TD62107PG/FG
2005-03-02
1
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic
TD62107PG,TD62107FG
4ch High-current Darlington Sink Driver
The TD62107PG/FG are high-voltage, high-current darlington
drivers and enable inputs which can gate the outputs. All units
feature integral clamp diodes for switching inductive loads.
The TD62107PG/FG have a wide supply voltage range and all
input are compatible with TTL and 5-V CMOS.
Application include relay, hammer, lamp and stepping moter
drivers.
Please observe the thermal condition for using.
This devices are a product for the Pb free(Sn-Ag).
Features
• Output current (single output) 750 mA (max)
• High sustaining voltage output: 45 V min (TD62107PG)
35 V min (TD62107FG)
• Output clamp diodes
• Enable inputs E1, E2
• Wide supply voltage range VCC = 4.75 to 7 V
• Input compatible with TTL and 5-V CMOS
• GND terminal = heat sink
• Package type-PG: DIP-16pin
• Package type-FG: HSOP-16pin
Pin Assignm en t (top view)
TD62107PG
TD62107FG
TD62107PG
TD62107FG
Weight
DIP16-P-300-2.54A: 1.11 g ( typ.)
HS OP 16-P-300-1.00: 0.50 g (t yp.)
Heat sink
& GND
1 2 3 4 5 6 7
14 13 12 11 10 9
O2 Heat sink
& GND O3 O4 COMVCC
E1 I1 I2 I3 I4
16
2E8
15
O1
Heat sink
& GND
1 2 3 4 5 6 7
14 13 12 11 10 9
NC Heat sink
& GND O4 COM NCVCC
E1 I1 NC I3 NC
16
2E 8
15
O1 O3 O2
I2 I4
TD62107PG/FG
2005-03-02
2
Schematics (each driver) Truth Table
E1 2E I1 to I4 O1 to O4
L L L or H Disable OFF
L H L or H Disable OFF
H L L or H Enable In
H H L or H Disable O FF
In = I1~I4
Input Equivalent Circuit Output Equivalent Circuit
Note: The input and output parasi t ic diodes cannot be used as clamp diodes.
Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Supply voltage VCC −0.5 to 17 V
PG −0.5 to 45
Outp u t sustaini n g
voltage FG VCE (SUS) −0.5 to 35 V
Output current IOUT 750 mA
Input voltage VIN −0.5 to VCC +
0.5 V
PG 45
Clamp diode reverse
voltage FG VR 35 V
Clamp diode forword current IF 500 mA
PG 2.7 (Note 1)
Power dissipation FG PD 1.4 (Note 2) W
Operating temperatur e Topr −40 to 85 °C
Storage temperat ure Tstg −55 to 150 °C
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)
Note 2: On glass epoxy PCB (60 × 30 × 1.6 m m Cu 30%)
Common
Output
VCC
Input
I1
I2
I3
I4
O1
O2
O3
O4
Common
E1
2E
TD62107PG/FG
2005-03-02
3
Recomm end ed Operating Co ndition s (Ta = −40 to 85°C)
Characteristics Symbol Condition Min Typ. Max Unit
Supply voltage VCC ⎯ 4.75 ⎯ 15 V
PG 0 ⎯ 45
Output sustaining
voltage FG VCE (SUS) ⎯ 0 ⎯ 35 V
T
pw = 25 ms, Duty = 75%, 1 Circuit 0 ⎯ 500
PG Duty = 30% 0 ⎯ 400
Output current
FG
IOUT Tpw = 2 5 ms, 4 Circuit Duty = 40% ⎯ ⎯ 300
mA
Input voltage VIN ⎯ 0 ⎯ V
CC V
PG ⎯ ⎯ 45
Clamp diode reverse
voltage FG VR ⎯ ⎯ ⎯ 35 V
Clamp diode forward current IF ⎯ ⎯ ⎯ 500 mA
PG ⎯ ⎯ ⎯ 1.0
Power dissipation FG PD Ta = 85°C (Note 1) ⎯ ⎯ 0.7 W
Note1: On Glass Epoxy PCB (60 × 30 × 1.6 mm Cu 30 %)
Electrical Characteristics (Ta = 25°C)
Characteristics Symbol
Test
Circuit Tes t Condition Min Typ. Max Unit
High level VIH 2.0 ⎯ V
CC
Input voltage Low level VIL 1 ⎯ ⎯ 0.8 V
PG VCE = 45 V, Ta = 75°C ⎯ ⎯ 100
Output current High
level FG IOH 2 VCE = 35 V, Ta = 85°C ⎯ ⎯ 100 µA
Output voltage Low level VOL 3 IOUT = 50 mA ⎯ ⎯ 1.3 V
High level IIH 4 VIN = 13 V ⎯ ⎯ 100 µA
Input current Low level IIL 5 VIN = 0.4 V ⎯ ⎯ −0.3 mA
PG VR = 45 V ⎯ ⎯ 100
Clamp diode reverse current FG IR 6 VR = 35 V ⎯ ⎯ 100 µA
Clamp diode forward voltage VF 7 IF = 500 mA ⎯ ⎯ 2.0 V
Output
high ICCH 4 VCC = 13 V, VIN = 0 V
Output open ⎯ ⎯ 13
Supply current Output
low
ICC ICCL 5 VCC = 13 V, VIN = 5 V
Output open ⎯ ⎯ 17
mA
PG VCC = 5 V, RL = 90 Ω
CL = 15 pF, VOUT = 45 V ⎯ 5 ⎯
Turn-on delay
FG tON 8 VCC = 5 V, RL = 70 Ω
CL = 15 pF, VOUT = 35 V ⎯ 5 ⎯
µs
PG VCC = 5 V, RL = 90 Ω
CL = 15 pF, VOUT = 45 V ⎯ 5 ⎯
Turn-off delay FG tOFF 8 VCC = 5 V, RL = 70 Ω
CL = 15 pF, VOUT = 35 V ⎯ 5 ⎯
µs
TD62107PG/FG
2005-03-02
4
Test Circuit
1. VIH, VIL 2. IOH 3. VOL
4. IIH, ICCL 5. IIL, ICCL 6. IR
7. VF 8. tON, tOFF
Input Condition
Note 1: Pulse width 50 µs, duty cycle 10%
Output Impedance 50 Ω, tr ≤ 5ns, t f ≤ 10 ns
Note 2: VIH = 3 V, E1 = VIH, 2E = GND, VCC = 5 V
Note 3: CL includes probe and jig capacitance
Precauti ons fo r Using
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, VCC, COMMON and GND line since IC may be
destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
Pulse
generator
(Note 1)
Input
CL = 15 pF
(Note 3)
VOUT
Output
RL
Open
VCC = 5 V
(Note 2)
VIN (ON) VOL
Open
IOUT
VCC
ICCL
IIH
VIN
Open
Open
VCC
ICCH
IIL
VIN
Open
Open
VCC
Open
Open
IR VR
VCC
Open
Open
IF VF
VCC
10% 50%
tON t
OFF
tf
trVIH = 3 V
VOH
VOL
Input 50%
50 µs
Output 50% 50%
90%
10%
90%
0
IOH
Open
VCE
VCC
VIH, VIL VCE
Open VCC
IOUT
TD62107PG/FG
2005-03-02
5
0075 150
4.0
3.0
1.0
2.0
100 25 125 50
TD62107PG
VCE (sat) – IOUT
VOUT – VIN
IOUT – Duty cycle
IOUT – Duty cycle
PD – Ta
PD – Ta
Output saturation voltage VCE (sat) (V) Input voltage VIN (V)
Duty cycle (%) Duty cycle (%)
Ambient temperature Ta (°C) Ambient temperature Ta (°C)
Output curre nt IOUT (A)
Output curre nt IOUT (A)
出力電流 I
OUT (A)
Output curre nt IOUT (A)
Power dissipation PD (W)
Power dissipation PD (W)
00 75 150
4
3
1
2
100 25 125 50
(1) Type-FG on PCB
60 × 30 × 1.6 mm Cu 30%
(2) Type-FG free air
(1)
(2)
00 1.2 1.6
8.0
6.0
0.2
0.4
0.4 0.8
VCC = 5 to 17 V
Ta = 75°C
−30
25
004.0 5.0
50
20
30
2.0 3.0
−30
25
Ta = 75°C
IOUT = 500 mA
40
10
1.0
0.2
30 90
0.8
0.4
0.6
50 70
Ta = 75°C
Recommended limit
4 Circuit
2
1
3
Device limit
0.2
30 90
0.8
0.4
0.6
50 70
Ta = 25°C
4 Ci rcuit
3
1, 2 Device limit
Recommended limit
TD62107PG/FG
2005-03-02
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Package Dimensions
W eight: 1.11 g (typ.)
TD62107PG/FG
2005-03-02
7
Package Dimensions
Weight: 0. 50 g (t y p.)
TD62107PG/FG
2005-03-02
8
• The inform ation contai ned herein is subjec t to chang e wit hout notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and r eliability of its products. Never theless, semic onductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHI BA products c ould c ause loss of human life, b odi l y injury or damage to proper t y.
In developing your designs, pleas e ensure that TOSHIBA produc ts are used within specifi ed operating r an ges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc . .
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer , personal equi pmen t, offi ce equipm ent, me asuri ng equipm ent, in dustr i al robotics, domesti c applia nces,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be m ade at t he customer’s own risk .
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regul ations.
030619EBA
RESTRICTIONS ON PRODUCT USE
About solderability, followi ng conditions were confirmed
• Solderability
(1) Use of Sn-63Pb solder Bath
· solder bath temperature = 230° C
· dipping time
= 5 seconds
· t he num ber of ti m es = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245° C
· dipping time
= 5 seconds
· t he num ber of ti m es = once
· use of R-type flux
