REVISIONS
LTR DESCRIPTION DATE (YR-MO-DA) APPROVED
A Add figure 4. Change in terminal connections. Add subgroup 8 to Table II.
Change vendor similar part number for case outline 2.
Change IIL. Editorial changes throughout. mlp
89-03-07 Michael A. Frye
B Changes to Table I and Table II and other changes per NOR 5962-R026-92.
tvn 91-11-26 Monica L. Poelking
C Add package CDFP4-F16. Change document to current electronic format.
Editorial changes throughout. les 98-02-04 Raymond Monnin
D Figure 4 modified to be consistent with Table I. ljs 98-08-10 Raymond Monnin
The original first page of this drawing has been replaced.
REV
SHEET
REV
SHEET
REV STATUS REV D D DDDDDDDDDDD
OF SHEETS SHEET 1 2345678910111213
PMIC N/A PREPARED BY
Monica L.Poelking
DEFENSE SUPPLY CENTER COLUMBUS
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
Raymond Monnin
COLUMBUS, OHIO 43216
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
APPROVED BY
Michael A. Frye MICROCIRCUIT, DIGITAL, ECL, QUAD LINE
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE
87-11-10 RECEIVER, MONOLITHIC SILICON
AMSC N/A REVISION LEVEL
DSIZE
ACAGE CODE
67268 5962-87501
SHEET 1 OF 13
DSCC FORM 2233
APR 97 5962-E449-98
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A5962-87501
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000 REVISION LEVEL
DSHEET 2
DSCC FORM 2234
APR 97
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87501 01 E X
Drawing number Device type Case outline Lead finish
(see 1.2.1) (see 1.2.2) (see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function
01 10H515 Quad line receiver
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
E GDIP1-T16 or CDIP2-T16 16 Dual-in-line
F GDFP2-F16 or CDFP3-F16 16 Flat package
X CDFP4-F16 16 Flat package
2 CQCC1-N20 20 Square chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range (VEE) ............................................................... -8.0 V dc to 0.0 V dc
Input voltage range........................................................................... -5.2 V dc to 0.0 V dc
Storage temperature range............................................................... -65
C to +165
C
Lead temperature (soldering, 10 seconds)....................................... +300
C
Junction temperature (TJ) ................................................................. +165
C
Maximum power dissipation (PD) ...................................................... 196 mW
Thermal resistance, junction-to-case (
JC)....................................... See MIL-STD-1835
1.4 Recommended operating conditions.
Supply voltage range (VEE) ............................................................... -5.46 V dc minimum to -4.94 V dc maximum
Supply voltage range (VCC ................................................................ -0.02 V dc to 0.02 V dc or 1.98 V dc
to 2.02 V dc
Ambient operating temperature range (T A) ...................................... -55
C to +125
C
Minimum high level input voltage (VIH):
TA = +25
C.................................................................................. -0.780 V
TA = +125
C................................................................................ -0.650 V
TA = -55
C................................................................................... -0.840 V
Maximum low level input voltage (VIL)............................................... -1.950 V
STANDARD
MICROCIRCUIT DRAWING
SIZE
A5962-87501
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000 REVISION LEVEL
DSHEET 3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed
in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in
the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-973 - Configuration Management.
MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2.
3.2.4 Logic diagram(s). The logic diagram(s) shall be as specified on figure 3.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A5962-87501
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000 REVISION LEVEL
DSHEET 4
DSCC FORM 2234
APR 97
3.2.5 Test circuit and switching waveforms. Test circuit and switching waveforms shall be as specified on figure 4.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristic are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For
packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the
option of not marking the "5962-" on the device.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with
each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535,
appendix A.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A5962-87501
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000 REVISION LEVEL
DSHEET 5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test Symbol
Conditions
-55
C
TA
+125
C
unless otherwise specified Group A
subgroups Limits Unit
Min Max
Cases E, F, 2 and X Quiescent tests 1/
VIH VIL
High level output voltage VOH Outputs terminated
through 100
to -2 V
VCC = 0.0 V
VEE = -5.2 V 2/
-0.780
-0.650
-0.840
-1.950
-1.950
-1.950
1
2
3
-1.010
-0.860
-1.060
-0.780
-0.650
-0.840
V
Low level output voltage VOL -0.780
-0.650
-0.840
-1.950
-1.950
-1.950
1
2
3
-1.950
-1.950
-1.950
-1.580
-1.565
-1.610
V
High level threshold
output voltage VOHA -1.110
-0.960
-1.160
-1.480
-1.465
-1.510
1
2
3
-1.010
-0.860
-1.060
-0.780
-0.650
-0.840
V
Low level threshold
output voltage VOLA -1.110
-0.960
-1.160
-1.480
-1.465
-1.510
1
2
3
-1.950
-1.950
-1.950
-1.580
-1.565
-1.610
V
Power supply drain IEE VEE = -5.46 V 1 -26 mA
current 3/ VCC = 0.0 V 2,3 -29
High level input current IIH VIH = -0.780 V at +25
C
-0.650 V at +125
C195
A
-0.840 V at -55
C2,3 150
A
Input leakage current ICBO VEE = -5.46 V 3/
VCB = -5.2 V
VCC = 0.0 V
1,2
3-1.0
-1.5
A
Reference bias supply VBB VEE = -5.46 V 1 -1.37 -1.25 V
voltage VCC = 0.0 V 2 -1.31 -1.19
3 -1.41 -1.27
Functional tests See 4.3.1c 7,8A,8B
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A5962-87501
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000 REVISION LEVEL
DSHEET 6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test Symbol
Conditions
-55
C
TA
+125
C
unless otherwise specified Group A
subgroups Limits Unit
Min Max
Cases E, F and X Rapid tests 4/
VIH VIL
High level output voltage VOH Outputs terminated
through 100
to -2 V
VCC = 0.0 V
VEE = -5.2 V 2/
-0.788
-0.659
-0.849
-1.950
-1.950
-1.950
1
2
3
-1.017
-0.868
-1.068
-0.788
-0.659
-0.849
V
Low level output voltage VOL -0.788
-0.659
-0.849
-1.950
-1.950
-1.950
1
2
3
-1.950
-1.950
-1.950
-1.582
-1.568
-1.613
V
High level threshold
output voltage VOHA -1.117
-0.968
-1.168
-1.482
-1.468
-1.513
1
2
3
-1.017
-0.868
-1.068
-0.788
-0.659
-0.849
V
Low level threshold
output voltage VOLA -1.117
-0.968
-1.168
-1.482
-1.468
-1.513
1
2
3
-1.950
-1.950
-1.950
-1.582
-1.568
-1.613
V
Power supply drain
current 3/ IEE VEE = -5.46 V
VCC = 0.0 V 1
2,3 -25
-28 mA
High level input current IIH VIH = -0.788 V at +25
C
-0.659 V at +125
C180
A
-0.849 V at -55
C2, 3 135
A
Input leakage current ICBO VEE = -5.46 V 3/
VCB = -5.2 V
VCC = 0.0 V
1,2
3-1.0
-1.5
A
Reference bias supply VBB VEE = -5.46 V 1 -1.377 -1.257 V
voltage VCC = 0.0 V 2 -1.317 -1.197
3 -1.417 -1.277
Functional tests See 4.3.1c 7,8A,8B
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A5962-87501
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000 REVISION LEVEL
DSHEET 7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test Symbol
Conditions
-55
C
TA
+125
C
unless otherwise specified Group A
subgroups Limits Unit
Min Max
Case 2 Rapid tests 4/
VIH VIL
High level output voltage VOH Outputs terminated
through 100
to -2 V
VCC = 0.0 V
VEE = -5.2 V 2/
-0.793
-0.665
-0.855
-1.950
-1.950
-1.950
1
2
3
-1.022
-0.874
-1.074
-0.793
-0.665
-0.855
V
Low level output voltage VOL -0.793
-0.665
-0.855
-1.950
-1.950
-1.950
1
2
3
-1.950
-1.950
-1.950
-1.584
-1.570
-1.615
V
High level threshold
output voltage VOHA -1.122
-0.974
-1.174
-1.484
-1.470
-1.515
1
2
3
-1.022
-0.874
-1.074
-0.793
-0.665
-0.855
V
Low level threshold
output voltage VOLA -1.122
-0.974
-1.174
-1.484
-1.470
-1.515
1
2
3
-1.950
-1.950
-1.950
-1.584
-1.570
-1.615
V
Power supply drain IEE VEE = -5.46 V 1 -25 mA
current 3/ VCC = 0.0 V 2,3 -28
High level input current IIH VIH = -0.793 V at +25
C
-0.665 V at +125
C180
A
-0.855 V at -55
C2, 3 135
Input leakage current ICBO VEE = -5.46 V 3/
VCB = -5.2 V
VCC = 0.0 V
1,2
3-1.0
-1.5
A
Reference bias supply VBB VEE = -5.46 V 1 -1.381 -1.261 V
voltage VCC = 0.0 V 2 -1.322 -1.202
3 -1.422 -1.281
Functional tests See 4.3.1c 7, 8A, 8B
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A5962-87501
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000 REVISION LEVEL
DSHEET 8
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test Symbol
Conditions
-55
C
TA
+125
C
unless otherwise specified Group A
subgroups Limits Unit
Min Max
Cases E, F, 2 and X AC tests
Transition time tTLH,
tTHL
VEE = -2.94 V
VCC = 2.0 V
CL < 5 pF
9
10
11
0.45
0.50
0.50
1.40
1.70
1.40
ns
Propagation delay time,
input to output tPLH,
tPHL,
tPLL,
tPHH
Load all outputs through 100
to ground
See figure 4
9
10
11
0.45
0.50
0.45
1.20
1.80
1.20
ns
1/ The quiescent limits are determined after a device has reached thermal equilibrium. This is defined as the reading
taken with the device in a socket with > 500 LFPM of +25
C, +125
C or -55
C (as applicable) air blowing on the
unit in a transverse direction with power applied for at least 4 minutes before the reading is taken. This method was
used for theoretical limit establishment only. All devices shall be tested to the delta V (rapid test) conditions
specified herein. The rapid test method is an equivalent method of testing quiescent conditions.
2/ The high and low level output current varies with temperature and shall be calculated using the following formulas:
IOH = (-2 V - VOH)/100
and IOL = (-2 V - VOL)/100
.
3/ The IEE limits, although specified in the minimum column, shall not be exceeded, in magnitude, as a
maximum value.
4/ The DC rapid test forcing functions and limits are used for all dc testing. These limits are determined for each
device type based on the power dissipation and package type. The rapid test (delta V) limits and forcing functions
are skewed allowing rapid testing to be performed at standard temperatures without the addition of delta T’s.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A5962-87501
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000 REVISION LEVEL
DSHEET 9
DSCC FORM 2234
APR 97
Case outlines E F, X 2
Terminal number Terminal symbol
1V
CC1 DIN NC
2A
OUT COUT VCC1
3B
OUT DOUT AOUT
4AIN VCC2 BOUT
5A
IN VCC1 AIN
6B
IN AOUT NC
7BIN BOUT AIN
8V
EE AIN BIN
9V
BB AIN BIN
10 CIN BIN VEE
11 CIN BIN NC
12 DIN VEE VBB
13 DIN VBB CIN
14 COUT CIN CIN
15 DOUT CIN DIN
16 VCC2 DIN NC
17 - - - - - - DIN
18 - - - - - - COUT
19 - - - - - - DOUT
20 - - - - - - VCC2
NC = No connection
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A5962-87501
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000 REVISION LEVEL
DSHEET 10
DSCC FORM 2234
APR 97
Inputs Output
Inverting Noninverting
L
H
L
H
VBB
VBB
H
L
VBB
VBB
H
L
L
H
L
H
L
H
H = High level
L = Low level
VBB = Irrelevant
FIGURE 2. Truth table.
FIGURE 3. Logic diagram.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A5962-87501
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000 REVISION LEVEL
DSHEET 11
DSCC FORM 2234
APR 97
NOTES:
1. Unused outputs connected 100
to ground.
2. L1 = L2 : matched for equal time delays.
3. 2:1 divider may be used.
4. CL (test jig)
5 pF.
5. Pulse generator characteristics:
PRR = 1MHz, tr and tf = 1.0 ns
0.2 ns (20% to 80%), duty cycle = 50%.
FIGURE 4. Test circuit and switching waveforms.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A5962-87501
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000 REVISION LEVEL
DSHEET 12
DSCC FORM 2234
APR 97
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015 of MIL-STD-883.
(2) TA = +125
C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
TABLE II. Electrical test requirements.
MIL-STD-883 test requirements Subgroups
(in accordance with
MIL-STD-883, method 5005,
table I)
Interim electrical parameters
(method 5004) 1
Final electrical test parameters
(method 5004) 1*, 2, 3, 7*
8A, 8B, 9
Group A test requirements
(method 5005) 1, 2, 3, 7, 8A,
8B, 9, 10, 11
Groups C and D end-point
electrical parameters
(method 5005)
1, 2, 3
* PDA applies to subgroup 1 and 7.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of
MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. Subgroups 7, 8A, and 8B shall verify the truth table as specified on figure 2 herein.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A5962-87501
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000 REVISION LEVEL
DSHEET 13
DSCC FORM 2234
APR 97
4.3.2 Groups C and D inspections.
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test conditions, method 1005 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1005 of MIL-STD-883.
(2) TA = +125
C, minimum.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a
contractor-prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished in accordance with MIL-STD-973 using DD Form 1692,
Engineering Change Proposal.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application
requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for
coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962)
should contact DSCC-VA, telephone (614) 692-0525.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone
(614) 692-0674.
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-
HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted
by DSCC-VA.
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 98-08-10
Approved sources of supply for SMD 5962-87501 are listed below for immediate acquisition information only and shall
be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8750101EA 0EU86 AS10H515C16/883C
5962-8750101FA 3/ 10H515/BFAJC
5962-87501012A 0EU86 AS10H515EC20/883C
5962-8750101XA 0EU86 AS10H515F16/883C
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ No longer available from the approved source of supply.
Vendor CAGE Vendor name
number and address
0EU86 Austin Semiconductor Inc.
8701 Cross Park Dr.
Austin, TX 78754-4566
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
