PC8171X NSZ Series
PC8171XNSZ Series
■ Rank Table
■ Absolute Maximum Ratings
■ Outline Dimensions (Unit : mm)
Low Input Current Type
Photocoupler
1. Programmable controllers
2. Facsimiles
3. Telephones
■ Features
■ Applications
1. Low input current type(IF=0.5mA)
2. High resistance to noise due to high common rejection
voltage (CMR:MIN. 10kV/µs)
3. Compact dual-in line package
4. Isolation voltage(Viso:5kVrms)
5. Recognized by UL, file No. E64380
*1 Pulse width<=100µs, Duty ratio=0.001
*2 40 to 60%RH, AC for 1 minute, f=60Hz
*3 For 10s
Parameter Symbol Rating Unit
Forward current
Peak forward current
IF
IFM
10
200
mA
mA
mA
Reverse voltage
Input
Output
VRV
V
Power dissipation
Collector-emitter voltage
P 15
Collector power dissipation
Collector current
Total power dissipation
150
70
50
mW
mW
mW
Ptot
IC
PC
VCEO
V
Emitter-collector voltage
6
VECO
Viso kVrms
170
Operating temperature
Topr −55 to +125
−30 to +100 °C
°C
Storage temperature
Isolation voltage
Tstg
*2
*3
*1
Soldering temperature
Tsol 260
5°C
(Ta=25°C)
6
8 1 7 1
4.58±0.5
0.6±0.2
1.2±0.3
2.54±0.25
6.5±0.5
7.62±0.3 4.58±0.5
3.5±0.5
3.0±0.5
2.7±0.5
0.5TYP.
Anode mark
0.5±0.1
0.26±0.1
θθ
θ : 0 to 13°
Epoxy resin
1
2
3
4
AnodeAnode
Cathode
Emitter
Collector
Internal connection diagram
1
2
4
3
1
2
4
3
Model No. Rank mark Ic (mA) Conditions
PC81710NSZ
PC81711NSZ
PC81712NSZ
PC81713NSZ
PC81715NSZ
PC81716NSZ
PC81718NSZ
A, B, C or no mark
A
B
C
A or B
B or C
A, B or C
0.5 to 3.0
0.6 to 1.5
0.8 to 2.0
1.0 to 2.5
0.6 to 2.0
0.8 to 2.5
0.6 to 2.5
IF=0.5mA
VCE=5V
Ta=25°C
Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
PC8171XNSZ Series
■ Electro-optical Characteristics
Parameter Symbol MIN. TYP. MAX. Unit
Forward voltage
Reverse current
Collector current
Isolation resistance
Floating capacitance
Response time
Common mode rejection voltage
Terminal capacitance
Collector dark current
Emitter-collector breakdown voltage
Collector-emitter breakdown voltage
Collector-emitter saturation voltage
Rise time
Fall time
VF
IR
Ct
ICEO
BVCEO
BVECO
RISO
Cf
IC
VCE (sat)
tr
tf
CMR
Conditions
IF=10mA
IF=0.5mA, VCE=5V
IF=10mA, IC=1mA
V=0, f=1kHz
VCE=50V, IF=0
IC=0.1mA, IF=0
IE=10µA, IF=0
DC500V 40 to 60%RH
V=0, f=1MHz
VCE=2V, IC=2mA, RL=100Ω
Ta=25°C, RL=470Ω, VCM=1.5kV (peak),
IF=0mA, VCC=9V, Vnp=100mV
1.4 V
VR=4V −
−
−
−
−
−
70
6
0.5
5×1010 1×1011
30
1.2
−
−
3.0
250
−0.6 1.0
−418
−318
100
−
10 −−
10
V
−−
−
V
V
−0.2
−
µA
µs
µs
kV/µs
mA
pF
pF
nA
Ω
(Ta=25°C)
InputOutputTransfer characteristics
*1 Refer to Fig.1.
*1
Fig.2 Forward Current vs. Ambient
Temperature
Fig.1 Test Circuit for Common Mode Rejection Voltage
VCM
Vcp Vnp
VO
(dV/dt)
1)
RLVnp VCC
VCM (Vcp Nearly = dV/dt×Cf×RL)
1) Vcp : Voltage which is generated by displacement current in floating
capacitance between primary and secondary side.
VCM : High wave
pulse
RL=470Ω
VCC=9V
Forward current IF (mA)
Ambient temperature Ta (°C)
0
10
5
−30 0 25 50 75 100 125
Fig.3
Diode Power Dissipation vs. Ambient
Temperature
Diode power dissipation P (mW)
Ambient temperature Ta (°C)
0
15
10
5
−30 0 25 50 75 100 125
PC8171XNSZ Series
Fig.6 Peak Forward Current vs. Duty Ratio Fig.7 Forward Current vs. Forward Voltage
Fig.9 Collector Current vs. Collector-emitter
Voltage
Peak forward current IFM (mA)
Duty ratio
10
1000
100
10−2
10−310−1
22 2555 5 1
2000
200
20
500
50
Pulse width <=100µs
Ta=25°C
Forward current IF (mA)
0.1
1
10
100
0 0.5 1.0 1.5 2.0
Forward voltage VF (V)
Ta=25°C
Ta=75°C
Ta=100°C
Ta=50°C
Ta=0°C
Ta=−25°C
Collector current IC (mA)
Collector-emitter voltage VCE (V)
0
40
0246810
Ta=25°C
30
20
10
PC (MAX.)
IF=7mA
IF=5mA IF=3mA
IF=2mA
IF=1mA IF=0.5mA
Fig.5
Total Power Dissipation vs. Ambient
Temperature
Total power dissipation Ptot (mW)
Ambient temperature Ta (°C)
0
200
150
170
100
50
−30 0 25 50 75 100 125
Fig.4 Collector Power Dissipation vs.
Ambient Temperature
Collector power dissipation PC (mW)
Ambient temperature Ta (°C)
0
200
150
100
50
−30 0 25 50 75 100 125
Fig.8 Current Transfer Ratio vs. Forward
Current
Current transfer ratio CTR (%)
Forward current IF (mA)
0.1 1 10
0
800
700
600
500
400
300
200
100
VCE=5V
Ta=25°C
PC8171XNSZ Series
Fig.14
Response Time vs. Load Resistance
(Saturation)
Response time (µs)
0.1
1000
1 10 100
Load resistance RL (kΩ)
VCC=5V
IF=16mA
Ta=25°Ctf
tr
td
ts
100
10
1
Fig.10 Relative Current Transfer Ratio vs.
Ambient Temperature
Relative current transfer ratio (%)
Ambient temperature Ta (°C)
−30 1009080706050403020100−10−20
VCE=5V
IF=0.5mA
0
150
100
50
Fig.13 Response Time vs. Load Resistance
Response time (µs)
0.1
1000
0.1 1 10
Load resistance RL (kΩ)
VCE=2V
IC=2mA
Ta=25°C
tf
tr
td
ts
100
10
1
Fig.12 Collector Dark Current vs. Ambient
Temperature
Ambient temperature Ta (°C)
−30 1009080706050403020100−10−20
VCE=50V
10−11
10−5
10−6
10−7
10−8
10−9
10−10
Collector dark current ICEO (A)
Fig.11 Collector - emitter Saturation Voltage
vs. Ambient Temperature
Fig.15 Test Circuit for Response Time
Collector-emitter saturation voltage VCE (sat) (V)
Ambient temperature Ta (°C)
0
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
IF=10mA
IC=1mA
−30 1009080706050403020100−10−20
10%
Input
Output
Input Output
90%
ts
td
VCC
RDRL
tf
tr
PC8171XNSZ Series
Fig.18 Reflow Soldering
25°C
2min
230°C
200°C
180°C
1min
30s
1min
10s
Only one time soldering is recommended within the temperature
profile shown below.
Fig.16
Voltage Gain vs Frequency
Voltage gain AV (dB)
−25
5
0.1 1 10 100 1000
Frequency f (kHz)
VCE=2V
IC=2mA
Ta=25°C
0
−5
−10
−15
−20
RL=10kΩ
1kΩ
100Ω
Fig.17 Collector-emitter Saturation Voltage
vs. Forward Current
Collector-emitter saturation voltage VCE (sat) (V)
Forward current IF (mA)
0
5
0246810
Ta=25°C
4
3
2
1
IC=7mA
IC=5mA
IC=3mA
IC=2mA
IC=1mA
IC=0.5mA
115
Application Circuits
NOTICE
●The circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
●Observe the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
●If the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
●This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
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