TLP291-4
1
Photocouplers GaAs Infrared LED & Photo Transistor
TLP291-4
TLP291-4
TLP291-4
TLP291-4
1.
1.
1.
1. Applications
Applications
Applications
Applications
• Programmable Logic Controllers (PLCs)
• Switching Power Supplies
• Simplex/Multiplex Data Transmission
2.
2.
2.
2. General
General
General
General
The Toshiba TLP291-4 consists of phototransistors optically coupled to gallium arsenide infrared emitting diodes.
The TLP291-4 Photocoupler is housed in the very small and thin SO16 package.
Since the TLP291-4 is guaranteed over a wide operating temperature range (Ta = -55 to 110), it is suitable for
high-density surface mount applications such as programmable controllers.
3.
3.
3.
3. Features
Features
Features
Features
(1) Collector-emitter voltage: 80 V (min)
(2) Current transfer ratio: 50% (min)
GB Rank: 100% (min)
(3) Isolation voltage: 2500 Vrms (min)
(4) Operating temperature: -55 to 110
(5) Safety standards
UL-approved UL1577 File No.E67349
cUL-approved CSA Component Acceptance Service No.5A File No.E67349
VDE approved EN60747-5-2 Certificate No. 40009347 (Note)
Note: When an EN60747-5-2 approved type is needed, please designate the Option (V4)
Note: When an EN60747-5-2 approved type is needed, please designate the Option (V4)
Note: When an EN60747-5-2 approved type is needed, please designate the Option (V4)
Note: When an EN60747-5-2 approved type is needed, please designate the Option (V4).
4.
4.
4.
4. Packaging and Pin Configuration
Packaging and Pin Configuration
Packaging and Pin Configuration
Packaging and Pin Configuration
1, 3, 5, 7: Anode
2, 4, 6, 8: Cathode
9, 11, 13, 15: Emitter
10, 12, 14, 16: Collector
11-11F1
2012-03-22
Rev.4.0
TLP291-4
2
5.
5.
5.
5. Principle of Operation
Principle of Operation
Principle of Operation
Principle of Operation
5.1.
5.1.
5.1.
5.1. Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Characteristics
Creepage distances
Clearance
Internal isolation thickness
Min
5.0
5.0
0.1
Unit
mm
6.
6.
6.
6. Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
LED
Detector
Common
Characteristics
Input forward current
Input forward current derating
Input forward current (pulsed)
Input reverse voltage
Junction temperature
Collector-emitter voltage
Emitter-collector voltage
Collector current
Collector power dissipation
Collector power dissipation
derating (1 circuit)
Junction temperature
Operating temperature
Storage temperature
Lead soldering temperature
Total power dissipation
(1 circuit)
Input power dissipation
derating(1 circuit)
Isolation voltage
(Ta ≥ 50)
(Ta ≥ 25)
(10 s)
(Ta ≥ 25)
AC, 1min, R.H. ≤ 60%
Symbol
IF
∆IF/∆Ta
IFP
VR
Tj
VCEO
VECO
IC
PC
∆PC/∆Ta
Tj
Topr
Tstg
Tsol
PT
∆PD/∆Ta
BVS
Note
(Note 1)
(Note 2)
Rating
50
-0.67
1
5
125
80
7
50
100
-1.0
125
-55 to 110
-55 to 125
260
170
-1.7
2500
Unit
mA
mA/
A
V
V
mA
mW
mW/
mW
mW/
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 100 µs, f = 100 Hz
Note 2: This device is considered as a two-terminal device: Pins 1, 2, 3, 4, 5, 6, 7 and 8 are shorted together, and pins
9, 10, 11, 12, 13, 14, 15 and 16 are shorted together.
2012-03-22
Rev.4.0
TLP291-4
3
7.
7.
7.
7. Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
LED
Detector
Characteristics
Input forward voltage
Input reverse current
Input capacitance
Collector-emitter breakdown
voltage
Emitter-collector breakdown
voltage
Dark Current
Collector-emitter capacitance
Symbol
VF
IR
Ct
V(BR)CEO
V(BR)ECO
IDARK
CCE
Note Test Condition
IF = 10 mA
VR = 5 V
V = 0 V, f = 1 MHz
IC = 0.5 mA
IE = 0.1 mA
VCE = 48 V
VCE = 48 V, Ta = 85
V = 0 V, f = 1 MHz
Min
1.1
80
7
Typ.
1.20
30
0.01
2
10
Max
1.4
10
0.1
50
Unit
V
µA
pF
V
µA
pF
8.
8.
8.
8. Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Current transfer ratio
Saturated current transfer ratio
Collector-emitter saturation
voltage
OFF-state collector current
Symbol
IC/IF
IC/IF(sat)
VCE(sat)
IC(off)
Note
(Note 1)
Test Condition
IF = 5 mA, VCE = 5 V
IF = 5 mA, VCE = 5 V, Rank GB
IF = 1 mA, VCE = 0.4 V
IF = 1 mA, VCE = 0.4 V, Rank GB
IC = 2.4 mA, IF = 8 mA
IC = 0.2 mA, IF = 1 mA
IC = 0.2 mA, IF = 1 mA, Rank GB
VF = 0.7 V, VCE = 48 V
Min
50
100
30
Typ.
60
0.2
Max
400
400
0.4
0.4
10
Unit
%
V
µA
Note 1: See Table 8.1 for current transfer ratio.
Table
Table
Table
Table 8.1
8.1
8.1
8.1 Current transfer ratio (CTR) Rank (Note) (Unless otherwise specified, T
Current transfer ratio (CTR) Rank (Note) (Unless otherwise specified, T
Current transfer ratio (CTR) Rank (Note) (Unless otherwise specified, T
Current transfer ratio (CTR) Rank (Note) (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Rank
Blank
GB
Test Condition
IF = 5 mA, VCE = 5 V
Current
transfer
ratio IC/IF
Min
50
100
Current
transfer
ratio IC/IF
Max
400
400
Marking of
Classification
Blank
GB
Unit
%
Note: Specify both the part number and a rank in this format when ordering.
Example: TLP291-4 (GB)
For safety standard certification, however, specify the part number alone.
Example: TLP291-4 (GB,E: TLP291-4
9.
9.
9.
9. Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Total capacitance (input to
output)
Isolation resistance
Isolation voltage
Symbol
CS
RS
BVS
Note Test Conditions
VS = 0 V, f = 1 MHz
VS = 500 V, R.H. ≤ 60%
AC, 1 min
AC, 1s in oil
DC, 1min in oil
Min
1 × 1012
2500
Typ.
0.8
1014
5000
5000
Max
Unit
pF
Ω
Vrms
Vdc
2012-03-22
Rev.4.0
TLP291-4
4
10.
10.
10.
10. Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Rise time
Fall time
Turn-on time
Turn-off time
Turn-on time
Storage time
Turn-off time
Symbol
tr
tf
ton
toff
ton
ts
toff
Note Test Condition
VCC = 10 V, IC = 2 mA,
RL = 100 Ω
See Figure 10.1
RL = 1.9 kΩ, VCC = 5 V,
IF = 16 mA
Min
Typ.
2
3
3
3
2
25
40
Max
Unit
µs
Fig.
Fig.
Fig.
Fig. 10.1
10.1
10.1
10.1 Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
2012-03-22
Rev.4.0
TLP291-4
5
11.
11.
11.
11. Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Fig.
Fig.
Fig.
Fig. 11.1
11.1
11.1
11.1 I
I
I
IF
F
F
F - T
- T
- T
- Ta
a
a
aFig.
Fig.
Fig.
Fig. 11.2
11.2
11.2
11.2 P
P
P
PC
C
C
C - T
- T
- T
- Ta
a
a
a
Fig.
Fig.
Fig.
Fig. 11.3
11.3
11.3
11.3 I
I
I
IFP
FP
FP
FP - D
- D
- D
- DR
R
R
RFig.
Fig.
Fig.
Fig. 11.4
11.4
11.4
11.4 I
I
I
IF
F
F
F - V
- V
- V
- VF
F
F
F
Fig.
Fig.
Fig.
Fig. 11.5
11.5
11.5
11.5 ∆
∆
∆
∆V
V
V
VF
F
F
F/
/
/
/∆
∆
∆
∆T
T
T
Ta
a
a
a - I
- I
- I
- IF
F
F
FFig.
Fig.
Fig.
Fig. 11.6
11.6
11.6
11.6 I
I
I
IFP
FP
FP
FP - V
- V
- V
- VFP
FP
FP
FP
2012-03-22
Rev.4.0
TLP291-4
6
Fig.
Fig.
Fig.
Fig. 11.7
11.7
11.7
11.7 I
I
I
IC
C
C
C - V
- V
- V
- VCEO
CEO
CEO
CEO Fig.
Fig.
Fig.
Fig. 11.8
11.8
11.8
11.8 I
I
I
IC
C
C
C - V
- V
- V
- VCEO
CEO
CEO
CEO
Fig.
Fig.
Fig.
Fig. 11.9
11.9
11.9
11.9 I
I
I
IC
C
C
C - I
- I
- I
- IF
F
F
FFig.
Fig.
Fig.
Fig. 11.10
11.10
11.10
11.10 I
I
I
IDARK
DARK
DARK
DARK - T
- T
- T
- Ta
a
a
a
Fig.
Fig.
Fig.
Fig. 11.11
11.11
11.11
11.11 I
I
I
IC
C
C
C/I
/I
/I
/IF
F
F
F - I
- I
- I
- IF
F
F
F
2012-03-22
Rev.4.0
TLP291-4
7
Fig.
Fig.
Fig.
Fig. 11.12
11.12
11.12
11.12 V
V
V
VCE(sat)
CE(sat)
CE(sat)
CE(sat) - T
- T
- T
- Ta
a
a
aFig.
Fig.
Fig.
Fig. 11.13
11.13
11.13
11.13 I
I
I
IC
C
C
C - T
- T
- T
- Ta
a
a
a
Fig.
Fig.
Fig.
Fig. 11.14
11.14
11.14
11.14 Switching Time - R
Switching Time - R
Switching Time - R
Switching Time - RL
L
L
LFig.
Fig.
Fig.
Fig. 11.15
11.15
11.15
11.15 Switching Time - T
Switching Time - T
Switching Time - T
Switching Time - Ta
a
a
a
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
2012-03-22
Rev.4.0
TLP291-4
8
12.
12.
12.
12. Soldering and Storage
Soldering and Storage
Soldering and Storage
Soldering and Storage
12.1.
12.1.
12.1.
12.1. Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
• When using soldering reflow (See Fig. 12.1.1 and 12.1.2)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig.
Fig.
Fig.
Fig. 12.1.1
12.1.1
12.1.1
12.1.1 An example of a temperature profile
An example of a temperature profile
An example of a temperature profile
An example of a temperature profile
when Sn-Pb eutectic solder is used
when Sn-Pb eutectic solder is used
when Sn-Pb eutectic solder is used
when Sn-Pb eutectic solder is used
Fig.
Fig.
Fig.
Fig. 12.1.2
12.1.2
12.1.2
12.1.2 An example of a temperature profile
An example of a temperature profile
An example of a temperature profile
An example of a temperature profile
when lead(Pb)-free solder is used
when lead(Pb)-free solder is used
when lead(Pb)-free solder is used
when lead(Pb)-free solder is used
• When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150 for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
• When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
12.2.
12.2.
12.2.
12.2. Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
• Avoid storage locations where devices may be exposed to moisture or direct sunlight.
• Follow the precautions printed on the packing label of the device for transportation and storage.
• Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%,
respectively.
• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
• When restoring devices after removal from their packing, use anti-static containers.
• Do not allow loads to be applied directly to devices while they are in storage.
• If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
2012-03-22
Rev.4.0
TLP291-4
9
13.
13.
13.
13. Land Pattern Dimensions for Reference Only
Land Pattern Dimensions for Reference Only
Land Pattern Dimensions for Reference Only
Land Pattern Dimensions for Reference Only
Fig.
Fig.
Fig.
Fig. 13.1
13.1
13.1
13.1 Land Pattern Dimensions for Reference Only (unit: mm)
Land Pattern Dimensions for Reference Only (unit: mm)
Land Pattern Dimensions for Reference Only (unit: mm)
Land Pattern Dimensions for Reference Only (unit: mm)
14.
14.
14.
14. Marking
Marking
Marking
Marking
Fig.
Fig.
Fig.
Fig. 14.1
14.1
14.1
14.1 Marking
Marking
Marking
Marking
2012-03-22
Rev.4.0
TLP291-4
10
15.
15.
15.
15. Embossed-Tape Packing (TP) Specification for Mini-Flat Photocouplers
Embossed-Tape Packing (TP) Specification for Mini-Flat Photocouplers
Embossed-Tape Packing (TP) Specification for Mini-Flat Photocouplers
Embossed-Tape Packing (TP) Specification for Mini-Flat Photocouplers
15.1.
15.1.
15.1.
15.1. Applicable Package
Applicable Package
Applicable Package
Applicable Package
Package Name
SO16
Product Type
Mini-Flat Coupler
15.2.
15.2.
15.2.
15.2. Product Naming Conventions
Product Naming Conventions
Product Naming Conventions
Product Naming Conventions
Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification
is as below.
Example) TLP291-4 (GB-TP, E
Part number: TLP291-4
CTR rank: (GB
Tape type: TP
[[G]]/RoHS COMPATIBLE: E (Note)
(Note)
(Note)
(Note)
Note: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
15.3.
15.3.
15.3.
15.3. Tape Dimensions Specification
Tape Dimensions Specification
Tape Dimensions Specification
Tape Dimensions Specification
15.3.1.
15.3.1.
15.3.1.
15.3.1. Orientation of Device in Relation to Direction of Feed
Orientation of Device in Relation to Direction of Feed
Orientation of Device in Relation to Direction of Feed
Orientation of Device in Relation to Direction of Feed
Device orientation in the carrier cavities as shown in Figure 15.3.1.1.
Fig.
Fig.
Fig.
Fig. 15.3.1.1
15.3.1.1
15.3.1.1
15.3.1.1 Device Orientation
Device Orientation
Device Orientation
Device Orientation
15.3.2.
15.3.2.
15.3.2.
15.3.2. Packing Quantity
Packing Quantity
Packing Quantity
Packing Quantity
2000 pcs per reel
15.3.3.
15.3.3.
15.3.3.
15.3.3. Empty Cavities
Empty Cavities
Empty Cavities
Empty Cavities
Table
Table
Table
Table 15.3.3.1
15.3.3.1
15.3.3.1
15.3.3.1 Empty Cavities
Empty Cavities
Empty Cavities
Empty Cavities
Characteristics
Occurrences of 2 or more
successive empty cavities
Single empty cavity
Criterion
0
6 devices (max) per reel
Remarks
Within any given 40-mm section of tape, not including leader
and trailer
Not including leader and trailer
15.3.4.
15.3.4.
15.3.4.
15.3.4. Tape Leader and Trailer
Tape Leader and Trailer
Tape Leader and Trailer
Tape Leader and Trailer
The start end of the tape has 50 or more empty cavities. The hub end of the tape has 50 or more empty cavities
and two empty turns only for a cover tape.
2012-03-22
Rev.4.0
TLP291-4
11
15.3.5.
15.3.5.
15.3.5.
15.3.5. Tape Dimensions
Tape Dimensions
Tape Dimensions
Tape Dimensions
Tape material: Plastic (for protection against static electricity)
Fig.
Fig.
Fig.
Fig. 15.3.5.1
15.3.5.1
15.3.5.1
15.3.5.1 Tape Dimensions
Tape Dimensions
Tape Dimensions
Tape Dimensions
Table
Table
Table
Table 15.3.5.1
15.3.5.1
15.3.5.1
15.3.5.1 Tape Dimensions (unit: mm, unless oherwise specified:
Tape Dimensions (unit: mm, unless oherwise specified:
Tape Dimensions (unit: mm, unless oherwise specified:
Tape Dimensions (unit: mm, unless oherwise specified: ±
±
±
±0.1)
0.1)
0.1)
0.1)
Symbol
A
B
D
E
F
G
K0
Dimension
7.5
10.5
7.5
1.75
12.0
4.0
2.2
Remark
Center line of embossed cavity and sprocket hole
Distance between tape edge and sprocket hole center
Cumulative error +0.1/-0.3 (max) per 10 empty cavities holes
Cumulative error +0.1/-0.3 (max) per 10 sprocket holes
Internal space
2012-03-22
Rev.4.0
TLP291-4
12
15.3.6.
15.3.6.
15.3.6.
15.3.6. Reel specification
Reel specification
Reel specification
Reel specification
Material: Plastic
Fig.
Fig.
Fig.
Fig. 15.3.6.1
15.3.6.1
15.3.6.1
15.3.6.1 Reel Dimensions
Reel Dimensions
Reel Dimensions
Reel Dimensions
Table
Table
Table
Table 15.3.6.1
15.3.6.1
15.3.6.1
15.3.6.1
Reel Dimensions (unit: mm)
Reel Dimensions (unit: mm)
Reel Dimensions (unit: mm)
Reel Dimensions (unit: mm)
Symbol
A
B
C
E
U
W1
W2
Dimension
φ330 ± 2
φ80 ± 1
φ13 ± 0.5
2.0 ± 0.5
4.0 ± 0.5
17.5 ± 0.5
21.5 ± 1.0
15.4.
15.4.
15.4.
15.4. Packing
Packing
Packing
Packing
Either one reel or ten reels of photocouplers are packed in a shipping carton.
15.5.
15.5.
15.5.
15.5. Label Format
Label Format
Label Format
Label Format
The label on each carton provides the part number, quantity, lot number, the Toshiba logo, CTR rank, etc.
15.6.
15.6.
15.6.
15.6. Ordering Information
Ordering Information
Ordering Information
Ordering Information
When placing an order, please specify the part number, CTR rank, tape type and quantity as shown in the
following example.
Example) TLP291-4 (GB-TP, E 2000
Part number: TLP291-4
CTR rank: (GB
Tape type: TP
[[G]]/RoHS COMPATIBLE: E (Note)
(Note)
(Note)
(Note)
Quantity (must be a multiple of 2000)
Note: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
2012-03-22
Rev.4.0
TLP291-4
13
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions Unit: mm
Weight: 0.19 g (typ.)
Package Name(s)
TOSHIBA: 11-11F1
2012-03-22
Rev.4.0
TLP291-4
14
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product
is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/
or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact
("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace
industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment,
equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and
equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange
and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology
are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
2012-03-22
Rev.4.0
