ExpressPortTM QSFP / QSFP+ Series
UltraPortTM SFP+ Series
UltraPortTM QSFP+ Series
SFP Series
ExpressPortTM SFP+
UE86 Series
UE76 Series
U77 Series
U95 Series
U95 Series
FS1 Series
30
30
Connector
Cage
Connector
Connector
2xN Combo
Cage
12
14
14
Mini-SAS
Mini-SAS HD
CXP Series
XFP Series
CFP2/CFP4
16
16
18
20
22
22
24
26
26
28
U99 Series
U56 Series
U98 Series
Host Connector
Plug Connector
Cage
32
32
32
4
5
OPTION 3
0 - Standard
OPTION 2
6
7
8
16
9
OPTION 3
- Standard
10
16
11
UltraPortTM SFP+ Stacked
The UltraPort SFP+ interconnect system is comprised of a 20-position hot swappable I/O connector enclosed in
a metal cage mounted to a host PCB. It supports 32Gbps applications with a backward compatibility for next
generation Ethernet and Fibre Channel applications. Stacked versions (2XN) consist of a 2-row cage with inte-
grated connectors. The entire assembly is press-t pin compliant.
P-U95-Z205-XXX1-XX1 P-U95-Z305-XXX1-XX1
The UltraPort SFP+ interconnect system is comprised
of a 20-position, 2-row integrated connector.
General Characteristics
• RoHS Compliant
• Industry Standard Footprint
• Industry Standard EIA-364
• Packaging: Tape and Reel
• Halogen Free
Mechanical Characteristics
• Durability: 250 Mating Cycles min
Electrical Characteristics
• Hot Swappable
• Allows Module Swapping
• Operating Voltage: 30V AC
• Operating Current: 0.5 A
• Spring Contacts for Superior EMI Grounding
• Contact Resistance: 10 mΩ max
• Insulation Resistance: 1000MΩ min
• DWV: 300V DC for 60 Seconds
• Differential Impedance: 100Ω+/-10Ω
Materials
• Cage
o Base Material: Copper Alloy
o Plating: Nickel
o Spring Clip: Copper Alloy, Nickel Plating
• Connector
o Contact Base Material: Gold
o Contact Plating: Nickel on Mating Area,
o Tin-Lead Over Nickel on Termination
o Housings: Glass Reinforced, Thermoplastic
o UL94V-0 Rated
Temperature Rating
• Operating Temperature: -55°C to +85°C
• Storage Temperature: -55°C to 105°C
Congurations (Rows x Ports per Row)
• 2x1 • 2x2
• 2x4 • 2x5
• 2x6 • 2x8
Options
• Thermoplastic Dust Covers
Packaging
• Tray Packaging: Cage and Connector Assembly
12
13
UE86
UE86
UE86 -Standard SFP+ Cage and Connector with Light Pipes (RoHS)
UltraPortTM 3G 2
3G 3G- 3rd generation 25/32G applications
X X XX 1
006
0
2
X
6
LIGHT PIPE OPTIONS
CHASIS EMI OPTIONS
TRAY PACKAGING
PLATING OPTION: CAGE
PLATING OPTION: CONNECTOR
DUST COVER OPTIONS
MOUNTING TYPE: CAGE
MOUNTING TYPE: CONNECTOR
4-Gasket
6-Spring Finger
2 - Standard Press Fit Pins
0 - Standard Cage
X - Various Options Available
Consult Sales or Website for Details
X - Various Options Available
Consult Sales or Website for Details
0 - Without Dust Covers
D - With Dust Covers
6 - Pre-Plating
1 - Tray packaging (stacked)
UltraPortTM SFP+ SMT Connector and Cages
The UltraPort SFP+ interconnect system is comprised of a 20-position hot swappable I/O connector
enclosed in a metal cage mounted to a host PCB. It supports 32Gbps applications with a backward
compatibility for next generation Ethernet and Fibre Channel applications. Amphenol’s UltraPort SFP+
connector shares the same exceptional mating interface and EMI cage dimensions as the SFP+ form
factor. The cages are built for use with several board thicknesses and assembly processes to accommo-
date server and switch applications with great cost savings. The connector accepts multiple transceiv-
ers per INF-8081 and combines, transmits, and receives functions in a low cost, compact and exible
format. We offer a wide variety of cage congurations, which have a two-piece construction with
enhanced transceiver mating tabs available in press-t or solder tail versions.
14
U77-3GA6X1M-X091
General Characteristics
• RoHS Compliant
• Industry Standard Footprint
• Industry Standard EIA-364
• Halogen Free
Electrical Characteristic
• Operating voltage: 30 V AC
• Rated current: 0.5 A
• Dielectric withstanding voltage: 300V AC
• Insulation resistance: 1000 MΩ
• Differential impedance: 100Ω +/-10Ω
Packaging
• Tape and Reel
UE76-3G20-X600T
The UltraPort SFP+ interconnect system is comprised of a 20-position hot swappable I/O connector. It supports
32 Gbps applications with a backward compatibility for next generation Ethernet and Fibre Channel applications
Materials
• Cage:
o Base Material: Copper alloy
o Plating: Nickel plating, bright tin or matte tin over nickel
• Connector:
o Base Material: Copper alloy
o Plating: Gold over Nickel in contact areas
o Housing: Lead-free solder reow process compatible
thermoplastic, UL 94 V-0 rated
Temperature Rating
• Operating temperature: -55° to +85°
• Storage temperature: -55° to +85°
Congurations (Rows x Ports/Row)
• 1x1
• 1x2
• 1x4
• 1x6
UltraPortTM
UltraPortTM U77
U77
X
3G X
3rd Generation- 25/32G Ganged Cage
3G
NUMBER OF PORT IN ROW
SERIES DESIGNATION (RoHS)
XX X X X X
N-1XN(N=1,2,3,4,6,8)
EMI CHASSIS GROUNDING
4 - Gasket
6 - Spring Finger
X
X
PACKAGING
1-Tray Packaging
T - Tape and Reel Packaging
X
X
OPTION 1
7 - Cage with Extra Bottom Spring Fingers,
No Bottom Mid G-Pins
PLATING OPTIONS FOR CAGE
2-Nickel Plating
3-Matte Tin Plating
6-Silver-Nickel Material (No Plating)
PCB MOUNTING OPTION
UE76
P
UE76
3G
3G 3rd Generation- 25/32G Ganged Connector
SERIES DESIGNATION (RoHS)
20
20X 6 00
6
0
T
T
PLATING
2-
PACKAGING
T- Tape and reel packaging
3-
0
5-
6-
X
20 SMT connector
OPTION 3
OPTION 2
OPTION 1
0.76um Gold at mating area gold ash in termination
0.76um Gold at mating area gold ash 3.0-7.62um matte tin in termination
0.38um Gold at mating area gold ash in termination
0.38um gold at mating area 3.0-7.62um matte tin in termination
HEAT SINK AND LIGHT PIPE OPTION
DUST COVER OPTION
15
A
ASTYLE
A - One Row
1- No Heat Sink/ Light Pipe
X - Various Options Available
Consult Sales or Website for Details
0 - Without Dust Covers
D - With Dust Covers
The ExpressPortTM QSFP+/QSFP interconnect system is comprised of a 38 position 0.8mm picth SMT
connector, and a press-t cage desgined to comply with the Quad Small Form-factor Pluggable(QSFP)
Transciever inteneded for extral connections. High speed serial interconnect application include clusters,
servers, and storage devices.
U90-G351-101A U90-XXX1-1XXXU90-XXX1-1XXX
Mechanical Characteristics
• Cage is Keyed According to QSFP MSA
o QSFP+: SFF-8436
o E-Series: SFF-8672
• Durability: 250 Mating Cycles min
• Connector Insertion Froce: 40 N max
• Connector Withdrawal Force: 30 N max
Electrical Characteristics
• Hot Swappable
• Operating Voltage: 30V
• Operating Current: 0.5A
• DifferentiaI Impedance: 100 Ω +/- 10Ω
• DWV: 300 V AC
• Insulation Resistance: 1000MΩ min
• Contact Resistance: 70 mΩ max
16
17
18
16
19
UltraPortTM QSFP+ Stacked
The UltraPortTM QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector
built for use in high speed serial applications. Each port offers 4 channels to increase port density
which contributes to more board real estate and immense cost savings. High speed serial intercon-
nect applications include clusters, servers, and storage devices.
General Characteristics
• RoHS Compliant
• Industry Standard Footprint
• Belly-to-belly Mount
• Combos are tray packed
• Dust cover for front face is
available (bulk packed)
The UltraPortTM QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in
high speed serial applications and supports 32 Gbps per channel. Each port offers 4 channels to increase port
density.
Connector Mechanical Characteristics
• Insertion force: 40 N maximum
• Withdrawal force: 30 N maximum
• Durability: 250 mating cycles
Connector Electrical Characteristics
• Maximum current: 0.5A per contact
• Maximum voltage: 30V per contact
• LLCR: 80 mΩ max
• Insulation Resistance: 1000 MΩ at
100V DC for 60 seconds
• DWV: 300V minimum DC for 60 seconds
Material Requirements
Electrical connector chicklets:
• Contact area to have 15
μ’’ and
30
μ’’
gold option,
over
50 μ’’
nickel on mating area
• Press t termination to have 100-300
μ’’ nickel
• Molding body LCP
Housing: Glass-reinforced thermoplastic, UL 94 V-0 rated
Cage: Copper alloy, tin over nickel or nickel only plating
Temperature Rating
Temperature rise: Meets the requirement of 30
°
C
Δ
T
Operating and storage temperature: -40
°
to +85
°
C
Available Congurations (Rows x Ports/Row)
• 2x1,2x2,2x3,2x4
Available Options
• Various EMI Shielding Options
• Heat Sinks
• Light Pipes
• Dust Covers
• Through and Behind the Bezel
and Hybrid Cage Options
Supports Multiple Data Transfer Protocols
• Inniband : 4x SDR/DDR/QDR/HDR
• 100 Gigabit Ethernet
P-U95-Z105-XXX1-XX1 P-U95-Z205-XXX1-XX1 P-U95-Z305-XXX1-XX1
20
U95 0
Z5
U95
0
5
UltraPortTM
Z
Z-Standard
1-Standard
21
New QSFP version as an extension of the H-Series, similar to the zQSFP/zQSFP+, tentatively named hQSFP
UltraPortTM QSFP+ SMT Connector and Cages
The UltraPortTM QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built
for use in high speed serial applications. Each port offers 4 channels to increase port density which
contributes to more board real estate and immense cost savings. The UltraPortTM QSFP+ connecter
supports next generation 100G+ applications and transmits up to 40 Gbps per-serial-lane making it the
fastest connector in the QSFP+ market. It features a stamped and formed contact design providing
improved mechanical durability and resonance dampening features for superior performance. The
design minimizes crosstalk and transmission line impedance discontinuity across the connector interface
at speeds up to 32 Gbps.
General Characteristics
• RoHS Compliant
• Industry Standard Footprint (SFF 8665)
• Belly-to-belly Mount
Available Congurations (Rows x Ports/Row)
• 1x1,1x2,1x3,1x4,1x6
Connector Mechanical Characteristics
• Insertion force: 40 N maximum
• Withdrawal force: 30 N maximum
• Durability: 300 mating cycles
Connector Electrical Characteristics
• Maximum current: 0.5A per contact
• Maximum voltage: 30V per contact
• LLCR: 80 mΩ max
• Insulation Resistance: 1000 MΩ at
100V DC for 60 seconds
• DWV: 300V minimum DC for 60 seconds
Material Requirements
Contacts:
• Base material : Phosphor Bronze
• Contact Normal Force : 60g nominal
• Formed edge
• Plating :
o Mating area : 30 microinches (0.76
μm
)
μ”
min
Gold over 50
μ” (1.27μm) min Nickel
o Solder tails :100 microinches (2.54
μm
)
μ”
min
Tin over 50
μ” (1.27μm) min Nickel
• Housing: Black color, glass-reinforced, lead-free
solder reow process compatible thermoplastic,
UL94V-0 rated
• Resonance dampening feature: Conductive polymer
Temperature Rating
Temperature rise: Meets the requirement of 30
°
C
Δ
T
Operating and storage temperature: -40
°
to +85
°
C
Signal Integrity
• Insertion loss : Max 1.0 dB at 16 GHz
• Return loss : Less than -10 dB at 18 GHz
• Common mode conversion : Lesss than
• 7.0 dB at 18 GHz
• NEXT (Near End Cross Talk) less than
• 50 dB range of 1MHz to 20GHz
• FEXT (Far End Cross Talk) less than
• 30 dB range of 1MHz to 20GHz
Available Options
• Various EMI Shielding Options
• Heat Sinks
• Light Pipes
• Dust Covers
• Through and Behind the Bezel
and Hybrid Cage Options
FS1-Z38-20Z6-10
22
U95-T1X1-1XXXU95-T6X1-1XXX
Z
Z
Z 6
Z
UltraPortTM QSFP+
6
5
T
T
5
Y - Extruded Custom Heat Sink for Front to Back Air Flow (Nickel Plated)
and Clip (H=6.94 mm)
W - Extruded Custom Heat Sink for Front to Back Air Flow (Nickel Plated)
and Clip (H=8.72 mm)
1 - Tray Packaging (Light Pipe and/or Heat
Sink Shipped Loose if Ordered)
A - Tray Packaging (Light Pipe and/or Heat
Sink Assembled to the Cage)
1 - Dual Barrel Light Pipe - Round Outlet
7- Single Barrel Light Pipe -Round Outlet
R
UltraPortTM QSFP+
+
+
Standard
Standard
Standard
23
with Heat Sink and Clip
and Optional LP
Amphenol’s CXP connector comes in a one-piece press-t assmebly system with twelve channels of up
to 20 Gbps, resulting in 240 Gbps of total bandwidth - the fastest and most dense I/O on the market
today. This allows our CXP to go beyond the 100 Gigabit Ethernet IEEE 802.3ba and the Inniband
CXP12x QDR standards. It also enables pluggable copper or optical cables to increase the exibility of
system-level hardware for end users. The CXP interconnect system is ideal for network switches, routers,
severs, and storage devices.
24
25
26
27
28
29
7 - Same as 3, but with enhanced chicklet
30
31
The CFP2 and CFP4 interconnect systems are comprised of insert molding assemblies for top side contacts and press-t
cage assemblies. Both CFP2 and CFP4 have a plug connector on the mating interface that improves accuracy and aids in
achieving high speed performance.
General Characteristics
• Complies with IEEE and ITU-T applications
• 0.6mm contact pitch
• CFP2 has 104 positions, CFP4 has 56 positions.
• Rated for 25 Gbps per ch. with resonance dampening for
improved signal integrity.
• Module and host systems are hot pluggable, not damaged
by insertion/removal
• Integrated kickout spring with cage assembly for CFP4
Applications
• Supports 40Gbit/s and 100Gbit/s interfaces for Ethernet
(IEEE802.3), Telecommunication (ITU-T) and other
optical networking applications
• Supports single mode and multimode ber optics
• Accommodates a wide range of power dissipations and
applications
• Nominal signalling rate of 25Gbit/s per ch.
Key Features
• Two piece electrical connector for superior electrical
performance and superior mechanical integrity
• Supports LC, MTP12 and MTP24 optical connector
types
• Alternative solutions to limitations of QSFP+:
thermal, jitter budget and reach
Mechanical Characteristics
• Maximum Insertion Force: 80N (Cage and Connector)
• Maximum Extraction Force: 80N (Cage and Connector)
• Minimum Cage Retention: 180N
• Minimum Module Retention: 90 N
• Durability: 200 Mating Cycles min
Electrical Characteristics
• Operating Voltage: 3.3 V
• Operating Current: 1.875A
Materials
• Cage
oBase Material: Copper Alloy
oPlating: Nickel
oHeat Sink: Aluminum Alloy
oHeat Sink Clip: Stainless Steel
oDust Cover: Thermoplastic
oConnector cover: Zinc Alloy
• Connector
oContact Base Material: Phosphor Bronze
oContact Plating: Gold on Mating Area, Matte Tin on
Termination
oHousings: Glass Reinforced, Lead-Free Solder Reow
Process Compatible Thermoplastic, UL94V-0 Rate d
oResonance Dampening Feature: Conductive Polymer
Options
• Heat Sink and Clip
oStandard: Aluminum Alloy
oCustom designs available
• EMI Gasket
• Connector Cover
• Dust Cover
P-U20-KCFP2-1XXX P-U98-C1X1-X0XX
32
33
2 -Standard Heat Sink (Hard Coat Anodized) And Clip
MYLAR TAPE OPTION
1 -Standard (No Mylar Tape)
2 -With Mylar Tape on Bottom Cage
0 -With Connector Cover, No Kickout Spring
A -Without Connector Cover or Kickout Spring
B -Without Connector Cover, With Kickout Spring
C -With Connector Cover & Kickout Spring
*
*
*CPF2 Only
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35
