SEMICONDUCTOR TECHNICAL DATA
3–35 REV 5
Motorola, Inc. 1996
3/93
The MC10109 is a dual 4–5 input OR/NOR gate.
PD= 30 mW typ/gate (No Load)
tpd = 2.0 ns typ
tr, tf= 2.0 ns typ (20%–80%)
LOGIC DIAGRAM
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
6
53
2
4
7
12
10 14
15
9
13
11
DIP
PIN ASSIGNMENT
VCC1
AOUT
AOUT
AIN
AIN
AIN
AIN
VEE
VCC2
BOUT
BOUT
BIN
BIN
BIN
BIN
BIN
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–1 1 of the Motorola MECL Data
Book (DL122/D).
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
MC10109
MOTOROLA MECL Data
DL122 — Rev 6
3–36
ELECTRICAL CHARACTERISTICS
Pi
Test Limits
Pin
Under –30°C +25°C +85°C
Characteristic Symbol
Under
Test Min Max Min Typ Max Min Max Unit
Power Supply Drain Current IE8 15 11 14 15 mAdc
Input Current IinH 4425 265 265 µAdc
IinL 40.5 0.5 0.3 µAdc
Output Voltage Logic 1 VOH 2
3–1.060
–1.060 –0.890
–0.890 –0.960
–0.960 –0.810
–0.810 –0.890
–0.890 –0.700
–0.700 Vdc
Output Voltage Logic 0 VOL 2
3–1.890
–1.890 –1.675
–1.675 –1.850
–1.850 –1.650
–1.650 –1.825
–1.825 –1.615
–1.615 Vdc
Threshold Voltage Logic 1 VOHA 2
3–1.080
–1.080 –0.980
–0.980 –0.910
–0.910 Vdc
Threshold Voltage Logic 0 VOLA 2
3–1.655
–1.655 –1.630
–1.630 –1.595
–1.595 Vdc
Switching T imes (50Ω Load) ns
Propagation Delay t4+2+
t4–2–
t4+3–
t4–3+
2
2
3
3
1.0
1.0
1.0
1.0
3.7
3.7
3.7
3.7
1.0
1.0
1.0
1.0
2.0
2.0
2.0
2.0
2.9
2.9
2.9
2.9
1.0
1.0
1.0
1.0
3.7
3.7
3.7
3.7
Rise Time (20 to 80%) t2+
t3+ 2
31.1
1.1 4.0
4.0 1.1
1.1 2.0
2.0 3.3
3.3 1.1
1.1 4.0
4.0
Fall T ime (20 to 80%) t2–
t3– 2
31.1
1.1 4.0
4.0 1.1
1.1 2.0
2.0 3.3
3.3 1.1
1.1 4.0
4.0
MC10109
3–37 MOTOROLAMECL Data
DL122 — Rev 6
ELECTRICAL CHARACTERISTICS (continued)
TEST VOLTAGE VALUES (Volts)
@ Test Temperature VIHmax VILmin VIHAmin VILAmax VEE
–30°C–0.890 –1.890 –1.205 –1.500 –5.2
+25°C–0.810 –1.850 –1.105 –1.475 –5.2
+85°C–0.700 –1.825 –1.035 –1.440 –5.2
Pin
Under
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
(VCC)
Characteristic Symbol
U
n
d
er
Test VIHmax VILmin VIHAmin VILAmax VEE
(V
CC
)
Gnd
Power Supply Drain Current IE8 8 1, 16
Input Current IinH 4 4 8 1, 16
IinL 4 4 8 1, 16
Output Voltage Logic 1 VOH 2
34 8
81, 16
1, 16
Output Voltage Logic 0 VOL 2
348
81, 16
1, 16
Threshold Voltage Logic 1 VOHA 2
3448
81, 16
1, 16
Threshold Voltage Logic 0 VOLA 2
344 8
81, 16
1, 16
Switching T imes (50Ω Load) Pulse In Pulse Out –3.2 V +2.0 V
Propagation Delay t4+2+
t4–2–
t4+3–
t4–3+
2
2
3
3
4
4
4
4
2
2
3
3
8
8
8
8
1, 16
1, 16
1, 16
1, 16
Rise Time (20 to 80%) t2+
t3+ 2
34
42
38
81, 16
1, 16
Fall T ime (20 to 80%) t2–
t3– 2
34
42
38
81, 16
1, 16
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the
same manner .
MC10109
MOTOROLA MECL Data
DL122 — Rev 6
3–38
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
XG1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T–
SEATING
PLANE
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
H
VIEW S
K
K1
F
G1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.385 0.395 9.78 10.03
B0.385 0.395 9.78 10.03
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 ––– 0.51 –––
K0.025 ––– 0.64 –––
R0.350 0.356 8.89 9.04
U0.350 0.356 8.89 9.04
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y––– 0.020 ––– 0.50
Z2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
____
MC10109
3–39 MOTOROLAMECL Data
DL122 — Rev 6
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
–T–
FE
G
NK
C
SEATING
PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.750 0.785 19.05 19.93
B0.240 0.295 6.10 7.49
C––– 0.200 ––– 5.08
D0.015 0.020 0.39 0.50
E0.050 BSC 1.27 BSC
F0.055 0.065 1.40 1.65
G0.100 BSC 2.54 BSC
H0.008 0.015 0.21 0.38
K0.125 0.170 3.18 4.31
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
____
16 9
18
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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Opportunity/Af firmative Action Employer .
How to reach us:
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MC10109/D
*MC10109/D*
◊
