TiWi-uB2 Module
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TiWi-uB2 Bluetooth Module
FEATURES
Built in CC2564 single-chip Bluetooth fully
supports BT 2.1 + EDR, BLE 4.0.
RF Output Power: +10 dBm (Class 1.5)
RF Receive Sensitivity: -94 dBm
Miniature Size: 7 mm x 7 mm x 1.5 mm
Operating Voltage: 2.2V to 4.8V
Operating temperature: -30 to +85o C
Worldwide acceptance: FCC (USA), IC
(Canada), ETSI (Europe), Giteki (Japan)
RoHS compliant
Supports maximum Bluetooth data rates
over HCI UART interface.
Supports multiple Bluetooth profiles with
enhanced QoS, both mono and stereo,
assisted A2DP
APPLICATIONS
Medical (ex Heart Rate Monitor, Blood
Pressure Sensor, Blood Glucose Meter)
Thermometer
Flood Alarm
Heating Control
Automatic Key Control
Industrial Sensors
Toys
Entertainment Devices
Mobile Accessories
All Bluetooth Wireless Applications
DESCRIPTION
LSR would like to announce a low-cost and low-
power consumption module which has all of the
Bluetooth functionalities. The highly integrated
TiWi-uB2 module makes the use of Bluetooth
headsets and other applications possible.
The TiWi-uB2 module fully supports the dual mode
Bluetooth and BLE operation, and the output power
can support class 1.5. The SIP module provides
UART interface / audio PCM interface for Bluetooth.
The SIP module is specifically developed for Smart
phones and Portable devices.
Need to get to market quickly? Not an expert in
Bluetooth? Need a custom antenna? Do you need
help with your host board? LSR Design Services will
be happy to develop custom hardware or software,
or help integrate the design. Contact us at
sales@lsr.com or call us at 262-375-4400.
ORDERING INFORMATION
Order Number
Description
450-0104
TiWi-uB2 Module (Tray)
450-0104R
TiWi-uB2 Module (Tape & Reel)
450-0105
TiWi-uB2 EM Board
Table 1 Orderable Model Numbers
TiWi-uB2 Module
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MODULE ACCESSORIES
Order Number
Description
001-0001
2.4 GHz Dipole Antenna with Reverse Polarity
SMA Connector
080-0001
U.FL to Reverse Polarity SMA Bulkhead Cable
105mm
Table 2 Module Accessories
TiWi-uB2 Module
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BLOCK DIAGRAM
Figure 1 TiWi-uB2 Module Block Diagram
TiWi-uB2 Module
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TABLE OF CONTENTS
FEATURES ................................................................................................................................... 1
APPLICATIONS ............................................................................................................................ 1
DESCRIPTION .............................................................................................................................. 1
ORDERING INFORMATION .......................................................................................................... 1
MODULE ACCESSORIES ................................................................................................................ 2
BLOCK DIAGRAM ........................................................................................................................ 3
FOOTPRINT AND PIN DEFINITIONS .............................................................................................. 6
PIN DESCRIPTIONS ...................................................................................................................... 8
ELECTRICAL SPECIFICATIONS ....................................................................................................... 9
Absolute Maximum Ratings ................................................................................................................................... 9
Recommended Operating Conditions .................................................................................................................... 9
General Characteristics ........................................................................................................................................ 10
Current Consumption for Active and Standby States ........................................................................................... 10
Bluetooth RF Characteristics ................................................................................................................................ 13
BLUETOOTH POWER-UP/ DOWN SEQUENCE ............................................................................. 14
nSHUTD Requirements ........................................................................................................................................ 14
SLOW CLOCK (32 KHZ) SOURCE REQUIREMENTS ........................................................................ 17
BLUETOOTH HCI UART .............................................................................................................. 18
BLUETOOTH AUDIO CODEC/PCM .............................................................................................. 19
SOLDERING RECOMMENDATIONS ............................................................................................. 20
Recommended Reflow Profile for Lead Free Solder ............................................................................................. 20
CLEANING ................................................................................................................................. 21
OPTICAL INSPECTION ................................................................................................................ 21
REWORK ................................................................................................................................... 21
SHIPPING, HANDLING, AND STORAGE ....................................................................................... 21
Shipping ............................................................................................................................................................... 21
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Handling .............................................................................................................................................................. 21
Moisture Sensitivity Level (MSL) .......................................................................................................................... 21
Storage ................................................................................................................................................................ 21
Repeating Reflow Soldering ................................................................................................................................. 22
AGENCY CERTIFICATIONS .......................................................................................................... 23
AGENCY STATEMENTS ............................................................................................................... 23
Federal Communication Commission Interference Statement ............................................................................. 23
Industry Canada Statements ................................................................................................................................ 24
OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS ............. 25
OEM LABELING REQUIREMENTS FOR END-PRODUCT ................................................................. 26
OEM END PRODUCT USER MANUAL STATEMENTS ..................................................................... 27
EUROPE .................................................................................................................................... 28
CE Notice ............................................................................................................................................................. 28
Declaration of Conformity (DOC) ......................................................................................................................... 28
BLUETOOTH CERTIFICATION ...................................................................................................... 28
MECHANICAL DATA ................................................................................................................... 29
Tape & Reel Dimensions ...................................................................................................................................... 31
Tray Dimensions .................................................................................................................................................. 32
DEVICE MARKINGS .................................................................................................................... 33
Rev 1 Devices ....................................................................................................................................................... 33
Rev 2 Devices ....................................................................................................................................................... 33
Rev 3 Devices ....................................................................................................................................................... 34
CONTACTING LSR ...................................................................................................................... 35
TiWi-uB2 Module
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FOOTPRINT AND PIN DEFINITIONS
Figure 2 TiWi-uB2 Module Schematic View
TiWi-uB2 Module
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Figure 3 TiWi-uB2 Module Footprint View
TiWi-uB2 Module
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PIN DESCRIPTIONS
Module
Pin
Name
I/O Type
1
HCI_CTS
I
2
HCI_TX
O
3
HCI_RX
I
4
HCI_RTS
O
5
GND
GND
6
GND
GND
7
GND
GND
8
SLOW_CLK_IN
I
9
GND
GND
10
NC1
O
11
NC2
O
12
VBAT
PI
13
GND
GND
14
BT_ANT
RF
15
GND
GND
16
nSHUTD
I
17
GND
GND
18
VDD_IO
PI
19
AUD_IN
I
20
AUD_OUT
O
21
AUD_CLK
IO
22
AUD_FSYNC
IO
23
NC3
O
24
TX_DBG
O
25-33
GND
GND
PI = Power Input
I = Input
O = Output
IO = Bi-directional Input Output Port
RF = Bi-directional RF Port
GND=Ground
Table 3 TiWi-uB2 Pin Descriptions
TiWi-uB2 Module
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ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Symbol
Description
Min
Max
Unit
VBAT
Input supply Voltage
-0.5
5.5
V
VDD_IO
Digital Bluetooth I/O Voltage
-0.5
2.145
V
Table 4 Absolute Maximum Ratings
1
Recommended Operating Conditions
Test conditions: Ambient Temp = 25°C
Symbol
Min
Typ
Max
Unit
VBAT
2.2
3.3
4.8
V
VDD_IO
1.62
1.8
1.92
V
Table 5 Recommended Operating Conditions
1
Under no circumstances should exceeding the ratings specified in the Absolute Maximum Ratings section be
allowed. Stressing the module beyond these limits may result permanent damage to the module that is not
covered by the warranty.
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General Characteristics
Characteristic
Description
Model Name
TiWi-uB2
Product Description
Bluetooth Wireless Module
Dimension
7.0 mm x 7.0 mm x 1.5 mm (W*L*T)
BT Interface
HCI UART, Audio PCM
Operating temperature
-30°C to 85°C
Storage temperature
-40°C to 85°C
Humidity
Operating Humidity 10% to 95% Non-Condensing
Storage Humidity 5% to 95% Non-Condensing
Weight
0.18 g +/- 0.01g
Table 6 General Characteristics
Current Consumption for Active and Standby States
(1) Vbat + Vio
(2) Vbat + Vio + Vsd (shutdown)
Mode Description
Min
25°C
Typ
25°C
Max
25°C
Min
-40°C
Min
-40°C
Typ
-40°C
Max
-40°C
Min
85°C
Typ
85°C
Max
85°C
Unit
Current consumption in shut-
down mode(1)
1
3
7
µA
Current consumption in deep-
sleep mode(2)
40
105
µA
Total I/O current consumption
for active mode
1
1
1
µA
Table 7 Current Consumption for Active and Standby States
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Current Consumption – for Different Bluetooth BR/EDR Scenarios
Conditions: VBAT = 3.6 V, VDD_IO = 1.8V, 25°C, 26 MHz fast clock, nominal unit, 4 dBm output power
Mode Description
Master/Slave
Average Current
Unit
Idle current (ARM off)
Master/slave
2.5
mA
SCO link HV3
Master/slave
12
mA
eSCO link EV3 64 kbps, no retransmission
Master/slave
11.5
mA
eSCO link 2-EV3 64 kbps, no retransmission
Master/slave
8.3
mA
GFSK full throughput: TX = DH1, RX = DH5
Master/slave
38.5
mA
EDR full throughput: TX = 2-DH1, RX = 2-DH5
Master/slave
39.2
mA
EDR full throughput: TX = 3-DH1, RX = 3-DH5
Master/slave
39.2
mA
Sniff, one attempt, 1.28 s
Master/slave
76/100
µA
Page or inquiry scan 1.28 s, 11.25 ms
Master/slave
300
µA
Page (1.28 s) and inquiry (2.56 s) scans, 11.25 ms
Master/slave
430
µA
Low power scan, 1.28-s interval, quiet environment
Master/slave
135
µA
Table 8 Bluetooth Power Consumption
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Current Consumption – for Different Bluetooth LE Scenarios
Conditions: VBAT = 3.6 V, VDD_IO = 1.8V, 25°C, 26 MHz fast clock, nominal unit, 10 dBm output power
Mode
Description
Average Current
Unit
Advertising, non-
connectable
Advertising in all 3 channels
1.28msec advertising interval
15Bytes advertise data
104
µA
Advertising, discoverable
Advertising in all 3 channels
1.28msec advertising interval
15Bytes advertise data
121
µA
Scanning
Listening to a single frequency per window
1.28msec scan interval
11.25msec scan window
302
µA
Connected (master role)
500msec connection interval
0msec Slave connection latency
Empty Tx/Rx LL packets
169
µA
Table 9 Bluetooth Power Consumption
Power Consumption – Bluetooth
Conditions: VBAT = 3.3V, VDD_IO = 1.8V, Ambient Temp = 25°C
Packet type
Typ
Max
Unit
DM1
47.1
mA
DH1
30.2
mA
DM3
21.3
mA
DH3
17.4
mA
DM5
15.6
mA
DH5
13.0
mA
Deep Sleep Mode
0.033
mA
Constant RX
44.5
mA
BER Mode
38.8
mA
Table 10 Bluetooth VBAT Power Consumption
Packet type
Typ
Max
Unit
DM1
0.069
mA
DH1
0.069
mA
DM3
0.069
mA
DH3
0.069
mA
DM5
0.069
mA
DH5
0.069
mA
Deep Sleep mode
0.032
mA
Constant RX
0.069
mA
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Packet type
Typ
Max
Unit
BER Mode
0.069
mA
Table 11 Bluetooth VDDIO Power Consumption
Bluetooth RF Characteristics
General Specifications
Feature
Description
Bluetooth Standard
Bluetooth 4.0 (with EDR)
Host Interface
HCI UART, PCM
Antenna Reference
Small antennas with 0~2 dBi peak gain
Frequency Band
2.402 GHz ~ 2.480 GHz
Number of Channels
79 channels
Modulation
FHSS, GFSK, DPSK, DQPSK
Table 12 Bluetooth General Specifications
RF Characteristics
Test Conditions : VBAT = 3.3V, VDD_IO = 1.8V
Characteristic
Condition
-30°C Typ
25°C Typ
85°C Typ
BT Spec
Unit
Output Power
Class 1.5
9.5
10
10.8
dBm
Modulation
GFSK
dF1 avg
158
158
158
140~ 175
KHz
dF2 max
138
137
136
>115
KHz
dF2avg / dF1avg
90
90
90
80
%
Modulation
EDR at 8DPSK
RMS DEVM
5
5
5
13
%
99% DEVM
10
10
10
20
%
Peak DEVM
13
13
13
25
%
Sensitivity at
Dirty Tx On
GFSK at BER = 0.1%
-95
-94
-93
-70
dBm
π/4-DQPSK at BER = 0.01%
-93
-92
-91
-70
dBm
8DPSK at BER = 0.01%
-86
-85
-84
-70
dBm
Maximum
Input Level
GFSK at BER = 0.1%
-5
-5
-5
-20
dBm
π/4-DQPSK at BER = 0.1%
-10
-10
-10
-20
dBm
8DPSK at BER = 0.1%
-10
-10
-10
-20
dBm
Table 13 Bluetooth RF Characteristics
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BLUETOOTH POWER-UP/ DOWN SEQUENCE
Power up requirements:
nSHUTD must be low. VDD_IN and VDD_IO are don't-care when nSHUTD is low. However, no signals
are allowed on the I/O pins if no I/O power is supplied, because the I/Os are not fail-safe. Exceptions
are SLOW_CLK_IN, XTALP, XTALM, and AUD_xxx, which are fail-safe and can tolerate external
voltages with no VDD_IO and VDD_IN.
VDD_IO and VDD_IN must be stable before releasing nSHUTD.
Fast clock must be stable maximum 20 ms after nSHUTD goes high.
Slow clock must be stable within 2 ms of nSHUTD going high.
The CC256x indicates that the power-up sequence is complete by asserting RTS low. This occurs up to100 ms
after nSHUTD goes high.
Figure 4 Bluetooth Power-Up/Down Sequence
nSHUTD Requirements
Parameter
Symbol
Min
Max
Unit
Operation mode level (1)
VIH
1.42
1.98
V
Shutdown mode level (1)
VIL
0
0.4
V
Minimum time for nSHUT_DOWN low to reset the device
5
Rise/fall times
Tr/Tf
20
us
(1) Internal pull-down retains shutdown mode when no external signal is applied to this pin.
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Table 14 nSHUTD Requirements
Power Supplies and Shutdown—Static States
The nSHUTD signal puts the CC256x in ultra-low power mode and also performs an internal reset to the device.
nSHUTD rise time must not exceed 20 μs, and nSHUTD must be low for a minimum of 5 ms. All I/O pins are set
to high-impedance state during shut down and power up of the CC256x device to prevent conflicts with external
signals. The internal pull resistors are enabled on each I/O pin.
VDD_IN(1)
VDD_IO(1)
nSHUTD(1)
PM_MODE
Comments
1
None
None
Asserted
Shut Down
I/O state is undefined. No I/O voltages allowed on non
fail-safe pins.
2
None
None
Deasserted
Not Allowed
I/O state is undefined. No I/O voltages allowed on non
fail-safe pins.
3
None
Present
Asserted
Shut Down
IOs are defined as 3-state with internal pullup/pulldown
enabled.
4
None
Present
Deasserted
Not Allowed
I/O state is undefined. No I/O voltages allowed on non
fail-safe pins.
5
Present
None
Asserted
Shut Down
I/O state is undefined. No I/O voltages allowed on non
fail-safe pins.
6
Present
None
Deasserted
Not Allowed
I/O state is undefined. No I/O voltages allowed on non
fail-safe pins.
7
Present
Present
Asserted
Shut Down
IOs are defined as 3-state with internal pullup/pulldown
enabled.
8
Present
Present
Deasserted
Active
See Table 16 I/O States in Various Power Modes
Table 15 Power Modes
(1) None/Asserted can be any of the following conditions: directly pulled to ground/driven low, pulled to ground through pull down resistor, or left
NC/floating (high-impedance output stage).
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I/O Name
Shut Down
Default Active (1)
Deep Sleep (2)
I/O State
Pull
I/O State
Pull
I/O State
Pull
HCI_RX
Z
PU
I
PU
I
(3)
HCI_TX
Z
PU
O-H
-
O
-
HCI_RTS
Z
PU
O-H
-
O
-
HCI_CTS
Z
PU
I
PU
I
(3)
AUD_CLK
Z
PD
I
PD
I
PD
AUD_FSYNC
Z
PD
I
PD
I
PD
AUD_IN
Z
PD
I
PD
I
PD
AUD_OUT
Z
PD
Z
PD
Z
PD
I2C_SCL
Z
(4)
I
(4)
I
(4)
I2C_SDA
Z
(4)
I
(4)
I
(4)
TX_DBG
Z
PU
O
-
Table 16 I/O States in Various Power Modes
(1) I = input, O = output, Z = HiZ, — = no pull
(2) Shown only if different from active. Can be changed by vendor-specific command.
(3) PU or no pull - depends on setting in init script.
(4) PU if TX_DBG = 1 at shutdown, PD if TX_DBG = 0 at shutdown.
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SLOW CLOCK (32 KHZ) SOURCE REQUIREMENTS
External Slow Clock signal characteristics
Characteristic
Condition
Sym
Min
Typ
Max
Unit
Input slow clock frequency
32768
Hz
Input slow clock accuracy
(Initial + temp + aging)
-250
250
ppm
Input transition time
tr/tf - 10% to 90%
tr/tf
100
ns
Frequency input duty cycle
15
50
85
%
Phase noise
At 1 kHz
-125
dBc/Hz
Jitter
Integrated over
300 to 15000 Hz
1
Hz
Slow clock input voltage limits
Square wave,
DC coupled
VIH
0.65 x
VDD_IO
VDD_IO
V peak
VIL
0
0.35 x
VDD_IO
V peak
Input impedance
1
MΩ
Input capacitance
5
pF
Table 17 32 kHz Clock Requirements
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BLUETOOTH HCI UART
Figure 5 Bluetooth HCI UART Timing
Symbol
Characteristic
Condition
Min
Typ
Max
Unit
Baud rate
37.5
4000
kbps
Baud rate accuracy
-2.5
1.5
%
t3
CTS low to TX_DATA on
0
2
us
t4
CTS high to TX_DATA off
Hardware flow control
1
byte
t6
CTS high pulse width
1
Bit
t1
RTS low to RX_DATA on
0
2
us
t2
RTS high to RX_DATA off
Interrupt set to ¼ FIFI
16
byte
Table 18 Bluetooth HCI UART Timing
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BLUETOOTH AUDIO CODEC/PCM
Figure 6 Bluetooth PCM Timing
PCM Master
Symbol
Parameter
Condition
Min
Max
Unit
Tclk
Cycle time
166.67 (6 MHz)
15625 (64 kHz)
ns
TW
High or low pulse width
50% of Tclk min
ns
tis
AUD_IN setup time
25
ns
tih
AUD_IN hold time
0
ns
top
AUD_OUT propagation time
40pF load
0
10
ns
top
FSYNC_OUT propagation time
40pF load
0
10
ns
Table 19 Bluetooth PCM Master Timing
PCM Slave
Symbol
Parameter
Condition
Min
Max
Unit
Tclk
Cycle time
62.5 (16 MHz)
ns
TW
High or low pulse width
40% of Tclk
ns
tis
AUD_IN setup time
8
ns
tih
AUD_IN hold time
0
ns
tis
AUD_FSYNC setup time
8
ns
tih
AUD_FSYNC hold time
0
ns
top
AUD_OUT propagation time
40pF load
0
21
ns
Table 20 Bluetooth PCM Slave Timing
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SOLDERING RECOMMENDATIONS
Recommended Reflow Profile for Lead Free Solder
Figure 7 Recommended Soldering Profile
Note: The quality of solder joints on the surface mount pads where they contact the host board
should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of Electronic
Assemblies, section 8.2.1 “Bottom Only Terminations.”
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CLEANING
In general, cleaning the populated modules is
strongly discouraged. Residuals under the module
cannot be easily removed with any cleaning
process.
Cleaning with water can lead to capillary effects
where water is absorbed into the gap between
the host board and the module. The
combination of soldering flux residuals and
encapsulated water could lead to short circuits
between neighboring pads. Water could also
damage any stickers or labels.
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux residuals
into the RF shield, which is not accessible for
post-washing inspection. The solvent could also
damage any stickers or labels.
Ultrasonic cleaning could damage the module
permanently.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the following:
Proper alignment and centering of the module
over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring
pads, or vias.
REWORK
The module can be unsoldered from the host board
if the Moisture Sensitivity Level (MSL) requirements
are met as described in this datasheet.
Never attempt a rework on the module
itself, e.g. replacing individual
components. Such actions will terminate
warranty coverage.
SHIPPING, HANDLING, AND STORAGE
Shipping
Bulk orders of the TiWi-uB2 modules are delivered
in trays of 416 (13 x 32) or reels of 2,000.
Handling
The TiWi-uB2 modules contain a highly sensitive
electronic circuitry. Handling without proper ESD
protection may damage the module permanently.
Moisture Sensitivity Level (MSL)
Per J-STD-020, devices rated as MSL 4 and not
stored in a sealed bag with desiccant pack should be
baked prior to use.
Devices are packaged in a Moisture Barrier Bag with
a desiccant pack and Humidity Indicator Card (HIC).
Devices that will be subjected to reflow should
reference the HIC and J-STD-033 to determine if
baking is required.
If baking is required, refer to J-STD-033 for bake
procedure.
Storage
Per J-STD-033, the shelf life of devices in a Moisture
Barrier Bag is 12 months at <40ºC and <90% room
humidity (RH).
Do not store in salty air or in an environment with a
high concentration of corrosive gas, such as Cl2,
H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
The product should not be subject to excessive
mechanical shock.
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Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
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330-0100-R1.4 Copyright © 2012-2016 LSR Page 23 of 35
AGENCY CERTIFICATIONS
FCC ID: TFB-BT1, 15.247
IC ID: 5969A-BT1, RSS 210
CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489
Giteki: 007-AD0084
AGENCY STATEMENTS
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the interference by one of the
following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
This portable transmitter with its antenna complies with FCC/IC RF exposure limits for general population /
uncontrolled exposure.
FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.
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Industry Canada Statements
This device complies with Industry Canada License-exempt RSS standard(s). Operation is subject to the following
two conditions: (1) this device may not cause interference, and (2) this device must accept any interference,
including interference that may cause undesired operation of the device.
To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the
equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.
This device has been designed to operate with the antenna(s) listed below, and having a maximum gain of 2.0
dBi (LSR Dipole) and 1.3dBi (Johanson Chip). Antennas not included in this list or having a gain greater than 2.0
dBi and 1.3dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms.
List of all Antennas Acceptable for use with the Transmitter
1)
LSR 001-0001 center-fed dipole antenna and LSR 080-0001 U.FL to Reverse Polarity SMA connector cable.
2)
Johanson 2450AT43B100 chip antenna.
Cet appareil est conforme aux normes d'Industrie Canada exempts de licence RSS (s). L'opération est soumise
aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit
accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de
l'appareil.
Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre choisis de
manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle permise pour une
communication réussie.
Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de
2,0 dBi (LSR dipôle) et1.3dBi (Chip Johanson). Antennes pas inclus danscette liste ou d'avoir un gain supérieur
à 2,0 dBi et-1.3dBi sont strictement interdites pour l'utilisation avec cet appareil. L'impédance d'antenne
requise est de 50 ohms.
Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur
1)
LSR 001-0001 alimenté par le centre antenne dipôle et LSR 080-0001 U.FL d'inversion de polarité du
câble connecteur SMA.
2)
Antenne Johanson puce 2450AT43B100.
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OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS
The TiWi-uB2 Module has been certified for integration into products only by OEM integrators under the
following conditions:
The antennas for this transmitter must not be co-located with any other transmitters except in accordance with
FCC and Industry Canada multi-transmitter procedures. Co-location means having a separation distance of less
than 20 cm between transmitting antennas.
As long as the two conditions above are met, further transmitter testing will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional
compliance requirements required with this module installed (for example, digital device
emissions, PC peripheral requirements, etc.).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-
location with another transmitter), then the FCC and Industry Canada authorizations are no longer
considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In
these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC and Industry Canada authorization.
Le module de TiWi-uB2 a été certifié pour l'intégration dans des produits uniquement par des
intégrateurs OEM dans les conditions suivantes:
Les antennes pour ce transmetteur ne doit pas être co-localisés avec les autres émetteurs sauf en conformité
avec la FCC et Industrie Canada multi-émetteur procédures. Co-localisation des moyens ayant une distance de
séparation inférieure à 20 cm entre les antennes d'émission.
Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas
tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les
exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil
numérique, les exigences de périphériques PC, etc.)
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines
configurations ou de co-implantation avec un autre émetteur), puis la FCC et Industrie autorisations
Canada ne sont plus considérés comme valides et l'ID de la FCC et IC numéro de certification ne peut
pas être utilisé sur la produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer
le produit final (y compris l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada
l'autorisation.
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OEM LABELING REQUIREMENTS FOR END-PRODUCT
The TiWi-uB2 module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC certification
numbers are not visible when the module is installed inside another device, as such the end device into which
the module is installed must display a label referring to the enclosed module. The final end product must be
labeled in a visible area with the following:
“Contains Transmitter Module FCC ID: TFB-BT1”
“Contains Transmitter Module IC: 5969A-BT1”
or
“Contains FCC ID: TFB-BT1”
“Contains IC: 5969A-BT1”
The OEM of the TiWi-uB2 Module must only use the approved antenna(s) listed above, which have been
certified with this module.
Le module de TiWi-uB2 est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la FCC
et IC numéros de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre appareil,
comme par exemple le terminal dans lequel le module est installé doit afficher une etiquette faisant référence
au module ci-joint. Le produit final doit être étiqueté dans un endroit visible par le suivant:
“Contient Module émetteur FCC ID: TFB-BT1"
“Contient Module émetteur IC: 5969A-BT1"
ou
“Contient FCC ID: TFB-BT1"
“Contient IC: 5969A-BT1"
Les OEM du module TiWi-uB2 ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec ce
module.
TiWi-uB2 Module
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OEM END PRODUCT USER MANUAL STATEMENTS
The OEM integrator should not provide information to the end user regarding how to install or remove this RF
module or change RF related parameters in the user manual of the end product.
Other user manual statements may apply.
L'intégrateur OEM ne devraient pas fournir des informations à l'utilisateur final sur la façon d'installer ou de
supprimer ce module RF ou modifier les paramètres liés RF dans le manuel utilisateur du produit final.
Autres déclarations manuel de l'utilisateur peuvent s'appliquer.
TiWi-uB2 Module
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EUROPE
CE Notice
This device has been tested and certified for use in the European Union. See the Declaration of Conformity
(DOC) for specifics.
If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU
standards. A Declaration of Conformity must be issued and kept on file as described in the Radio and
Telecommunications Terminal Equipment (R&TTE) Directive.
The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive.
Declaration of Conformity (DOC)
The DOC can be downloaded from the LSR Wiki.
BLUETOOTH CERTIFICATION
The TiWi-uB2 module has been certified as a Controller Subsystem and has a QDID of B020349. An End Product
Listing (EPL) can be created when this device is combined with a Host Subsystem QDID. The cost for creating an
EPL by combination of the Controller Subsystem and Host Subsystem QDIDs is free of charge. See the Bluetooth
website for additional details on the EPL process.
TiWi-uB2 Module
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MECHANICAL DATA
Figure 8 Module Mechanical Dimensions
TiWi-uB2 Module
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Figure 9 Soldering Footprint for Host Board and Module Placement
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Tape & Reel Dimensions
Figure 10 Tape and Reel Specification
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Tray Dimensions
Figure 11 Tray Specification
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DEVICE MARKINGS
Rev 1 Devices
1234567 = Lot Code
1 = production region (ex: Taiwan = T)
23 = production year in hex (ex: 2012 = 0A)
4 = production month in hex (ex: Jul = 7)
567 = last 3 numbers of tracking card in hex
YYWW = Date Code (YY=Year, WW=Week)
R1 = Rev 1
LSR
Model: uBleu2
FCC: TFB-BT1
IC: 5969A-BT1
1234567
YYWW R1
Rev 2 Devices
1234567 = Lot Code
1 = production region (ex: Taiwan = T)
23 = production year in hex (ex: 2012 = 0A)
4 = production month in hex (ex: Jul = 7)
567 = last 3 numbers of tracking card in hex
YYWW = Date Code (YY=Year, WW=Week)
R2 = Rev 2
LSR
Model: TiWi-uB2
FCC: TFB-BT1
IC: 5969A-BT1
1234567
YYWW R2
TiWi-uB2 Module
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Rev 3 Devices
Updated the shield etching to include the Giteki EMC marking information.
Updated the shield etching to add a Lot Code.
TYYMLLL = Lot Code
T = Manufacturing Location (ex: Taiwan = T)
YY = Production year in hex (ex: 2012 = 0C)
M = Production month in hex (ex: Jul = 7)
LLL = Lot Number in hex
YYWW = Date Code
YY=Year (0-99)
WW=Week (0-53)
R3 = Rev 3
LSR Model: TiWi-uB2
FCC: TFB-BT1
TYYMLLL
YYWW
P/N: 450-0104 R3
007-AD0084R
IC: 5969A-BT1
TiWi-uB2 Module
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CONTACTING LSR
Headquarters LSR
W66 N220 Commerce Court
Cedarburg, WI 53012-2636
USA
Tel: 1(262) 375-4400
Fax: 1(262) 375-4248
Website www.lsr.com
Sales Contact sales@lsr.com
The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”) products. No
license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in
connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSR’S TERMS AND CONDITIONS OF SALE LOCATED ON
LSR’S WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL LSR BE LIABLE FOR
ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT
LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE
USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF LSR HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. LSR
makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and
reserves the right to make changes to specifications and product descriptions at any time without notice. LSR does not
make any commitment to update the information contained herein. Unless specifically provided otherwise, LSR products
are not suitable for, and shall not be used in, automotive applications. LSR’s products are not intended, authorized, or
warranted for use as components in applications intended to support or sustain life.