NCV4294CSN50T1G - ON SEMICONDUCTOR

October, 2019 − Rev. 2

1Publication Order Number:

NCV4294C/D

NCV4294C

Voltage Regulator - Low

Dropout

30 mA

The NCV4294C is a monolithic integrated low dropout voltage

regulator with an output current capability of 30 mA available in the

TSOP–5 package.

The output voltage is accurate within ±4.0% with a maximum

dropout voltage of 250 mV with an input up to 45 V. Low quiescent

current is a feature typically drawing only 160 mA with a 1 mA load.

This part is ideal for automotive and all battery operated

microprocessor equipment.

The regulator is protected against reverse battery, short circuit and

thermal overload conditions.

Features

•Output Voltage Options: 3.3 V, 5.0 V

•Output Voltage Accuracy: ±4.0%

•Output Current: up to 30 mA

•Low Quiescent Current (typ. 160 mA @ 1 mA)

•Low Dropout Voltage (typ. 65 mV @ 20 mA)

•Wide Input Voltage Operating Range: up to 45 V

•Protection Features:

♦Current Limitation

♦Thermal Shutdown

♦Reverse Polarity Protection and Reverse Bias Protection

•AEC−Q100 Grade 1 Qualified and PPAP Capable

•This is a Pb−Free Device

Typical Applications

•Microprocessor Systems Power Supply

Figure 1. Applications Circuit

NCV4294C

Vin

Cout

2.2 mF

Output

Cin

100 nF

GND

Vout

Input

TSOP−5

CASE 483

PIN CONNECTIONS

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MARKING

DIAGRAM

(Top View)

Vin

GND

Vout

(Note: Microdot may be in either location)

xxxAYWG

xxx = Specific Device Code

A = Assembly Location

Y = Year

W = Work Week

G= Pb−Free Package

GND

ORDERING INFORMATION

See detailed ordering, marking and shipping information on

page 10 of this data sheet.

NCV4294C

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Figure 2. Simplified Block Diagram

GND

VOLTAGE

REFERENCE

SATURATION

PROTECTION

THERMAL

SHUTDOWN

TSD

Vin Vout

VREF

PIN FUNCTION DESCRIPTION

Pin No.

TSOP−5Pin Name Description

1 NC Not connected. (Not internally bonded)

2 GND Power Supply Ground.

3 Vin Unregulated Positive Power Supply Input. Connect 0.1 mF capacitor to ground.

4 Vout Regulated Positive Output Voltage. Connect 2.2 mF capacitor with ESR < 7 W to ground.

5 GND Power Supply Ground.

ABSOLUTE MAXIMUM RATINGS

Rating Symbol Min Max Unit

Input Voltage DC (Note 1)

Vin

−42 45

Input Voltage (Note 2)

Load Dump − Suppressed

−60

Output Voltage Vout −6 30 V

Maximum Junction T

emperature

TJ(max) −40 150 °C

Storage T

emperature

TSTG −50 150 °C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

2. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in

production. Passed Class A according to ISO16750−1.

ESD CAPABILITY (Note 3)

Rating Symbol Min Max Unit

ESD Capability, Human Body Model ESDHBM −2 2 kV

3. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)

Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes <50mm2 due to the

inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveform characteristic

defined in JEDEC JS−002−2014.

NCV4294C

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LEAD SOLDERING TEMPERATURE AND MSL (Note 4)

Rating Symbol Min Max Unit

Moisture Sensitivity Level MSL 1 −

4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D

THERMAL CHARACTERISTICS

Rating Symbol Value Unit

Thermal Characteristics, TSOP−5

Thermal Resistance, Junction−to−Air (Note 5) RθJA 136.2

°C/W

5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.

RECOMMENDED OPERATING RANGES

Rating Symbol Min Max Unit

Input Voltage (Note 6) Vin Vout, nom + 0.5 or 3.5 45 V

Junction T

emperature

TJ−40 150 °C

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the

Recommended

Operating Ranges limits may affect device reliability.

6. Minimum Vin = Vout, nom + 0.5 or 3.5, whichever is higher.

NCV4294C

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ELECTRICAL CHARACTERISTICS

Vin = 13.5 V, Cin = 0.1 mF, C out = 2.2 mF, for typical values TJ = 25°C, for min/max values TJ = −40°C to 150°C; unless otherwise noted.

(Note 7)

Parameter Test Conditions Symbol Min Typ Max Unit

REGULATOR OUTPUT

Output Voltage 5.0 V

3.3 V

Vin = 13.5 V, Iout = 1 mA to 30 mA

Vin = 6 V to 40 V, Iout = 10 mA

Vin = 13.5 V, Iout = 1 mA to 30 mA

Vin = 4.3 V to 40 V, Iout = 10 mA

Vout 4.80

4.80

3.17

5.00

3.30

5.20

3.43

Line Regulation Vin = Vin, min to 36 V, Iout = 5 mA, TJ = 25°C

Vin = Vin, min to 36 V, Iout = 5 mA

Regline −

−

Load Regulation Iout = 1 mA to 25 mA, TJ = 25°C

Iout = 1 mA to 25 mA

Regload −

−

Dropout Voltage (Note 8) Iout = 20 mA VDO −65 250 mV

QUIESCENT CURRENT

Quiescent Current, Iq = Iin − Iout Iout < 0.1 mA, TJ < 85°C

Iout < 1 mA

Iout < 30 mA

−

150

160

0.8

170

200

μA

CURRENT LIMIT PROTECTION

Current Limit Vout = Vout, nom – 100 mV ILIM 30 − − mA

PSRR

Power Supply Ripple Rejection f = 100 Hz, 0.5 Vpp PSRR −60 −dB

THERMAL SHUTDOWN

Thermal Shutdown T

emperature

(Note 9)

TSD 151 175 195 °C

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

7. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [TJ. Low duty cycle

pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.

8. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.5 V. If Vout < 5 V, then VDO = Vin − Vout. Maximum dropout

voltage value is limited by minimum input voltage Vin = Vout, nom + 0.5 V recommended for guaranteed operation at maximum output current.

9. Values based on design and/or characterization.

NCV4294C

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TYPICAL CHARACTERISTICS − 5.0 V VERSION

Figure 3. Output Stability with Output

Capacitor ESR

Iout, OUTPUT CURRENT (mA)

302520151050

0.01

0.1

100

1000

Figure 4. Output Voltage vs. Junction

Temperature

Figure 5. Output Voltage vs. Input Voltage

TJ, JUNCTION TEMPERATURE (°C) Vin, INPUT VOLTAGE (V)

16012080400−40

4.90

4.95

5.00

5.05

5.10

97653210

Figure 6. Dropout Voltage vs. Output Current Figure 7. Maximum Output Current vs. Input

Voltage

Iout, OUTPUT CURRENT (mA) Vin, INPUT VOLTAGE (V)

302520151050

100

150

40302520151050

ESR (W)

Vout, OUTPUT VOLTAGE (V)

VDO, DROPOUT VOLTAGE (mV)

Iout, OUTPUT CURRENT (mA)

Unstable Region

Stable Region

Cout ≥ 2.2 mF

TJ = 25°C

Vin = 13.5 V

RL = 5 kW

RL = 166 W

TJ = 25°C

4810

Vout = 0 V

TJ = 25°C

35 45

TJ = 25°C

TJ = −40°C

TJ = 125°C

NCV4294C

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TYPICAL CHARACTERISTICS − 5.0 V VERSION

Figure 8. Quiescent Current vs. Output Current

(High Load)

Figure 9. Quiescent Current vs. Output Current

(Low Load)

Iout, OUTPUT CURRENT (mA) Iout, OUTPUT CURRENT (mA)

302520151050

0.1

0.2

0.3

0.4

0.5

0.6

0.8

543210

100

200

300

Figure 10. Quiescent Current vs. Input Voltage

Vin, INPUT VOLTAGE (V)

35302520151050

1.0

2.0

3.0

3.5

4.0

5.0

Iq, QUIESCENT CURRENT (mA)

Vin = 13.5 V

TJ = 25°C

RL = 166 W

TJ = 25°C

0.7

Vin = 13.5 V

TJ = 25°C

1.5

0.5

2.5

4.5

NCV4294C

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TYPICAL CHARACTERISTICS − 3.3 V VERSION

Figure 11. Output Stability with Output

Capacitor ESR

Iout, OUTPUT CURRENT (mA)

302520151050

0.01

0.1

100

1000

Figure 12. Output Voltage vs. Junction

Temperature

Figure 13. Output Voltage vs. Input Voltage

TJ, JUNCTION TEMPERATURE (°C) Vin, INPUT VOLTAGE (V)

16012080400−40

3.20

3.25

3.30

3.35

3.40

97653210

0.5

1.0

2.0

2.5

3.5

4.0

Figure 14. Maximum Output Current vs. Input

Voltage

Figure 15. Quiescent Current vs. Input Voltage

Vin, INPUT VOLTAGE (V) Vin, INPUT VOLTAGE (V)

302520151050

40302520151050

0.5

1.0

2.0

3.0

3.5

4.0

5.0

ESR (W)

Vout, OUTPUT VOLTAGE (V)

Iout, OUTPUT CURRENT (mA)

Iq, QUIESCENT CURRENT (mA)

Unstable Region

Stable Region

Cout ≥ 2.2 mF

TJ = 25°C

Vin = 13.5 V

RL = 3.3 kW

RL = 110 W

TJ = 25°C

4810

1.5

3.0

RL = 110 W

TJ = 25°C

1.5

2.5

4.5

Vout = 0 V

TJ = 25°C

35 40 45

NCV4294C

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TYPICAL CHARACTERISTICS − 3.3 V VERSION

Figure 16. Quiescent Current vs. Output

Current (High Load)

Figure 17. Quiescent Current vs. Output

Current (Low Load)

Iout, OUTPUT CURRENT (mA) Iout, OUTPUT CURRENT (mA)

302520151050

0.1

0.2

0.3

0.4

0.5

0.6

0.8

543210

100

200

300

PCB Cu Area (mm2)

5004003002001000

100

125

150

175

200

Iq, QUIESCENT CURRENT (mA)

RqJA, THERMAL RESISTANCE (°C/W)

Vin = 13.5 V

TJ = 25°C

1 oz

0.7

Vin = 13.5 V

TJ = 25°C

700600

2 oz

Figure 18. RqJA vs. PCB Cu Area

NCV4294C

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DEFINITIONS

General

All measurements are performed using short pulse low

duty cycle techniques to maintain junction temperature as

close as possible to ambient temperature.

Output Voltage

The output voltage parameter is defined for specific

temperature, input voltage and output current values or

specified over Line, Load and Temperature ranges.

Line Regulation

The change in output voltage for a change in input

voltage measured for specific output current over operating

ambient temperature range.

Load Regulation

The change in output voltage for a change in output

current measured for specific input voltage over operating

ambient temperature range.

Dropout Voltage

The input to output differential at which the regulator

output no longer maintains regulation against further

reductions in input voltage. It is measured when the output

drops 100 mV below its nominal value. The junction

temperature, load current, and minimum input supply

requirements affect the dropout level.

Quiescent Current

Quiescent Current (Iq) is the difference between the input

current (measured through the LDO input pin) and the

output load current.

Current Limit

Current Limit is value of output current by which output

voltage drops 100 mV below its nominal value. It means

that the device is capable to supply minimum 30 mA.

PSRR

Power Supply Rejection Ratio is defined as ratio of

output voltage and input voltage ripple. It is measured in

decibels (dB).

Thermal Protection

Internal thermal shutdown circuitry is provided to

protect the integrated circuit in the event that the maximum

junction temperature is exceeded. When activated at

typically 175°C, the regulator turns off. This feature is

provided to prevent failures from accidental overheating.

Maximum Package Power Dissipation

The power dissipation level is maximum allowed power

dissipation for particular package or power dissipation at

which the junction temperature reaches its maximum

operating value, whichever is lower.

NCV4294C

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APPLICATIONS INFORMATION

The NCV4294C low dropout regulator is self−protected

with internal thermal shutdown and internal current limit.

Typical characteristics are shown in Figure 3 to Figure 18.

Input Decoupling (Cin)

A ceramic or tantalum 0.1 mF capacitor is recommended

and should be connected close to the NCV4294C package.

Higher capacitance and lower ESR will improve the

overall line and load transient response.

Output Decoupling (Cout)

The NCV4294C is a stable component and does not

require a minimum Equivalent Series Resistance (ESR) for

the output capacitor. Stability region of ESR vs. Output

Current is shown in Figures 3 and 11. The minimum output

decoupling value is 2.2 mF and can be augmented to fulfill

stringent load transient requirements. The regulator works

with ceramic chip capacitors as well as tantalum devices.

Larger values improve noise rejection and load transient

response.

Thermal Considerations

As power in the NCV4294C increases, it might become

necessary to provide some thermal relief. The maximum

power dissipation supported by the device is dependent

upon board design and layout. Mounting pad configuration

on the PCB, the board material, and the ambient

temperature affect the rate of junction temperature rise for

the part. When the NCV4294C has good thermal

conductivity through the PCB, the junction temperature

will be relatively low with high power applications. The

maximum dissipation the NCV4294C can handle is given

by:

PD(MAX) +ƪTJ(MAX) *TAƫ

RqJA

(eq. 1)

Since TJ is not recommended to exceed 150°C, then the

NCV4294C soldered on 645 mm2, 1 oz copper area, FR4

can dissipate up to 0.92 W when the ambient temperature

(TA) is 25°C. See Figure 18 for RthJA versus PCB area. The

power dissipated by the NCV4294C can be calculated from

the following equations:

PD[VinǒIq@IoutǓ)IoutǒVin *VoutǓ(eq. 2)

Vin(MAX) [

PD(MAX) )ǒVout IoutǓ

Iout )Iq

(eq. 3)

Hints

Vin and GND printed circuit board traces should be as wide

as possible. When the impedance of these traces is high,

there is a chance to pick up noise or cause the regulator to

malfunction. Place external components, especially the

output capacitor, as close as possible to the NCV4294C and

make traces as short as possible.

ORDERING INFORMATION

Device Marking Package Shipping†

NCV4294CSN50T1G 45V TSOP−5

(Pb−Free) 3000 / Tape & Reel

NCV4294CSN33T1G 43V

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

NCV4294C

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PACKAGE DIMENSIONS

TSOP−5

CASE 483

ISSUE M

0.7

0.028

1.0

0.039

ǒmm

inchesǓ

SCALE 10:1

0.95

0.037

2.4

0.094

1.9

0.074

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE

MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS. MOLD

FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT

EXCEED 0.15 PER SIDE. DIMENSION A.

5. OPTIONAL CONSTRUCTION: AN ADDITIONAL

TRIMMED LEAD IS ALLOWED IN THIS LOCATION.

TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2

FROM BODY.

DIM MIN MAX

MILLIMETERS

C0.90 1.10

D0.25 0.50

G0.95 BSC

H0.01 0.10

J0.10 0.26

K0.20 0.60

M0 10

S2.50 3.00

123

54 S

0.20

CAB

T0.10

2X T0.20

NOTE 5

CSEATING

PLANE

0.05

DETAIL Z

TOP VIEW

SIDE VIEW

END VIEW

1.35 1.65

2.85 3.15

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