CREAT BY ART
- Glass passivated chip junction
- Ideal for automated placement
- Low forward voltage drop
- High current capability
- High surge current capability
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
V
RRM
50 100 200 400 600 800 1000 V
V
RMS
35 70 140 280 420 560 700 V
V
DC
50 100 200 400 600 800 1000 V
I
F(AV)
A
Trr μs
Cj pF
T
JO
C
T
STG O
C
Document Number: DS_D1405068 Version: I14
S3A thru S3M
Surface Mount Rectifiers
FEATURES
- Moisture sensitivity level: level 1, per J-STD-020
Taiwan Semiconductor
S3G S3J S3K S3M
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: DO-214AB (SMC) DO-214AB (SMC)
Polarity: Indicated by cathode band
Weight: 0.21 g (approximately)
Unit
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER SYMBOL S3A S3B S3D
Maximum average forward rectified current 3
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
100 A
V
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=125 ℃I
R
μA
Maximum instantaneous forward voltage (Note 1)
I
F
= 3 A V
F
1.15
10
250
Typical reverse recovery time (Note 2) 1.5
Typical thermal resistance R
θJL
R
θJA
13
47
Typical junction capacitance (Note 3) 60
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
O
C/W
Operating junction temperature range - 55 to +150
Storage temperature range - 55 to +150
Note 1: Pulse test with PW=300μs, 1% duty cycle
PART NO.
PART NO.
S3M
S3M
S3M
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
Document Number: DS_D1405068 Version: I14
R6 SMC 3,000 / 13" Paper reel
M6
S3A thru S3M
Taiwan Semiconductor
ORDERING INFORMATION
AEC-Q101
QUALIFIED
PACKING COD E GREEN COMPOUND
CODE
PACKAGE PACKING
AEC-Q101
QUALIFIED PACKING CODE GREEN COMPOUND
CODE DESCRIPTION
S3x
(Note 1) Prefix "H"
R7
Suffix "G"
SMC 850 / 7" Plastic reel
S3M R7G R7 G Green compound
SMC 3,000 / 13" Plastic reel
Note 1: "xx" defines voltage from 50V (S3A) to 1000V (S3M)
EXAMPLE
PREFERRED P/N
S3MHR7 H R7 AEC-Q101 qualified
S3M R7 R7
0
0.5
1
1.5
2
2.5
3
3.5
0 25 50 75 100 125 150
AVERAGE FORWARD CURRENT (A)
LEAD TEMPERATURE (oC)
FIG.1 FORWARD CURRENT DERATING CURVE
RESISTIVE OR
INDUCTIVE LOAD
10
100
1 10 100
PEAK FORWARD SURGE URRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Single Half Sine Wave
0.1
1
10
100
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT
(μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=125℃
0.1
1
10
100
0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6
INSTANTANEOUS FORWARD CURRENT
(A)
FORWARD VOLTAGE (V)
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
Pulse Width=300μs
1% Duty Cycle
Min Max Min Max
A 2.90 3.20 0.114 0.126
B 6.60 7.11 0.260 0.280
C 5.59 6.22 0.220 0.245
D 2.00 2.62 0.079 0.103
E 1.00 1.60 0.039 0.063
F 7.75 8.13 0.305 0.320
G 0.10 0.20 0.004 0.008
H 0.15 0.31 0.006 0.012
P/N = Specific Device Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1405068 Version: I14
S3A thru S3M
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
SUGG ESTED PAD LAYO UT
Symbol Unit (mm) Unit (inch)
A 3.3 0.130
B 2.5 0.098
C 6.8 0.268
MARKING DIAGRAM
D 4.4 0.173
E 9.4 0.370
1
10
100
0.01 0.1 1 10 100
CAPACITANCE (pF)
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vsig=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1405068 Version: I14
S3A thru S3M
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
