ACPF-7003
High Rx and Image Rejection Tx Filter for US PCS Band
Data Sheet
Features
• High rejection from a single lter with no switches
required
• True split band replacement
• Passband: 1850-1910 MHz
• 35 dB min Attenuation, 1930-1990 MHz
• 2.5 dB Typical Insertion Loss
• 25dB image rejection at 1830 MHz
• Space saving solution
- Small footprint: 1.6 x 2.0-mm solution
- Low prole package: 0.9 mm high (Typ)
- 1.0mm (Max)
Applications
• US PCS band handsets
• Wireless Data terminals
General Description
The ACPF-7003 is a high rejection full band transmit lter
designed for US PCS handsets. Its performance rivals split-
band surface acoustic wave (SAW) transmit lters. Since a
single lter provides the rejection, no switches are required,
saving board space and external components, eliminat-
ing switch loss, and reducing programming complexity.
Furthermore, with 25dB rejection at 1830 MHz, it is a true
split band replacement.
The ACPF-7003 FBAR transmit lter utilizes Avago Tech-
nologies’ Microcap bonded-wafer chip scale packaging
technology. This process allows the ultra small lters
to be assembled into a Molded Chip on Board (MCOB)
Module.
In typical cellular phone architectures, the transmit lter
ts between the driver amplier and the power amplier.
This lter reduces the noise in the Rx band being ampli-
ed by the transmit chain, enhancing receiver sensitivity.
High rejection keeps unwanted signals out of the receive
path.
Avago Technologies’ thin-Film Bulk Acoustic Resonator
(FBAR) technology makes possible high-Q lters at a frac-
tion their usual size.
2
Absolute Maximum Ratings[2]
Notes:
1. Temperature is dened at case TC, the temperature of the underside of the lter where it makes contact with the circuit board.
2. Specications are guaranteed over the given temperature range. Operation in excess of any one of these conditions may result in permanent
damage to the device.
Parameter Unit Value
Operating temperature[1] °C -30 to +85
Storage temperature[1] °C -40 to +125
Electrical Specications, Zo=50 Ω
Symbol Parameters Units
+25° C -30° to +85° C
Min Typ Max Min Typ Max
f Passband [1850.6 - 1909.4] MHz
IL Insertion Loss 1850.6-1855
MHz
dB 2.0 3.5 3.5
IL Insertion Loss 1855-1905 MHz dB 1.5 2.5 2.5
IL Insertion Loss 1905-1909.4
MHz
dB 2.5 3.0 3.0
D S21 Ripple, 1850-1910 MHz dB 2.5
S21 Min Rejection, 1930.6-1990
MHz
dB 35 45 35 45
S21 Min Rejection 10 -1715 MHz dB 25 25
S21 Min Rejection 1715 - 1785
MHz
dB 25 25
S21 Min Rejection 1785 - 1830
MHz
dB 25 25
S21 Min Rejection 1990 - 2500
MHz
dB 30 30
S21 Min Rejection 2500 - 3820
MHz
dB 22 22
S21 Min Rejection 3820 - 5730
MHz
dB 15 15
S11, S22 In-band return loss dB 10 13 10 13
Pin max Safe Input Power Level dBm 20 20
3
Typical Performance (25 C, Zo = 50 Ohms)
Figure 2. Insertion Loss (dB) vs. frequency
Figure 1. Attenuation (dB) vs. frequency
Figure 3. Attenuation (dB) vs. frequency (broadband)
Figure 4. Return Loss (dB) vs. frequency
Figure 5. S(1,1) Figure 6. S(2,2)
4
PCB Interface & Mounting instructions
Mounting Consideration and board description
The ACPF-7003 FBAR lter has one input (Pin 1), one output
(Pin 3) and two grounds (Pins 2 and 4.)
• Demo board uses 3 mil Getek Microstrip.
The demo board uses CPWG transmission lines for high
isolation between the two ports. It uses via holes to con-
nect the CPWG line from the underside of the board to
the lter mounting pads on top.
Note: For best performance, try to reproduce this board stack up closely.
If Ground-Signal-Ground (GSG) type board is used, better return loss
can be achieved since it eliminates connector mismatch.
Figure 7. Board stack up description
Figure 9. Closer look at the recommended board footprint and soldermask
Figure 8. PCB Footprint pad
3 mils
Layer 2
(ground)
Layer 3
(signal)
Getek ML200D ( T =3.9)
28 mils
0.7 mils
Getek ML200D ( T =4.2)
Layer1
(signal)
Getekmaterial ML200D and RG200D
GetekML200D (∈=3.9)
GetekML200D (∈=4.2)
0.7 mils
Demo boards
Demo boards are available for sampling. (See board draw-
ing in Figures 7, 8, and 9.)
5
Figure 11. Suggested PCB layers
Figure 10. Detailed Bottom, Side and Top view of Package (dimensions in mm)
2.0
4
2
3
1.0 MAX
Shaded Region Grounded
A
0.60 ± 0.15
DC
B
Pin 1
Marking
1.6
1
SIDE VIEW
0.35 ± 0.15 8X
0.60 ± 0.15
LAYER 1
Via to layer 2
This region is Soldermask covering ground
Region (4) & (2) is exposed ground for soldering filter pads
2
4
Dimension in mm
IN
1
OUT
3
1.5
1.92
0.61
0.700.61
0.30
0.3
LAYER 2 (GROUND layer)
0.3
Metal voided
To decrease
Capacitance at
Input Port Metal voided
To decrease
Capacitance at
output Port
0.3
0.55
0.31
0.55
0.05
0.30
0.05
0.33
6
Figure 13. Carrier tape drawing
Figure 12. Recommended solder prole
Alloy type
Melting
temperature
(oC)
Recommended
working
temperature
(oC) Alloy type
Melting
temperature
(oC)
Recommended
working
temperature
(oC)
Sn42Bi58 138 160 - 180 Sn95.8Ag3.5Cu0.7 217 235 - 255
Sn43Pb43Bi14 144 - 163 165 - 185 Sn96.5Ag3.5 221 240 - 260
Sn63Pb37 183 200 - 240 Sn100 232 260 - 280
Sn60Pb40 186 200 - 240 Sn95Sb5 235 260 - 280
Sn91/Zn9 199 200 - 240 Sn97Cu3 240 260 - 300
Sn96.2Ag2.5Cu0.8Sb0.5 216 235 - 255
0 50 100 150 200 250 300
0
50
100
150
200
250
300
Time, seconds
Temperature, ˚C
Tested profile shown.
NOTE:
1. MEASURED FROM THE CENTRELINE OF THE SPROCKET HOLE TO THE CENTRELINE OF THE POCKET
HOLE AND FROM THE CENTRELINE OF THE SPROCKET HOLE TO THE CENTERLINE OF THE POCKET
2. CUMULATIVE TOLERANCE OF 10 SPROCKET HOELS IS ± 0.20
3. THIS THICKNESS IS APPLICABLE AS MEASURED AT THE EDGE OF THE TAPE.
4. MATERIAL: BLACK POLYSTYRENE
5. ALL DIMENSIONS IN MM.
6. ALLOWABLE CAMBER TO BE 1MM PER 250MM IN LENGTH
7. UNLESS OTHERWISE SPECIFIED TOLERANCE ± 0.10.
8. MEASUREMENT POINT TO BE 0.3 FROM BOTTOM POCKET.
9. SURFACE RESISITIVTY FROM 1.0X10 TO 1.0x10 OHMS/SQ
5 11
USER DIRECTION
OF UNREELING
0.30± 0.05(3) 2.00± 0.05(1) 4.0(2) ∅1.50
1.90(8) 4.00
1.20
∅1.0 MIN.
8.0± 0.3
8˚
typ
2.30(8)
3.5± 0.05(1)
1.75
+0.10
-0.00
7
Figure 14. Reel drawing
Figure 16. Device orientation in the carrier tape
Figure 15. Tape and reel orientation
Notes:
1. Cover tape material is clear polyester lm coated
with heat activated and anti static properties.
2. All dimensions are in mm except tape length.
3. Surface resistivity: 1010 to 1011 Ohms/sq.
USER
FEED
DIRECTION COVER
TAPE
CARRIER
TAPE
REEL
User Feed Direction
A B
Pin 1 Position
A B
A B
C
: Pin 1 Location
: WORK WEEK
: DATE CODE
: LOT NUMBER
A
B
C,D
Top View End View
D
C D C D
Empty Pocket/Cavity
Leader : 125 Pocket - 1
Trailer : 125 Pocket - 1
Ordering Information
ACPF-7003-BLK = Bulk option,
100 pieces per antistatic bag
ACPF-7003-TR1 = Tape and reel option,
3000 pieces per 7-inch reel
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
5989-3923EN - April 7, 2006