MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
HSM108
THRU
HSM101
MAXIMUM RATINGS
(@ TA=25
OC unless otherwise noted)
ELECTRICAL CHARACTERISTICS
(@TA=25
OC unless otherwise noted)
RATINGS
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
at TA = 50OC
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
Typical Junction Capacitance (Note 2)
SYMBOL
V
RRM
V
DC
I
FSM
C
J
T
STG
V
RMS
UNITS
Volts
Volts
Volts
Amps1.0
30
15 12
Amps
0
C
Storage Temperature Range
I
O
pF
Operating Temperature Range T
J
HSM101
50
-55 to + 150
150
0
C
HSM102 HSM103 HSM104 HSM105 HSM106
100 200 300 400
35 70 140 210 280
50 100 200 300 400
HSM107 HSM108
HSM101 HSM102 HSM103 HSM104 HSM105 HSM106 HSM107 HSM108
600 800 1000
600 800 1000
420 490 700
2007-5
CHARACTERISTICS
Maximum Average Reverse Current
Maximum Full Load Reverse Current, Full
cycle Average TA =55OC
Maximum Reverse Recovery Time (Note 4)
at Rated DC Blocking Voltage
V
F
SYMBOL
I
trr
R
mA
mA
mA
Maximum Instantaneous Forward Voltage at 1.0A DC Volts
5
50
100
50 75 nSec
@T
A
= 25
o
C
@T
A
= 125
o
C
1.0
UNITS
1.3 1.7
NOTES :
1. Measured at 1 MHz and applied reverse voltage of 4.0 volts.
3. Test Conditions: IF= 0.5A, IR= -1.0A, IRR= -0.25A.
2.
“Fully ROHS compliant”, “100% Sn plating (Pb-free)”.
MELF
Dimensions in inches and (millimeters)
.205 ( 5.2 )
.190 ( 4.8 )
.024 ( 0.6 )
.016 ( 0.4 )
.106 ( 2.7 )
.095 ( 2.4 )
SOLDERABLE
ENDS
FEATURES
* Glass passivated device
* Ideal for surface mounted applications
* Low leakage current
* Metallurgically bonded construction
* Mounting position: Any
* Weight: 0.015 gram
* Epoxy : Device has UL flammability classification 94V-0
MECHANICA
DISCONTINUED-
L DATA
"This series is replaced by the HFM10X series that meets to the same
fit and function parameters and share the same solder pad layout.
The HFM10X series is preferred for error-free vacuum pick-up and
PCB assembly.＂
SURFACE MOUNT GLASS PASSIVATED
HIGH EFFICIENCY SILICON RECTIFIER
VOLTAGE RANGE 50 to 1000 Volts CURRENT 1.0 Ampere
Discontinued
AMBIENT TEMPERATURE, (OC)
INSTANTANEOUS REVERSE CURRENT, (uA)
25
0.8
1.0
0
0.6
0.4
0.2
07550 175100 125 150
RATING AND CHARACTERISTICS CURVES ( HSM101 THRU HSM108 )
FIG.2 TYPICAL FORWARD CURRENT
DERATING CURVE
FIG.1 TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTIC
PERCENT OF RATED PEAK REVERSE VOLTAGE, (%)
AVERAGE FORWARD CURRENT, (A)
0
0.1
10
1.0
1000
100
6020 40 80 100 120 140
FIG.3 TYPICAL REVERSE
CHARACTERISTICS
trr
+0.5A
50 W
NONINDUCTIVE
10 W
NONINDUCTIVE
0
-0.25A
-1.0A
1cm
SET TIME BASE FOR 50/100 ns/cm
NOTES:
1 Rise Time = 7ns max. Input Impedance =
1 megohm. 22pF.
2. Rise Time = 10ns max. Source Impedance =
50 ohms.
D.U.T
25 Vdc
(approx)
( - )
( - )
( + )
( + )
1
NON-
INDUCTIVE
OSCILLOSCOPE
(NOTE 1)
PULSE
GENERATOR
(NOTE 2)
Single Phase
Half Wave 60Hz
Resistive or
Inductive Load
T
A
= 25 OC
T
A
= 75 OC
T
A
= 125 OC
NUMBER OF CYCLES AT 60Hz
PEAK FORWARD SURGE CURRENT, (A)
INSTANTANEOUS FORWARD VOLTAGE, (V)
1
10
30
20
50
100
125
150
200
INSTANTANEOUS FORWARD CURRENT, (A)
1.0
0.3
0.1
0.03
0.01
3.0
10
20
105 50 100
2.52.01.51.00.50 3.0 3.5
RATING AND CHARACTERISTICS CURVES ( HSM101 THRU HSM108 )
FIG.4 TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
FIG.5 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
REVERSE VOLTAGE, (V)
JUNCTION CAPACITANCE, (pF)
4
6
40
20
10
60
200
100
0.20.1
2
10.4 21.0 4 10 20 40 100
FIG.6 TYPICAL JUNCTION CAPACITANCE
8.3ms Single Half Sine-Wave
(JEDED Method)
Pulse Width=300uS
1% Duty Cycle
T
J
= 25 OC
T
J
= 25
O
C
HSM101~HSM103
HSM104~HSM105
HSM106~HSM108
HSM106~HSM108
HSM101~HSM105
Mounting Pad Layout
Dimensions in inches and (millimeters)
.100 (2.54)
.200 (5.08)
.300 (7.62)
.100 (2.54)
.100 (2.54) F-SLOT WIDTH
OPTIMUM PAD SIZE
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specification herein, to make corrections, modifications, enhancements or other
changes. Rectron Inc or anyone on its behalf assumes no responsibility or liabi-
lity for any errors or inaccuracies. Data sheet specifications and its information
contained are intended to provide a product description only. "Typical" paramet-
ers which may be included on RECTRON data sheets and/ or specifications ca-
n and do vary in different applications and actual performance may vary over ti-
me. Rectron Inc does not assume any liability arising out of the application or
use of any product or circuit.
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