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Detector
÷2 ÷2
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LMC567
SNOSBY1C –JUNE 1999–REVISED DECEMBER 2015
LMC567 Low-Power Tone Decoder
1 Features 3 Description
The LMC567 device is a low-power, general-purpose
1• Functionally Similar to LM567 LMCMOS tone decoder which is functionally similar
• 2-V to 9-V Supply Voltage Range to the industry standard LM567. The device consists
• Low Supply Current Drain of a twice frequency voltage-controlled oscillator
(VCO) and quadrature dividers which establish the
• No Increase in Current With Output Activated reference signals for phase and amplitude detectors.
• Operates to 500-kHz Input Frequency The phase detector and VCO form a phase-locked
• High Oscillator Stability loop (PLL) which locks to an input signal frequency
• Ground-Referenced Input which is within the control range of the VCO. When
• Hysteresis Added to Amplitude Comparator the PLL is locked and the input signal amplitude
exceeds an internally pre-set threshold, a switch to
• Out-of-Band Signals and Noise Rejected ground is activated on the output pin. External
• 20-mA Output Current Capability components set up the oscillator to run at twice the
input frequency and determine the phase and
2 Applications amplitude filter time constants.
• Touch-Tone Decoding Device Information (1)
• Precision Oscillators PART NUMBER PACKAGE BODY SIZE (NOM)
• Frequency Monitoring and Control LMC567 SOIC (8) 4.90 mm × 3.91 mm
• Wide-Band FSK Demodulation (1) For all available packages, see the orderable addendum at
• Ultrasonic Controls the end of the data sheet.
• Carrier Current Remote Controls
• Communications Paging Decoders
Simplified Diagram
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMC567
SNOSBY1C –JUNE 1999–REVISED DECEMBER 2015
www.ti.com
Table of Contents
9.3 Feature Description................................................... 8
1 Features.................................................................. 19.4 Device Functional Modes.......................................... 9
2 Applications ........................................................... 110 Application and Implementation........................ 10
3 Description............................................................. 110.1 Application Information.......................................... 10
4 Revision History..................................................... 210.2 Typical Application ............................................... 10
5 Device Comparison Table..................................... 311 Power Supply Recommendations ..................... 12
6 Pin Configuration and Functions......................... 312 Layout................................................................... 12
7 Specifications......................................................... 412.1 Layout Guidelines ................................................. 12
7.1 Absolute Maximum Ratings ...................................... 412.2 Layout Example ................................................... 12
7.2 Recommended Operating Conditions....................... 413 Device and Documentation Support................. 13
7.3 Thermal Information.................................................. 413.1 Device Support .................................................... 13
7.4 Electrical Characteristics........................................... 413.2 Community Resources.......................................... 13
7.5 Typical Characteristics.............................................. 613.3 Trademarks........................................................... 13
8 Parameter Measurement Information .................. 713.4 Electrostatic Discharge Caution............................ 13
8.1 Test Circuit................................................................ 713.5 Glossary................................................................ 13
9 Detailed Description.............................................. 814 Mechanical, Packaging, and Orderable
9.1 Overview................................................................... 8Information........................................................... 13
9.2 Functional Block Diagram......................................... 8
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (April 2013) to Revision C Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
Changes from Revision A (April 2013) to Revision B Page
• Changed layout of National Data Sheet to TI format ............................................................................................................. 9
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5 Device Comparison Table
DEVICE NUMBER DESCRIPTION
LMC567 Low power tone decoder
General-purpose tone decoder with half oscillator frequency than
LM567, LM567C LMC567
6 Pin Configuration and Functions
D Package
8-Pin SOIC
Top View
Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
GND 7 PWR Ground connection
IN 3 I Device input
LF_CAP 2 I Loop filter capacitor terminal
OF_CAP 1 I Output filter capacitor terminal
OUT 8 O Device output
T_CAP 5 I Timing capacitor connection terminal
T_RES 6 I Timing resistor connection terminal
VCC 4 PWR Voltage supply connection
(1) I = input, O = output, PWR = power
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0 9 V 0 2 V
0 5 V
f | f | 100
7 f |
u
LMC567
SNOSBY1C –JUNE 1999–REVISED DECEMBER 2015
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Input voltage IN 2 Vp–p
Supply voltage VCC 10 V
Output voltage OUT 13 V
Output current OUT 30 mA
Package dissipation 500 mW
Operating temperature, TA–25 125 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
7.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC Supply voltage 2 9 V
FIN Input frequency 1 500 Hz
TAOperating temperature –25 125 °C
7.3 Thermal Information LMC567
THERMAL METRIC(1) D (SOIC) UNIT
8 PINS
RθJA Junction-to-ambient thermal resistance 111.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.2 °C/W
RθJB Junction-to-board thermal resistance 52.2 °C/W
ψJT Junction-to-top characterization parameter 13.5 °C/W
ψJB Junction-to-board characterization parameter 51.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.4 Electrical Characteristics
Test Circuit, TA= 25°C, Vs= 5 V, RtCt #2, Sw. 1 Pos. 0, and no input, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Vs= 2 V 0.3
RtCt #1, quiescent
I4 Power supply current Vs= 5 V 0.5 0.8 mAdc
or activated Vs= 9 V 0.8 1.3
V3 Input D.C. bias 0 mVdc
R3 Input resistance 40 kΩ
I8 Output leakage 1 100 nAdc
Vs= 2 V 98
Center frequency, RtCt #2, measure oscillator
f0Vs= 5 V 92 103 113 kHz
Fosc ÷ 2 Frequency and divide by 2 Vs= V 105
Center frequency
Δf01 2 %/V
shift with supply (1)
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OSC P2 OSC P1
OSC P0
F | F |
Skew 1 100
2F |
§ ·
u
¨ ¸
© ¹
OSC P2 OSC P1
OSC P0
F | F |
L.D.B.W 100
F |
u
LMC567
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SNOSBY1C –JUNE 1999–REVISED DECEMBER 2015
Electrical Characteristics (continued)
Test Circuit, TA= 25°C, Vs= 5 V, RtCt #2, Sw. 1 Pos. 0, and no input, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Vs= 2 V 11 20 27
Set input frequency equal to f0measured
Vin Input threshold above. Increase input level until pin 8 goes Vs= 5 V 17 30 45 mVrms
low. Vs= 9 V 45
Starting at input threshold, decrease input
ΔVin Input hysteresis 1.5 mVrms
level until pin 8 goes high. I8 = 2 mA 0.06 0.15
Input level > threshold
V8 Output sat voltage Vdc
Choose RL for specified I8. I8 = 20 mA 0.7
Measure Fosc with Sw. 1 in Vs= 2 V 7% 11% 15%
Pos. 0, 1, and 2;
Largest detection Vs= 5 V 11% 14% 17%
L.D.B.W. bandwidth Vs= 9 V 15%
(2)
ΔBW Bandwidth skew 0% ±1.0%
(3)
Highest center RtCt #3
fmax 700 kHz
frequency Measure oscillator frequency and divide by 2.
Set input frequency equal to fmax measured above. Increase
Vin Input threshold at fmax 35 mVrms
input level until pin 8 goes low.
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7.5 Typical Characteristics
Figure 1. Supply Current vs Operating Frequency Figure 2. Bandwidth vs Input Signal Level
Figure 3. Largest Detection Bandwidth vs Temperature Figure 4. Bandwidth as a Function of C2
Figure 5. Frequency Drift With Temperature Figure 6. Frequency Drift With Temperature
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8 Parameter Measurement Information
All parameters are measured according to the conditions described in Specifications.
8.1 Test Circuit
Figure 7 was used to make the measurements of the typical characteristics of the LMC567.
Figure 7. LMC567 Test Circuit
Table 1. Rt and Ct Values for the Test Circuit
RtCt Rt Ct
#1 100k 300 pF
#2 10k 300 pF
#3 5.1k 62 pF
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INPUT 1
F Hz
2.8 RtCt
#
OSC 1
F Hz
1.4 RtCt
#
VCO
Phase
Detector
Amplitude
Detector
÷2 ÷2
1
2
3
4
8
7
6
5
LMC567
SNOSBY1C –JUNE 1999–REVISED DECEMBER 2015
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9 Detailed Description
9.1 Overview
The LMC567C is a low-power, general-purpose tone decoder with similar functionality to the industry standard
LM567. The device requires external components set up the internal oscillator to run at twice the input frequency
and determine the required filter constants. Internal VCO and Phase detector form a Phase-locked loop which
locks to an input signal frequency that is established by external timing components. When PLL is locked, a
switch to ground is activated in the output of the device.
9.2 Functional Block Diagram
9.3 Feature Description
9.3.1 Oscillator
The voltage-controlled oscillator (VCO) on the LMC567 must be set up to run at twice the frequency of the input
signal tone to be decoded. The center frequency of the VCO is set by timing resistor Rt and timing capacitor Ct
connected to pins 5 and 6 of the IC. The center frequency as a function of Rt and Ct is given by Equation 4:
(4)
Because this causes an input tone of half Fosc to be decoded by Equation 5,
(5)
Equation 5 is accurate at low frequencies; however, above 50 kHz (Fosc = 100 kHz), internal delays cause the
actual frequency to be lower than predicted.
The choice of Rt and Ct is a tradeoff between supply current and practical capacitor values. An additional supply
current component is introduced in Equation 6 due to Rt being switched to Vsevery half cycle to charge Ct:
Isdue to Rt = Vs/(4Rt) (6)
Thus the supply current can be minimized by keeping Rt as large as possible (see Figure 1). However, the
desired frequency dictates an RtCt product such that increasing Rt requires a smaller Ct. Below
Ct = 100 pF, circuit board stray capacitances begin to play a role in determining the oscillation frequency which
ultimately limits the minimum Ct.
To allow for IC and component value tolerances, the oscillator timing components requires a trim. This is
generally accomplished by using a variable resistor as part of Rt, although Ct could also be padded. The amount
of initial frequency variation due to the LMC567 itself is given in the Electrical Characteristics; the total trim range
must also accommodate the tolerances of Rt and Ct.
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Feature Description (continued)
9.3.2 Input
The input pin 3 is internally ground-referenced with a nominal 40-kΩresistor. Signals which are already centered
on 0 V may be directly coupled to pin 3; however, any DC potential must be isolated through a coupling
capacitor. Inputs of multiple LMC567 devices can be paralleled without individual DC isolation.
9.3.3 Loop Filter
Pin 2 is the combined output of the phase detector and control input of the VCO for the phase-locked loop (PLL).
Capacitor C2 in conjunction with the nominal 80-kΩpin 2 internal resistance forms the loop filter.
For small values of C2, the PLL has a fast acquisition time and the pull-in range is set by the built in VCO
frequency stops, which also determines the largest detection bandwidth (LDBW). Increasing C2 results in
improved noise immunity at the expense of acquisition time, and the pull-in range begins to become narrower
than the LDBW (see Figure 4). However, the maximum hold-in range always equal the LDBW.
9.3.4 Output Filter
Pin 1 is the output of a negative-going amplitude detector which has a nominal 0 signal output of 7/9 Vs. When
the PLL is locked to the input, an increase in signal level causes the detector output to move negative. When pin
1 reaches 2/3 Vs, the output is activated (see Output).
Capacitor C1 in conjunction with the nominal 40-kΩpin 1 internal resistance forms the output filter. The size of
C1 is a tradeoff between slew rate and carrier ripple at the output comparator. Low values of C1 produce the
least delay between the input and output for tone burst applications, while larger values of C1 improve noise
immunity.
Pin 1 also provides a means for shifting the input threshold higher or lower by connecting an external resistor to
supply or ground. However, reducing the threshold using this technique increases sensitivity to pin 1 carrier
ripple and also results in more part to part threshold variation.
9.3.5 Output
The output at pin 8 is an N-channel FET switch to ground which is activated when the PLL is locked and the
input tone is of sufficient amplitude to cause pin 1 to fall below 2/3 Vs. Apart from the obvious current component
due to the external pin 8 load resistor, no additional supply current is required to activate the switch. The ON-
resistance of the switch is inversely proportional to supply; thus the sat voltage for a given output current
increases at lower supplies.
9.4 Device Functional Modes
9.4.1 Operation as LM567
The LMC567 low power tone decoder can be operated at supply voltages of 2 V to 9 V and at input frequencies
ranging from 1 Hz up to 500 kHz.
The LMC567 can be directly substituted in most LM567 applications with the following provisions:
1. Oscillator timing capacitor Ct must be halved to double the oscillator frequency relative to the input frequency
(see Oscillator).
2. Filter capacitors C1 and C2 must be reduced by a factor of 8 to maintain the same filter time constants.
3. The output current demanded of pin 8 must be limited to the specified capability of the LMC567.
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
These typical connection diagrams highlight the required external components and system level connections for
proper operation of the device in several popular use cases.
Any design variation can be supported by TI through schematic and layout reviews. Visit support.ti.com for
additional design assistance. Also, join the audio amplifier discussion forum at e2e.ti.com.
10.2 Typical Application
Figure 8. LMC567 Application Schematic
10.2.1 Design Requirements
For this design example, use the parameters listed in Table 2.
Table 2. Design Parameters
DESIGN PARAMETER EXAMPLE VALUE
Supply voltage 2 V to 9 V
Input voltage 20 mVRMS to (VCC + 0.5)
Input frequency 1 Hz to 500 KHz
Output current maximum 30 mA
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IN (PIN 3)
OUT (PIN 8)
TINPUT T
1
R2.8 F C
|
TOSC T
1
R1.4 F C
|
INPUT OSC
F 2F
LMC567
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SNOSBY1C –JUNE 1999–REVISED DECEMBER 2015
10.2.2 Detailed Design Procedure
10.2.2.1 Timing Components
As VCO frequency (FOSC) runs at twice the frequency of the input tone, the desired input detection frequency can
be defined by Equation 7:
(7)
The central frequency of the oscillator is set by timing capacitor and resistor. The timing capacitor value (CT)
must be set in order to calculate the timing resistor value (RT). This is given by Equation 8:
(8)
So, in order to found the required component values to set the detection frequency Equation 9:
(9)
This approximation is valid with lower frequencies; considerations must be taken when using higher frequencies.
More information on this can be found in Oscillator.
10.2.2.2 Bandwidth
Detection bandwidth is represented as a percentage of FOSC. It can be approximated as a function of FOSC × C2
following the behavior indicated in Figure 4. More information on this can be found in Loop Filter.
10.2.2.3 Output Filter
The size of the output filter capacitor C1is a tradeoff between slew rate and carrier ripple. More information on
this can be found in Output Filter.
10.2.2.4 Supply Decoupling
The decoupling of supply pin 4 becomes more critical at high supply voltages with high operating frequencies,
requiring C4 to be placed as close as possible to pin 4.
10.2.3 Application Curve
SPACE
Figure 9. Frequency Detection
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1
2
3
4 5
6
7
8
0.1µF
RT
Top Layer Ground Plane Top Layer Traces
Pad to Top Layer Ground Plane Connection to Power Supply
CT
RL
C1
C2
CIN
OUT
IN
Vcc
Vcc
Short traces to external
components
Decoupling capacitor
placed as close as possible
to the device
LMC567
Ground Plane that gives low
impedance return path
LMC567
SNOSBY1C –JUNE 1999–REVISED DECEMBER 2015
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11 Power Supply Recommendations
The LMC567 is designed to operate with an input power supply range between 2 V and 9 V. Therefore, the
output voltage range of power supply must be within this range and well regulated. The current capability of
upper power must not exceed the maximum current limit of the power switch. Because the operating frequency
of the device could be very high for some applications, the decoupling of power supply becomes critical, so is
required to place a proper decoupling capacitor as close as possible to VCC pin. Low equivalent-series-
resistance (ESR) ceramic capacitor, typically 0.1 µF, is typically used. This capacitor must be placed within 2 mm
of the supply pin.
12 Layout
12.1 Layout Guidelines
The VCC pin of the LM567 must be decoupled to ground plane as the device can work with high switching
speeds. The decoupling capacitor must be placed as close as possible to the device. Traces length for the timing
and external filter components must be kept at minimum in order to avoid any possible interference from other
close traces.
12.2 Layout Example
Figure 10. LMC567 Board Layout
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13 Device and Documentation Support
13.1 Device Support
13.1.1 Development Support
For development support, see the following:
support.ti.com
13.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMC567CMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -25 to 100 LMC
567CM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMC567CMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 4-May-2017
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMC567CMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 4-May-2017
Pack Materials-Page 2
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PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
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EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
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EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
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