LTC1983-3/LTC1983-5
9
1983fc
For more information www.linear.com/LTC1983-3
operaTion
Inrush Currents
During normal operation, VIN will experience current
transients in the several hundred milliamp range whenever
the charge pump is enabled. During start-up, these inrush
currents may approach 1 to 2 amps. For this reason, it is
important to minimize the source resistance between the
input supply and the VIN pin. Too much source resistance
may result in regulation problems or even prevent start-
up. One way that this can be avoided (especially when
the source impedance can’t be lowered due to system
constraints) is to use a large VIN capacitor with low ESR
right at the VIN pin. If ceramic capacitors are used, you may
need to add 1µF to 10µF tantalum capacitor in parallel to
limit input voltage transients. Input voltage transients will
occur if VIN is applied via a switch or a plug. One example
of this situation is in USB applications.
Ultralow Quiescent Current Regulated Supply
The LTC1983 contains an internal resistor divider (refer
to the Block Diagram) that draws only 1µA (typ for the
3V version) from VOUT during normal operation. During
shutdown, the resistor divider is disconnected from the
output and the part draws only leakage current from the
output. During no-load conditions, applying a 1Hz to
100Hz, 2% to 5% duty cycle signal to the SHDN pin en-
sures that the circuit of Figure 2 comes out of shutdown
frequently enough to maintain regulation even under low-
load conditions. Since the part spends nearly all of its time
in shutdown, the no-load quiescent current is essentially
zero. However, the part will still be in operation during
the time the SHDN pin is high, so the current will not be
zero and can be calculated using the following equations
to determine the approximate maximum current: IIN(MAX)
= [(Time out of shutdown) • (Burst Mode operation qui-
escent current) + (Normal operating IIN) • (Time output
is being charged before the LTC1983 enters Burst Mode
operation)]/(Period of SHDN signal). This number will be
highly dependent on the amount of board leakage current
and how many devices are connected to VOUT (each will
draw some leakage current) and must be calculated and
verified for each different board design.
The LTC1983 must be out of shutdown for a minimum
duration of 200µs to allow enough time to sense the out-
put and keep it in regulation. A 1Hz, 2% duty cycle signal
will keep VOUT in regulation under no-load conditions.
Even though the term no-load is used, there will always
be board leakage current and leakage current drawn by
anything connected to VOUT. This is why it is necessary
to wake the part up every once in a while to verify regula-
tion. As the VOUT load current increases, the frequency
with which the part is taken out of shutdown must also
be increased to prevent VOUT from drooping below the
– 2.88V (for the 3V version) during the OFF phase (see
Figure 3). A 100Hz, 2% duty cycle signal on the SHDN pin
ensures proper regulation with load currents as high as
100µA. When load current greater than 100µA is needed,
the SHDN pin must be forced high as in normal operation.
Each time the LTC1983 comes out of shutdown, the part
delivers a minimum of one clock cycle worth of charge to
the output. Under high VIN (>4V) and/or low IOUT (<10µA)
conditions, this behavior may cause a net excess of charge
to be delivered to the output capacitor if a high frequency
signal is used on the SHDN pin (e.g., 50Hz to 100Hz). Under
such conditions, VOUT will slowly drift positive and may
even go out of regulation. To avoid this potential problem
VIN
GND
C+
SHDN
VOUT
C–
LTC1983-3
CFLY
1µF
CERAMIC
FROM MPU
SHDN
VIN
CIN
10µF
TANTALUM COUT
10µF
CERAMIC
SHDN PIN WAVEFORMS:
LOW IQ MODE
(IOUT ≤ 100µA)
VOUT LOAD ENABLE MODE
(IOUT = 100µA TO 100mA)
(1Hz TO 100Hz, 2% TO 5% DUTY CYCLE)
–3V ± 4%
1983 F02
3.3V TO 5.5V
Figure 2. Ultralow Quiescent Current Regulated Supply
(Refer to Block Diagram)