ProASICPLUS Family Flash FPGAs
2 Advanced v0.6
General Description
The ProASICPLUS family of devices offers enhanced
performance over Actel’s ProASIC family. It combines the
advantages of ASICs with the benefits of programmable
devices through nonvolatile Flash technology. This enables
engineers to create high-density systems using existing ASIC
or FPGA design flows and tools. In addition, the
ProASICPLUS family offers a unique clock conditioning
circuit based on two on-board phase lock loops (PLLs). The
family offers up to 1 million system gates, supported with up
to 198 kbits of 2-port SRAM and up to 712 user I/Os, all
providing 50 MHz PCI performance.
Advantages to the designer extend beyond performance.
Four levels of routing hierarchy simplify routing, while the
use of Flash technology allows all functionality to be live at
power up, unlike SRAM-based FPGAs. No external Boot
PROM is required to support device programming. While
on-board security mechanisms prevent all access to the
program information, reprogramming can be performed
in-system to support future design iterations and field
upgrades. The device’s architecture mitigates the
complexity of ASIC migration at higher user volume. This
makes ProASICPLUS a cost-effective solution for
applications in the networking, communications,
computing, and avionics markets.
The ProASICPLUS family achieves its nonvolatility and
reprogrammability through an advanced Flash-based 0.22m
LVCMOS process with four-layer metal. Standard CMOS
design techniques are used to implement logic and control
functions, including the PLLs and LVPECL inputs. The
result is predictable performance fully compatible with gate
arrays.
The ProASICPLUS architecture provides granularity
comparable to gate arrays. The device core consists of a
Sea-of-TilesTM. Each tile can be configured as a flip-flop,
latch, or 3-input/1-output logic function by programming the
appropriate Flash switches. The combination of fine
granularity, flexible routing resources, and abundant Flash
switches allow 100% utilization and over 95% routability for
highly congested designs. Tiles and larger functions are
interconnected through a 4-level routing hierarchy.
Embedded 2-port SRAM blocks with built-in FIFO/RAM
control logic can have user-defined depth and width. Users
can also select programming for synchronous or
asynchronous operation, as well as parity generations or
checking.
The clock conditioning circuitry is unique. Devices contain
two clock conditioning blocks, each with a PLL core, delay
lines, phase shifts (0×, 90×, 180×, 270×), and clock
multipliers/dividers. In short, this is all the circuitry needed
to provide bidirectional access to the PLL, and operation up
to 240 MHz. The PLL block contains four programmable
frequency dividers which allow the incoming clock signal to
be divided by a wide range of factors from 1 to 64. The clock
conditioning circuit also delays or advances the incoming
reference clock up to 4ns (in increments of 0.25ns). The
PLL can be configured internally or externally during
operation without redesigning or reprogramming the part.
In addition to the PLL, there are two LVPECL differential
input pairs to accommodate high speed clock and data
inputs.
To support customers’ needs for more comprehensive, lower
cost board-level testing, Actel’s ProASICPLUS devices are
fully compatible with IEEE Standard 1149.1 for test access
port and boundary-scan test architecture. For more details
on the Flash FPGA implementation please refer to the
“Boundary Scan” section on page 12.
ProASICPLUS devices are available in a variety of
high-performance plastic packages. Those packages, and the
performance features discussed above, are described in
more detail in the following sections of this document:
•“Features and Benefits” section on page 1
•“ProASICPLUS Architecture” section on page 5
•“Routing Resources” section on page 6
•“Clock Trees” section on page 9
•“Input/Output Blocks” section on page 10
•“LVPECL Input Pads” section on page 11
•“Boundary Scan” section on page 12
•“User Security” section on page 14
•“Embedded Memory Floorplan” section on page 14
•“Design Environment” section on page 17
•“Package Thermal Characteristics” section on page 19
•“Operating Conditions” section on page 22
•“DC Electrical Specifications (VDDP = 2.5V +/-0.2V)”
section on page 23 – page 25
•“AC Specifications (3.3V PCI Revision 2.2 Operation)”
section on page 26
•“Clock Conditioning Circuit” section on page 27
•“Embedded Memory Specifications” section on page 35
•“Package Pin Assignments” section on page 55 – page 109
•For more information concerning In-System Programming
with ProASICPLUS, refer to the application note,
Performing Internal In-System Programming Using
Actel’s ProASICPLUS Devices.
http://www.actel.com/appnotes/PAplusISPAN.pdf