AFBR-59F3Z
Compact 650 nm Transceiver for 1 Gbps Data communication
MLCC (Multilevel Coset Coded) over POF (Polymer Optical Fiber)
Data Sheet
Description
The Avago Technologies' AFBR-59F3Z transceiver pro-
vides system designers with the ability to support serial
communication to data rates of one Gigabit over 2.2 mm
jacketed standard Polymer Optical Fiber (POF).
The innovative bare ber locking mechanism of the
transceiver allows connection of POF cable with a simple
insert-and-lock system; no connectors are required. This
enables very fast installation and maintenance. This very
compact designed Laser Class 1 product is UL listed, lead
free and compliant with RoHS. The form factor is similar to
the well known RJ-45 connector.
Transmitter
The transmitter contains a 650 nm LED, which is driven by
a fully integrated driver IC. The LED driver operates at 3.3
V. The IC is a linear integrated LED driver with dierential
input signals. It converts the input voltage linear in an out-
put current for the LED. The driver needs an active Power-
Enable signal for active current output. With a Low signal
on the PowerEnable pin, the driver is set to power-saving
state. LED and IC are packaged in an optical subassembly.
The optical subassembly couples the optical output pow-
er over a optic lens eciently into the POF ber.
Receiver
The receiver device utilizes an integrated ber optical
receiver oering an integrated PIN photodiode together
with the necessary ampliers, which provide direct con-
version of light to dierential analog output signal.
Receiver circuitry provides an analog receive power moni-
tor output proportional to the amount of optical light at
the receiver.
The integrated receiver is packaged in an optical subas-
sembly. This optical subassembly couples the optical
power eciently from POF ber to the receiving PIN. The
integrated IC operates at 3.3V.
The receiver can be set into a power-saving state by ex-
ternally forcing the monitoring pin to a voltage above a
threshold.
Features
• Easy bare ber termination solution for 2.2 mm jacketed
standard POF
• EMI/EMC robust
• Link lengths 50 m for 1 Gbps transmission with 1 mm
core diameter POF (attenuation smaller than 0.19 dB/m
and NA = 0.5)
• Operating temperature range 0 °C to 70 °C
• 3.3 V power supply operation
• Integrated optics to eciently focus light for ber
coupling
• Analog receive power monitor (MON)
Applications
• Home/Oce Networking
• Factory automation
• Industrial vision system
Package
The transceiver package contains the two optical subas-
semblies, which are mounted in the housing for bare ber
connection.
The metal shield on the bare ber clamp transceiver pro-
vides excellent immunity to EMI/EMC.
2
Pin description and recommended PCB footprint
AFBR-597F3Z has ten active signal pins (including supply
voltage and ground pins), two EMI shield solder posts, two
additional ground pins and two mounting posts, which
exit at the bottom of the housing.
The EMI shield and the additional ground pins (11,12,13 &
14) are isolated from the internal circuit of the transceiver
and are to be connected to equipment chassis ground.
Pin Descriptions
Pin No. Name Symbol Pin No. Name Symbol
1 Data Input (Negative) TDN 8 Imon/Rx_En IMON/ Rx_EN
2 Data Input (Positive) TDP 9 Data Output (Negative) RDN
3Ground Tx GND 10 Data Output (Positive) RDP
4Supply Voltage Tx Vdd 11 Chassis GND
5 Tx_ Enable Tx_En 12 Chassis GND
6Supply Voltage Rx Vdd 13 Chassis GND
7 Ground Rx GND 14 Chassis GND
Figure 1. PCB footprint and Pin-out diagram
0
0
▼ ▼
9
8
7
6
4
5
2
3
Outer edge housing
Dimension: mm
Recommended PCB thickness: 1.57 ± 0.08
∅
3.2 (2×)
∅1.3 (2×)
∅0.8 (10×)
Mount Post
Unplated (2×)
∅1.3 (2×)
12
1413
11
10
1
2.74
4.0
5.2
7.74
7.83 5.83 3.89 0
0.76
2.03
3.3
4.57
5.84
FRONT
Top View
The mounting posts are to provide additional mechanical
strength to hold the transceiver module on the applica-
tion board.
Figure 1 shows the top view of the PCB footprint and Pin-
out diagram.
3
Recommended compliance table
Feature Test Method Performance
Electrostatic discharge
(ESD) to the electrical Pins
JESD22-A114 Withstands up to 2 kV HBM applied between the electrical pins.
Eye safety EN 60825-1:52007 Laser Class 1 product (LED radiation only).
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each
parameter in isolation, all other parameters having values within the recommended operation conditions. It should not
be assumed that limiting values of more than one parameter can be applied to the products at the same time. Exposure
to the absolute maximum ratings for extended periods can adversely aect device reliability.
Parameter Symbol Min. Max. Units
Supply Voltage Vdd Max -0.5 4.5 V
Storage Temperature TSTG -40 85 °C
Lead Soldering Temperature [1] Tsold 260 °C
Lead Soldering Time [1] tsold 10 s
Electrostatic Voltage Capability [2] ESD 2.0 kV
Installation temperature [3] TI0 50 °C
Notes:
1. The transceiver is Pb-free wave solderable. According to JEDEC J-STD-020D, the moisture sensitivity classication is MSL2a.
2. ESD Capability for all Pins HBM (human body model) according JESD22-A114B.
3. Temperature range over which bers can be connected or disconnected to or from the bare ber clamp.
Recommended Operating Conditions
Parameter Symbol Min. Typ. Max. Units
Operating temperature TA0 25 70 °C
DC Supply Voltage VDD 3.14 3.30 3.47 V
All the data in this specication refers to the operating conditions above and over lifetime, unless otherwise stated.
Mechanical Characteristics
Parameter Min. Typ. Max. Units Temp. [°C]
Fiber/Cable Retention Force [5] 30 N 25
15 50 N 0...70
Clamp opening force 20 N 25
10 30 N 0....50 [4]
Clamp closing force 13 N 25
5 20 N 0....50 [4]
Notes:
4. Temperature range over which bers can be connected or disconnected to or from the bare ber clamp.
5. Measured with Avago’s AFBR-HUDxxxZ (2.2mm duplex-ber, PE-jacket, without connector) with 100mm/ min traction speed.
4
Transmitter Electrical Characteristics
Parameter Symbol Min. Typ. Max. Units
Current Consumption Idd 47 55 mA
Current Consumption – disabled Idd, Dis 0.4 0.6 0.8 mA
Symbol Rate SR312.5 MSps
Input Impedance to GND ZIN, SE 64 Ω
Common Mode input voltage VIN, CM 190 240 300 mV
Dierential Input Voltage Swing [1] VIN,DIFF 960 1200 mVpk-pk
Transmitter Enable Input Low Voltage [2] VIL -0.3 0.8 V
Transmitter Enable Input High Voltage [2] VIH 2.0 VDD+0.3 V
Notes:
1. To avoid clipping, the dierential input amplitude swing must not exceed 4 × VCM.
2. The transmitter enable PIN has an internal pull-up resistor.
Transmitter Optical Characteristics
Parameter Symbol Min. Typ. Max. Units
Central wavelength lC635 650 675 nm
Spectral Bandwidth (RMS) Dl 17 nm
Average Output Power [3] P -6.0 -2.1 0.5 dBm
Extinction Ratio [3] ER 8 10 dB
Optical Rise Time (10% - 90%) [3, 4] tR2.3 4.0 ns
Optical Fall Time (90% - 10%) [3, 4] tF2.6 4.0 ns
Notes:
3. Measured with binary modulation at a data rate of 125 MBd and with typical VIN,CM and VIN,DIFF. The output power coupled into the POF is measured
with a large area detector at the end of 1 m POF with NA = 0.5, which is ideally coupled to the transmitter.
4. Measured with 62.5 MHz square signal.
Receiver Electrical Characteristics
Parameter Symbol Min. Typ. Max. Units
Current Consumption Idd 12 14 20 mA
Current Consumption – disabled Idd, Dis 0.5 0.7 0.9 mA
Output Common Mode Voltage VOUT, CM 1.18 1.23 1.28 V
Dierential Output Voltage Swing [5] VOUT,DIFF 180 240 300 mVpk-pk
Single-Ended Output Resistance ZOUT,SE 75 Ω
Dierential Output Resistance ZOUT,DIFF 150 Ω
Startup Time from Powersaving tON 300 ns
Shutdown Time to Powersaving tOFF 125 ns
Monitoring Output/Optical Input IMON/ Pin 0.23 A/W
Max. Monitor Voltage [6] VMON,MAX 1.3 V
Input voltage for power save mode VMON,PS-TH 1.8 V
Notes:
5. Conditions: Extinction ratio of optical input signal equal to 10 dB, dierential load=150 Ω.
6. Monitor current is limited by VMON,MAX/Load resistance
Receiver Optical Characteristics
Parameter Symbol Min. Typ. Max. Units
Central wavelength lC635 650 675 nm
5
Informative section
Avago cannot guarantee the following parameters and values because they also depend on the performance of the
PHY chips. However, you can use them to calculate the 1 Gbps link budget. Furthermore, you can use them to gauge
link performance.
Transmitter Optical Characteristics
Parameter Symbol Min. Typ. Max. Units
Average Output Power for 1 Gbps [1] POUT 1Gbps -5.8 -1.9 0.7 dBm
Unstressed Receiver Optical Characteristics
Parameter Symbol Min. Typ. Max. Units
Receiver Input Power for 1 Gbps [1, 2] Pin 1Gbps Min -17.5 3 dBm
Link Performance
Parameter Symbol Min. Typ. Max. Units
Link distance [1, 3] l 50 m
Notes:
1. 1 Gbps transmission based on PAM16 modulation. Tested with KDPOF KD1001 PHY-IC.
2. Only optical attenuator is used to degrade the optical input test signal to the receiver.
3. POF parameters: attenuation smaller than 0.19 dB/m, 1 mm core diameter and NA of 0.5. Direct connection between Tx and Rx without inline
connector or any additional attenuation.
6
Mechanical Data - Package Outline
Figure 2. Package Outline Drawing
Notes:
1. Dimension: mm
2. General tolerance: ±0.1
3. Recommended PCB thickness: 1.57 ± 0.08
4. Design related is a small gap between plastic part and
dust plug possible. Function is nevertheless given.
6
3
11.65
7.78
6.65
2.74
4.0 ± 0.15
9.4 ± 0.2
5.2
0
2.54 (6x)
0.25 ± 0.05 (10×)
0.5 ± 0.05 (10×)
3.75 ± 0.2
1.52
11.4
2.6
24.4 ± 0.25
15
Clamp open Clamp with Dust Plug
15.5 ± 0.25
12 ± 0.2 29.2
4.9
+0.4
-0.2
15.8 ± 0.2
[4]
0.25 ± 0.05
10.85 ± 0.2
0.9 ± 0.15
2.54
1.27 (8x)
15.9 ± 0.15
7
Application Circuit
The recommended application circuit is shown in Figure 3. It shows the minimum external circuitry at DC-coupling for
the connection of the AFBR-59F3Z to the KDPOF 1001-PHY.
GND
[1]
[1]
[2]
10 µF
10 µF 100 nF
10 µF
100 nF
GND
[3]
RDP
RDN
Imon/Rx_EN
GND
Tx_EN
Vdd
GND
TDP
TDN
Vdd
Tx
AFBR-59F3Z
Chassis GND
Rx
OFE_RXP
OFE_RXN
OFE_PMON
OFE_Rx_EN_N
Tx_EN OUT
TxOUT_P
TxOUT_N
KDPOF1001-PHY
237Ω
10 µF
3.3V
[2]
1 µH
1 µH
3.3V
GND
Figure 4. Typical Vmon vs. POF length
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0102030405060
Vmon (V)
POF length (m)
Monitor voltage vs. POF length
Vmon(10k)
Vmon(20k)
Vmon(47k)
Notes:
1. Single-ended output impedance, ZOUT,SE = 75 Ω.
2. Single-ended input impedance, ZIN,SE = 64 Ω.
3. Choose a suitable resistor value such that the output monitor voltage is not saturated. Refer to Figure 4.
Figure 3. Application Circuit with KDPOF KD1001 PHY-IC conguration
Figure 4 depicts the relationship between monitor voltage and POF length with 10 kΩ, 20 kΩ and 47 kΩ.
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved.
AV02-4655EN - December 17, 2014
