MICROWAVE CHIP RESISTORS
Thin Film on Ceramic
ORDERING INSTRUCTIONS
Construct Part Number From Choices:
___________ - ___________ - ___________- ___________
(size) (type) (ohms)* (tolerance)
2 MCB D = 0.5%
3 MCG F = 1%
4 MCS J = 5%
%01 = K5
*First 3 digits are significant figures. Fourth is number of zeros to follow or D for decimal between second and third digits.
Example: 2-MCS-1001-J
(Example is a 0.020-by-0.040-inch chip with solder-bump
terminations, 1000 ohms ±5% resistance.)
Spectrum Microwave Chip Resistors are produced with
state-of-the-art thin film sputtering techniques on microwave
grade alumina. The advantages of sputtered over evaporated
metal films include better adhesion to the substrate, increased
reliability, and more uniform composition, density, and
thickness. Their TCR, noise level, and stability are similar to
discrete metal film resistors. The small size and careful
design of Spectrum Microwave Chip Resistors result in low
VSWR and low parasitics. They are available with gold pads
for wire bonding or solder bumps for surface mounting.
FEATURES
• Low VSWR: < 1.2 at 8 GHz
• Low TCR
: 0 to -50 ppm
• Four Sizes:
0.020 X 0.040 to 0.100 X 0.100 inches
• Wire Bond / Solder Mount Option
MCB/MCG (BARE BACK/GOLD BACK)
The MCB and MCG resistors have gold terminations for wirebonds,
although epoxy may also be used. MCB resistors have no backside
metallization. They are die-mounted with epoxy. MCG resistors have
a gold backside metallization. The metallization is electronically
MCS (SOLDER BUMP)
MCS resistors have solder bump terminations for flip-chip surface
mounting. They have no backside metallizing. They can also be
die-mounted with epoxy with solder bumps exposed for connection.
L± .005
.010 MIN.
.003
TYP.
.003 TYP.
T = .010 ± .001
W± .005
L± .005
.010 MIN.
.003 TYP.
W± .005
0.003 TYP.
T = .020 MAX.
isolated from the front terminations.
Spectrum Microwave
Tel: 508-485-6350 Fax: 508-485-5168
165 Cedar Hill Street, Marlborough, Ma 01752
www.SpectrumMicrowave.com