NTC Thermistors The NTC Thermistors This is a Negative Temperature Coefficient Resistor whose resistance changes as ambient temperature changes. Thermistor comprises 2 or 4 kinds of metal oxides of iron, nickel, cobalt, manganese and copper, being shaped and sintered at high temperature (1200 to 1500 C) Features Recommended Applications Temperature Coefficient of Resistance is negative and extremely large Various kinds of types especially smaller ones are available. Resistance values are available from 22 to 470 k For temperature measurement or temperature detection : thermometer, temperature controller For temperature compensation : transistor circuit, measuring instruments Physical Characteristics of NTC Thermistors Thermistor is a resistor sensitive to temperature utilizing the large temperature-coefficient of metal oxide semiconductor. And its temperature dependency of resistance value is indicated by the following equation: R=R0 exp [ ( B 1 T 1 T0 )] Fig. 1 1000 100 .................................... (1) 10 RT/R25 T0: Standard Temperature 298.15 K(25 C) R0: Resistance at T0 K B: Thermistor Constant (K) So called Temperature Coefficient (a) is generally indicated as follows: 1 2000 3000 400 0 500 0 60 00 0.1 B .................................................................... (2) T2 0.01 But a is not adequate for use as a constant, because a change by temperature is considerably large, so B Value is used as a coefficient of thermistor. 0.001 a= B=1000 -40 -20 0 20 40 60 T (C) 80 100 120 140 Major Characteristics of NTC Thermistors The relation between resistance and temperature of a thermistor is linear as shown in Fig. 2, in which resistance is shown in vertical direction in a logarithmic scale and reciprocal of absolute temperature in horizontal direction. Bias degrees in these straight lines are determined according to the B Value expressed by the following equation. knR1 - knR2 1 1 T1 T2 10000000 700 =4 /5 0 050 5 2 B =4 50 < B 25 / 7 250 < =4 & +&1 50 5+ B 25/ &3 &35 < 35 =34 &3 5/85 + 2 B 5 00 <" &3 45 0= ( 5 / & 5 5+ B 2 &3 < 5 & 5+ &3 0 280 0= 25/5 B < " +& &35 1000000 100000 .................................................. (3) 10000 R (?) B= Fig. 2 R1: Resistance at T1 K R2: Resistance at T2 K When calculated from this equation, B Value is a variable in a strict sense, and the resistance is expressed by the following equation: R = AT-C exp D/T........................................................ (4) 1000 100 10 In (4), C is a small positive or negative constant and quite negligible except use in precision temperature-measuring device, thereby the B Value is, in practical usage, to be considered as a constant. In Fig. 1, the relation between the resistance ratio RT/R25 (R25: Resistance at 25 C, RT: Resistance at T C) and B Value is shown with T C, in the horizontal direction. 1 2.4 125 2.9 85 3.4 1 (L10 -3K-1) T 50 25 T (C) 3.9 0 -20 4.4 -40 00 Sep. 2010 2 Multilayer NTC Thermistors Multilayer NTC Thermistors Series: ERTJ Features Recommended Applications Mobile Phone * Temperature compensation for crystal oscillator * Temperature compensation for semiconductor devices Personal Computer * Temperature detection for CPU and memory device * Temperature compensation for ink-viscosity (Inkjet Printer) Battery Pack * Temperature detection of battery cells Liquid Crystal Display * Temperature compensation of display contrast * Temperature compensation of display backlighting (CCFL) Surface Mount Device (0201, 0402, 0603) Highly reliable multilayer / monolithic structure Wide temperature operating range (-40 to 125 C) Environmentally-friendly lead-free RoHS compliant Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 & 3 5 + & ( + " $PNNPO$PEF Product Code Type Code ERT NTC J Chip Type (SMD) Thermistors Multilayer Type 4J[F$PEF Z "0201" 0 "0402" 1 "0603" 1BDLBHJOH 4UZMF$PEF E V "0201", "0402" Pressed Carrier Taping Punched Carrier Taping (Pitch : 2 mm) "0603" Punched Carrier Taping (Pitch : 4 mm) #7BMVF$MBTT$PEF 2701 to 2800 A 3301 to 3400 G 3801 to 3900 M 4001 to 4100 P 4201 to 4300 R 4301 to 4400 S 4401 to 4500 T 4601 to 4700 V /PNJOBM3FTJTUBODF 3 ? The first two digits are significant figures of resistance and the third one denotes the number of zeros following them. (Example) 3FTJTUBODF5PMFSBODF $PEF F G H J 1% Narrow Tolerance 2% Type 3% Standard 5% Type 4QFDJBM 4QFDJGJDBUJPO Construction 3 Name A Semiconductive Ceramics B Internal electrode C 4 D 5 1 No E 2 Terminal electrode Substrate electrode Intermediate electrode External electrode Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 01 Dec. 2013 3 Multilayer NTC Thermistors Dimensions in mm (not to scale) L (Unit : mm) W Size Code (EIA) L W T L1, L 2 T L1 Z(0201) 0.600.03 0.300.03 0.300.03 0.150.05 0(0402) 1.00.1 0.500.05 0.500.05 0.250.15 1(0603) 1.600.15 0.80.1 0.80.1 0.30.2 L2 Packaging Methods Standard Packing Quantities Thickness (mm) Z(0201) 0(0402) 1(0603) 0.3 0.5 0.8 Pitch Quantity (mm) (pcs./reel) Kind of Taping Pressed Carrier Taping 2 2 4 Punched Carrier Taping W1 E 15,000 10,000 4,000 C B Size Code Reel for Taping D Pitch 2 mm (Pressed Carrier Taping) : Size 0201 Feeding hole fD0 Chip pocket A E t W2 Dim. (mm) B K0 Chip component A Symbol B W P 1 P2 F E P2 P0 fD 0 t 0.03 0.03 0.2 0.05 0.10 0.05 0.05 0.1 0 max. 0.03 Feeding hole fD0 D E W1 W2 9.0+1.0 11.41.0 0 Top cover tape Pitch 2 mm (Punched Carrier Taping) : Size 0402 100 min. Vacant position 400 min. Chip pocket E t1 C Leader Part and Taped End Leader part K0 Dim. 0.36 0.66 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.55 0.36 (mm) fB 0 180 -3 60.0+1.0 13.00.5 21.00.8 2.00.5 0 Tape running direction P0 P1 fA Symbol F W A Taped end B F W A t2 Chip component A Symbol B W P1 P2 F E P0 P1 P2 P0 fD 0 t1 Dim. 0.62 1.12 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.7 (mm) 160 min. Vacant position Tape running direction 0.05 0.05 0.2 0.05 0.10 0.05 0.05 0.1 0 t2 1.0 max. max. Minimum Quantity / Packing Unit Part Number Minimum Quantity Packing Quantity Carton / Packing Unit in Carton LxWxH (mm) (Size) Pitch 4 mm (Punched Carrier Taping) : Size 0603 Feeding hole fD0 Chip pocket E t1 B F W A t2 Symbol A Dim. 1.0 (mm) P1 Chip component 0.1 B W F E P2 P1 Tape running direction P0 P2 P0 fD 0 t1 1.8 8.0 3.50 1.75 4.0 2.00 4.0 1.5+0.1 1.1 0.1 0.2 0.05 0.10 0.1 0.05 0.1 0 (Unit : mm) ERTJZ (0201) 15,000 300,000 250x200x200 ERTJ0 (0402) 10,000 200,000 250x200x200 ERTJ1 (0603) 4,000 80,000 250x200x200 Part No., quantity and country of origin are designated on outer packages in English. t2 1.4 max. max. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 01 Dec. 2013 4 Multilayer NTC Thermistors Ratings Size code (EIA) Operating Temperature Range Rated Maximum Power Dissipation 1 Z(0201) 0(0402) 1(0603) 33 mW 66 mW 100 mW Dissipation Factor2 approximately 1 mW/C approximately 2 mW/C approximately 3 mW/C -40 to 125 C 1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature. * The Maximum Power Dissipation under ambient temperature 25 C or less is the same with the rated maximum power dissipation, and Maximum power dissipation beyond 25 C depends on the Decreased power dissipation curve. * Please see "Operating Power" for details paging 371. 2 Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 C through self heat generation under stable temperatures. * Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT). Resistance ratios to R25 at each temperature/Reference values (for obtaining resistance at each temperature by using R25 shown in part number) ERTJA ERTJG ERTJM ERTJP ERTJR ERTJ0ES ERTJ1VS B25/50 2750 K 2800 K (3375 K) 3900 K 4050 K 4250K 4330K (4330K) 4390K B25/85 (2700 K) (2750 K) 3435 K (3970 K) (4100 K) (4300K) (4390K) T(C) -40 13.05 13.28 20.52 32.11 33.10 43.10 45.67 45.53 -35 10.21 10.40 15.48 23.29 24.03 30.45 32.08 31.99 -30 8.061 8.214 11.79 17.08 17.63 21.76 22.80 22.74 -25 6.427 6.547 9.069 12.65 13.06 15.73 16.39 16.35 -20 5.168 5.261 7.037 9.465 9.761 11.48 11.91 11.89 -15 4.191 4.261 5.507 7.147 7.362 8.466 8.743 8.727 -10 3.424 3.476 4.344 5.444 5.599 6.300 6.479 6.469 -5 2.819 2.856 3.453 4.181 4.291 4.730 4.845 4.839 0 2.336 2.362 2.764 3.237 3.312 3.582 3.654 3.650 5 1.948 1.966 2.227 2.524 2.574 2.734 2.778 2.776 10 1.635 1.646 1.806 1.981 2.013 2.102 2.128 2.126 15 1.380 1.386 1.474 1.567 1.584 1.629 1.642 1.641 20 1.171 1.174 1.211 1.247 1.255 1.272 1.277 1.276 25 1 1 1 1 1 1 1 1 30 0.8585 0.8565 0.8309 0.8072 0.8016 0.7921 0.7888 0.7890 35 0.7407 0.7372 0.6941 0.6556 0.6461 0.6315 0.6263 0.6266 40 0.6422 0.6376 0.5828 0.5356 0.5235 0.5067 0.5004 0.5007 45 0.5595 0.5541 0.4916 0.4401 0.4266 0.4090 0.4022 0.4025 50 0.4899 0.4836 0.4165 0.3635 0.3496 0.3319 0.3251 0.3254 55 0.4309 0.4238 0.3543 0.3018 0.2881 0.2709 0.2642 0.2645 60 0.3806 0.3730 0.3027 0.2518 0.2386 0.2222 0.2158 0.2161 65 0.3376 0.3295 0.2595 0.2111 0.1985 0.1832 0.1772 0.1774 70 0.3008 0.2922 0.2233 0.1777 0.1659 0.1518 0.1463 0.1465 75 0.2691 0.2600 0.1929 0.1504 0.1393 0.1264 0.1213 0.1215 80 0.2417 0.2322 0.1672 0.1278 0.1174 0.1057 0.1011 0.1013 85 0.2180 0.2081 0.1451 0.1090 0.09937 0.08873 0.08469 0.08486 90 0.1974 0.1871 0.1261 0.09310 0.08442 0.07468 0.07122 0.07138 95 0.1793 0.1688 0.1097 0.07980 0.07200 0.06307 0.06014 0.06028 100 0.1636 0.1528 0.09563 0.06871 0.06166 0.05353 0.05099 0.05112 105 0.1498 0.1387 0.08357 0.05947 0.05306 0.04568 0.04340 0.04351 110 0.1377 0.1263 0.07317 0.05170 0.04587 0.03918 0.03708 0.03718 115 0.1270 0.1153 0.06421 0.04512 0.03979 0.03374 0.03179 0.03188 120 0.1175 0.1056 0.05650 0.03951 0.03460 0.02916 0.02734 0.02742 125 0.1091 0.09695 0.04986 0.03470 0.03013 0.02527 0.02359 0.02367 1 Other than ERTJ0ET104 in B25/50=4500K. 2 ERTJ0ET104 only. B25/50= kn (R25/R50) 1/298.15-1/323.15 B25/85= kn (R25/R85) 1/298.15-1/358.15 ERTJT ERTJ0ET104 ERTJV 4500K 4500K 4700K (4450K) (4580K) (4750K) 1 63.30 42.92 29.50 20.53 14.46 10.30 7.407 5.388 3.966 2.953 2.221 1.687 1.293 1 0.7799 0.6131 0.4856 0.3874 0.3111 0.2513 0.2042 0.1670 0.1377 0.1144 0.09560 0.08033 0.06782 0.05753 0.04903 0.04198 0.03609 0.03117 0.02702 0.02351 2 47.07 33.31 23.80 17.16 12.49 9.159 6.772 5.046 3.789 2.864 2.179 1.669 1.287 1 0.7823 0.6158 0.4876 0.3884 0.3111 0.2504 0.2026 0.1648 0.1348 0.1108 0.09162 0.07609 0.06345 0.05314 0.04472 0.03784 0.03218 0.02748 0.02352 0.02017 59.76 41.10 28.61 20.14 14.33 10.31 7.482 5.481 4.050 3.015 2.262 1.710 1.303 1 0.7734 0.6023 0.4721 0.3723 0.2954 0.2356 0.1889 0.1523 0.1236 0.1009 0.08284 0.06834 0.05662 0.04712 0.03939 0.03308 0.02791 0.02364 0.02009 0.01712 R25=Resistance at 25.00.1 C R50=Resistance at 50.00.1 C R85=Resistance at 85.00.1 C Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 01 Dec. 2013 5 Multilayer NTC Thermistors Specification and Test Method Item Specification Rated Zero-power Within the specified tolerance. Resistance (R25) Test Method The value of the d.c. resistance shall be measured at the rated ambient temperature of 25.0 0.1 C under the power less than 0.1mW which is negligible self heat generation. B Value The Zero-power resistances; R1 and R2, shall be measured respectively at T1 (C) and T2 (C). The B value is calculated by the following equation. kn (R1)-kn (R2) BT1/T2= 1/(T1+273.15)-1/(T2+273.15) Within the specified tolerance. Individual Specification shall specify B25/50 or B25/85. T1 25.0 0.1 C 25.0 0.1 C B25/50 B25/85 Adhesion T2 50.0 0.1 C 85.0 0.1 C The terminal electrode shall be free from peeling Applied force : or signs of peeling. Size 0201 :2N Size 0402, 0603 : 5 N Duration : 10 s Size : 0201, 0402 1.0 0.3/Size:0201 0.5/Size:0402 0.5R Test Sample Board 1.0 Size : 0603 Test Sample Bending distance : 1 mm Bending speed : 1 mm/s 20 Bending distance Bending Strength There shall be no cracks and other mechanical damage. R25 change : within 5 % Unit : mm R340 452 452 Unit : mm Resistance to Soldering Heat Solderability There shall be no cracks and other mechanical damage. Nallow Tol. type Standard type : within 2 % within 3 % R25 change B Value change : within 1 % within 2 % Soldering bath method Solder temperature : 270 5 C Dipping period : 3.0 0.5 s Preheat condition : More than 75 % of the soldered area of both terminal electrodes shall be covered with fresh solder. Soldering bath method Solder temperature : 230 5 C Dipping period : 4 1 s Solder : H63A (JIS-Z-3282) Step 1 2 Temp (C) 80 to 100 150 to 200 Period (s) 120 to 180 120 to 180 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 01 Dec. 2013 6 Multilayer NTC Thermistors Specification and Test Method Item Temperature Cycling Moisture Resistance Specification Test Method Nallow Tol. type Standard type Conditions of one cycle R25 change : within 2 % within 3 % Step 1 : -40 C, 303 min B Value change : within 1 % within 2 % Step 2 : Room temp., 3 min max. Step 3 : 125 C, 303 min. Step 4 : Room temp., 3 min max. Number of cycles: 100 cycles R25 change : B Value change : Damp Heat Load R25 change : B Value change : Cold Resistance Dry Heat Resistance Nallow Tol. type Standard type Temperature : 85 2 C within 2 % within 3 % Relative humidity : 85 5 % within 1 % within 2 % Test period : 1000 +48/0 h Nallow Tol. type Standard type Temperature : 85 2 C within 2 % within 3 % Relative humidity : 85 5 % within 1 % within 2 % Applied power : 10 mW Test period : 500 +24/0 h R25 change : B Value change : Nallow Tol. type Standard type Temperature : -40 3 C within 2 % within 3 % Test period : 1000 +48/0 h within 1 % within 2 % R25 change : B Value change : Nallow Tol. type Standard type Temperature : 125 3 C within 2 % within 3 % Test period : 1000 +48/0 h within 1 % within 2 % Part Number List of Narrow Tolerance Type (Resistance Tolerance : 2 %, 1 %) 0201(EIA) B value class code G Nominal Resistance Resistance 25/50 Nominal B value B (3375 K) Tolerance at 25 C 3435 K1 % () Reference value B25/85 10 k ERTJZEG103A 1 %(F) 47 k or 2 %(G) 100 k P 4050 K1 % (4100 K) V 4700 K1 % (4750 K) ERTJZEP473 ERTJZEV104 : Resistance Tolerance Code Avoid flow soldering. 0402(EIA) B value class code G Nominal Resistance Resistance 25/50 Nominal B value B (3375 K) Tolerance at 25 C 3435 K1 % () Reference value B25/85 10 k ERTJ0EG103A 1 %(F) 47 k or 2 %(G) 100 k P 4050 K1 % (4100 K) S 4330 K1 % (4390 K) V 4700 K1 % (4750 K) ERTJ0ES104 ERTJ0EV104 ERTJ0EP473 : Resistance Tolerance Code Avoid flow soldering. 0603(EIA) B value class code G Nominal Resistance Resistance 25/50 Nominal B value B (3375 K) Tolerance at 25 C 3435 K1 % () Reference value B25/85 10 k 1 %(F) ERTJ1VG103A or 100 k 2 %(G) : Resistance Tolerance Code Avoid flow soldering. S (4330 K) 4390 K1 % ERTJ1VS104A Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 01 Dec. 2013 7 Multilayer NTC Thermistors Part Number List of Standard Type (Resistance Tolerance : 5 %, 3 %) 0201(EIA) B value class code G Nominal Resistance Resistance 25/50 Nominal B value B (3375 K) Tolerance at 25 C 3435 K2 % () Reference value B25/85 2.0 k 3.0 k 4.7 k 3 %(H) or 10 k 5 %(J) ERTJZEG103A 47 k 100 k P 4050 K3 % (4100 K) T 4500 K2 % (4450 K) ERTJZET202 ERTJZET302 ERTJZET472 V 4700 K2 % (4750 K) ERTJZEP473 ERTJZEV104 : Resistance Tolerance Code Avoid flow soldering. 0402(EIA) Nominal Resistance at 25 C 22 33 40 47 68 100 150 Nominal Resistance at 25 C 3.3 k 4.7 k 6.8 k 10 k 15 k 22 k 33 k 47 k 100 k Resistance Tolerance B value class code Nominal B value B25/50 () Reference value B25/85 3 %(H) or 5 %(J) Resistance Tolerance A 2750 K3 % (2700 K) ERTJ0EA220 ERTJ0EA330 ERTJ0EA400 ERTJ0EA470 2800 K3 % (2750 K) ERTJ0EA680 ERTJ0EA101 ERTJ0EA151 B value class code Nominal B value B25/50 () Reference value B25/85 3 %(H) or 5 %(J) B value class code Nominal Resistance Resistance Nominal B value B25/50 Tolerance at 25 C () Reference value B25/85 1.0 k 1.5 k 2.0 k 2.2 k 3.0 k 3.3 k 4.7 k 3 %(H) or 47 k 5 %(J) 68 k 100 k 150 k 220 k 330 k 470 k G (3375 K) 3435 K1 % M 3900 K2 % (3970 K) ERTJ0EG103A ERTJ0EM103 P 4050 K2 % (4100 K) ERTJ0EP333 ERTJ0EP473 ERTJ0EP104 S 4330 K2 % (4390 K) T 4500 K2 % (4450 K, 4580 K) ERTJ0ET102 ERTJ0ET152 ERTJ0ET202 ERTJ0ET222 ERTJ0ET302 ERTJ0ET332 ERTJ0ET472 ERTJ0ES104 ERTJ0ET104 ERTJ0ET154 R 4250 K2 % (4300 K) ERTJ0ER332 ERTJ0ER472 ERTJ0ER682 ERTJ0ER103 ERTJ0ER153 ERTJ0ER223 ERTJ0ER333 V 4700 K2 % (4750 K) ERTJ0EV473 ERTJ0EV683 ERTJ0EV104 ERTJ0EV154 ERTJ0EV224 ERTJ0EV334 ERTJ0EV474 : Resistance Tolerance Code Avoid flow soldering. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 01 Dec. 2013 8 Multilayer NTC Thermistors 0603(EIA) B value class code Nominal Resistance Resistance Nominal B value B25/50 Tolerance at 25 C () Reference value B25/85 22 33 A 2750 K3 % (2700 K) ERTJ1VA220 68 G (3375 K) 3435 K1 % ERTJ1VA400 3 %(H) or 5 %(J) ERTJ1VA470 ERTJ1VA680 100 ERTJ1VA101 10 k ERTJ1VG103A 47 k ERTJ1VP473 B value class code Nominal Resistance Resistance Nominal B value B25/50 Tolerance at 25 C () Reference value B25/85 1.0 k R 4250 K2 % (4300 K) S (4330 K) 4390 K1% T 4500 K2 % (4450 K) ERTJ1VT102 1.5 k ERTJ1VT152 2.0 k ERTJ1VT202 2.2 k ERTJ1VT222 3.0 k 4.7 k 10 k V 4700 K2 % (4750 K) ERTJ1VT302 3.3 k 6.8 k P 4050 K3 % (4100 K) ERTJ1VA330 40 47 2800 K3 % (2750 K) 3 %(H) or 5 %(J) ERTJ1VR332 ERTJ1VT332 ERTJ1VR472 ERTJ1VT472 ERTJ1VR682 ERTJ1VR103 15 k ERTJ1VR153 22 k ERTJ1VR223 33 k ERTJ1VR333 47 k ERTJ1VR473 ERTJ1VV473 68 k ERTJ1VR683 ERTJ1VV683 100 k ERTJ1VS104A 150 k ERTJ1VV104 ERTJ1VV154 : Resistance Tolerance Code Avoid flow soldering. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 01 Dec. 2013 9 Multilayer NTC Thermistors Typical Application Temperature Detection Writing current control of HDD Vcc GMR Head R R L Rth NTC AD converter CPU Interface Temperature Compensation (Pseudo-linearization) Contrast level control of LCD Vcc R Rth NTC R LCD R Temperature Compensation (RF circuit) Rth Rth 0TDGSFREFWJBUJPOEGE5 QQN Temperature compensation of TCXO X'tal [for Low Temp.] [for High Temp.] R NTC NTC R Vcc Output C C R C C R with compensation without compensation 8 0 -8 -20 25 75 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 01 Dec. 2013 10 Multilayer NTC Thermistors Multilayer Chip NTC Thermistors Series: ERTJ Handling Precautions Safety Precautions Multilayer NTC Thermistors (hereafter referred to as "Thermistors") should be used for general purpose applications found in consumer electronics (audio/visual, home, office, information & communication) equipment. When subjected to severe electrical, environmental, and/or mechanical stress beyond the specifications, as noted in the Ratings and Specified Conditions section, the Thermistor may fail in a short circuit mode or in an open-circuit mode. This case results in a burn-out, smoke or flaming. For products which require high safety levels, please carefully consider how a single malfunction can affect your product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe, such as setting up protecting circuits, etc. For the following applications and conditions, please contact us for additional not found in this document. * When your application may have difficulty complying with the safety or handling precautions specified below. * For any applications where a malfunction with this product may directly or indirectly cause hazardous conditions which could result in death or injury; 1 Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.) 2 Submarine Equipment (submarine repeating equipment, etc.) 3 Transportation Equipment (motor vehicles, airplanes, trains, ship, traffic signal controllers, etc.) 4 Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system, etc.) 5 Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.) 6 Information Processing Equipment (large scale computer systems, etc.) 7 Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.) 8 Rotary Motion Equipment 9 Security Systems J And any similar types of equipment Operating Conditions and Circuit Design [Maximum power dissipation] * The Maximum power that can be continuously applied under static air at a certain ambient temperature. The Maximum power dissipation under an ambient temperature of 25 C or less is the same with the rated maximum power dissipation, and Maximum power dissipation beyond 25 C depends on the Decreased power dissipation curve below. 1. Circuit Design 1.1 Operating Temperature and Storage Temperature The specified "Operating Temperature Range" found in the Specifications is the absolute maximum and minimum temperature rating. Every Thermistor shall be operated within the specified "Operating Temperature Range". The Thermistors mounted on PCB shall be stored without operating within the specified "Storage Temperature Range" in the Specifications. Maximum power dissipation / Rated maximum power dissipation (%) Decreased power dissipation curve 1.2 Operating Power Thermistors shall not be operated in excess of the "Maximum power dissipation". If the Thermistors are operated beyond the specified Maximum power dissipation, it may cause burnout and/or damage due to thermal run away. For temperature detection applications, the accuracy may be greatly influenced by self-heat generation and the heat dissipation of the Thermistor, even if the Thermistor is operated under the specified Maximum Power Dissipation. Please check the safety and reliability of your circuit. 100 50 25 75 125 Ambient temperature (C) [Dissipation factor] * The constant amount power required to raise the temperature of the Thermistor 1 C through self heat generation under stable temperatures. Dissipation factor (mW/C) = Power consumption of Thermistor / Temperature rise of element 00 Sep. 2010 11 Multilayer NTC Thermistors (2) The size of lands shall be designed to have equal spacing between the right and left sides. If the amount of solder on the right land is different from that on the left land, the component may be cracked by stress since the side with a larger amount of solder solidifies later during cooling. 1.3 Environmental Restrictions The Thermistors shall not be operated and/or stored under the following conditions. (1) Environmental conditions (a) Under direct exposure to water or salt water (b) Under conditions where water can condense and/or dew can form (c) Under conditions containing corrosive gases such as hydrogen sulfide, sulfurous acid, chlorine and ammonia (2) Mechanical conditions Under severe conditions of vibration or impact beyond the specified conditions found in the Specifications. Recommended Amount of Solder (a) Excessive amount (c) Insufficient amount 2.3 Utilization of Solder Resist (1) Solder resist shall be utilized to equalize the amounts of solder on both sides. (2) Solder resist shall be used to divide the pattern for the following cases; * Components are arranged closely. * The Thermistor is mounted near a component with lead wires. * The Thermistor is placed near a chassis. See the table below. 1.4 Measurement of Resistance The resistance of the Thermistors varies dependent on ambient temperatures and self-heating. Note the following points when measuring resistance values of the Thermistors during inspection or when considering them for circuits. 1 Measurement temp : 250.1 C Measurement in liquid (silicon oil, etc.) is recommended for a stable measurement temperature. 2 Power : 0.10 mW max. 4 terminal measurement with a constant-current power supply is recommended. Prohibited Applications and Recommended Applications Item 2. Design of Printed Circuit Board Mixed mounting with a component with lead wires 2.1 Selection of Printed Circuit Boards When the Thermistors are mounted and soldered on an "Alumina Substrate", the substrate influences the Thermistors' reliability against "Temperature Cycles" and "Heat shock" due to the difference in the thermal expansion coefficient between them. Confirm that the actual board used does not deteriorate the characteristics of the Thermistors. Arrangement near chassis Prohibited applications The lead wire of a component with lead wires Chassis Solder (Ground solder) Improved applications by pattern division Solder resist Solder resist Electrode pattern 2.2 Design of Land Pattern (1) Recommended land dimensions are shown below. Retro-fitting of component with lead wires Use the proper amount of solder in order to prevent cracking. Using too much solder places excessive stress on the Thermistors. Recommended Land Dimensions Lateral arrangement SMD A lead wire of Soldering Retro-fitted component iron Portion to be excessively soldered Land Solder resist Solder resist Solder resist c Land (b) Proper amount 2.4 Component Layout b The Thermistors/components shall be placed on the PC board such that both electrodes are subjected to uniform stresses, or to position the component electrodes at right angles to the grid glove or bending line. T his should be done to avoid cracking the Thermistors from bending the PC board after or during placing/mounting on the PC board. Placement of the Thermistors near heating elements also requires that great care be taken in order to avoid stresses from rapid heating and cooling. a Unit (mm) Size Code (EIA) Z(0201) 0(0402) 1(0603) Component dimensions L W T 0.6 0.3 0.3 1.0 0.5 0.5 1.6 0.8 0.8 a b c 0.2 to 0.3 0.4 to 0.5 0.8 to 1.0 0.25 to 0.30 0.4 to 0.5 0.6 to 0.8 0.2 to 0.3 0.4 to 0.5 0.6 to 0.8 00 Sep. 2010 12 Multilayer NTC Thermistors (1) To minimize mechanical stress caused by the warp or bending of a PC board, please follow the recommended Thermistors' layout below. Prohibited layout 2. Chip Mounting Consideration (1) When mounting the Thermistors/components on a PC board, the Thermistor bodies shall be free from excessive impact loads such as mechanical impact or stress due to the positioning, pushing force and displacement of vacuum nozzles during mounting. (2) Maintenance and inspection of the Chip Mounter must be performed regularly. (3) If the bottom dead center of the vacuum nozzle is too low, the Thermistor will crack from excessive force during mounting. The following precautions and recommendations are for your reference in use. (a) Set and adjust the bottom dead center of the vacuum nozzles to the upper surface of the PC board after correcting the warp of the PC board. (b) Set the pushing force of the vacuum nozzle during mounting to 1 to 3 N in static load. (c) F or double sur face m ounting, apply a supporting pin on the rear surface of the PC board to suppress the bending of the PC board in order to minimize the impact of the vacuum nozzles. Typical examples are shown in the table below. Recommended layout Layout the Thermistors sideways against the stressing direction (2) The following layout is for your reference since mechanical stress near the dividing/breaking position of a PC board varies depending on the mounting position of the Thermistors. E D Perforation C A B Slit Magnitude of stress A>B=C>D>E (3) The magnitude of mechanical stress applied to the Thermistors when the circuit board is divided is in the order of push back < slit < V-groove < perforation. Also take into account the layout of the Thermistors and the dividing/breaking method. (4) When the Thermistors are placed near heating elements such as heater, etc., cracks from thermal stresses may be caused by the following: * Soldering the Thermistors directly heating elements. * Mounting the Thermistors on the same land that another Thermistor is mounted on. For the above - mentioned mounting and/or placement, please contact us in advance, Item Single surface mouting Prohibited mounting Crack Recommended mounting The supporting pin does not necessarily have to be positioned beneath the Thermistor. Supporting pin Double surface mounting Separation of Solder Crack Supporting pin (d) Adjust the vacuum nozzles so that their bottom dead center during mounting is not too low. (4) The closing dimensions of the positioning chucks shall be controlled. Maintenance and replacement of positioning chucks shall be performed regularly to prevent chipping or cracking of the Thermistors caused by mechanical impact during positioning due to worn positioning chucks. (5) Maximum stroke of the nozzle shall be adjusted so that the maximum bending of PC board does not exceed 0.5 mm at 90 mm span. The PC board shall be supported by an adequate number of supporting pins. 2.5 Mounting Density and Spaces If components are arranged in too narrow a space, the components can be affected by solder bridges and solder balls. The space between components should be carefully determined. Precautions for Assembly 1. Storage (1) The Thermistors shall be stored between 5 - 40 C and 20 - 70 % RH, not under severe conditions of high temperature and humidity. (2) If stored in a place that is humid, dusty, or contains corrosive gasses (hydrogen sulfide, sulfurous acid, hydrogen chloride and ammonia etc.), the solderability of terminal electrodes may deteriorate. In addition, storage in a place subjected to heating and/or exposure to direct sunlight will cause deformed tapes and reels, and component sticking to tapes, both of which can result in mounting problems (3) Do not store components longer than 6 months. Check the solderability of products that have been stored for more than 6 months before use 3. Selection of Soldering Flux Soldering flux may seriously affect the performance of the Thermistors. The following shall be confirmed before use. (1) The soldering flux should have a halogen based content of 0.1 wt% (converted to chlorine) or below. Do not use soldering flux with strong acid. (2) When applying water-soluble soldering flux, wash the Thermistors sufficiently because the soldering flux residue on the surface of PC boards may deteriorate the insulation resistance on the Thermistors' surface. 00 Sep. 2010 13 Multilayer NTC Thermistors (b) Preheating: The Thermistors shall be preheated so that the "Temperature Gradient" between the devices and the tip of soldering iron is 150 C or below. (c) Temperature of Iron tip: 300 C max. (The required amount of solder shall be melted in advance on the soldering tip.) (d) Gradual cooling: After soldering, the Thermistors shall be cooled gradually at room temperature. 4. Soldering 4.1 Reflow Soldering The reflow soldering temperature conditions are each temperature curves of Preheating, Temp. rise, Heating, Peak and Gradual cooling. Large temperature difference caused by rapid heat application to the Thermistors may lead to excessive thermal stresses, contributing to the thermal cracks. The Preheating temperature requires controlling with great care so that tombstone phenomenon may be prevented. Recommended profile of Hand soldering (EX) Period or Speed 60 to 120 sec Gradual cooling 2 to 5 C /sec 6T Temperature 140 to 180 C 1Preheating Preheating temp 2Temp. rise to Peak temp. 220 C min. 3Heating 260 C max. 4Peak Peak temp. 5Gradual cooling to 140 C Item 60 sec max. 10 sec max. Preheating 1 to 4 C /sec 60 to 120 sec 3 sec max. Recommended profile of Reflow soldering (EX) 65 Temperature (C) T : Allowable temperature difference T < 150 C 4 Peak 260 220 (2) Condition 2 (without preheating) Hand soldering can be per formed without preheating, by following the conditions below: (a) Soldering iron tip shall never directly touch the ceramic and terminal electrodes of the Thermistors. (b) The lands are sufficiently preheated with a soldering iron tip before sliding the soldering iron tip to the terminal electrodes of the Thermistors for soldering. 2 Temp. rise 5 Gradual cooling 180 140 1 Preheating 3 Heating Time 60 to 120 sec 60 sec max. T : Allowable temperature difference T < 150 C Conditions of Hand soldering without preheating The rapid cooling (forced cooling) during Gradual cooling part should be avoided, because this may cause defects such as the thermal cracks, etc. When the Thermistors are immersed into a cleaning solvent, make sure that the surface temperatures of the devices do not exceed 100 C. Performing reflow soldering twice under the conditions shown in the figure above [Recommended profile of Reflow soldering (EX)] will not cause any problems. However, pay attention to the possible warp and bending of the PC board. Item Temperature of Iron tip Wattage Shape of Iron tip Soldering time with a soldering iron Condition 270 C max. 20 W max. f3 mm max. 3 sec max. 5. Post Soldering Cleaning 5.1 Cleaning solvent Soldering flux residue may remain on the PC board if cleaned with an inappropriate solvent. This may deteriorate the electrical characteristics and reliability of the Thermistors. 4.2 Hand Soldering Hand soldering typically causes significant temperature change, which may induce excessive thermal stresses inside the Thermitors, resulting in the thermal cracks, etc. In order to prevent any defects, the following should be observed. * The temperature of the soldering tips should be controlled with special care. * The direct contact of soldering tips with the Thermistors and/or terminal electrodes should be avoided. * Dismounted Thermistors shall not be reused. (1) Condition 1 (with preheating) (a) Soldering: f1.0 mm or below Thread eutectic solder with soldering flux in the core. Rosin-based and non-activated flux is recommended. 5.2 Cleaning conditions Inappropriate cleaning conditions such as insufficient cleaning or excessive cleaning may impair the electrical characteristics and reliability of the Thermistors. (1) Insufficient cleaning can lead to: (a) The halogen substance found in the residue of the soldering flux may cause the metal of terminal electrodes to corrode. (b) The halogen substance found in the residue of the soldering flux on the surface of the Thermistors may change resistance values. (c) Water-soluble soldering flux may have more remarkable tendencies of (a) and (b) above compared to those of rosin soldering flux. 00 Sep. 2010 14 Multilayer NTC Thermistors (3) Examples of PCB dividing/breaking jigs: The outline of PC board breaking jig is shown below. When PC boards are broken or divided, loading points should be close to the jig to minimize the extent of the bending Also, planes with no parts mounted on should be used as plane of loading, which generates a compressive stress on the mounted plane, in order to prevent tensile stress induced by the bending, which may cause cracks of the Thermistors or other parts mounted on the PC boards. (2) Excessive cleaning can lead to: (a) Overuse of ultrasonic cleaning may deteriorate the strength of the terminal electrodes or cause cracking in the solder and /or ceramic bodies of the Thermistors due to vibration of the PC boards. Please follow these conditions for Ultrasonic cleaning: Ultrasonic wave output : 20 W/L max. Ultrasonic wave frequency : 40 kHz max. Ultrasonic wave cleaning time : 5 min. max. 5.3 Contamination of Cleaning solvent Outline of Jig Cleaning with contaminated cleaning solvent may cause the same results as insufficient cleaning due to the high density of liberated halogen. PC board V-groove 6.Inspection Process When mounted PC boards are inspected with measuring terminal pins, abnormal and excess mechanical stress shall not be applied to the PC board or mounted components, to prevent failure or damage to the devices. (1) Mounted PC boards shall be supported by an adequate number of supporting pins with bend settings of 90 mm span 0.5 mm max. (2) Confirm that the measuring pins have the right tip shape, are equal in height and are set in the correct positions. The following figures are for your reference to avoid bending the PC board. Item Prohibited setting PC board splitting jig Prohibited dividing Chip component Loading direction V-groove Chip component Loading point 9. Mechanical Impact (1) The Thermistors shall be free from any excessive mechanical impact. The Thermistor body is made of ceramics and may be damaged or cracked if dropped. N eve r use a T h er misto r w hich has be en dropped; their quality may be impaired and failure rate increased. (2) When handling PC boards with Thermistors mounted on them, do not allow the Thermistors to collide with another PC board. When mounted PC boards are handled or stored in a stacked state, impact between the corner of a PC board and the Thermistor may cause damage or cracking and can deteriorate the withstand voltage and insulation resistance of the Thermistor. Check pin Bending of PC board Separated, Crack PC board V-groove Recommended setting Check pin Loading direction Loading point PC board Recommended dividing Supporting pin 7. Protective Coating When the surface of a PC board on which the Capacitors have been mounted is coated with resin to protect against moisture and dust, it shall be confirmed that the protective coating which is corrosive or chemically active is not used, in order that the reliability of the Thermistors in the actual equipment may not be influenced. Coating materials that expand or shrink also may lead to damage to the Thermistors during the curing process. Mounted PCB 8. Dividing/Breaking of PC Boards Crack (1) Abnormal and excessive mechanical stress such as bending or torsion shown below can cause cracking in the Thermistors. Crack Floor Bending Torsion Other The various precautions described above are typical. For special mounting conditions, please contact us. (2) Dividing/Breaking of the PC boards shall be done carefully at moderate speed by using a jig or apparatus to prevent the Thermistors on the boards from mechanical damage. 00 Sep. 2010 15 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Panasonic: ERT-J0EV224H ERT-J0EV334H ERT-J0EV474H ERT-JZEG103HA ERT-JZEP473H ERT-JZET202H ERTJZET302H