PC8171XNSZ Series PC8171X NSZ Series Low Input Current Type Photocoupler Features Outline Dimensions 3 6.50.5 1. Programmable controllers 2. Facsimiles 3. Telephones 4.580.5 Ic (mA) 0.5 to 3.0 0.6 to 1.5 0.8 to 2.0 1.0 to 2.5 0.6 to 2.0 0.8 to 2.5 0.6 to 2.5 Epoxy resin Conditions 0.260.1 IF=0.5mA VCE=5V Ta=25C 0.50.1 : 0 to 13 Internal connection diagram 1 4 1 2 3 Absolute Maximum Ratings 3.00.5 Rank Table 2.70.5 3.50.5 7.620.3 2 (Ta=25C) Parameter Symbol Rating IF 10 Forward current *1 Peak forward current I FM 200 Input 6 VR Reverse voltage Power dissipation P 15 Collector-emitter voltage VCEO 70 Emitter-collector voltage VECO 6 Output 50 IC Collector current PC 150 Collector power dissipation 170 Total power dissipation Ptot Operating temperature -30 to +100 Topr -55 to +125 Tstg Storage temperature *2 Viso Isolation voltage 5 *3 260 Soldering temperature Tsol 0.5TYP. 2 Applications Model No. Rank mark PC81710NSZ A, B, C or no mark A PC81711NSZ B PC81712NSZ C PC81713NSZ A or B PC81715NSZ B or C PC81716NSZ PC81718NSZ A, B or C 4 8 1 7 1 4.580.5 1 2.540.25 1.20.3 Anode mark 0.60.2 1. Low input current type(IF=0.5mA) 2. High resistance to noise due to high common rejection voltage (CMR:MIN. 10kV/s) 3. Compact dual-in line package 4. Isolation voltage(Viso:5kVrms) 5. Recognized by UL, file No. E64380 (Unit : mm) 3 4 Anode Cathode Emitter Collector Unit mA mA V mW V V mA mW mW C C kVrms C *1 Pulse width<=100s, Duty ratio=0.001 *2 40 to 60%RH, AC for 1 minute, f=60Hz *3 For 10s Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/ PC8171XNSZ Series Transfer characteristics Output Input Electro-optical Characteristics Parameter Symbol Forward voltage VF Reverse current IR Terminal capacitance Ct Collector dark current ICEO Collector-emitter breakdown voltage BVCEO Emitter-collector breakdown voltage BVECO IC Collector current Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Cf Floating capacitance tr Rise time Response time tf Fall time *1 CMR Common mode rejection voltage (Ta=25C) MIN. - - - - Conditions IF=10mA VR=4V V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10A, IF=0 IF=0.5mA, VCE=5V IF=10mA, IC=1mA DC500V 40 to 60%RH V=0, f=1MHz 5x1010 - - - 1x1011 0.6 4 3 1.0 18 18 Unit V A pF nA V V mA V pF s s 10 - - kV/s 70 6 0.5 - VCE=2V, IC=2mA, RL=100 Ta=25C, RL=470, VCM=1.5kV (peak), IF=0mA, VCC=9V, Vnp=100mV TYP. 1.2 - 30 - - - MAX. 1.4 10 250 100 - - - - 3.0 0.2 - *1 Refer to Fig.1. Fig.1 Test Circuit for Common Mode Rejection Voltage (dV/dt) VCM RL 1) VCC Vnp VCM Fig.3 Diode Power Dissipation vs. Ambient Temperature Diode power dissipation P (mW) Forward current IF (mA) Fig.2 Forward Current vs. Ambient Temperature 10 5 0 -30 0 Vnp Vcp VCM : High wave VO pulse (Vcp Nearly = dV/dtxCfxRL) RL=470 1) Vcp : Voltage which is generated by displacement current in floating VCC=9V capacitance between primary and secondary side. 25 50 75 Ambient temperature Ta (C) 100 125 15 10 5 0 -30 0 25 50 75 Ambient temperature Ta (C) 100 125 PC8171XNSZ Series Fig.5 Total Power Dissipation vs. Ambient Temperature Total power dissipation Ptot (mW) Collector power dissipation PC (mW) Fig.4 Collector Power Dissipation vs. Ambient Temperature 200 150 100 50 0 -30 0 25 50 75 100 200 170 150 100 50 0 -30 125 0 25 50 75 100 125 Ambient temperature Ta (C) Ambient temperature Ta (C) Fig.6 Peak Forward Current vs. Duty Ratio Fig.7 Forward Current vs. Forward Voltage 100 Pulse width <=100s Ta=25C 1000 Forward current IF (mA) Peak forward current IFM (mA) 2000 500 200 100 50 10 Ta=25C Ta=100C Ta=0C Ta=75C 1 Ta=-25C Ta=50C 20 10 -3 5 10 2 5 10 -2 2 -1 5 10 0.1 2 5 0 1 0.5 Fig.8 Current Transfer Ratio vs. Forward Current 800 2.0 40 Ta=25C PC (MAX.) 600 Collector current IC (mA) Current transfer ratio CTR (%) 1.5 Fig.9 Collector Current vs. Collector-emitter Voltage VCE=5V Ta=25C 700 1.0 Forward voltage VF (V) Duty ratio 500 400 300 200 30 IF=7mA IF=5mA 20 IF=3mA IF=2mA 10 IF=1mA 100 0 0.1 IF=0.5mA 0 1 Forward current IF (mA) 10 0 2 4 6 8 Collector-emitter voltage VCE (V) 10 PC8171XNSZ Series Fig.10 Relative Current Transfer Ratio vs. Ambient Temperature Fig.11 Collector - emitter Saturation Voltage vs. Ambient Temperature Collector-emitter saturation voltage VCE (sat) (V) Relative current transfer ratio (%) 150 VCE=5V IF=0.5mA 100 50 0 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 0.16 IF=10mA IC=1mA 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Ambient temperature Ta (C) Ambient temperature Ta (C) Fig.12 Collector Dark Current vs. Ambient Temperature 1000 VCE=50V VCE=2V IC=2mA Ta=25C 10-6 100 10-7 Response time (s) Collector dark current ICEO (A) 10-5 Fig.13 Response Time vs. Load Resistance 10-8 10-9 tf 10 ts tr 1 10-10 10-11 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 0.1 0.1 1 Ambient temperature Ta (C) 10 Load resistance RL (k) Fig.14 Response Time vs. Load Resistance (Saturation) Fig.15 Test Circuit for Response Time 1000 VCC VCC=5V IF=16mA Ta=25C RD tf 100 Response time (s) td Input RL Output Input Output 10% ts td tr 10 td 1 tr 0.1 1 10 Load resistance RL (k) 100 ts tf 90% PC8171XNSZ Series Fig.17 Collector-emitter Saturation Voltage vs. Forward Current Fig.16 Voltage Gain vs Frequency VCE=2V IC=2mA Ta=25C Voltage gain AV (dB) 0 -5 RL=10k 1k -10 100 -15 -20 -25 0.1 1 10 100 1000 Frequency f (kHz) Only one time soldering is recommended within the temperature profile shown below. 230C 200C 180C 25C 10s 30s 1min 5 IC=7mA Ta=25C IC=5mA 4 IC=3mA IC=2mA 3 IC=1mA IC=0.5mA 2 1 0 0 2 4 6 Forward current IF (mA) Fig.18 Reflow Soldering 2min Collector-emitter saturation voltage VCE (sat) (V) 5 1min 8 10 Application Circuits NOTICE The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). Contact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. 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