TpliTM 200 Series Gap Filler Innovative Technology for a Connected World Exceptionally soft, highly compressible gap filler TpliTM 200 is a premium gap filler. A unique blend of boron nitride and silicone produce the highest performing interface pad. TpliTM 200's exceptional combination of high thermal conductivity and compliancy generate unmatched thermal resistances in a gap filling interface material. TpliTM 200 absorbs shock and relieves stresses, thus minimizing potential damage to components. TpliTM 200 is electrically insulating, stable from -45C to 200C, and meets UL 94 HB rating. FEATURES AND BENEFITS APPLICATIONS * Thermal performance leader * Notebook computers * 6 W/mK thermal conductivity * Handheld portable electronics * Soft and compliant * Micro heat pipe thermal solutions * Available in thicknesses from * Micro processors, memory chips, and graphic processors 0.010" - 0.200" (0.25mm - 5.0mm) * Automotive engine control modules * Wireless communication hardware global solutions: local support Americas: +1.800.843.4556 Europe: +49.8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice@lairdtech.com www.lairdtech.com/thermal TM TpliTM 200 Series Gap Filler Innovative Technology for a Connected World Construction & Composition TpliTM 210 TpliTM 220 TpliTM 240 TpliTM 260 TpliTM 2100 Reinforced boron nitride filled silicone elastomer Boron nitride filled silicone elastomer Boron nitride filled silicone elastomer Boron nitride filled silicone elastomer Boron nitride filled silicone elastomer Rose Blue Yellow Grey Grey 0.010" (0.25mm) 0.020" (0.51mm) 0.040" (1.02mm) 0.060" (1.52mm) 0.100" (2.54mm) 0.001" ( 0.025mm) 0.002" ( 0.05mm) 0.003" ( 0.08mm) 0.004" ( 0.10mm) 0.007" ( 0.18mm) 1.44 g/cc 1.43 g/cc 1.43 g/cc 1.38 g/cc 1.36 g/cc Helium Pycnometer 75 Shore OO 70 Shore OO 70 Shore OO 70 Shore OO 70 Shore OO ASTM D2240 N/A 35 psi 35 psi 20 psi 15 psi ASTM D412 Color Thickness Thickness Tolerance Density Hardness Tensile Strength % Elongation Test Method Visual N/A 5 5 5 5 ASTM D412 Outgassing TML (Post Cured) 0.08% 0.07% 0.07% 0.10% 0.15% ASTM E595 Outgassing CVCM (Post Cured) 0.03% 0.02% 0.02% 0.04% 0.07% ASTM E595 UL Flammability Rating 94 HB 94 HB 94 HB 94 HB 94 HB E180840 Temperature Range -45C to 200C -45C to 200C -45C to 200C -45C to 200C -45C to 200C Thermal Conductivity 6 W/mK 6 W/mK 6 W/mK 6 W/mK 6 W/mK ASTM D5470 (modified) Thermal Impedance @ 20 psi @ 138KPa 0.16C - in2/W 1.03C - cm2/W 0.21C - in2/W 1.35C - cm2/W 0.37C - in2/W 2.45C - cm2/W 0.49C - in2/W 3.35C - cm2/W 0.84C - in2/W 5.81C - cm2/W ASTM D5470 (modified) Thermal Expansion 51 ppm/C 123 ppm/C 72 ppm/C 72 ppm/C 96 ppm/C IPC-TM-650 2.4.24 Breakdown Voltage 1,000 Volts AC 4,000 Volts AC >5,000 Volts AC >5,000 Volts AC >5,000 Volts AC ASTM D149 Volume Resistivity 5 x 1013 ohm-cm 5 x 1013 ohm-cm 5 x 1013 ohm-cm 5 x 1013 ohm-cm 5 x 1013 ohm-cm ASTM D257 Dielectric Constant @ 1MHz 3.21 3.21 3.26 3.26 3.4 ASTM D150 Standard Thicknesses 0.010" (0.25mm) 0.030" (0.76mm) 0.070" (1.78mm) 0.110" (2.79mm) 0.150" (3.81mm) 0.190" (4.83mm) 0.015" (0.38mm) 0.040" (1.02mm) 0.080" (2.03mm) 0.120" (3.05mm) 0.160" (4.06mm) 0.200" (5.08mm) Pressure Sensitive Adhesive 0.020" (0.51mm) 0.025" (0.64mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.170" (4.32mm) 0.180" (4.57mm) Consult the factory for alternate thicknesses. Standard Sheet Sizes 8" x 8" (203mm x 203 mm) & 16" x 16" (406mm x 406mm). TpliTM 200 may be die cut into individual shapes. Request no adhesive with"AO" suffix. Request adhesive on one side with "A1" suffix. Double sided adhesive is not available Reinforcement Fiberglass is required in thicknesses of 0.010" (0.25mm) and 0.015" (0.38mm). Reinforcement is optional in thicknesses 0.020" (0.5mm) and 0.025" (0.63mm). Indicate fiberglass by "FG" suffix. Thicknesses above 0.025" (0.063mm) are not reinforced. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. THR-DS-Tpli-200 0710 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies' Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. (c) Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. 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