Datasheet, Version 2.3, May 2011 EiceDRIVER TM 1ED020I12-F Single IGBT Driver IC Asic & Power ICs N e v e r s t o p t h i n k i n g . 5 Asic & Power ICs Revision History: May 2011 Previous Version: 2.2 Page Subjects (major changes since last revision) 5 Figure2 changed to more details 14 4.4.6 Dynamic Characteristics changed delays Version 2.3 Edition 2011-05-03 Published by Infineon Technologies AG, Campeon 1-12, 85579 Neubiberg, Germany (c) Infineon Technologies AG 2011. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. EiceDRIVERTM 1ED020I12-F Single IGBT Driver IC Product Highlights * * * * * * Coreless transformer isolated driver Galvanic Insulation Integrated protection features Suitable for operation at high ambient temperature Cost effective technology Approvals: DIN EN 60747-5-2, UL1577 Features * * * * * Typical Application Single channel isolated IGBT Driver For 600V/1200V IGBTs 2A rail-to-rail output Vcesat-detection Active Miller Clamp * * * VCC1 AC-Drives UPS-Systems Welding VCC2,H DESAT IN+, IN-, /RST EiceDRIVERTM OUT 1ED020I12-F /FLT, RDY CLAMP VEE2,H GND2,H CPU VCC2,L DESAT IN+, IN-, /RST EiceDRIVERTM 1ED020I12-F OUT /FLT, RDY CLAMP GND1 VEE2,L GND2,L Figure 1: Typical Application Type Gate drive current Package 1ED020I12-F +/- 2A PG-DSO-16-15 Datasheet 3 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F Table of Contents Page 1 Blockdiagram and Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 2.1 2.2 2.2.1 2.2.2 2.2.3 2.2.4 2.3 2.4 2.5 2.5.1 2.5.2 2.5.3 2.6 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal Protection Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Undervoltage Lockout (UVLO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . READY status output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Active Shut-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Non-Inverting and Inverting Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Driver Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External Protection Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Desaturation Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Active Miller Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Short Circuit Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3.1 3.2 Pin Configuration and Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 4.1 4.2 4.3 4.4 4.4.1 4.4.2 4.4.3 4.4.4 4.4.5 4.4.6 4.4.7 4.4.8 Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Recommended Operating Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Logic Input and Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gate Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Active Miller Clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Short Circuit Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Dynamic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Desaturation protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Active Shut Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 10 11 11 12 12 12 13 13 14 14 15 15 5 5.1 5.2 5.3 Insulation Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DIN EN 60747-5-2 (VDE 0884 Teil 2): 2003-01. Basic Insulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . UL 1577 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 16 16 6 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8 8.1 8.2 Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Reference Layout for Thermal Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Printed Circuit Board Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Datasheet 4 6 6 6 6 6 6 6 6 6 7 7 7 7 7 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F 1 Blockdiagram and Application VCC1 15 UVLO UVLO & IN+ 10 K4 TX VCC2 7 CLAMP 6 OUT 4 NC 2 DESAT 3 GND2 2V delay delay 5 & RX 1 VCC1 IN- VCC2 11 & VCC1 RDY VEE2 12 /RDY DECODER RX TX ENCODER FLT2 & 1 VEE2 VCC2 VCC1 13 & K3 Q S delay 1 RST 1 9V 1k R VCC1 I3 2k FLT 1 14 & 1 & /RST RDY2 FLTNL /FLT 2 VEE2 9 GND1 1 1ED020I12-F 16 1 8 GND1 Figure 2: Blockdiagram 1ED020I12-F Figure 3: Datasheet Application example 5 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F 2 Functional Description 2.1 Introduction 2.2.2 The READY output shows the status of three internal protection features. The 1ED020I12-F is an advanced IGBT gate driver that can be also used for driving power MOS devices. Control and protection functions are included to make possible the design of high reliability systems. * * * The device consists of two galvanic separated parts. The input chip can be directly connected to a standard 5V DSP or microcontroller with CMOS in/output and the output chip is connected to the high voltage side. 2.2.3 The device also includes an IGBT desaturation protection with a FAULT status output. A READY status output reports if the device is supplied and operates correctly. 2.2.1 Undervoltage Lockout (UVLO) 2.2.4 Active Shut-Down The Active Shut-Down feature ensures a safe IGBT offstate if the output chip is not connected to the power supply. 2.3 To ensure correct switching of IGBTs the device is equipped with an undervoltage lockout for both chips. Non-Inverting and Inverting Inputs There are two possible input modes to control the IGBT. At non-inverting mode IN+ controls the driver output while IN- is set to low. At inverting mode INcontrols the driver output while IN+ is set to high. A minimum input pulse width is defined to filter occasional glitches. If the power supply voltage VVCC1 of the input chip drops below VUVLOL1 a turn-off signal is sent to the output chip before power-down. The IGBT is switched off and the signals at IN+ and IN- are ignored as long as VVCC1 reaches the power-up voltage VUVLOH1 . If the power supply voltage VVCC2 of the output chip goes down below VUVLOL2 the IGBT is switched off and signals from the input chip are ignored as long as VVCC2 reaches the power-up voltage VUVLOH2 . Datasheet Watchdog Timer The 1ED020I12-F incorporates two level of signal transmission security implemented through two independent watchdog timers. First level ensures the short term signal integrity by resending the (turn on/off) signals with a watchdog period of typical 500ns. The second level monitors during normal operation the internal signal transmission. If the transmission fails for a given time, the IGBT is switched off and the READY output reports an internal error. A rail-to-rail driver output enables the user to provide easy clamping of the IGBTs gate voltage during short circuit of the IGBT. So an increase of short circuit current due to the feedback via the Miller capacitance can be avoided. Further, a rail-to-rail output reduces power dissipation. Internal Protection Features UVLO of the input chip UVLO of the output chip after a short delay Internal signal transmission It is not necessary to reset the READY signal since its state only depends on the status of the former protection signals. An effective active Miller clamp function avoids the need of negative gate driving in most applications and allows the use of a simple bootstrap supply for the high side driver. 2.2 READY status output 2.4 Driver Output The output driver section uses only MOSFETs to provide a rail-to-rail output. This feature permits that tight control of gate voltage during on-state and short circuit can be maintained as long as the drivers supply is stable. Due to the low internal voltage drop, switching behaviour of the IGBT is predominantly governed by the gate resistor. Furthermore, it reduces the power to be dissipated by the driver. 6 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F 2.5 External Protection Features 2.5.1 Desaturation Protection A desaturation protection ensures the protection of the IGBT at short circuit. When the DESAT voltage goes up and reaches 9V, the output is driven low. Further, the /FAULT output is activated. A programmable blanking time is used to allow enough time for IGBT saturation. Blanking time is provided by a highly precise internal current source and an external capacitor. 2.5.2 Active Miller Clamping A Miller clamp allows sinking the Miller current during a high dV/dt situation. Therefore, the use of a negative supply voltage can be avoided in many applications. During turn-off, the gate voltage is monitored and the clamp output is activated when the gate voltage goes below 2V (related to VEE2). 2.5.3 Short Circuit Clamping During short circuit the IGBTs gate voltage tends to rise because of the feedback via the Miller capacitance. An additional protection circuit connected to OUT and CLAMP limits this voltage to a value slightly higher than the supply voltage. A current of maximum 500 mA for 10us may be fed back to the supply through one of this paths. If higher currents are expected or a tighter clamping is desired external Schottky diodes may be added. 2.6 RESET The reset input has two functions. Firstly, /RST is in charge of setting back the FAULT output. If /RST is low longer than a given time , /FLT will be reseted at the rising edge of /RST; otherwise, it will remain unchanged. Moreover, it works as enable/shutdown of the input logic. Datasheet 7 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F 3 Pin Configuration and Functionality 3.1 Pin Configuration Pin Symbol Function 1 VEE2 Negative power supply output side 2 DESAT Desaturation protection 3 GND2 Signal ground output side 4 NC Not connected 5 VCC2 Positive power supply output side 6 OUT Driver output 7 CLAMP Miller clamping 8 VEE2 Negative power supply output side 9 GND1 Signal ground input side 10 IN+ Non inverted driver input 11 IN- Inverted driver input 12 RDY Ready output 13 FLT Fault output 14 RST Reset input 15 VCC1 Positive power supply input side 16 GND1 Signal ground input side 3.2 VEE2 GND1 16 2 DESAT VCC1 15 3 GND2 /RST 14 4 NC /FLT 13 5 VCC2 RDY 12 6 OUT IN- 11 7 CLAMP IN+ 10 8 VEE2 GND1 9 Figure 4: PG-DSO-16-15 Pin Functionality /FLT (Fault output) Open-drain with internal pull up resistor output to report a desaturation error of the IGBT (/FLT is low if desaturation occurs) GND1 Ground connection of the input side. IN+ Non-inverting driver input IN+ control signal for the driver output if IN- is set to low. (The IGBT is on if IN+ = high and IN- = low) A minimum pulse width is defined to make the IC robust against glitches at IN+. An internal Pull-Down-Resistor ensures IGBT Off-State. IN- Inverting driver input IN- control signal for driver output if IN+ is set to high. (IGBT is on if IN- = low and IN+ = high) A minimum pulse width is defined to make the IC robust against glitches at IN-. An internal Pull-Up-Resistor ensures IGBT Off-State. RDY (Ready status) Open-drain with internal pull up resistor output to report the correct operation of the device. (RDY = high if both chips are above the UVLO level and the internal chip transmission is faultless) VCC1 5V power supply of the input chip VEE2 Negative power supply pins of the output chip. If no negative supply voltage is available, both pins have to be connected to GND2. /RST (Reset) input Function 1: Enable/shutdown of the input chip. (The IGBT is off if /RST = low). A minimum pulse width is defined to make the IC robust against glitches at IN-. Function 2: Resets the DESAT-FAULT-state of the chip if /RST is low for a time TRST. An internal Pull-UpResistor is used to ensure FLT status output. Datasheet 1 DESAT (Desaturation) Monitoring of the IGBT saturation voltage (VCE) to detect desaturation caused by short circuits. If OUT is high, VCE is above a defined value and a certain blanking time has expired, the desaturation protection is activated and the IGBT is switched off. The blanking 8 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F time is adjustable by an external capacitor. CLAMP (Clamping) Ties the gate voltage to ground after the IGBT has been switched off at a defined voltage to avoid a parasitic switch-on of the IGBT.During turn-off, the gate voltage is monitored and the clamp output is activated when the gate voltage goes below 2V (related to VEE2). GND2 Reference ground of the output chip. OUT (Driver output) Output pin to drive an IGBT. The voltage is switched between VEE2 and VCC2. In normal operating mode Vout is controlled by IN+, IN- and /RST. During error mode (UVLO, internal error or DESAT) Vout is set to VEE2 independent of the input control signals. VCC2 Positive power supply pin of the output side. Datasheet 9 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F Electrical Parameters 4 Electrical Parameters 4.1 Absolute Maximum Ratings Note: Absolute maximum ratings are defined as ratings, which when being exceeded may lead to destruction of the integrated circuit. Unless otherwise noted all parameters refer to GND1. Parameter Symbol Limit Values min. max. Unit Remarks Positive power supply output side VVCC2 -0.3 20 V 1) Negative power supply output side VVEE2 -12 0.3 V 1) Maximum power supply voltage output side (VVCC2-VVEE2) Vmax2 28 V Gate driver output VOUT Gate driver high output maximum current IOUT VVEE2-0.3 Vmax2+0.3 -- 2.4 V A t = 2s Gate driver low output maximum current IOUT -- 2.4 A t = 2s Maximum short circuit clamping time tCLP 10 us ICLAMP/OUT = 500mA Positive power supply input side VVCC1 -0.3 6.5 V Logic input voltages (IN+,IN-,RST) VLogicIN -0.3 6.5 V Opendrain Logic output voltage (FLT) VFLT -0.3 6.5 V Opendrain Logic output voltage (RDY) VRDY -0.3 6.5 V Opendrain Logic output current (FAULT) IFLT 10 mA Opendrain Logic output current (RDY) IRDY 10 mA Pin DESAT voltage VDESAT -0.3 VVCC2 +0.3 V Pin CLAMP voltage VCLAMP VVEE2-0.3 VVCC2+0.3 V Junction temperature TJ -40 150 C Storage temperature TS -55 150 C Power dissipation, Input chip PD, IN 100 Power dissipation, Output chip PD, OUT Thermal resistance (Input chip active) RTHJA,IN Thermal resistance (Output chip active) RTHJA,OUT ESD Capability VESD 1) VVEE2 = -8V mW 3) @TA = 25 700 mW 3) @TA = 25 160 K/W @TA = 25C 125 K/W @TA = 25C 2) 1 kV Human Body Model4) 1) With respect to GND2. 2) may be exceeded during short circuit clamping 3) Output IC power dissipation is derated linearly at 10 mW/C above 62C. Input IC power dissipation does not require derating. See section 8.1 for reference layouts for these thermal data. Thermal performance may change significantly with layout and heat dissipation of components in close proximity. 4) According to EIA/JESD22-A114-B (discharging a 100pF capacitor through a 1.5k series resistor). Datasheet 10 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F Electrical Parameters 4.2 Operating Parameters Note: Within the operating range the IC operates as described in the functional description. Unless otherwise noted all parameters refer to GND1. Parameter Symbol Limit Values Unit min. max. Remarks Positive power supply output side VVCC2 13 20 V 1) Negative power supply output side VVEE2 -12 0 V 1) Maximum power supply voltage output side (VVCC2-VVEE2) Vmax2 28 V Positive power supply input side VVCC1 4.5 5.5 V Logic input voltages (IN+,IN-,RST) VLogicIN -0.3 5.5 V Pin CLAMP voltage VCLAMP VVEE2-0.3 VVCC22) V Pin DESAT voltage VDESAT -0.3 VVCC2 V TA -40 105 C |VISO/dt| -- 50 Ambient temperature Common mode transient immunity 3) 1) kV/s @ 500V 1) With respect to GND2. 2) may be exceeded during short circuit clamping 3) The parameter is not subject to production test - verified by design/characterization 4.3 Recommended Operating Parameters Note: Unless otherwise noted all parameters refer to GND1. Parameter Symbol Values Unit Remarks Positive power supply output side VVCC2 15 V 1) Negative power supply output side VVEE2 -8 V 1) Positive power supply input side VVCC1 5 V 1) With respect to GND2. Datasheet 11 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F Electrical Parameters 4.4 Electrical Characteristics Note: The electrical characteristics involve the spread of values for the supply voltages, load and junction temperatures given below. Typical values represent the median values, which are related to production processes at T = 25C. Unless otherwise noted all voltages are given with respect to GND. 4.4.1 Voltage Supply. Parameter Symbol Limit Values min. UVLO Threshold Input Chip typ. Unit Test Conditions max. VUVLOH1 -- 4.1 4.3 V VUVLOL1 3.5 3.8 -- V UVLO Hysteresis Input Chip (VUVLOH1 - VUVLOL1) VHYS1 0.15 -- -- V UVLO Threshold Output Chip VUVLOH2 -- 12.0 12.6 V VUVLOL2 10.4 11.0 -- V UVLO Hysteresis Output Chip (VUVLOH1 - VUVLOL1) VHYS2 0.7 0.9 -- V Quiescent Current Input Chip IQ1 -- 7 9 mA VVCC1 =5V IN+ = High, IN- = Low =>OUT = High, RDY = High, /FLT = High Quiescent Current Output Chip IQ2 -- 4 6 mA VVCC2 =15V VVEE2 =-8V IN+ = High, IN- = Low =>OUT = High, RDY = High, /FLT = High 4.4.2 Logic Input and Output Parameter Symbol Limit Values min. typ. Unit Test Conditions max. IN+,IN-, RST Low Input Voltage VIN+L,VINL,VRSTL -- -- 1.5 V IN+,IN-, RST High Input Voltage VIN+H,VINHVRSTH 3.5 -- -- V IN-, RST Input Current IIN-,IRST -- 100 400 uA VIN-=GND1 VRST =GND1 IN+ Input Current IIN+, -- 100 400 uA VIN+=VCC1 RDY,FLT Pull Up Current IPRDY, IPFLT -- 100 400 uA VRDY=GND1 VFLT=GND1 Input Pulse Suppression IN+, IN- TMININ+, TMININ- 30 40 -- ns Input Pulse Suppression RST for ENABLE/SHUTDOWN TMINRST 30 40 -- ns Pulse Width RST for Reseting FLT TRST 800 -- -- ns FLT Low Voltage VFLTL -- -- 300 mV ISINK(FLT) = 5mA RDY Low Voltage VRDYL -- -- 300 mV ISINK(RDY) = 5mA Datasheet 12 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F Electrical Parameters 4.4.3 Gate Driver Parameter Symbol Limit Values High Level Output Voltage VOUTH1 VVCC2-1.2 VVCC2-0.8 VOUTH2 VVCC2-2.5 VVCC2-2 VOUTH3 VVCC2-9 min. typ. max. VVCC2-5 VOUTH4 Unit Test Conditions VVCC2-10 V IOUTH = -20mA V IOUTH = -200mA V IOUTH = -1A V IOUTH = -2A A IN+ = High, IN- = Low; OUT = High High Level Output Peak Current IOUTH -1.5 Low Level Output Voltage VOUTL1 VVEE2+0.04 VVEE2 +0.09 V IOUTL = 20mA VOUTL2 VVEE2+0.5 VVEE2 +0.85 V IOUTL = 200mA VVEE2+2.5 VVEE2 +5.0 VOUTL4 IOUTL 1.5 VOUTL3 Low Level Output Peak Current 4.4.4 -2 VVEE2+7 2 V IOUTL = 1A -- V IOUTL = 2A -- A IN+ = Low, IN- = Low; OUT = Low Active Miller Clamp Parameter Symbol Limit Values min. Low Level Clamp Voltage typ. Unit Test Conditions max. VCLAMPL1 -- VVEE2+0.03 VVEE2 +0.08 V IOUTL = 20mA VCLAMPL2 -- VVEE2+0.3 VVEE2 +0.8 V IOUTL = 200mA VCLAMPL3 -- VVEE2+1.9 V Low Level Clamp Current ICLAMPL 2 VVEE2 +4.8 Clamp Threshold Voltage VCLAMP 1.6 2.1 A IOUTL 1) = 1A 2.4 V Related to VEE2 1) The parameter is not subject to production test - verified by design/characterization Datasheet 13 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F Electrical Parameters 4.4.5 Short Circuit Clamping Parameter Symbol Limit Values Clamping voltage (OUT) (VOUT-VVCC2) VCLPout 0.8 1.3 V Clamping voltage (CLAMP) (VVCLAMP-VVCC2) VCLPclamp IN+=High, IN-=Low, OUT=High IOUT = 500mA (pulse test,tCLPmax=10us) 1.3 V Clamping voltage (CLAMP) VCLPclamp IN+=High, IN-=Low, OUT=High ICLAMP = 500mA (pulse test,tCLPmax=10us) 0.7 1.1 V IN+=High, IN-=Low, OUT=High ICLAMP = 20mA min. 4.4.6 typ. Unit Test Conditions max. Dynamic Characteristics Parameter Symbol Limit Values min. typ. Unit Test Conditions max. Input to output propagation delay ON TPDON 180 205 225 ns Input to output propagation delay OFF TPDOFF 155 175 195 ns Input to output propagation delay distortion TPDOFF-TPDON TPDISTO -60 -30 0 ns Input to output propagation delay ON TPDONt variation due to temp 1) -- -- 20 ns Input to output propagation delay OFF variation due to temp 1) TPDOFFt -- -- 35 ns Input to output propagation delay distortion variation due to temp 1) TPDISTOt -- -- 20 ns Rise Time TRISE -- 60 -- ns VVCC2 =15V,VVEE2 =-8V CLOAD= 1nF VL 10% ,VH 90% -- 400 -- ns VVCC2 =15V,VVEE2 =-8V CLOAD= 34nF VL 10% ,VH 90% -- 60 -- ns VVCC2 =15V,VVEE2 =-8V CLOAD= 1nF VL 10% ,VH 90% -- 600 -- ns VVCC2 =15V,VVEE2 =-8V CLOAD= 34nF VL 10% ,VH 90% Fall Time TFALL VVCC1 = 5V, VVCC2 =15V,VVEE2 =-8V CLOAD= 100pF VIN+=50%, VOUT=50% @ 25C VVCC2 =15V,VVEE2 =-8V CLOAD= 100pF VIN+=50%, VOUT=50% 1) The parameter is not subject to production test - verified by design/characterization Datasheet 14 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F Electrical Parameters 4.4.7 Desaturation protection Parameter Symbol Limit Values Blanking Capacitor Charge Current IDESATC 215 250 295 Blanking Capacitor Discharge Current IDESATD 1 2 -- Desaturation Reference Level VDESAT 8.3 9 9.5 V VVCC2 =15V,VVEE2 =-8V Desaturation Reference Level VDESAT 7.6 8.6 9.5 V VVCC2 =15V,VVEE2 =0V Desaturation Sense to OUT Low Delay TDESATOUT -- 100 150 ns VOUT =90% CLOAD= 1nF Desaturation Sense to FLT Low Delay TDESATFLT -- -- 2.25 us VFLT =10%; IFLT =5mA Desaturation Low Voltage VDESATL 0.4 0.6 0.95 V IN+=Low, IN-=Low, OUT=Low min. 4.4.8 typ. max. uA VVCC2 =15V,VVEE2 =-8V VDESAT=2V mA VVCC2 =15V,VVEE2 =-8V VDESAT=6V Active Shut Down Parameter Symbol Limit Values min. Active Shut Down Voltage 1) Unit Test Conditions VACTSD 1) Unit Test Conditions typ. max. 4 V IOUT=-200mA, VCC2 open With reference to VEE2 Datasheet 15 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F Insulation Characteristics 5 Insulation Characteristics 5.1 DIN EN 60747-5-2 (VDE 0884 Teil 2): 2003-01. Basic Insulation Description Symbol Characteristic Installation classification per EN 60664-1, Table 1 for rated mains voltage 150 VRMS for rated mains voltage 300 VRMS for rated mains voltage 600 VRMS Unit I-IV I-III I-II Climatic Classification 55/105/21 Pollution Degree (EN 60664-1) 2 Minimum External Clearance CLR 8.12 mm Minimum External Creepage CPG 8.24 mm Minimum Comparative Tracking Index CTI 175 VIORM 1420 VPEAK Input to Output Test Voltage, Method b VPR VIORM * 1.875 = VPR, 100% Production Test with tm = 1 sec, Partial Discharge < 5pC 2663 VPEAK Input to Output Test Voltage, Method a1) VIORM * 1.6 = VPR, Type and sample Test, tm = 60 sec, Partial Discharge < 5pC VPR 2272 VPEAK Highest Allowable Overvoltage1) VIOTM 6000 VPEAK Maximum Surge Insulation Voltage VIOSM 6000 V Insulation Resistance at Ts, VIO = 500 V RIO >109 Maximum Repetitive Insulation Voltage 1) 1) Refer to VDE 0884 for a detailed description of Method a and Method b partial discharge test profiles. *Note 1:Insulation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. Surface mount classification is class A in accordance with CECCOO802. *Note 2: This coupler is suitable for "basic insulation" only within the safety ratings. Compliance with the safety ratings shall be ensured by means of suitable protective circuits. 5.2 UL 1577 Description Symbol Insulation Withstand Voltage / 1min Insulation Test Voltage / 1sec 5.3 Characteristic Unit VISO 3750 Vrms VISO 4500 Vrms Reliability For Qualification Report please contact your local Infineon Technologies office. Datasheet 16 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F Timing Diagrams 6 Timing Diagrams IN OUT TPDELAY TPDELAY Figure 5: Propagation Delay IN+ IN- RST OUT Figure 6: Turn-on and Turn-off IN+ INOUT 9V DESAT RDY FLT Tdesatflt 1.0...1.8us RST Figure 7: Desaturation Fault Datasheet 17 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F Timing Diagrams IN+ IN- Vcc1 Vcc2 OUT RDY FLT RST Figure 8: UVLO Datasheet 18 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F Package Outlines 7 Package Outlines PG-DSO-16-15 (Plastic Dual Small 1) Does not include plastic or metal protusions of 0.15 max per side Figure 9: PG-DSO-16-15 Datasheet 19 Version 2.3, 2011-05-03 EiceDRIVERTM 1ED020I12-F Application Notes 8 Application Notes 8.1 Reference Layout for Thermal Data The PCB layout shown in figure 12 represents the reference layout used for the thermal characterisation. Pins 9 and 16 (GND1) and pins 1 and 8 (VEE2) require ground plane connections for achiving maximum power dissipation. The 1ED020I12-F is conceived to dissipate most of the heat generated through this pins. Output Side Input Side PCB + Top-Layer PCB + Bottom-Layer Total Area = 374.4 mm2 Figure 10: Reference layout for thermal data (Copper thickness 105m) 8.2 Printed Circuit Board Guidelines Following factors should be taken into account for an optimum PCB layout. - Sufficient spacing should be kept between high voltage isolated side and low voltage side circuits. - The same minimum distance between two adjacent high-side isolated parts of the PCB should be maintained to increase the effective isolation and reduce parasitic coupling. - In order to ensure low supply ripple and clean switching signals, bypass capacitor trace lengths should be kept as short as possible. Datasheet 20 Version 2.3, 2011-05-03 Total Quality Management Qualitat hat fur uns eine umfassende Bedeutung. Wir wollen allen Ihren Anspruchen in der bestmoglichen Weise gerecht werden. Es geht uns also nicht nur um die Produktqualitat - unsere Anstrengungen gelten gleichermaen der Lieferqualitat und Logistik, dem Service und Support sowie allen sonstigen Beratungs- und Betreuungsleistungen. Dazu gehort eine bestimmte Geisteshaltung unserer Mitarbeiter. Total Quality im Denken und Handeln gegenuber Kollegen, Lieferanten und Ihnen, unserem Kunden. Unsere Leitlinie ist jede Aufgabe mit Null Fehlern" zu losen - in offener Sichtweise auch uber den eigenen Arbeitsplatz hinaus - und uns standig zu verbessern. Unternehmensweit orientieren wir uns dabei auch an top" (Time Optimized Processes), um Ihnen durch groere Schnelligkeit den entscheidenden Wettbewerbsvorsprung zu verschaffen. Geben Sie uns die Chance, hohe Leistung durch umfassende Qualitat zu beweisen. Wir werden Sie uberzeugen. www.infineon.com/gatedriver Published by Infineon Technologies AG Quality takes on an allencompassing significance at Semiconductor Group. For us it means living up to each and every one of your demands in the best possible way. So we are not only concerned with product quality. We direct our efforts equally at quality of supply and logistics, service and support, as well as all the other ways in which we advise and attend to you. Part of this is the very special attitude of our staff. Total Quality in thought and deed, towards co-workers, suppliers and you, our customer. Our guideline is "do everything with zero defects", in an open manner that is demonstrated beyond your immediate workplace, and to constantly improve. Throughout the corporation we also think in terms of Time Optimized Processes (top), greater speed on our part to give you that decisive competitive edge. Give us the chance to prove the best of performance through the best of quality - you will be convinced.