F-213 ERF8-020-05.0-S-DV-TR TM ERF8-040-05.0-S-DV-TR (0,80 mm) .0315" ERF8-060-05.0-L-DV-TR ERF8 SERIES RUGGED HIGH SPEED SOCKET SPECIFICATIONS Board Mates: ERM8 For complete specifications and recommended PCB layouts see www.samtec.com?ERF8 Cable Mates: ERCD, ERDP Insulator Material: Black LCP Contact Material: BeCu Plating: Au or Sn over 50" (1,27 m) Ni Current Rating: 1.4A per contact @ 95C (6 adjacent pins powered) Operating Temp Range: -55C to + 125C Voltage Rating: 200 VAC max RoHS Compliant: Yes fina ERM8/ERF8 7 mm Stack Height Rated @ 3dB Insertion Loss with PCB effects* w/o PCB effects** ERF8 NO. OF POSITIONS PER ROW -005, -010, -013, -020, -025, -030, -040, -049, -050, -060, -070, -075 LEAD STYLE Specify LEAD STYLE from chart LEAD STYLE A -05.0 (5,10) .200 APPLICATIONS STANDARD POS. PART NOs. SERIES NEXUS5001TM.org POWER.orgTM 11 17 20 23 35 ASP-137969-01 ASP-130368-01 ASP-130367-01 ASP-130368-01 ASP-135029-01 ERF8-DV ERF8-DV ERF8-DV ERF8-DV ERF8-DV Note: Some lengths, styles and options are non-standard, non-returnable. (1,50 mm) .059" NOMINAL WIPE MATED HEIGHT* Single-Ended 10.5 GHz / 21 Gbps 12 GHz / 24 Gbps Signaling Differential Pair 9.5 GHz / 19 Gbps 15.5 GHz / 31 Gbps Signaling *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?ERF8 or contact sig@samtec.com notes at Download app ppnote /a m co c. te www.sam samtec.com @ IG S t ac Cont on protocols for questions Other positions and mezzanine stack heights available. Call Samtec. l i nch.com EXTENDED LIFE PRODUCT 100 GbE (R) s PCI Expres APPLICATION SPECIFIC (R) 10 year Mixed Flowing Gas with 30" Gold Call Samtec for maximum cycles mated with ERM8 Lead-Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (005-030) (0,12 mm) .005" max (040-060) (0,15 mm) .006" max (070-075) ARM/HSSTP NEXUS5001TM.org POWER.orgTM 10 to 150 I/Os TM Processing: s ocol t o r P rted o p p Su Robust Edge RateTM contact improves "Zippered" unmating -07.0 (7,00) .276 No. of Positions x (0,80) .0315 + (6,00) .236 -L & -EGP = No. of Positions x (0,80) .0315 + (7,50) .295 -EGPS = No. of Positions x (0,80) .0315 + (10,00) .394 01 (3,35) .132 ERF8 ERM8 LEAD STYLE LEAD STYLE -02.0 -05.0 -08.0 -09.0 (10,00) (13,00) (14,00) -05.0 (7,00) .276 .394 .512 .551 (12,00) (15,00) (16,00) -07.0 (9,00) .354 .472 .591 .629 *Processing conditions will affect mated height. PLATING OPTION -L -L = 10" (0,25 m) Gold on contact, Matte Tin on tail -S = 30" (0,76 m) Gold on contact, Matte Tin on tail = Latching (Lead Style -05.0 only) (N/A with -EGP or -EGPS option) -EGP = Extended Guide Post (Lead Style -07.0 only) (N/A with -L & -EGPS option) -EGPS = Extended Guide Post Shield (Lead Style -07.0 only) (N/A with -L & -EGP option) (-010, -020, -025, -030 only) -K (7,25) .285 (5,60) .220 OTHER OPTION DV -EGP = (6,00 mm) .236" DIA Polyimide Film Pick & Place Pad (5,30) .209 (2,50) .098 02 (3,35) .132 A (1,32) .052 DIA (1,07) .042 (0,80) .0315 WWW.SAMTEC.COM (5,40) .213 (0,64) .025 (0,94) -L .037 (6,20) .244 (7,20) .283 -EGPS TR -TR = Tape & Reel Packaging