USB Connectors XM7 5
Precautions
■Correct Use
General Environmental Conditions
Do not use the product in any atmosphere or environment that
exceeds the ratings.
Automatic Soldering
Reference: Automated Soldering Conditions (Jet Flow);
•Soldering temperature: 250 ± 5°C
•Continuous soldering time:5±1seconds max.
Soldering Conditions
Reference: Reflow Conditions;
•Maximum temperature: 260°C
•Time: 5 to 15 seconds max.
These conditions, however, depend on the type of solder, the manu-
facturer, the amount of solder, the size of the board, and other
mounting materials.
Screen Thickness for Printing Cream Solder
We recommend a metal mask thickness of 0.15 mm when printing
cream solder.
The appropriate conditions however, depend on the type of solder,
the manufacturer, the amount of solder the size of the circuit board,
other mounting materials and other conditions
Terminal Shapes
The terminals will deform if they are subjected to an excessive load,
which will in turn reduce solderability when mounting. Do not drop
the connectors or handle them carelessly. Do not connect anything
when the connectors are not mounted to a board. Doing so may
deform the terminals.
Using an Automatic Solder Bath after Reflow
Mask the mating portions with tape before you perform automatic
soldering to prevent flux or solder from entering the mating portion of
the Connector. Select and use a suitable masking tape.
Application Precautions
Confirm that there is no excessive misalignment or inclination in the
mating contact portion between the plug and socket before mating
the connector. Make sure that the connector is mated all the way to
the back. If the connector is not mated all the way to the back, con-
tact reliability may be lost.
Do not apply an extreme load during connector insertion or removal.
The connector may be damaged, and contact failure may result.
Twist the plug and socket as little as possible when mating the con-
nector. Not doing so may deform the terminals or housing or crack
the housing.
Do not insert a foreign object, such as tweezers, into the connector
mating contact portion. Doing so may cause the plating to peel off or
deform the terminals.
Precautions for Board Mounting
Be careful of the amount of board warping. If the board is excessively
warped, soldering faults may occur.
Storage
Do not store the connectors in locations subject to dust or high
humidity. Do not store the connectors in locations close to sources of
gasses such as ammonia gas or sulfide gas.
Preheating time:
60 s max.
Soldering time:
5 to 15 s max.
Preheating temperature
Soldering temperature
Peak temperature
(°C)
(s)
150
250
260