SI7057-A10-IM - SILICON LABS

Si7057/8/9-A10

DIGITAL I2C TEMPERATURE SENSOR

Features

Applications

Description

The Si7057/8/9 I2C Temperature Sensors are monolithic CMOS ICs that

integrate temperature sensor elements, an analog-to-digital converter,

signal processing, calibration data, and an I2C interface.

The temperature sensors are factory-calibrated and the calibration data is

stored in the on-chip non-volatile memory. This ensures that the sensors

are fully interchangeable, with no calibration or software changes

required.

The Si7057/8/9 devices are available in a 2x2 mm DFN package and are

reflow solderable. The Si7057/8/9 sensors offer an accurate, low-power,

factory-calibrated digital solution ideal for measuring temperature in

applications ranging from HVAC/R and asset tracking to industrial and

consumer platforms.

High Accuracy Temperature

Sensor

Si7057: ±0.35 °C (max), 0 to 70 °C

Si7058: ±0.5 °C (max), 0 to 70 °C

Si7059: ±1.0 °C (max), 0 to 70 °C

–40 to +125 °C operating range

Low Voltage Operation (1.8 V)

14-bit resolution

Low Power Consumption

50 nA, standby current

Factory-calibrated

I2C Interface

Pin-selectable I2C addresses

2x2 mm QFN package

Excellent long term stability

Mobile smartphones and tablets

Consumer electronics

HVAC/R

White goods

Asset and goods tracking

Thermostats

Micro-environments/data centers

Indoor weather stations

Patent Protected. Patents pending

Ordering Information:

See page 17.

Pin Assignments

DNC

SCL

VDD 1

GND

SDA

ADD

Top View

Si7057/8/9-A10

2 Rev. 1.1

Functional Block Diagram

ADC

GND

SCL

Si705x

Temp

Sensor

SDA

Vdd

1.25V

Ref

Calibration

Memory

Control Logic

ADD

I2C Interface

Si7057/8/9-A10

Rev. 1.1 3

TABLE OF CONTENTS

Section Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2. Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

5. I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

5.1. Issuing a Measurement Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

5.2. Measuring Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

5.3. Firmware Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

5.4. Electronic Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

6. Pin Descriptions: Si7057/8/9 (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

8. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

8.1. Package Outline: 2x2 6-pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

9. PCB Land Pattern and Solder Mask Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

10. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

10.1. Si7057/8/9 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

10.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

11. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

Si7057/8/9-A10

4 Rev. 1.1

1. Electrical Specifications

Unless otherwise specified, all min/max specifications apply over the recommended operating conditions.

Table 1. Recommended Operating Conditions

Parameter Symbol Test Condition Min Typ Max Unit

Power Supply VDD 1.67 — 1.98 V

Operating Temperature TA–40 — +125 °C

Table 2. General Specifications

1.67  VDD  1.98 V; TA = –40 to +125 °C unless otherwise noted.

Parameter Symbol Test Condition Min Typ Max Unit

Input Voltage High VIH ADD, SCL, SDA pins 0.7xVDD — — V

Input Voltage Low VIL ADD, SCL, SDA pins — — 0.3xVDD V

Input Voltage Range VIN SCL, SDA pins with respect to GND 0.0 — VDD+2 V

ADD pin with respect to GND 0.0 — VDD+0.3 V

Input Leakage IIL ADD, SCL, SDA pins — — 1 μA

Output Voltage Low VOL SDA pin; IOL = 1.5 mA — — 0.4 V

Current Consumption IDD Normal Mode, Temperature conver-

sion in progress, first step1

— 245 288 μA

Normal Mode, Temperature conver-

sion in progress, second step1

— 106 145 μA

Standby, –40 to +85 °C2 — 0.05 0.56 μA

Standby, –40 to +125 °C2 — 0.05 5.2 μA

Peak IDD during powerup3 —45.1 mA

Peak IDD during I2C operations4 — 3.5 4 mA

After writing to user registers5 —11.6 17 µA

Notes:

1. Total conversion time is first-step time plus second-step time.

2. No conversion or I2C transaction in progress. Typical values measured at 25 °C.

3. Occurs once during powerup. Duration is <5 msec.

4. Occurs during I2C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration

is <100 μs when I2C clock speed is >100 kHz (>200 kHz for 2-byte commands).

5. IDD after a user register write. Initiating any other subsequent I2C transaction on the same bus (such as a user register

read, starting an RH measurement, or traffic directed at other I2C devices) will transition the device to standby mode.

Si7057/8/9-A10

Rev. 1.1 5

Conversion Time1tCONV Normal Mode,

Temperature conversion first step

3.7 6 ms

Fast Mode,

Temperature conversion first step

0.9 1.5 ms

Normal or Fast Mode,

Temperature conversion second step

2.5 4.0 ms

Powerup Time tPU From VDD ≥1.67 V to ready for a

conversion, 25 °C

— 10 15ms

From VDD ≥1.67 V to ready for a

conversion, full temperature range

— —50ms

After issuing a software reset

command

— 1.2 2.0 ms

Table 2. General Specifications (Continued)

1.67  VDD  1.98 V; TA = –40 to +125 °C unless otherwise noted.

Parameter Symbol Test Condition Min Typ Max Unit

Notes:

1. Total conversion time is first-step time plus second-step time.

2. No conversion or I2C transaction in progress. Typical values measured at 25 °C.

3. Occurs once during powerup. Duration is <5 msec.

4. Occurs during I2C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration

is <100 μs when I2C clock speed is >100 kHz (>200 kHz for 2-byte commands).

5. IDD after a user register write. Initiating any other subsequent I2C transaction on the same bus (such as a user register

read, starting an RH measurement, or traffic directed at other I2C devices) will transition the device to standby mode.

Si7057/8/9-A10

6 Rev. 1.1

Figure 1. I2C Interface Timing Diagram

Table 3. I2C Interface Specifications1

1.67  VDD  1.98 V; TA = –40 to +125 °C unless otherwise noted.

Parameter Symbol Test Condition Min Typ Max Unit

Hysteresis VHYS High-to-low versus

low-to-high transition

0.05 x VDD ——V

SCLK Frequency2fSCL — — 400 kHz

SCL High Time tSKH 0.6 — — µs

SCL Low Time tSKL 1.3 — — µs

Start Hold Time tSTH 0.6 — — µs

Start Setup Time tSTS 0.6 — — µs

Stop Setup Time tSPS 0.6 — — µs

Bus Free Time tBUF Between Stop and Start 1.3 — — µs

SDA Setup Time tDS 100 — — ns

SDA Hold Time tDH 100 — — ns

SDA Valid Time tVD;DAT From SCL low to data valid — — 0.9 µs

SDA Acknowledge Valid Time tVD;ACK From SCL low to data valid — — 0.9 µs

Suppressed Pulse Width3tSP 50 — — ns

Notes:

1. All values are referenced to VIL and/or VIH.

2. Depending on the conversion command, the Si7057/8/9 may hold the master during the conversion (clock stretch). At

above 300 kHz SCL, the Si7057/8/9 may hold the master briefly for user register and device ID transactions. At the

highest I2C speed of 400 kHz the stretching will be <50 µs.

3. Pulses up to and including 50 ns will be suppressed.

SCL

1/fSCL tSKH

SDA

tSKL

tSTH

D6 D5 D0 R/W ACK

tDS tDH

Start Bit Stop Bit

tBUF

tSTS tVD : ACK

tSPS

tSP

Si7057/8/9-A10

Rev. 1.1 7

Figure 2. Typical Temperature Accuracy Figure 3. Max Temperature Accuracy

Table 4. Temperature Sensor

1.67 ≤ VDD ≤1.98 V; TA= –40 to +125 °C unless otherwise noted.

Parameter Symbol Test Condition Min Typ Max Unit

Operating Range –40 — +125 °C

Accuracy1tA =30 °C, Si7057 — 0.2 0.35 °C

tA =30 °C, Si7058 — 0.25 0.5 °C

tA =30 °C, Si7059 — 0.5 1.0 °C

–40 < tA<125 °C — Figure 2 Figure 3 °C

Repeatability/Noise2Normal — 0.03 — °C RMS

Fast — 0.09 — °C RMS

Response Time3τ63% Unmounted device — 0.7 — s

Si7057/8/9-EB — 5.1 — s

Long Term Stability — < 0.01 — °C/Yr

Notes:

1. Normal conversion time.

2. 3-sigma measurement deviation.

3. Time to reach 63% of final value in response to a step change in temperature. Actual response time will vary

dependent on system thermal mass and air-flow.

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.1

1.2

1.3

1.4

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120

Temperature Measurement Error (+/-

ιሻ

Temperature (

ιሻ

Typical Temperature Accuracy

Si7057 Si7058 Si7059

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.1

1.2

1.3

1.4

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120

Temperature Measurement Error (+/-

ιሻ

Temperature (

ιሻ

Max Temperature Accuracy

Si7057 Si7058 Si7059

Si7057/8/9-A10

8 Rev. 1.1

Table 5. Thermal Characteristics

Parameter Symbol Test Condition QFN-6 Unit

Junction to Air Thermal Resistance JA JEDEC 2-Layer Board, No Airflow 173 °C/W

Junction to Air Thermal Resistance JA JEDEC 2-Layer Board, 1 m/s Airflow 153 °C/W

Junction to Air Thermal Resistance JA JEDEC 2-Layer Board, 2 m/s Airflow 146 °C/W

Junction to Case Thermal Resistance JC JEDEC 2-Layer Board 84 °C/W

Junction to Board Thermal Resistance JB JEDEC 2-Layer Board 114 °C/W

Table 6. Absolute Maximum Ratings1,2

Parameter Symbol Test Condition Min Typ Max Unit

Ambient temperature

under bias

–55 — 125 °C

Storage Temperature –65 — 150 °C

Voltage on I/O pins –0.3 — VDD+2.0 V V

Voltage on VDD with

Respect to GND

–0.3 — 2.3 V

ESD Tolerance HBM 2 kV

CDM 1.25 kV

MM 250 V

Notes:

1. Absolute maximum ratings are stress ratings only, operation at or beyond these conditions is not implied and may

shorten the life of the device or alter its performance.

2. Special handling considerations apply; see application note, “AN607: Si70xx Humidity and Temperature Sensor

Designer’s Guide”.

Si7057/8/9-A10

Rev. 1.1 9

2. Typical Application Circuit

The primary function of the Si7057/8/9 is to measure temperature. Figure 4 demonstrates the typical application

circuit to achieve this function. Pin 6 may be left unconnected or tied to VDD.

Figure 4. Typical Application Circuit for Temperature Measurement

GND

SCL

Si705x

1.67 to 1.98V

VDD

0.1µF

SDA

10K

SCL

SDA

ADD

DNC

Si7057/8/9-A10

10 Rev. 1.1

3. Bill of Materials

Table 7. Typical Application Circuit BOM for Temperature Measurement

Reference Description Mfr Part Number Manufacturer

R1 Resistor, 10 k, ±5%, 1/16W, 0402 CR0402-16W-103JT Venkel

R2 Resistor, 10 k, ±5%, 1/16W, 0402 CR0402-16W-103JT Venkel

C1 Capacitor, 0.1 µF, 6.3 V, X7R, 0402 C0402X7R6R3-104MNP Venkel

U1 IC, Digital Temperature Sensor Si7057/8/9-A10-IM Silicon Labs

Si7057/8/9-A10

Rev. 1.1 11

4. Functional Description

Figure 5. Si7057/8/9 Block Diagram

The Si7057/8/9 are digital temperature sensors that integrate a sensor element, an analog-to-digital converter,

signal processing, calibration, polynomial non-linearity correction, and an I2C interface all in a single chip. The

Si7057/8/9 are factory-calibrated with the calibration data stored in on-chip non-volatile memory. This ensures that

the sensor is fully interchangeable, with no recalibration or changes to software required. The Si7057/8/9 offer low

power, high accuracy, calibrated and stable solution ideal for a wide range of temperature applications including

medical and instrumentation, high-reliability automotive and industrial systems, and cost-sensitive consumer

electronics.

ADC

GND

SCL

Si705x

Temp

Sensor

SDA

Vdd

1.25V

Ref

Calibration

Memory

Control Logic

ADD

I2C Interface

Si7057/8/9-A10

12 Rev. 1.1

5. I2C Interface

The Si7057/8/9 communicates with the Host controller over a digital I2C interface. The 7-bit base slave address is

pin-selectable to be either 0x71 (ADD pin low) or 0x72 (ADD pin high).

Master I2C devices communicate with the Si7057/8/9 using a command structure. The commands are listed in the

I2C command table. Commands other than those documented below are undefined and should not be sent to the

device.

Table 8. I2C Slave Address Byte

Bit A6A5A4A3A2A1A0R/W

Value when ADD Low 11100011/0

Value when ADD High 11100101/0

Table 9. I2C Command Table

Command Hold/No Hold Mode Hex Code

Read Electronic ID:

Two Separate IDs with checksum

— 0xFA 0x0F

Read Electronic ID:

Two Separate IDs with checksum

— 0xFC 0xC9

Soft Reset — 0xFE

Temperature Measurement:

Normal Mode

Hold Mode 0x7C 0xA2

Temperature Measurement:

Normal Mode

No Hold Mode 0x78 0x66

Temperature Measurement:

Fast Mode

Hold Mode 0x64 0x58

Temperature Measurement:

Fast Mode

No Hold Mode 0x60 0x9C

Query Device Device will ACK command,

No Functional Effect or

response

0x80 0x5D

Query Device Response 0x00 0x47 0x2B 0xEF 0xC8

Read Firmware Revision — 0x84 0xF1

Si7057/8/9-A10

Rev. 1.1 13

5.1. Issuing a Measurement Command

The measurement commands instruct the Si7057/8/9 to perform temperature measurements. The procedure to

issue any one of these commands is identical. While the measurement is in progress, the option of either clock

stretching (Hold Master Mode) or Not Acknowledging read requests (No Hold Master Mode) is available to indicate

to the master that the measurement is in progress; the chosen command code determines which mode is used. A

checksum byte is returned from the slave for use in checking for transmission errors. The checksum byte will follow

the least significant measurement byte. The checksum byte is calculated using a CRC generator polynomial of

x8 + x5 + x4 + 1, with an initialization of 0xFC.

In the I2C sequence diagrams in the following sections, bits produced by the master and slave are color coded as

shown:

Table 10. I2C Bit Descriptions

Name Symbol Description

START S SDA goes low while SCL high.

STOP P SDA goes high while SCL high.

Repeated START Sr SDA goes low while SCL high. It is allowable to generate a STOP before the

repeated start. SDA can transition to high before or after SCL goes high in

preparation for generating the START.

READ R Read bit = 1

WRITE W Write bit = 0

All other bits — SDA value must remain high or low during the entire time SCL is high (this

is the set up and hold time in Figure 1).

SequencetoPerformaMeasurementandReadBackResult(HoldMode)

SSlave

Address W A Command

Byte 1 ACommand

Byte 2 ASr Slave

Address

R A ClockStretchDuring

Measurement TempMSB A TempLSB A Checksum*NA P

*Note: Reading the checksum is optional. If the checksum is not needed, then NA and STOP after the Temp LSB.

SequencetoPerformaMeasurementandReadBackResult(NoHoldMode)

SSlave

Address W A Command

Byte 1 ACommand

Byte 2 ASr Slave

Address

RNA1Sr Slave Address R ATe mp MS B A Temp LSB A Checksum2NA P

Notes:

1. Device will NACK the slave address byte until conversion is complete.

2. Reading the checksum is optional. If the checksum is not needed then NA and STOP after the Temp LSB.

Si7057/8/9-A10

14 Rev. 1.1

The Si7057/8/9 devices are software-compatible with Si7034 relative humidity and temperature sensor. If an ACK

is sent to the Si7057/8/9 after the temp checksum, two more data bytes can be read from the Si7057/8/9 along with

a second checksum value. The data contained within these two data bytes is undefined, but the 2nd checksum

value will be correct for the data that is contained within the two additional data bytes.

5.2. Measuring Temperature

The results of the temperature measurement may be converted to temperature in degrees Celsius (°C) using the

following expression:

Where:

Temperature (°C) is the measured temperature value in °C

Temp_Code is the 16-bit word returned by the Si7057/8/9

5.3. Firmware Revision

The internal firmware revision can be read with the following I2C transaction:

The values in this field are encoded as follows: 0x10 = Firmware version 1.0

SSlave

Address WA0x84A0xF1ASr Slave

Address

R A FWREV ANA P

T45–175 Temp_Code

216

----------------------------------

+=

Si7057/8/9-A10

Rev. 1.1 15

5.4. Electronic Serial Number

The Si7057/8/9 provides a serial number individualized for each device that can be read via the I2C serial interface.

Two I2C commands are required to access the device memory and retrieve the complete serial number. The

command sequence, and format of the serial number response is described in the figure below:

First access:

The format of the complete serial number is 64-bits in length, divided into 8 data bytes. The complete serial number

sequence is shown below:

The SNB3 field contains the device identification to distinguish between the different Silicon Labs temperature

devices. The value of this field maps to the following devices according to this table:

0x00 or 0xFF engineering samples

0x39 = Si7057

0x40 = Si7058

0x41 = Si7059

Master Slave

S Slave Address W ACK 0xFA ACK 0X0F ACK

S Slave Address R ACK

SNA_3 ACK CRC ACK SNA_2 ACK CRC ACK

SNA_1 ACK CRC ACK SNA_0 ACK CRC NACK P

2nd Access:

S Slave Address W ACK 0xFC ACK 0XC9 ACK

S Slave Address R ACK

SNB_3 ACK SNB_2 ACK CRC ACK

SNB_1 ACK SNB_0 ACK CRC NACK P

SNA_3 SNA_2 SNA_1 SNA_0 SNB_3 SNB_2 SNB_1 SNB_0

Si7057/8/9-A10

16 Rev. 1.1

6. Pin Descriptions: Si7057/8/9 (Top View)

Pin Name Pin # Pin Description

VDD 1 Power. This pin is connected to the power supply on the circuit board.

SCL 2 I2C clock

ADD 3 Tie this pin low for I2C address 0x71, or tie this pin high for address 0x72.

SDA 4 I2C data

GND 5 Ground. This pin is connected to ground on the circuit board.

DNC 6 Leave unconnected, or tie to VDD.

DNC

SCL

VDD 1

GND

ADD

SDA

Si7057/8/9-A10

Rev. 1.1 17

7. Ordering Guide

Table 11. Device Ordering Guide

Part Number Description Max. Accuracy Pkg Packing Format

Si7057-A10-IM Digital temperature sensor ±0.35 °C QFN 6 Cut Tape

Si7057-A10-IMR Digital temperature sensor ±0.35 °C QFN 6 Tape and Reel

Si7058-A10-IM Digital temperature sensor ±0.5 °C QFN 6 Cut Tape

Si7058-A10-IMR Digital temperature sensor ±0.5 °C QFN 6 Tape and Reel

Si7059-A10-IM Digital temperature sensor ±1.0 °C QFN 6 Cut Tape

Si7059-A10-IMR Digital temperature sensor ±1.0 °C QFN 6 Tape and Reel

Si7057/8/9-A10

18 Rev. 1.1

8. Package Outline

8.1. Package Outline: 2x2 6-pin QFN

Figure 6 illustrates the package details for the Si7057/8/9.

Figure 6. Si7057/8/9 Package Drawing

Table 12. Package Dimensions

Dimension Min Nom Max

A 0.70 0.75 0.80

b 0.30 0.35 0.40

D 2.00 BSC

E 2.00 BSC

e 1.00 BSC

D2 0.60 0.70 0.80

E2 1.50 1.60 1.70

g 0.20 0.25 0.30

L 0.30 0.35 0.40

aaa 0.10

bbb 0.10

ccc 0.08

ddd 0.10

Notes:

1. All dimensions shown are in millimeters (mm).

2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.



Si7057/8/9-A10

Rev. 1.1 19

9. PCB Land Pattern and Solder Mask Design

Figure 7. PCB Land Pattern Dimensions

Table 13. PCB Land Pattern Dimensions

Symbol mm

C1 2.00

E1 1.00

E2 0.90

X1 0.40

Y1 0.75

Z0.80

Notes:

General

1. All dimensions shown are in millimeters (mm).

2. This Land Pattern Design is based on the IPC-7351 guidelines.

3. All dimensions shown are at Maximum Material Condition (MMC). Least Material

Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.

Solder Mask Design

4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the

solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.

Stencil Design

5. A stainless steel, laser-cut and electropolished stencil with trapezoidal walls should

be used to assure good solder paste release.

6. The stencil thickness should be 0.125 mm (5 mils).

7. The ratio of stencil aperture to land pad size should be 1:1 for all pads.

Card Assembly

8. A No-Clean, Type-3 solder paste is recommended.

9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification

for Small Body Components.



Si7057/8/9-A10

20 Rev. 1.1

10. Top Marking

10.1. Si7057/8/9 Top Marking

10.2. Top Marking Explanation

Mark Method: Laser

Font Size: 0.40 mm

Line 1 Marking: 705 = Device Code

Line 2 Marking: TTTT = Manufacturing Trace Code Digits 1–4

Line 3 Marking: Circle = 0.35 mm Diameter



Si7057/8/9-A10

Rev. 1.1 21

11. Additional Reference Resources

AN607: Si70xx Humidity and Temperature Sensor Designer’s Guide

AN1026: Si70xx Temperature Sensor Designer's Guide

Si7057/8/9-A10

22 Rev. 1.1

DOCUMENT CHANGE LIST

Revision 0.9 to Revision 1.0

Clarified Features list on page 1.

Revision 1.0 to Revision 1.1

April 18, 2017

Changed Si7057 max inaccuracy spec to 0.35 C

(was 0.2 C).

Updated Figure 2 and Figure 3.

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Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or

intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"

parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes

without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included

information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted

hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of

Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant

personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass

destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.

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