Engwinklige LED im MIDLED-Gehause Narrow beam LED in MIDLED package Lead (Pb) Free Product - RoHS Compliant SFH 4640 SFH 4645 SFH 4640 SFH 4645 gema OS-PCN-2009-021-A2 acc. to OS-PCN-2009-021-A2 Wesentliche Merkmale Features * Infrarot LED mit hoher Ausgangsleistung (55 mW) * Emissionswellenlange typ. 950 nm * Enger Abstrahlwinkel ( 15) * Geringe Bauhohe * Als Toplooker und Sidelooker einsetzbar * SFH 4640: Gurtung als Toplooker SFH 4645: Gurtung als Sidelooker * * * * * * Anwendungen Applications * * * * * * * * Infrarotbeleuchtung fur Kameras IR-Datenubertragung Sensorik in der Automobiltechnik Fernsteuerung High Power (55 mW) Infrared LED Peak wavelength typ. 950 nm Narrow halfangle ( 15) Low profile component Usable as top-looking and side-looking device SFH 4640: Taping as Toplooker SFH 4645: Taping as Sidelooker Infrared Illumination for cameras IR Data Transmission Automotive sensors Remote controls Sicherheitshinweise Safety Advices Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefahrlich fur das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, mussen gema den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Typ Type Bestellnummer Ordering Code Strahlstarkegruppierung1) (IF = 100 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) SFH 4640 SFH 4645 Q65110A9369 Q65110A9367 25 (typ. 60) 25 (typ. 60) 1) gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr 2012-03-08 1 SFH 4640, SFH 4645 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top , Tstg - 40 ... + 100 C Sperrspannung Reverse voltage VR 5 V Vorwartsgleichstrom Forward current IF 100 mA Stostrom, tp = 300 s, D = 0 Surge current IFSM 1 A Verlustleistung Power dissipation Ptot 180 mW 340 K/W 180 K/W Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Warmewiderstand Sperrschicht - Lotstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA peak 950 nm Schwerpunkt-Wellenlange der Strahlung Centroid wavelength IF = 100 mA centroid 940 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA 42 nm Abstrahlwinkel Half angle 15 Grad deg. 2012-03-08 2 SFH 4640, SFH 4645 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Aktive Chipflache Active chip area A 0.09 mm2 Abmessungen der aktiven Chipflache Dimension of the active chip area LxB LxW 0.3 x 0.3 mm Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 t r, t f 12 ns VF VF 1.5 (< 1.8) 2.3 (< 3.0) V V Sperrstrom Reverse current IR not designed for A reverse operation Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms e typ 55 mW Temperaturkoeffizient von Ie bzw. e, IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA TCI - 0.5 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV -3 mV/K Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA TC + 0.3 nm/K Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s 2012-03-08 3 SFH 4640, SFH 4645 Strahlstarke Ie in Achsrichtung1) gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Symbol Werte Values Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie max 25 50 40 80 63 125 mW/sr mW/sr Strahlstarke Radiant intensity IF = 1 A, tp = 25 s Ie typ 260 420 660 mW/sr -T 1) -U Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one bin in one packing unit (variation lower 2:1) Abstrahlcharakteristik Radiation Characteristics Irel = f () 40 30 20 10 0 OHF03823 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 1.0 2012-03-08 0.8 0.6 0.4 0 20 40 60 80 4 100 Einheit Unit 120 -V SFH 4640, SFH 4645 Relative Spectral Emission Irel = f () Single pulse, tp = 25 s OHF04134 100 Ie = f (IF) Ie 100 mA Radiant Intensity OHF03821 101 I e (100 mA) I F 90 0 80 80 10 OHF02533 110 mA Ie I rel % Max. Permissible Forward Current IF = f (TA), RthJA = 340 K/W 70 5 60 60 40 10-1 50 5 40 30 10-2 20 20 5 10 10 0 800 850 900 950 nm 1025 0 -3 10 0 5 10 1 5 10 2 Forward Current IF = f (VF) Single pulse, tp = 100 s IF Permissible Pulse Handling Capability IF = f (), TA = 25 C, duty cycle D = parameter OHF03822 100 A mA 10 3 IF IF 1.2 A OHF02532 t tP D = TP 1.0 10-1 IF T D= 5 0.8 10-2 0.6 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 5 0.4 10-3 5 10-4 0.2 0 0.5 1 1.5 2 V 2.5 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp VF 2012-03-08 5 0 20 40 60 80 C 100 TA SFH 4640, SFH 4645 Mazeichnung Package Outlines Mae in mm / Dimensions in mm. Gehause / Package MID mit klarem Silikonverguss / MID casted with clear Silicone Anschlussbelegung Pin configuration Pad 1 = Anode / anode Pad 2 = Kathode / cathode 2012-03-08 6 SFH 4640, SFH 4645 Gurtung / Polaritat und Lage Verpackungseinheit 2000/Rolle, o180 mm oder 9000/Rolle, o330 mm Method of Taping / Polarity and Orientation Packing unit 2000/reel, o180 mm or 9000/reel, o330 mm SFH 4640 Mae in mm (inch) / Dimensions in mm (inch). SFH 4645 Mae in mm (inch) / Dimensions in mm (inch). 2012-03-08 7 SFH 4640, SFH 4645 Empfohlenes Lotpaddesign Recommended Solder Pad Design SFH 4640 2.4 1.35 Padgeometrie fur verbesserte Warmeableitung 4.0 Paddesign for improved heat dissipation Cu-Flache > 16 mm 2 Cu-area Lotstopplack Solder resist OHF02422 SFH 4645 1.7 1.25 Padgeometrie fur verbesserte Warmeableitung 4.5 Paddesign for improved heat dissipation Cu-Flache > 16 mm 2 Cu-area Lotstopplack Solder resist OHF02421 Mae in mm / Dimensions in mm. Verarbeitungshinweis: Das Gehause ist mit Silikon vergossen. Mechanischer Stress auf der Bauteiloberflache sollte so gering wie moglich gehalten werden. Handling indication: 2012-03-08 The package is casted with silicone. Mechanical stress at the surface of the unit should be as low as possible. 8 SFH 4640, SFH 4645 Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020D.01) (acc. to J-STD-020D.01) OHA04525 300 C T 250 Tp 245 C 240 C tP 217 C 200 tL 150 tS 100 50 25 C 0 0 50 100 150 200 s 300 250 t Profileigenschaften Profile Feature Aufheizrate zum Vorwarmen*) / Ramp-up rate to preheat*) Zeit ts von TSmin bis TSmax / Time ts from TSmin to TSmax Aufheizrate zur Spitzentemperatur*) / Ramp-up rate to peak*) Bleifreier Aufbau / Pb-Free Assembly (SnAgCu) Empfehlung / Recommendation Grenzwerte / Max. Ratings 2K/s 3K/s 100 s min. 60 s max. 120 s 2K/s 3K/s 25 C to 150 C 150 C to 200 C 180 C to TP Liquidustemperatur TL / Liquidus temperature TL 217 C Zeit tL uber TL / Time tL above TL 80 s max. 100 s Spitzentemperatur TP / Peak temperature TP 245 C max. 260 C Verweilzeit tP innerhalb des spezifizierten Spitzentemperaturbereichs TP - 5 K / Time tP within the specified peak temperature range TP - 5 K 20 s min. 10 s max. 30 s Abkuhlrate*) / Ramp-down rate*) 3K/s 6 K / s maximum TP to 100 C Zeitspanne von 25 C bis zur Spitzentemperatur / Time from 25 C to peak temperature max. 8 min. Alle Temperaturen beziehen sich auf die Bauteilmitte, jeweils auf der Bauteiloberseite gemessen / All temperatures refer to the center of the package, measured on the top of the package * Steigungsberechnung T/t: t max. 5 s; erfullt uber den gesamten Temperaturbereich / slope calculation T/t: t max. 5 s; fulfillment for the whole T-range 2012-03-08 9 SFH 4640, SFH 4645 Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2012-03-08 10