INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1303-R04 1
CPC1303
Optocoupler with
Single-Transistor Output
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Part Number Description
CPC1303G 4-Pin DIP (100/Tube)
CPC1303GR 4-Pin Surface Mount (100/Tube)
CPC1303GRTR 4-Pin Surface Mount (1000/Reel)
Parameter Rating Units
Breakdown Voltage - BVCEO 30 VP
Current Transfer Ratio 200 %
Saturation Voltage 0.5 V
Input Control Current 0.2 mA
Applications
Features
Description
Ordering Information
Pin Configuration
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment: Patient/Equipment Isolation
• Aerospace
• Industrial Controls
• 5000Vrms Input/Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 4-pin Package
• Machine Insertable, Wave Solderable
The CPC1303 is a unidirectional input optocoupler
with a single-transistor output, which uses optically
coupled technology to provide an enhanced 5000Vrms
isolation barrier between the input and the output.
The optically coupled output is controlled by a highly
efficient GaAlAs infrared LED.
This optocoupler satisfies the PD output requirements
of IXYS Integrated Circuits Division's CPC1466
Broadband ADSL/VDSL DC Termination IC.
Approvals
• UL 1577 Approved Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN 60950 Certified Component:
TUV Certificate B 10 05 49410 006
1
A
K
C
E
2
4
3
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R04
CPC1303
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
Parameters Conditions Symbol Min Typ Max Units
Output Characteristics
Phototransistor Breakdown Voltage ICEO=10µA BVCEO 30 - - VP
Phototransistor Output (Dark) Current VCEO=5V, IF=0mA ICEO - 25 500 nA
Saturation Voltage IC=0.4mA, IF=0.2mA VCEsat
- 0.1 0.45 V
IC=10mA, IF=10mA - 0.12 0.5 V
Current Transfer Ratio IF=0.2mA, VCE=0.5V CTR 200 1000 2500 %
Output Capacitance VCEO=25V, f=1MHz COUT -6-pF
Input Characteristics
Input Control Current IC=0.4mA, VCE=0.5V IF- - 0.2 mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Input Reverse Current VR=5V IR- - 10 µA
Common Characteristics
Input to Output Capacitance - CI/O -3-pF
Parameter Ratings Units
Breakdown Voltage 30 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Power Dissipation 2
Input 1150
mW
Phototransistor 2150
Isolation Voltage, Input to Output 5000 Vrms
Operating Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / oC
2 Derate linearly 2.00 mW / oC
Characteristic Symbol Test Condition Typ Units
Turn-On Time ton VCC=5V, IF=1mA, RL=5002s
Turn-Off Time toff 8
Switching Characteristics @ 25ºC
Switching Time Test Circuit VCC
VCE
RL
IF
Pulse Width=5ms
Duty Cycle=1%
IF
10%
90%
ton toff
VCE
INTEGRATED CIRCUITS DIVISION
CPC1303
www.ixysic.com 3
R04
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
LED Forward Voltage (V)
1.1 1.2 1.3 1.4 1.5 1.6
LED Forward Current (mA)
0
10
20
30
40
50
LED Voltage vs. LED Current
(Linear)
LED Forward Voltage (V)
1.1 1.2 1.3 1.4 1.5 1.6
LED Forward Current (mA)
0.1
1
10
100
LED Voltage vs. LED Current
(LOG)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
LED Forward Voltage
vs. Temperature
IF=50mA
IF=5mA
IF=10mA
IF=20mA
IF=0.2mA
IF=1mA
IF=2mA
LED Forward Current (PA)
1 10 100 1000
CTR (%)
0
200
400
600
800
1000
1200
LED Forward Current vs. CTR
-40ºC
85ºC
25ºC
Collector Voltage (V)
012345
Collector Current (mA)
0
10
20
30
40
50
60
Typical Collector Voltage vs.
Typical Collector Current
(TA=25ºC)
IF=5mA
IF=3mA
IF=2mA
IF=1mA IF=0.5mA IF=0.2mA
Temperature (ºC)
-40 0 40 80 120
ICE Current (PA)
1
10
100
1000
10000
100000
ICE Current vs. Temperature
IF=1000PA
IF=1PA
IF=2PA
IF=5PA
IF=10PA
IF=20PA
IF=50PA
IF=100PA
IF=200PA
IF=500PA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Saturation Voltage (V)
0.06
0.08
0.10
0.12
0.14
0.16
Saturation Voltage vs. Temperature
(IF=1mA, ICE=2mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
87
88
89
90
91
92
93
94
95
96
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
100
200
300
400
500
Leakage Current vs. Temperature
VCE Leakage 10V
VCE Leakage 3V
VCE Leakage 5V
Load Resistance (:)
0 20000 40000 60000 80000 100000
Turn-On Time (Ps)
0.9
1.0
1.1
1.2
1.3
1.4
1.5
Turn-On Time vs. Load Resistance
(IF=1mA, VCC=5V, TA=25ºC)
Load Resistance (:)
0 20000 40000 60000 80000 100000
Turn-Off Time (Ps)
0
50
100
150
200
250
300
350
Turn-Off Time vs. Load Resistance
(TA=25ºC, VCC=5V, IF=1mA)
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R04
CPC1303
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1303G / CPC1303GR MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC1303G / CPC1303GR 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
CPC1303
www.ixysic.com 5
R04
MECHANICAL DIMENSIONS
PC Board Pattern (Top View)
Dimensions
mm
(inches)
PIN 1
6.350 ± 0.127
(0.250 ± 0.005)
4.572 ± 0.127
(0.180 ± 0.005)
0.991
(0.039)
9º (ALL)
3.30 ± 0.050
(0.130 ± 0.002)
0.254
(0.010)
9.144 ± 0.508
(0.360 ± 0.020)
7.620 ± 0.250
(0.300 ± 0.010)
7.620 ± 0.127
(0.300 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
9º (ALL)
0.457 ± 0.076
(0.018 ± 0.003)
2.540 ± 0.127
(0.100 ± 0.005) 3.175
(0.125)
0.508
(0.020)
2.159
(0.085)
Dimensions
mm
(inches)
PCB Land Pattern
PIN #1
6.350 ± 0.127
(0.250 ± 0.005)
0.991
(0.039)
9.525
(0.375)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.254
(0.025 ± 0.010)
0.254
(0.010)
3.300 ± 0.050
(0.130 ± 0.002)
3.480 ± 0.076
(0.137 ± 0.003)
2.287
(0.09)
8.80
(0.346)
1.60
(0.063)
0.95
(0.037)
9º ± 1º
(ALL)
0.102 min / 0.254 max
(0.004 min / 0.010 max)
4.572 ± 0.127
(0.180 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
2.287 ± 0.127
(0.090 ± 0.005)
CPC1303G
CPC1303GR
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1303-R04
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/16/2012
For additional information please visit our website at: www.ixysic.com
6
CPC1303
Dimensions
mm
(inches)
NOTES:
1. All dimensions meet EIA-481-C requirements
2. Unless otherwise noted, tolerances = ±0.10 (0.004)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max) K0=4.20
(0.165)
K1=3.70
(0.146)
W=16.00±0.30
(0.630±0.012)
A0=10.01
(0.394)
P=12.00
(0.472)
B0=5.00
(0.197)
CPC1303GRTR Tape & Reel
