MP34DT06JTR - STMICROELECTRONICS

Features

• Single supply voltage

• Low power consumption

• AOP = 122.5 dBSPL

• 64 dB signal-to-noise ratio

• Omnidirectional sensitivity

• –26 dBFS ± 1 dB sensitivity

• PDM output

• HCLGA package

– Top-port design

– SMD-compliant

– EMI-shielded

–ECOPACK®, RoHS, and “Green” compliant

Applications

• Mobile terminals

• Laptop and notebook computers

• Portable media players

• VoIP

• Speech recognition

• A/V eLearning devices

• Gaming and virtual reality input devices

• Digital still and video cameras

• Antitheft systems

Description

The MP34DT06J is an ultra-compact, low-power, omnidirectional, digital MEMS

microphone built with a capacitive sensing element and an IC interface.

The sensing element, capable of detecting acoustic waves, is manufactured using a

specialized silicon micromachining process dedicated to producing audio sensors.

The IC interface is manufactured using a CMOS process that allows designing a

dedicated circuit able to provide a digital signal externally in PDM format.

The MP34DT06J is a low-distortion digital microphone with a 64 dB signal-to-noise

ratio and –26 dBFS ± 1 dB sensitivity.

The MP34DT06J is available in a top-port, SMD-compliant, EMI-shielded package

and is guaranteed to operate over an extended temperature range from -40 °C to

+85 °C.

Product status link

MP34DT06J

Product summary

Order code MP34DT06JTR

Temperature

range -40 °C to +85 °C

Package HCLGA

(3 x 4 x 1 mm) 4 LD

Packing Tape and reel

MEMS audio sensor omnidirectional digital microphone

MP34DT06J

Datasheet

DS12698 - Rev 1 - July 2018

For further information contact your local STMicroelectronics sales office.

www.st.com

1Pin description

Figure 1. Pin connections

GND

CLKLR

DOUT

Vdd

BOTTOM VIEW

Table 1. Pin description

Pin # Pin name Function

1 Vdd Power supply

2 LR Left/Right channel selection

3 CLK Synchronization input clock

4 DOUT Left/Right PDM data output

(ground ring) GND Ground

MP34DT06J

Pin description

DS12698 - Rev 1 page 2/19

2Acoustic and electrical specifications

2.1 Acoustic and electrical characteristics

The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25 °C, unless otherwise

noted.

Table 2. Acoustic and electrical characteristics

Symbol Parameter Test condition Min. Typ. (1) Max. Unit

Vdd Supply voltage 1.6 1.8 3.6 V

Idd Current consumption in normal mode Mean value 650 µA

IddPdn Current consumption in power-down mode (2) 5 µA

Scc Short-circuit current 1 10 mA

AOP Acoustic overload point 122.5 dBSPL

So Sensitivity -27 -26 -25 dBFS

SNR Signal-to-noise ratio A-weighted @1 kHz,

94 dB SPL 64 dB(A)

PSR Power supply rejection 100 mVpp sine 1 kHz -90 dBFS

Clock Input clock frequency (3) 1.2 2.4 3.25 MHz

Ton Turn-on time (4) Guaranteed by design 10 ms

Top Operating temperature range -40 +85 °C

VIOL Low-level logic input/output voltage Iout = 1 mA -0.3 0.35xVdd V

VIOH High-level logic input/output voltage Iout = 1 mA 0.65xVdd Vdd+0.3 V

CLOAD Capacitive load 100 pF

1. Typical specifications are not guaranteed.

2. Input clock in static mode.

3. Duty cycle: min = 40% max = 60%.

4. Time from the first clock edge to valid output data.

Table 3. Distortion specifications @ 1 kHz

Parameter Test condition Typical value (1)

Distortion 94 dBSPL 0.2% THD + N

Distortion 110 dBSPL 0.7% THD + N

Distortion 120 dBSPL 6% THD + N

1. Typical specifications are not guaranteed.

MP34DT06J

Acoustic and electrical specifications

DS12698 - Rev 1 page 3/19

2.2 Timing characteristics

Table 4. Timing characteristics

Parameter Description Min. Max. Unit

fCLK Clock frequency for normal mode 1.2 3.25 MHz

fPD Clock frequency for power-down mode 0.23 MHz

TCLK Clock period for normal mode 308 1000 ns

TR,EN Data enabled on DATA line, L/R pin = 1 70 90 ns

TR,DIS Data disabled on DATA line, L/R pin = 1 4.3 5.3 ns

TL,EN Data enabled on DATA line, L/R pin = 0 64 87 ns

TL,DIS Data disabled on DATA line, L/R pin = 0 3.5 4.3 ns

Figure 2. Timing waveforms

High Z High Z

TL,EN

R,DIS

R,EN

L,DIS

TCLK

CLK

PDM R

PDM L

MP34DT06J

Timing characteristics

DS12698 - Rev 1 page 4/19

2.3 Frequency response

Figure 3. Typical frequency response normalized to 1 kHz

MP34DT06J

Frequency response

DS12698 - Rev 1 page 5/19

3Application recommendations

Figure 4. MP34DT06J electrical connections (top view)

Ground ring

L / R

CODEC

CLK

Dout

100nF

1µF

Vdd

TOP VIEW

Figure 5. MP34DT06J electrical connections for stereo configuration (top view)

Ground ring

L / R

CODEC

CLK

Dout 1

Vdd

100nF

1µF

Vdd

TOP VIEW

Dout

Power supply decoupling capacitors (100 nF ceramic, 1 μF ceramic) should be placed as near as possible to pin

1 of the device (common design practice).

The L/R pin must be connected to Vdd or GND (refer to Table 6. L/R channel selection).

MP34DT06J

Application recommendations

DS12698 - Rev 1 page 6/19

4Carrier tape mechanical specifications

Figure 6. Carrier tape without microphone (top view)

Figure 7. Carrier tape with microphone (top view)

MP34DT06J

Carrier tape mechanical specifications

DS12698 - Rev 1 page 7/19

5Process recommendations

To ensure a consistent manufacturing process it is strongly advised to comply with the following

recommendations:

• The recommended pick-up area for the MP34DT06J package must be defined using the worst case (ie. no

device alignment during picking process). This area has been defined considering all the tolerances of the

components involved (reel, package, sound inlet). The picker tolerance shall be considered as well.

• To prevent damage to the MEMS membrane or incorrect pick-up and placement, do not pick up the

component on the inlet area.

• For the package outline please refer to Figure 7. Carrier tape with microphone (top view). Nozzle shape,

size, and placement accuracy are the other key factors to consider when deciding on the coordinates for

picking.

• Device alignment before picking is highly recommended.

• A vacuum force greater than 7 psi must be avoided

• 1 kPa = 0.145 psi (lb/in²) = 0.0102 kgf/cm² = 0.0098 atm

• MSL (moisture sensitivity level) Class 3

• Maximum of 3 reflow cycles is recommended

• All recommended dimensions (device safe-picking area) do not include the pick-and-place equipment

tolerances

Figure 8. Recommended picking area

To have a safe pick-up “by design”, ST strongly advises an ad hoc nozzle.

The following picker ensures that the holes for the vacuum and the air stream are ALWAYS away from the

porthole of the device (4 vacuum ports located at each corner of the device). The recommended nozzle also has

a recess in the form of a cross which guarantees that the porthole is always left at atmospheric pressure. By using

the recommended nozzle, the membrane will not suffer any sudden air disturbances during the picking or placing

of the devices in the tape and reel.

MP34DT06J

Process recommendations

DS12698 - Rev 1 page 8/19

Figure 9. Recommended picker design

MP34DT06J

Process recommendations

DS12698 - Rev 1 page 9/19

6Sensing element

The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate

placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity

between those two plates.

MP34DT06J

Sensing element

DS12698 - Rev 1 page 10/19

7Absolute maximum ratings

Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device under these conditions is not implied. Exposure to

maximum rating conditions for extended periods may affect device reliability.

Table 5. Absolute maximum ratings

Symbol Ratings Maximum value Unit

Vdd Supply voltage -0.3 to 5 V

Vin Input voltage on any control pin -0.3 to Vdd +0.3 V

TSTG Storage temperature range -40 to +125 °C

ESD Electrostatic discharge protection

±2000 (HBM)

±200 (MM)

±750 (CBM)

ESD Product standard EN 55024:2010 - 3 air discharges ±15000 V

This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.

This device is sensitive to electrostatic discharge (ESD), improper handling can cause permanent damage to the part.

MP34DT06J

Absolute maximum ratings

DS12698 - Rev 1 page 11/19

8Functionality

8.1 L/R channel selection

The L/R digital pad lets the user select the DOUT signal pattern as shown in the following table. The L/R pin must

be connected to Vdd or GND.

Table 6. L/R channel selection

L/R CLK low CLK high

GND Data valid High impedance

Vdd High impedance Data valid

Note: As the L/R pin is internally connected to GND via a 200 kohm pull-down resistor, it is not mandatory to

connect the pin itself to GND for the respective channel selection.

MP34DT06J

Functionality

DS12698 - Rev 1 page 12/19

9Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®

packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions

and product status are available at: www.st.com. ECOPACK® is an ST trademark.

9.1 Soldering information

The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards and is qualified for

soldering heat resistance according to JEDEC J-STD-020.

Landing pattern and soldering recommendations are available at www.st.com.

Figure 10. Recommended soldering profile limits

RAMP-DOWN

RAMP-UP

PREHEAT

TLto T P

TSMAX

TSMIN

30 60 90 120 150 180 210 240 270 300 330 360 390

T25° to PEAK

TEMPERATURE

CRITICAL ZONE

TIME

Table 7. Recommended soldering profile limits

Description Parameter Pb free

Average ramp rate TL to TP3 °C/sec max

Preheat

Minimum temperature TSMIN 150 °C

Maximum temperature TSMAX 200 °C

Time (TSMIN to TSMAX) tS60 sec to 120 sec

Ramp-up rate TSMAX to TL

Time maintained above liquidus temperature

Liquidus temperature

60 sec to 150 sec

217 °C

Peak temperature TP260 °C max

Time within 5 °C of actual peak temperature 20 sec to 40 sec

Ramp-down rate 6 °C/sec max

Time 25 °C (t25 °C) to peak temperature 8 minutes max

MP34DT06J

Package information

DS12698 - Rev 1 page 13/19

9.2 HCLGA package information

Figure 11. HCLGA (3 x 4 x 1 mm) 4-lead package outline and mechanical data

Dimensions are in millimeter unless otherwise specified

General Tolerance is +/-0.15mm unless otherwise specified

DM00231908_5

Table 8. Outer dimensions

Item Dimensions (mm) Tolerance (mm)

Length (L) 3 ±0.1

Width (W) 4 ±0.1

Height (H) 1.00 ±0.1

AP Ø 0.25 ±0.05

1. The MEMS microphone plastic cap can exhibit some level of variation in color when the device is subjected

to thermal processes. This variation does not affect acoustic or electrical performance.

2. Ring plating can be subject to change not affecting acoustic and electrical performance.

MP34DT06J

HCLGA package information

DS12698 - Rev 1 page 14/19

Revision history

Table 9. Document revision history

Date Version Changes

17-Jul-2018 1 Initial release

MP34DT06J

DS12698 - Rev 1 page 15/19

Contents

1Pin description ....................................................................2

2Acoustic and electrical specifications..............................................3

2.1 Acoustic and electrical characteristics .............................................3

2.2 Timing characteristics ...........................................................4

2.3 Frequency response ............................................................4

3Application recommendations .....................................................6

4Carrier tape mechanical specifications .............................................7

5Process recommendations ........................................................8

6Sensing element..................................................................10

7Absolute maximum ratings .......................................................11

8Functionality .....................................................................12

8.1 L/R channel selection ..........................................................12

9Package information..............................................................13

9.1 Soldering information ..........................................................13

9.2 HCLGA package information ....................................................13

Revision history .......................................................................15

MP34DT06J

Contents

DS12698 - Rev 1 page 16/19

List of tables

Table 1. Pin description......................................................................2

Table 2. Acoustic and electrical characteristics......................................................3

Table 3. Distortion specifications @ 1 kHz .........................................................3

Table 4. Timing characteristics .................................................................4

Table 5. Absolute maximum ratings ............................................................ 11

Table 6. L/R channel selection ................................................................ 12

Table 7. Recommended soldering profile limits..................................................... 13

Table 8. Outer dimensions................................................................... 14

Table 9. Document revision history ............................................................. 15

MP34DT06J

List of tables

DS12698 - Rev 1 page 17/19

List of figures

Figure 1. Pin connections ...................................................................2

Figure 2. Timing waveforms ..................................................................4

Figure 3. Typical frequency response normalized to 1 kHz .............................................5

Figure 4. MP34DT06J electrical connections (top view)...............................................6

Figure 5. MP34DT06J electrical connections for stereo configuration (top view) ..............................6

Figure 6. Carrier tape without microphone (top view).................................................7

Figure 7. Carrier tape with microphone (top view) ...................................................7

Figure 8. Recommended picking area ...........................................................8

Figure 9. Recommended picker design ..........................................................9

Figure 10. Recommended soldering profile limits ................................................... 13

Figure 11. HCLGA (3 x 4 x 1 mm) 4-lead package outline and mechanical data .............................. 14

MP34DT06J

List of figures

DS12698 - Rev 1 page 18/19

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MP34DT06J

DS12698 - Rev 1 page 19/19