(0,80 mm) .0315"
ERF8 SERIES
ERF8–060–05.0–L–DV–TR
ERF8–020–05.0–S–DV–TR
ERF8–040–05.0–S–DV–TR
Robust Edge Rate™
contact improves
“Zippered” unmating
10 to 150 I/Os
WWW.SAMTEC.COM
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–005, –010, –013,
–020, –025, –030,
–040, –049, –050,
–060, –070, –075
F-213
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?ERF8
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
1.4A per contact @ 95°C
(6 adjacent pins powered)
Operating Temp Range:
-55°C to + 125°C
Voltage Rating:
200 VAC max
RoHS Compliant:
Ye s
Processing:
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10 mm) .004" max (005-030)
(0,12 mm) .005" max (040-060)
(0,15 mm) .006" max (070-075)
–L
= 10µ"
(0,25 µm)
Gold on
contact,
Matte Tin
on tail
–S
= 30µ"
(0,76 µm)
Gold on
contact,
Matte Tin
on tail
(0,80)
.0315
(1,07)
.042
02
(1,32)
.052
DIA
01
(5,60)
.220
(3,35)
.132
(5,30)
.209
(3,35)
.132 A
(5,40)
.213 (0,94)
.037
(2,50)
.098
(7,25)
.285
(7,20)
.283
(6,20)
.244
(0,64)
.025
No. of Positions x
(0,80) .0315 + (6,00) .236
–L & –EGP = No. of Positions x
(0,80) .0315 + (7,50) .295
–EGPS = No. of Positions x
(0,80) .0315 + (10,00) .394
Specify
LEAD
STYLE
from
chart
LEAD
STYLE A
(5,10)
.200
–05.0
–07.0 (7,00)
.276
SPECIFICATIONS
APPLICATION
SPECIFIC
Other positions
and mezzanine stack
heights available.
Call Samtec.
ERF8 NO. OF POSITIONS
PER ROW TR
PLATING
OPTION OTHER
OPTION
LEAD
STYLE DV
–TR
= Tape
& Reel
Packaging
–L
= Latching
(Lead Style –05.0 only)
(N/A with –EGP or
–EGPS option)
–EGP
= Extended Guide Post
(Lead Style –07.0 only)
(N/A with –L & –EGPS option)
–EGPS
= Extended
Guide Post Shield
(Lead Style –07.0 only)
(N/A with –L & –EGP option)
(–010, –020, –025, –030 only)
–K
= (6,00 mm) .236" DIA
Polyimide Film
Pick & Place Pad
APPLICATIONS
STANDARD POS. PART NOs. SERIES
NEXUS5001™.org
POWER.org™
11 ASP-137969-01 ERF8-DV
17 ASP-130368-01 ERF8-DV
ARM/HSSTP 20 ASP-130367-01 ERF8-DV
NEXUS5001™.org
POWER.org™
23 ASP-130368-01 ERF8-DV
35 ASP-135029-01 ERF8-DV
–L
–EGP
–EGPS
RUGGED HIGH SPEED SOCKET
™
Board Mates:
ERM8
Cable Mates:
ERCD, ERDP
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 30µ" Gold
TM
Call Samtec for maximum cycles mated with ERM8
(1,50 mm)
.059"
NOMINAL
WIPE
ERM8/ERF8
7 mm Stack Height
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended
Signaling 10.5 GHz / 21 Gbps 12 GHz / 24 Gbps
Differential Pair
Signaling 9.5 GHz / 19 Gbps 15.5 GHz / 31 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?ERF8 or contact sig@samtec.com
MATED HEIGHT*
ERF8
LEAD
STYLE
ERM8 LEAD STYLE
–02.0 –05.0 –08.0 –09.0
–05.0 (7,00)
.276
(10,00)
.394
(13,00)
.512
(14,00)
.551
–07.0 (9,00)
.354
(12,00)
.472
(15,00)
.591
(16,00)
.629
*Processing conditions
will affect mated height.
100 GbE
PCI Express
®
Download app notes at
www.samtec.com/appnote
Contact SIG @ samtec.com
for questions on protocols
Protocols
Supported
f
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