 3.0 5.7 190 7.98 UP5-151-R 150 1.5 2.6 4.5 250 6.56 UP5-221-R 220 1.2 2.4 3.7 380 5.39 UP5-331-R 330 1.0 1.9 3.0 560 4.39 UP5-471-R 470 0.82 1.4 2.7 850 3.70 UP5-681-R 680 0.72 1.2 2.2 1100 3.08 UP5-102-R 1000 0.56 1.0 2.0 1800 2.54 1. OpenCircuitInductance(OCL)TestParameters:100kHz,0.25Vrms,0.0Adc 2. Irms: DC current for an approximate T rise of 40C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generat- ing components will affect the temperature rise. It is recommended the part temperature not exceed 125C under worst case operating conditions verified in the end application. 3. Isat: Peak current for approximately 10% rolloff at 25C. 4. K-factor:UsedtodetermineBp-pforcoreloss(seegraph).Bp-p=K*L*I,Bp-p:(Gauss), K: (K-factor from table), L: (inductance in H), I (peak-to-peak ripple current in amps). 5. Part Number Definition: UP5-xxx-R * UP5 = Product code and size * xxx= Inductance value in H, R = decimal point. If no R is present, then third digit equals the number of zeros. * "-R" suffix = RoHS compliant Dimensions (mm) xxx = Inductance value in H (R = Decimal point). If no "R" is present, then the third digit equals the number of zeros. wwllyy = Date code R = Revision level 2 www.eaton.com/elx UP5 High power, drum inductors Technical Data 4409 Effective December 2015 Packaging information Supplied in tape-and-reel packaging, 250 parts per reel, 13" diameter reel. Temperature rise vs. total loss 60 40 30 20 10 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.0 Temerature Rise (C) 50 Total Loss (W) www.eaton.com/elx 3 UP5 High power, drum inductors Technical Data 4409 Effective December 2015 Core loss Core Loss vs. Bp-p 1 Core Loss (W) 300kHz 100kHz 200kHz 0.1 0.01 0.001 100 1000 10000 Bp-p (Gauss) Inductance characteristics % of OCL vs. Isat 110% 100% 90% % of OCL 80% 70% 60% -40C 50% +25C 40% +85C 30% 20% 10% % of I sat 4 www.eaton.com/elx 200% 180% 160% 140% 120% 100% 80% 60% 40% 20% 0% 0% UP5 High power, drum inductors Technical Data 4409 Effective December 2015 Solder reflow profile TP TC -5C tP Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 <2.5mm) 235C 220C 2.5mm 220C 220C Table 2 - Lead (Pb) Free Solder (Tc) Tsmin 25C ts Time 25C to Peak Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260C 260C 260C 1.6 - 2.5mm 260C 250C 245C >2.5mm 250C 245C 245C Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder * Temperature min. (Tsmin) 100C 150C * Temperature max. (Tsmax) 150C 200C * Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3C/ Second Max. 3C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183C 60-150 Seconds 217C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6C/ Second Max. 6C/ Second Max. Time 25C to Peak Temperature 6 Minutes Max. 8 Minutes Max. Preheat and Soak * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx (c) 2015 Eaton All Rights Reserved Printed in USA Publication No. 4409 BU09493 December 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners.