TVS Diode Array (SPA ® Diodes)
General Purpose ESD Protection - SP1001 Series
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/05/19
Description
Avalanche breakdown diodes fabricated in a proprietary
silicon avalanche technology protect each I/O pin to provide
a high level of protection for electronic equipment that
may experience destructive electrostatic discharges (ESD).
These robust diodes can safely absorb repetitive ESD
strikes above the maximum level specified in IEC 61000-4-
2 international standard (Level 4, ±8kV contact discharge)
without performance degradation. Their very low loading
capacitance also makes them ideal for protecting high-
speed signal pins.
Pinout
Functional Block Diagram
Features
• Low capacitance of 8pF
(TYP) per I/O
• ESD protection of ±15kV
contact discharge, ±30kV
air discharge, (Level 4,
IEC 61000-4-2)
• EFT protection, IEC
61000-4-4, 40A
(5/50ns)
• Low leakage current of
0.5μA (MAX) at 5V
• Small package saves
board space
• Lightning Protection, IEC
61000-4-5, 2A (8/20µs)
• AEC-Q101 Qualified
Applications
• Computer Peripherals
• Mobile Phones
• Digital Cameras
• Desktops/Notebooks
• LCD/PDP TVs
• Set Top Boxes
• DVD Players
• MP3/PMP
1
34
5
*SP1001-02
(SC70-3) (SC70-5) (SC70-6)
1
3
2
*SP1001-04
1
3
5
4
6
*SP1001-05
2
2
1
34
51
3
5
4
6
2
2
SP1001-02
(SOT 553)
4
5
2
NC
NC
SP1001-04
(SOT 553)
SP1001-05
(SOT 563)
SP1001-05
(SOT 963)
1
3
5
4
6
2
SP1001-02 SP1001-02
2
3
1
213
4
2
5
2
13
SP1001-05
SP1001-04
4
54
65
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
Application Example
Shield
Ground
SP 1001-04JTG (SC70-5)
SP 1001-04XTG (SOT553)
Outside World
Input LCD module
Controller
D1
D2
D3
D4
Signal
Ground
SP1001 Series - 8pF 15kV Unidirectional TVS Array
Note: * AEC-Q101 Qualified
TVS Diode Array (SPA ® Diodes)
General Purpose ESD Protection - SP1001 Series
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/05/19
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs) 2 A
TOP Operating Temperature -40 to 125 °C
TSTOR Storage Temperature -505 to 150 °C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the
component. This is a stress only rating and operation of the component at these or any other conditions above
those indicated in the operational sections of this specification is not implied.
Electrical Characteristics (TOP = 25°C)
Parameter Symbol Test Conditions Min Ty p Max Units
Forward Voltage Drop VFIF=10mA 0.7 0.9 1.2 V
Reverse Voltage Drop VRIR=1mA 7. 0 7. 8 8.5 V
Reverse Standoff Voltage VRWM IR≤1µA 5.5 V
Reverse Leakage Current ILEAK VR=5V 0.1 µA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Fwd 8.0 11. 0 V
IPP=2A, tp=8/20µs, Fwd 9.7 13.0 V
Dynamic Resistance RDYN (VC2 - VC1) / (IPP2 - IPP1)1.7 Ω
ESD Withstand Voltage1,2 VESD
IEC 61000-4-2 (Contact) ±15 kV
IEC 61000-4-2 (Air) ±30 kV
Diode Capacitance1CD
Reverse Bias=0V 12 pF
Reverse Bias=2.5V 8 pF
Reverse Bias=5V 7 pF
Notes:
1 Parameter is guaranteed by component characterization
2 A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode
Thermal Information
Capacitance vs. Reverse Bias
0
2
4
6
8
10
12
14
DC Bias (V)
Capacitance (pF)
0 0.5 11.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Design Consideration
Because of the fast rise-time of the ESD transient,
placement of ESD components is a key design
consideration. To achieve optimal ESD suppression, the
components should be placed on the circuit board as
close to the source of the ESD transient as possible.
Install the ESD suppressors directly behind the connector
so that they are the first board-level circuit component
encountered by the ESD transient. They are connected
from signal/data line to ground.
Parameter Rating Units
Storage Temperature Range -55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature
(Soldering 20-40s) 260 °C
Thermal resistance junction to ambient 124.21 oC/W
Thermal resistance junction to case 190.54 oC/W
Power dissipation 1 W
TVS Diode Array (SPA ® Diodes)
General Purpose ESD Protection - SP1001 Series
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/05/19
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-downRamp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
L
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes max.
Do not exceed 260°C
Soldering Parameters
Part Numbering System
Ordering Information
Part Number Package Marking Min. Order Qty.
SP1001-02JTG SC70-3 A*23000
SP1001-02XTG SOT553 A*23000
SP1001-04JTG SC70-5 A*43000
SP1001-04XTG SOT553 A*43000
SP1001-05JTG SC70-6 A*53000
SP1001-05VTG SOT963 A5 8000
SP1001-05XTG SOT563 A*53000
Part Marking System
SP 1001 -0**TG
Series
Number of Channels
02 = 2 Channel
04 = 4 Channel
05 = 5 Channel
Package
J = SC70-3, SC70-5 or SC70-6
X = SOT553 or SOT563
V = SOT963
T= Tape & Reel
G= Green
TVS Diode Arrays
(SPA® Diodes)
Product Characteristics
Lead Plating Matte Tin (SC70-x) Pre-Plated Frame (SOT5x3,
SOT963)
Lead Material Copper Alloy
Lead Coplanarity 0.004 inches(0.102mm)
Substrate material Silicon
Body Material Molded Compound
Flammability UL Recognized compound meeting flammability
rating V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
A**
A**
Product Series
A = SP1001 series
Assembly Site
(varies)
Number of Channels
(varies)
TVS Diode Array (SPA ® Diodes)
General Purpose ESD Protection - SP1001 Series
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/05/19
Package Dimensions — SC70
B
3
EHE
2
1
ee
D
A2 A
A1
C
L
Package SC70-3
Pins 3
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A0.80 1.10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1. 0 0 0.028 0.039
B0.15 0.30 0.006 0.012
c0.08 0.25 0.003 0.010
D1.85 2.25 0.073 0.089
E1.15 1.35 0.045 0.053
e0.66 BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L 0.26 0.46 0.010 0.018
Package SC70-6
Pins 6
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A0.80 1.10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1. 0 0 0.028 0.039
B0.15 0.30 0.006 0.012
c0.08 0.25 0.003 0.010
D1.85 2.25 0.073 0.089
E1.15 1.35 0.045 0.053
e0.65 BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L0.26 0.46 0.010 0.018
D
A2 A
A1
C
L
EHE
2
13
654
BB
B
D
A2 A
A1
C
L
EHE
2
13
65
not used 4
ee
B
Package SC70-5
Pins 5
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A0.80 1.10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1. 0 0 0.028 0.039
B0.15 0.30 0.006 0.012
c0.08 0.25 0.003 0.010
D1.85 2.25 0.073 0.089
E1.15 1.35 0.045 0.053
e0.65 BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L0.26 0.46 0.010 0.018
SC70-5
Solder Pad Layout
SC70-6
Solder Pad Layout
SC70-3
Solder Pad Layout
TVS Diode Array (SPA ® Diodes)
General Purpose ESD Protection - SP1001 Series
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/05/19
Package Dimensions — SOT553 and SOT563
Package SOT 553
Pins 5
Millimeters Inches
Min Max Min Max
A0.50 0.60 0.020 0.024
B0.17 0.27 0.007 0.011
c0.08 0.18 0.003 0.007
D1.50 1.70 0.059 0.067
E1.10 1.30 0.043 0.051
e0.50 BSC 0.020 BSC
L0.10 0.30 0.004 0.012
HE 1.50 1.70 0.059 0.067
5
(not used)
c
HE
L
A
D
64
23
E
e
B
Package SOT 563
Pins 6
Millimeters Inches
Min Max Min Max
A0.50 0.60 0.020 0.024
B0.17 0.27 0.007 0.011
c0.08 0.18 0.003 0.007
D1.50 1.70 0.059 0.067
E1.10 1.30 0.043 0.051
e0.50 BSC 0.020 BSC
L0.10 0.30 0.004 0.012
HE 1.50 1.70 0.059 0.067
c
HE
L
A
D
64
23
E
e
B
5
SOT 553
Solder Pad Layout
SOT 563
Solder Pad Layout
Recommanded Solder Pad Layout
Package Dimensions — SOT963
Package SOT 963
Pins 6
Millimeters Inches
Min Nom Max Min Nom Max
A0.44 0.48 0.50 0.0173 0.0189 0.0197
B0.10 0.15 0.20 0.004 0.006 0.008
c0.05 0.10 0.15 0.002 0.004 0.006
D0.95 1. 0 0 1.05 0.037 0.039 0.041
E0.75 0.80 0.85 0.029 0.031 0.033
E1 0.95 1. 0 0 1.05 0.037 0.039 0.041
e0.35 BSC 0.014 BSC
L0.05 0.10 0.15 0.002 0.004 0.006
L1 0.125 0.15 0.175 0.005 0.006 0.007
ø3 º 5 º 7 º 3 º 5 º 7 º
TVS Diode Array (SPA ® Diodes)
General Purpose ESD Protection - SP1001 Series
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/05/19
Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6
Symbol Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F3.45 3.55 0.135 0.139
P2 1.95 2.05 0.077 0.081
D1.40 1.60 0.055 0.063
D1 1. 0 0 1.25 0.039 0.049
P0 3.90 4.10 0.154 0.161
10P0 40.0 +/- 0.20 1.574 +/- 0.008
W7.70 8.10 0.303 0.318
P3.90 4.10 0.153 0.161
A0 2.14 2.34 0.084 0.092
B0 2.24 2.44 0.088 0.096
K0 1.12 1.32 0.044 0.052
t0.27 max 0.010 max
Dimensions
Embossed Carrier Tape & Reel Specification — SC70-3
Symbol Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F3.45 3.55 0.135 0.139
P2 1.95 2.05 0.077 0.081
D1.40 1.60 0.055 0.063
D1 1. 0 0 1.25 0.039 0.049
P0 3.90 4.10 0.154 0.161
10P0 40.0 +/- 0.20 1.574 +/- 0.008
W7.70 8.10 0.303 0.318
P3.90 4.10 0.153 0.161
A0 2.30 2.50 0.090 0.098
A1 1.00 Ref 0.039 Ref
B0 2.30 2.50 0.090 0.098
B1 1.90 Ref 0.074
K0 1.10 1.30 0.043 0.051
K1 0.60 Ref 0.023 Ref
t0.27 max 0.010
Dimensions
TVS Diode Array (SPA ® Diodes)
General Purpose ESD Protection - SP1001 Series
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/05/19
Embossed Carrier Tape & Reel Specification – SOT963
Symbol Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F3.45 3.55 0.136 0.140
D1 0.45 0.55 0.018 0.022
D1.50 min 0.059 min
P0 3.90 4.10 0.154 0.161
10P0 40.0 +/- 0.20 1.575 +/- 0.008
P1.95 2.05 0.077 0.081
P2 1.95 2.05 0.077 0.081
W7.90 8.20 0.311 0.323
A0 1.11 1.21 0.044 0.048
B0 1.11 1.21 0.044 0.048
K0 0.58 0.68 0.023 0.027
t0.22 max 0.009 max
PO
P2
oD
/
FE
W
BO
t
P
oD1
/
AO
KO
Embossed Carrier Tape & Reel Specification — SOT553 and SOT563
Symbol Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F3.45 3.55 0.135 0.139
P2 1.95 2.05 0.077 0.081
D1.40 1.60 0.055 0.063
D1 0.45 0.55 0.017 0.021
P0 3.90 4.1 0.154 0.161
10P0 40.0 +/- 0.20 1.574 +/- 0.008
W7.70 8.10 0.303 0.318
P3.90 4.10 0.153 0.161
A0 1.73 1.83 0.068 0.072
B0 1.73 1.83 0.068 0.072
K0 0.64 0.74 0.025 0.029
t0.22 max .009 max
Dimensions
Dimensions
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are
not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.
