Si7057/8/9-A10
4 Rev. 1.1
1. Electrical Specifications
Unless otherwise specified, all min/max specifications apply over the recommended operating conditions.
Table 1. Recommended Operating Conditions
Parameter Symbol Test Condition Min Typ Max Unit
Power Supply VDD 1.67 — 1.98 V
Operating Temperature TA–40 — +125 °C
Table 2. General Specifications
1.67 VDD 1.98 V; TA = –40 to +125 °C unless otherwise noted.
Parameter Symbol Test Condition Min Typ Max Unit
Input Voltage High VIH ADD, SCL, SDA pins 0.7xVDD — — V
Input Voltage Low VIL ADD, SCL, SDA pins — — 0.3xVDD V
Input Voltage Range VIN SCL, SDA pins with respect to GND 0.0 — VDD+2 V
ADD pin with respect to GND 0.0 — VDD+0.3 V
Input Leakage IIL ADD, SCL, SDA pins — — 1 μA
Output Voltage Low VOL SDA pin; IOL = 1.5 mA — — 0.4 V
Current Consumption IDD Normal Mode, Temperature conver-
sion in progress, first step1
— 245 288 μA
Normal Mode, Temperature conver-
sion in progress, second step1
— 106 145 μA
Standby, –40 to +85 °C2 — 0.05 0.56 μA
Standby, –40 to +125 °C2 — 0.05 5.2 μA
Peak IDD during powerup3 —45.1 mA
Peak IDD during I2C operations4 — 3.5 4 mA
After writing to user registers5 —11.6 17 µA
Notes:
1. Total conversion time is first-step time plus second-step time.
2. No conversion or I2C transaction in progress. Typical values measured at 25 °C.
3. Occurs once during powerup. Duration is <5 msec.
4. Occurs during I2C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration
is <100 μs when I2C clock speed is >100 kHz (>200 kHz for 2-byte commands).
5. IDD after a user register write. Initiating any other subsequent I2C transaction on the same bus (such as a user register
read, starting an RH measurement, or traffic directed at other I2C devices) will transition the device to standby mode.