CYBLE-214015-01 - CYPRESS SEMICONDUCTOR

PRELIMINARY CYBLE-214015-01

EZ-BLE™ PSoC® Bluetooth 4.2 Module

Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600

Document Number: 002-15923 Rev. ** Revised September 7, 2016

EZ-BLE™ PSoC® B luetooth 4.2 Modu le

General Description

The Cypress CYBLE-214015-01 is a fully certified and qualified

module supporting Bluetooth Low Energy (BLE) wireless

communication. The CYBLE-214015-01 is a turnkey solution

and includes onboard crystal oscillators, trace antenna, passive

components, and the Cypress PSoC® 4 BLE. Refer to the

PSoC® 4 BLE datasheet for additional details on the capabilities

of the PSoC 4 BLE device used on this module.

The EZ-BLE PSoC® module is a scalable and reconfigurable

platform architecture. It combines programmable and

reconfigurable analog and digital blocks with flexible automatic

routing. The CYBLE-214015-01 also includes digital

programmable logic, high-performance analog-to-digital

conversion (ADC), opamps with comparator mode, and standard

communication and timing peripherals.

The CYBLE-214015-01 includes a royalty-free BLE stack

compatible with Bluetooth 4.2 and provides up to 25 GPIOs in a

small 11 × 11 × 1.80 mm package. The CYBLE-214015-01 is

drop-in compatible with the CYBLE-014008-00 and

CYBLE-214009-00 EZ-BLE Modules.

The CYBLE-214015-01 is a complete solution and an ideal fit for

applications seeking a highly integrated BLE wireless solution.

Module Description

■Module size: 11.0 mm × 11.0 mm × 1.80 mm (with shield)

■Drop-in compatible with CYBLE-014008-00 and

CYBLE-214009-00

■256-KB flash memory, 32-KB SRAM memory

■Up to 25 GPIOs configurable as open drain high/low,

pull-up/pull-down, HI-Z analog, HI-Z digial, or strong output

■Bluetooth 4.2 qualified single-mode module

❐QDID: 79480

❐Declaration ID: D029646

■Certified to FCC, CE, MIC, KC, and IC regulations

■Industrial temperature range: –40 °C to +85 °C

■32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit

multiply, operating at up to 48 MHz

■Watchdog timer with dedicated internal low-speed oscillator

(ILO)

■Two-pin SWD for programming

Power Consumption

■TX output power: –18 dbm to +3 dbm

■Received signal strength indicator (RSSI) with 1-dB resolution

■TX current consumption of 15.6 mA (radio only, 0 dbm)

■RX current consumption of 16.4 mA (radio only)

■Low power mode support

❐Deep Sleep: 1.3 µA with watch crystal oscillator (WCO) on

❐Hibernate: 150 nA with SRAM retention

❐Stop: 60 nA with GPIO (P2.2) or XRES wakeup

Programmable Analog

■Four opamps with reconfigurable high-drive external and

high-bandwidth internal drive, comparator modes, and ADC

input buffering capability; can operate in Deep-Sleep mode

■12-bit, 1-Msps SAR ADC with differential and single-ended

modes; channel sequencer with signal averaging

■Two current DACs (IDACs) for general-purpose or capacitive

sensing applications on any pin

■One low-power comparator that operate in Deep-Sleep mode

Programmable Digital

■Four programmable logic blocks called universal digital blocks,

(UDBs), each with eight macrocells and datapath

■Cypress-provided peripheral Component library, user-defined

state machines, and Verilog input

Capacitive Sensing

■Cypress CapSense Sigma-Delta (CSD) provides best-in-class

SNR (> 5:1) and liquid tolerance

■Cypress-supplied software component makes

capacitive-sensing design easy

■Automatic hardware-tuning algorithm (SmartSense™)

Segment LCD Drive

■LCD drive supported on all GPIOs (common or segment)

■Operates in Deep-Sleep mode with four bits per pin memory

Serial Communication

■Two independent runtime reconfigurable serial communication

blocks (SCBs) with I2C, SPI, or UART functionality

Timing and Pulse-Width Modulation

■Four 16-bit timer, counter, pulse-width modulator (TCPWM)

blocks

■Center-aligned, Edge, and Pseudo-random modes

■Comparator-based triggering of Kill signals for motor drive and

other high-reliability digital logic applications

Up to 25 Programmable GPIOs

■Any GPIO pin can be CapSense, LCD, analog, or digital

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Document Number: 002-15923 Rev. ** Page 2 of 42

More Information

Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to

quickly and effectively integrate the module into your design.

■Overview: EZ-BLE Module Portfolio, Module Roadmap

■EZ-BLE PSoC Product Overview

■PSoC 4 BLE Silicon Datasheet

■Application notes: Cypress offers a number of BLE application

notes covering a broad range of topics, from basic to advanced

level. Recommended application notes for getting started with

EZ-BLE modules are:

❐AN96841 - Getting Started with EZ-BLE Module

❐AN94020 - Getting Started with PSoC® 4 BLE

❐AN97060 - PSoC® 4 BLE and PRoC™ BLE - Over-The-Air

(OTA) Device Firmware Upgrade (DFU) Guide

❐AN91162 - Creating a BLE Custom Profile

❐AN91184 - PSoC 4 BLE - Designing BLE Applications

❐AN92584 - Designing for Low Power and Estimating Battery

Life for BLE Applications

❐AN85951 - PSoC® 4 CapSense® Design Guide

❐AN95089 - PSoC® 4/PRoC™ BLE Crystal Oscillator

Selection and Tuning Techniques

❐AN91445 - Antenna Design and RF Layout Guidelines

■Knowledge Base Articles

❐KBA97095 - EZ-BLE™ Module Placement

❐KBA213976 - FAQ for BLE and Regulatory Certifications with

EZ-BLE modules

❐KBA210802 - Queries on BLE Qualification and Declaration

Processes

■Technical Reference Manual (TRM):

❐PSoC® 4 BLE Technical Reference Manual

❐PSOC(R) 4 BLE Registers Technical Reference Manual

(TRM)

■Development Kits:

❐CYBLE-214015-EVAL, CYBLE-214015-01 Evaluation Board

❐CY8CKIT-042-BLE, Bluetooth® Low Energy (BLE) Pioneer

Kit

❐CY8CKIT-002, PSoC® MiniProg3 Program and Debug Kit

■Test and Debug Tools:

❐CYSmart, Bluetooth® LE Test and Debug Tool (Windows)

❐CYSmart Mobile, Bluetooth® LE Test and Debug Tool

(Android/iOS Mobile App)

PSoC® Creator™ Integrated Design Environment (IDE)

PSoC Creator is an Integrated Design Environment (IDE) that enables concurrent hardware and firmware editing, compiling and

debugging of PSoC 3, PSoC 4, PSoC 5LP, PSoC 4 BLE, PRoC BLE and EZ-BLE module systems with no code size limitations. PSoC

peripherals are designed using schematic capture and simple graphical user interface (GUI) with over 120 pre-verified,

production-ready PSoC Components™.

PSoC Components are analog and digital “virtual chips,” represented by an icon that users can drag-and-drop into a design and

configure to suit a broad array of application requirements.

Bluetooth Low Energy Component

The Bluetooth Low Energy Component inside PSoC Creator provides a comprehensive GUI-based configuration window that lets you

quickly design BLE applications. The Component incorporates a Bluetooth Core Specification v4.2 compliant BLE protocol stack and

provides API functions to enable user applications to interface with the underlying Bluetooth Low Energy Sub-System (BLESS)

hardware via the stack.

Technical Support

■Frequently Asked Questions (FAQs): Learn more about our BLE ECO System.

■Forum: See if your question is already answered by fellow developers on the PSoC 4 BLE and PRoC BLE forums.

■Visit our support page and create a technical support case or contact a local sales representatives. If you are in the United States,

you can talk to our technical support team by calling our toll-free number: +1-800-541-4736. Select option 2 at the prompt.

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 3 of 42

Contents

Overview ............................................................................4

Module Description ......................................................4

Pad Connection Interface ................................................6

Recommended Host PCB Layout ................................... 7

Power Supply Connections

and Recommended External Components .................. 11

Connection Options ...................................................11

External Component Recommendation .................... 11

Critical Components List ...........................................14

Antenna Design .........................................................14

Electrical Specification ..................................................15

GPIO .........................................................................17

XRES .........................................................................18

Analog Peripherals ....................................................18

Digital Peripherals .....................................................22

Serial Communication ...............................................24

Memory .....................................................................25

System Resources ....................................................26

Environmental Specifications .......................................31

Environmental Compliance .......................................31

RF Certification ..........................................................31

Environmental Conditions .........................................31

ESD and EMI Protection ........................................... 31

Regulatory Information .................................................. 32

FCC ...........................................................................32

Industry Canada (IC) Certification ............................. 33

European R&TTE Declaration of Conformity ............ 33

MIC Japan ................................................................. 34

KC Korea ................................................................... 34

Packaging ........................................................................ 35

Ordering Information ...................................................... 37

Part Numbering Convention ...................................... 37

Acronyms ........................................................................ 38

Document Conventions ................................................. 40

Units of Measure .......................................................40

Document History Page ................................................. 41

Sales, Solutions, and Legal Information ...................... 42

Worldwide Sales and Design Support ....................... 42

Products .................................................................... 42

PSoC®Solutions ....................................................... 42

Cypress Developer Community .................................42

Technical Support ..................................................... 42

PRELIMINARY CYBLE-214015-01

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Overview

Module Description

The CYBLE-214015-01 module is a complete module designed to be soldered to the main host board.

Module Dimensions and Drawing

Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE

module functionality. Such selections will guarantee that all height restrictions of the component area are maintained. Designs should

be completed with the physical dimensions shown in the mechanical drawings in Figure 1. All dimensions are in millimeters (mm).

Table 1. Module Design Dimensions

See Figure 1 on page 5 for the mechanical reference drawing for CYBLE-214015-01.

Dimension Item Specification

Module dimensions Length (X) 11.00 ± 0.15 mm

Width (Y) 11.00 ± 0.15 mm

Antenna location dimensions Length (X) 11.00 ± 0.15 mm

Width (Y) 4.62 ± 0.15 mm

PCB thickness Height (H) 0.80 ± 0.10 mm

Shield height Height (H) 1.00 ± 0.10 mm

Maximum component height Height (H) 1.00 mm typical (shield)

Total module thickness (bottom of module to highest component) Height (H) 1.80 mm typical

PRELIMINARY CYBLE-214015-01

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Figure 1. Module Mechanical Drawing

Top View

Bottom View

Side View

Note

1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on

recommended host PCB layout, see Figure 3 on page 6, Figure 4 and Figure 5 on page 7, and Figure 6 and Table 3 on page 8.

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Pad Connection Interface

As shown in the bottom view of Figure 1 on page 5, the CYBLE-214015-01 connects to the host board via solder pads on the back

of the module. Tab le 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-214015-01 module.

Figure 2. Solder Pad Dimensions (Seen from Bottom)

To maximize RF performance, the host layout should follow these recommendations:

1. The ideal placement of the Cypress BLE module is in a corner of the host board with the antenna located on the edge of the host

board. This placement minimizes the additional recommended keep-out area stated in item 2. Please refer to AN96841 for module

placement best practices.

2. To maximize RF performance, the area immediately around the Cypress BLE module trace antenna should contain an additional

keep-out area, where no grounding or signal traces are contained. The keep-out area applies to all layers of the host board. The

recommended dimensions of the host PCB keep-out area are shown in Figure 3 (dimensions are in mm).

Figure 3. Recommended Host PCB Keep-Out Area Around the CYBLE-214015-01 Trace Antenna

Table 2. Solder Pad Connection Description

Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch

SP 32 Solder Pads Pad9/Pad24: 0.74 mm

All Others: 0.79 mm

0.41 mm 0.66 mm

Host PCB Keep-Out Area Around Trace Antenna

PRELIMINARY CYBLE-214015-01

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Recommended Host PCB Layout

Figure 4 through Figure 6 and Table 3 provide details that can be used for the recommended host PCB layout pattern for the

CYBLE-214015-01. Dimensions are in millimeters unless otherwise noted. Pad length of 0.99 mm (0.494 mm from center of the pad

on either side) shown in Figure 6 is the minimum recommended host pad length. The host PCB layout pattern can be completed using

either Figure 4, Figure 5, or Figure 6. It is not necessary to use all figures to complete the host PCB layout pattern.

Figure 4. Host Layout Pattern for CYBLE-214015-01 Figure 5. Module Pad Location from Origin

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Table 3 provides the center location for each solder pad on the CYBLE-214015-01. All dimensions reference the to the center of the

solder pad. Refer to Figure 6 for the location of each module solder pad.

Table 3. Module Solder Pad Location Figure 6. Solder Pad Reference Location

Solder Pad

(Center of Pad)

Location (X,Y) from

Orign (mm)

Dimension from

Orign (mils)

1 (0.30, 4.83) (11.81, 190.16)

2 (0.30, 5.49) (11.81, 216.14)

3 (0.30, 6.15) (11.81, 242.13)

4 (0.30, 6.81) (11.81, 268.11)

5 (0.30, 7.47) (11.81, 294.09)

6 (0.30, 8.13) (11.81, 320.08)

7 (0.30, 8.79) (11.81, 346.06)

8 (0.30, 9.45) (11.81, 372.05)

9 (0.27, 10.11) (10.63, 398.03)

10 (1.21, 10.70) (47.64, 421.26)

11 (1.87, 10.70) (73.62, 421.26)

12 (2.53, 10.70) (99.61, 421.26)

13 (3.19, 10.70) (125.59, 421.26)

14 (3.85, 10.70) (151.57, 421.26)

15 (4.51, 10.70) (177.56, 421.26)

16 (5.17, 10.70) (203.54, 421.26)

17 (5.84, 10.70) (229.92, 421.26)

18 (6.50, 10.70) (255.91, 421.26)

19 (7.16, 10.70) (281.89, 421.26)

20 (7.82, 10.70) (307.87, 421.26)

21 (8.48, 10.70) (333.86, 421.26)

22 (9.14, 10.70) (359.84, 421.26)

23 (9.80, 10.70) (385.83, 421.26)

24 (10.73, 10.11) (422.44, 398.03)

25 (10.70, 9.45) (421.26, 372.05)

26 (10.70, 8.79) (421.26, 346.06)

27 (10.70, 8.13) (421.26, 320.08)

28 (10.70, 7.47) (421.26, 294.09)

29 (10.70, 6.81) (421.26, 268.11)

30 (10.70, 6.15) (421.26, 242.13)

31 (10.70, 5.49) (421.26, 216.14)

32 (10.70, 4.83) (421.26, 190.16)

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Table 4 and Table 5 detail the solder pad connection definitions and available functions for each connection pad. Tab le 4 lists the

solder pads on CYBLE-214015-01, the BLE device port-pin, and denotes whether the digital function shown is available for each

solder pad. Tab le 5 denotes whether the analog function shown is available for each solder pad. Each connection is configurable for

a single option shown with a ✓.

Table 4. Digital Peripheral Capabilities

Pad

Number

Device

Port Pin UART SPI I2CTCPWM[2] Cap

Sense

WCO

Out

ECO

OUT LCD SWD GPIO

1GND

[3] Ground Connection

2P1.1 ✓(SCB1_SS1) ✓(TCPWM0_N) ✓✓✓

3P1.0 ✓(TCPWM0_P) ✓✓✓

4P1.5✓(SCB0_TX) ✓(SCB0_MISO) ✓(SCB0_SCL) ✓(TCPWM2_N) ✓✓✓

5P0.1✓(SCB1_TX) ✓(SCB1_MISO) ✓(SCB1_SCL) ✓(TCPWM0_N) ✓✓✓

6P0.7✓(SCB0_CTS) ✓(SCB0_SCLK) ✓(TCPWM2_N) ✓✓

✓

(SWDCLK)

✓

7 VDD Digital Power Supply Input (1.71 to 5.5V)

8P1.4

✓(SCB0_RX) ✓(SCB0_MOSI) ✓(SCB0_SDA) ✓(TCPWM2_P) ✓✓✓

9P0.4✓(SCB0_RX) ✓(SCB0_MOSI) ✓(SCB0_SDA) ✓(TCPWM1_P) ✓✓✓ ✓

10 P0.5 ✓(SCB0_TX) ✓(SCB0_MISO) ✓(SCB0_SCL) ✓(TCPWM1_N) ✓✓✓

11 P0.6 ✓(SCB0_RTS) ✓(SCB0_SS0) ✓(TCPWM2_P) ✓✓✓

(SWDIO)

✓

12 P1.2 ✓(SCB1_SS2) ✓(TCPWM1_P) ✓✓✓

13 VDDR Radio Power Supply (1.9V to 5.5V)

14 P2.6 ✓✓✓

15 P1.3 ✓(SCB1_SS3) ✓(TCPWM1_N) ✓✓✓

16 P3.0 ✓(SCB0_RX) ✓(SCB0_SDA) ✓(TCPWM0_P) ✓✓✓

17 P2.1 ✓(SCB0_SS2) ✓✓✓

18 P2.2 ✓(SCB0_SS3) ✓✓✓

19 P2.3 ✓✓ ✓ ✓

20 VDDA Analog Power Supply Input (1.71 to 5.5V)

21 P3.4 ✓(SCB1_RX) ✓(SCB1_SDA) ✓(TCPWM2_P) ✓✓✓

22 P3.1 ✓(SCB0_TX) ✓(SCB0_SCL) ✓(TCPWM0_N) ✓✓✓

23 P3.7 ✓(SCB1_CTS) ✓(TCPWM3_N) ✓✓ ✓ ✓

24 P3.5 ✓(SCB1_TX) ✓(SCB1_SCL) ✓(TCPWM2_N) ✓✓✓

25 P3.3 ✓(SCB0_CTS) ✓(TCPWM1_N) ✓✓✓

26 VREF Reference Voltage Input

27 P3.2 ✓(SCB0_RTS) ✓(TCPWM1_P) ✓✓✓

28 P3.6 ✓(SCB1_RTS) ✓(TCPWM3_P) ✓✓✓

29 XRES External Reset Hardware Connection Input

30 P2.4 ✓✓✓

31 P2.5 ✓✓✓

32 GND[3] Ground Connection

Notes

2. TCPWM stands for timer, counter, and PWM. If supported, the pad can be configured to any of these peripheral functions.

3. The main board needs to connect both GND connections (Pad 1 and Pad 32) on the module to the common ground of the system.

PRELIMINARY CYBLE-214015-01

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Table 5. Analog Peripheral Capabilities

Pad Number Device Port Pin SARMUX OPAMP LPCOMP

1GND

[3] Ground Connection

2P1.1 ✓(CTBm1_OA0_INN)

3P1.0 ✓(CTBm1_OA0_INP)

4P1.5 ✓(CTBm1_OA1_INP)

5P0.1

6P0.7

7 VDD Digital Power Supply Input (1.71 to 5.5V)

8P1.4 ✓(CTBm1_OA1_INN)

9P0.4 ✓(COMP1_INP)

10 P0.5 ✓(COMP1_INN)

11 P0.6

12 P1.2 ✓(CTBm1_OA0_OUT)

13 VDDR Radio Power Supply (1.9V to 5.5V)

14 P2.6 ✓(CTBm1_OA0_INP)

15 P1.3 ✓(CTBm1_OA1_OUT)

16 P3.0 ✓

17 P2.1 ✓(CTBm1_OA0_INN)

18 P2.2 ✓(CTBm1_OA0_OUT)

19 P2.3 ✓(CTBm1_OA1_OUT)

20 VDDA Analog Power Supply Input (1.71 to 5.5V)

21 P3.4 ✓

22 P3.1 ✓

23 P3.7 ✓

24 P3.5 ✓

25 P3.3 ✓

26 VREF Reference Voltage Input (Optional)

27 P3.2 ✓

28 P3.6 ✓

29 XRES External Reset Hardware Connection Input

30 P2.4 ✓(CTBm1_OA1_INN)

31 P2.5 ✓(CTBm1_OA1_INP)

32 GND Ground Connection

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Power Supply Connections and Recommended External Components

Power Connections

The CYBLE-214015-01 contains three power supply connec-

tions, VDD, VDDA, and VDDR. The VDD and VDDA connections

supply power for the digital and analog device operation respec-

tively. VDDR supplies power for the device radio.

VDD and VDDA accept a supply range of 1.71 V to 5.5 V. VDDR

accepts a supply range of 1.9 V to 5.5 V. These specifications

can be found in Table 10. The maximum power supply ripple for

both power connections on the module is 100 mV, as shown in

Table 8.

The power supply ramp rate of VDD and VDDA must be equal

to or greater than that of VDDR when the radio is used.

Connection Options

Two connection options are available for any application:

1. Single supply: Connect VDD, VDDA, and VDDR to the same

supply.

2. Independent supply: Power VDD, VDDA, and VDDR

separately.

External Component Recommendation

In either connection scenario, it is recommended to place an

external ferrite bead between the supply and the module

connection. The ferrite bead should be positioned as close as

possible to the module pin connection.

Figure 7 details the recommended host schematic options for a

single supply scenario. The use of one or two ferrite beads will

depend on the specific application and configuration of the

CYBLE-214015-01.

Figure 8 details the recommended host schematic for an

independent supply scenario.

The recommended ferrite bead value is 330 , 100 MHz (Murata

BLM21PG331SN1D).

Figure 7. Recommended Host Schematic Options for Single Supply Option

Three Ferrite Bead Option

Single Ferrite Bead Option

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Figure 8. Recommended Host Schematic for Independent Supply Option

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The CYBLE-214015-01 schematic is shown in Figure 9.

Figure 9. CYBLE-214015-01 Schematic Diagram

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Critical Components List

Table 6 details the critical components used in the CYBLE-214015-01 module.

Table 6. Critical Component List

Antenna Design

Table 7 details antenna used on the CYBLE-214015-01 module. The Cypress module performance improves many of these

characteristics. For more information, see Table 9 on page 15.

Table 7. Trace Antenna Specifications

Component Reference Designator Description

Silicon U1 76-pin WLCSP Programmable System-on-Chip (PSoC) with BLE

Crystal Y1 24.000 MHz, 10 pF

Crystal Y2 32.768 kHz, 12.5 pF

Item Description

Frequency Range 2400 MHz–2500 MHz

Peak Gain 0.5 dBi typical

Average Gain –0.5 dBi typical

Return Loss 10 dB minimum

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Electrical Specification

Table 8 details the absolute maximum electrical characteristics for the Cypress BLE module.

Table 8. CYBLE-214015-01 Absolute Maximum Ratings

Table 9 details the RF characteristics for the Cypress BLE module.

Table 9. CYBLE-214015-01 RF Performance Characteristics

Table 10 through Table 51 list the module level electrical characteristics for the CYBLE-214015-01. All specifications are valid for

–40 °C  TA  85 °C and TJ  100 °C, except where noted. Specifications are valid for 1.71V to 5.5V, except where noted.

Parameter Description Min Typ Max Unit Details/Conditions

VDDD_ABS VDD, VDDA or VDDR supply relative to VSS

(VSSD = VSSA)

–0.5 – 6 V Absolute maximum

VCCD_ABS Direct digital core voltage input relative to VSSD –0.5 – 1.95 V Absolute maximum

VDDD_RIPPLE Maximum power supply ripple for VDD, VDDA and

VDDR input voltage

– – 100 mV 3.0V supply

Ripple frequency of 100 kHz

to 750 kHz

VGPIO_ABS GPIO voltage –0.5 – VDD +0.5 V Absolute maximum

IGPIO_ABS Maximum current per GPIO –25 – 25 mA Absolute maximum

IGPIO_injection GPIO injection current: Maximum for VIH > VDD

and minimum for VIL < VSS

–0.5 – 0.5 mA Absolute maximum current

injected per pin

LU Pin current for latch up –200 200 mA –

Parameter Description Min Typ Max Unit Details/Conditions

RFO RF output power on ANT –18 0 3 dBm Configurable via register

settings

RXSRF receive sensitivity on ANT – –87 – dBm Guaranteed by design

simulation

FRModule frequency range 2400 – 2480 MHz –

GPPeak gain – 0.5 – dBi –

GAvg Average gain – –0.5 – dBi –

RL Return loss – –10 – dB –

Table 10. CYBLE-214015-01 DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

VDD1 Power supply input voltage (VDD = VDDA = VDDR) 1.71 – 5.5 V With regulator enabled

VDD2 Power supply input voltage unregulated (VDD =

VDDA = VDDR)

1.71 1.8 1.89 V Internally unregulated

supply

VDDR1 Radio supply voltage (radio on) 1.9 – 5.5 V –

VDDR2 Radio supply voltage (radio off) 1.71 – 5.5 V –

Active Mode, VDD = 1.71 V to 5.5 V

IDD3 Execute from flash; CPU at 3 MHz – 1.7 – mA T = 25 °C,

VDD = 3.3 V

IDD4 Execute from flash; CPU at 3 MHz – – – mA T = –40 °C to 85 °C

IDD5 Execute from flash; CPU at 6 MHz – 2.5 – mA T = 25 °C,

VDD = 3.3 V

IDD6 Execute from flash; CPU at 6 MHz – – – mA T = –40 °C to 85 °C

IDD7 Execute from flash; CPU at 12 MHz – 4 – mA T = 25 °C,

VDD = 3.3 V

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IDD8 Execute from flash; CPU at 12 MHz – – – mA T = –40 °C to 85 °C

IDD9 Execute from flash; CPU at 24 MHz – 7.1 – mA T = 25 °C,

VDD = 3.3 V

IDD10 Execute from flash; CPU at 24 MHz – – – mA T = –40 °C to 85 °C

IDD11 Execute from flash; CPU at 48 MHz – 13.4 – mA T = 25 °C,

VDD = 3.3 V

IDD12 Execute from flash; CPU at 48 MHz – – – mA T = –40 °C to 85 °C

Sleep Mode, VDD = 1.71 V to 5.5 V

IDD13 IMO on – – – mA T = 25 °C, VDD = 3.3 V,

SYSCLK = 3 MHz

Sleep Mode, VDD and VDDR = 1.9 V to 5.5 V

IDD14 ECO on – – – mA T = 25 °C, VDD = 3.3 V,

SYSCLK = 3 MHz

Deep-Sleep Mode, VDD = 1.71 V to 3.6 V

IDD15 WDT with WCO on – 1.3 – µA T = 25 °C,

VDD = 3.3 V

IDD16 WDT with WCO on – – – µA T = –40 °C to 85 °C

IDD17 WDT with WCO on – – – µA T = 25 °C,

VDD = 5 V

IDD18 WDT with WCO on – – – µA T = –40 °C to 85 °C

Deep-Sleep Mode, VDD = 1.71 V to 1.89 V (Regulator Bypassed)

IDD19 WDT with WCO on – – – µA T = 25 °C

IDD20 WDT with WCO on – – – µA T = –40 °C to 85 °C

Hibernate Mode, VDD = 1.71 V to 3.6 V

IDD27 GPIO and reset active – 150 – nA T = 25 °C,

VDD = 3.3 V

IDD28 GPIO and reset active – – – nA T = –40 °C to 85 °C

Hibernate Mode, VDD = 3.6 V to 5.5 V

IDD29 GPIO and reset active – – – nA T = 25 °C,

VDD = 5 V

IDD30 GPIO and reset active – – – nA T = –40 °C to 85 °C

Stop Mode, VDD = 1.71 V to 3.6 V

IDD33 Stop-mode current (VDD) – 20 – nA T = 25 °C,

VDD = 3.3 V

IDD34 Stop-mode current (VDDR) – 40 – nA T = 25 °C,

VDDR = 3.3 V

IDD35 Stop-mode current (VDD) – – – nA T = –40 °C to 85 °C

IDD36 Stop-mode current (VDDR) – – – nA T = –40 °C to 85 °C,

VDDR = 1.9 V to 3.6 V

Stop Mode, VDD = 3.6 V to 5.5 V

IDD37 Stop-mode current (VDD) – – – nA T = 25 °C,

VDD = 5 V

IDD38 Stop-mode current (VDDR) – – – nA T = 25 °C,

VDDR = 5 V

IDD39 Stop-mode current (VDD) – – – nA T = –40 °C to 85 °C

IDD40 Stop-mode current (VDDR) – – – nA T = –40 °C to 85 °C

Table 10. CYBLE-214015-01 DC Specifications (continued)

Parameter Description Min Typ Max Unit Details/Conditions

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GPIO

Table 11. AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

FCPU CPU frequency DC – 48 MHz 1.71V VDD 5.5V

TSLEEP Wakeup from Sleep mode – 0 – µs Guaranteed by characterization

TDEEPSLEEP Wakeup from Deep-Sleep mode – – 25 µs 24-MHz IMO. Guaranteed by

characterization

THIBERNATE Wakeup from Hibernate mode – – 800 µs Guaranteed by characterization

TSTOP Wakeup from Stop mode – – 2 ms XRES wakeup

Table 12. GPIO DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

VIH[4] Input voltage HIGH threshold 0.7 × VDD – – V CMOS input

LVTTL input, VDD < 2.7 V 0.7 × VDD – – V –

LVTTL input, VDD  2.7 V 2.0 – – V –

VIL Input voltage LOW threshold – – 0.3 × VDD VCMOS input

LVTTL input, VDD < 2.7 V – – 0.3 × VDD V–

LVTTL input, VDD  2.7 V – – 0.8 V –

VOH Output voltage HIGH level VDD – 0.6 – – V IOH = 4 mA at 3.3-V VDD

Output voltage HIGH level VDD – 0.5 – – V IOH = 1 mA at 1.8-V VDD

VOL Output voltage LOW level – – 0.6 V IOL = 8 mA at 3.3-V VDD

Output voltage LOW level – – 0.6 V IOL = 4 mA at 1.8-V VDD

Output voltage LOW level – – 0.4 V IOL = 3 mA at 3.3-V VDD

RPULLUP Pull-up resistor 3.5 5.6 8.5 k–

RPULLDOWN Pull-down resistor 3.5 5.6 8.5 k–

IIL Input leakage current (absolute value) – – 2 nA 25 °C, VDD = 3.3 V

IIL_CTBM Input leakage on CTBm input pins – – 4 nA –

CIN Input capacitance – – 7 pF –

VHYSTTL Input hysteresis LVTTL 25 40 – mV VDD > 2.7 V

VHYSCMOS Input hysteresis CMOS 0.05 × VDD – – 1 –

IDIODE Current through protection diode to

VDD/VSS

– – 100 µA –

ITOT_GPIO Maximum total source or sink chip

current

– – 200 mA –

Note

4. VIH must not exceed VDD + 0.2 V.

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XRES

Analog Peripherals

Opamp

Table 13. GPIO AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

TRISEF Rise time in Fast-Strong mode 2 – 12 ns 3.3-V VDDD, CLOAD = 25 pF

TFALLF Fall time in Fast-Strong mode 2 – 12 ns 3.3-V VDDD, CLOAD = 25 pF

TRISES Rise time in Slow-Strong mode 10 – 60 ns 3.3-V VDDD, CLOAD = 25 pF

TFALLS Fall time in Slow-Strong mode 10 – 60 ns 3.3-V VDDD, CLOAD = 25 pF

FGPIOUT1 GPIO Fout; 3.3 V  VDD 5.5 V

Fast-Strong mode

– – 33 MHz 90/10%, 25 pF load, 60/40 duty cycle

FGPIOUT2 GPIO Fout; 1.7 VVDD 3.3 V

Fast-Strong mode

– – 16.7 MHz 90/10%, 25 pF load, 60/40 duty cycle

FGPIOUT3 GPIO Fout; 3.3 V VDD 5.5 V

Slow-Strong mode

– – 7 MHz 90/10%, 25 pF load, 60/40 duty cycle

FGPIOUT4 GPIO Fout; 1.7 V VDD 3.3 V

Slow-Strong mode

– – 3.5 MHz 90/10%, 25 pF load, 60/40 duty cycle

FGPIOIN GPIO input operating frequency

1.71 V VDD 5.5 V

– – 48 MHz 90/10% VIO

Table 14. XRES DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

VIH Input voltage HIGH threshold 0.7 × VDDD – – V CMOS input

VIL Input voltage LOW threshold – – 0.3 × VDDD V CMOS input

RPULLUP Pull-up resistor 3.5 5.6 8.5 k–

CIN Input capacitance – 3 – pF –

VHYSXRES Input voltage hysteresis – 100 – mV –

IDIODE Current through protection diode to

VDD/VSS

– – 100 µA –

Table 15. XRES AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

TRESETWIDTH Reset pulse width 1 – – µs –

Table 16. Opamp Specifications

Parameter Description Min Typ Max Unit Details/Conditions

IDD (Opamp Block Current. VDD = 1.8 V. No Load)

IDD_HI Power = high – 1000 1300 µA –

IDD_MED Power = medium – 500 – µA –

IDD_LOW Power = low – 250 350 µA –

GBW (Load = 20 pF, 0.1 mA. VDDA = 2.7 V)

GBW_HI Power = high 6 – – MHz –

GBW_MED Power = medium 4 – – MHz –

GBW_LO Power = low – 1 – MHz –

IOUT_MAX (VDDA  2.7 V, 500 mV from Rail)

IOUT_MAX_HI Power = high 10 – – mA –

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IOUT_MAX_MID Power = medium 10 – – mA –

IOUT_MAX_LO Power = low – 5 – mA –

IOUT (VDDA = 1.71 V, 500 mV from Rail)

IOUT_MAX_HI Power = high 4 – – mA –

IOUT_MAX_MID Power = medium 4 – – mA –

IOUT_MAX_LO Power = low – 2 – mA –

VIN Charge pump on, VDDA  2.7 V –0.05 – VDDA – 0.2 V –

VCM Charge pump on, VDDA  2.7 V –0.05 – VDDA – 0.2 V –

VOUT (VDDA  2.7 V)

VOUT_1 Power = high, ILOAD = 10 mA 0.5 – VDDA – 0.5 V –

VOUT_2 Power = high, ILOAD = 1 mA 0.2 – VDDA – 0.2 V –

VOUT_3 Power = medium, ILOAD = 1 mA 0.2 – VDDA – 0.2 V –

VOUT_4 Power = low, ILOAD = 0.1 mA 0.2 – VDDA – 0.2 V –

VOS_TR Offset voltage, trimmed 1 ±0.5 1 mV High mode

VOS_TR Offset voltage, trimmed – ±1 – mV Medium mode

VOS_TR Offset voltage, trimmed – ±2 – mV Low mode

VOS_DR_TR Offset voltage drift, trimmed –10 ±3 10 µV/C High mode

VOS_DR_TR Offset voltage drift, trimmed – ±10 – µV/C Medium mode

VOS_DR_TR Offset voltage drift, trimmed – ±10 – µV/C Low mode

CMRR DC 65 70 – dB VDDD = 3.6 V,

High-power mode

PSRR At 1 kHz, 100-mV ripple 70 85 – dB VDDD = 3.6 V

Noise

VN1 Input referred, 1 Hz–1 GHz, power = high – 94 – µVrms –

VN2 Input referred, 1 kHz, power = high – 72 – nV/rtHz –

VN3 Input referred, 10 kHz, power = high – 28 – nV/rtHz –

VN4 Input referred, 100 kHz, power = high – 15 – nV/rtHz –

CLOAD Stable up to maximum load. Performance

specs at 50 pF

––125 pF –

Slew_rate Cload = 50 pF, Power = High,

VDDA  2.7 V

6 – – V/µsec –

T_op_wake From disable to enable, no external RC

dominating

– 300 – µsec –

Comp_mode (Comparator Mode; 50-mV Drive, TRISE = TFALL (Approx.)

TPD1 Response time; power = high – 150 – ns –

TPD2 Response time; power = medium – 400 – ns –

TPD3 Response time; power = low – 2000 – ns –

Vhyst_op Hysteresis – 10 – mV –

Deep-Sleep Mode (Deep-Sleep mode operation is only guaranteed for VDDA > 2.5 V)

GBW_DS Gain bandwidth product – 50 – kHz –

IDD_DS Current – 15 – µA –

Vos_DS Offset voltage – 5 – mV –

Vos_dr_DS Offset voltage drift – 20 – µV/°C –

Vout_DS Output voltage 0.2 – VDD – 0.2 V –

Table 16. Opamp Specifications (continued)

Parameter Description Min Typ Max Unit Details/Conditions

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Temperature Sensor

SAR ADC

Vcm_DS Common mode voltage 0.2 – VDD – 1.8 V –

Table 16. Opamp Specifications (continued)

Parameter Description Min Typ Max Unit Details/Conditions

Table 17. Comparator DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

VOFFSET1 Input offset voltage, Factory trim – – ±10 mV –

VOFFSET2 Input offset voltage, Custom trim – – ±6 mV –

VOFFSET3 Input offset voltage, ultra-low-power mode – ±12 – mV –

VHYST Hysteresis when enabled – 10 35 mV –

VICM1 Input common mode voltage in normal mode 0 – VDDD – 0.1 V Modes 1 and 2

VICM2 Input common mode voltage in low-power

mode

0– V

DDD V–

VICM3 Input common mode voltage in ultra

low-power mode

0–V

DDD – 1.15 V –

CMRR Common mode rejection ratio 50 – – dB VDDD  2.7 V

CMRR Common mode rejection ratio 42 – – dB VDDD  2.7 V

ICMP1 Block current, normal mode – – 400 µA –

ICMP2 Block current, low-power mode – – 100 µA –

ICMP3 Block current in ultra-low-power mode – 6 – µA –

ZCMP DC input impedance of comparator 35 – – M–

Table 18. Comparator AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

TRESP1 Response time, normal mode, 50-mV

overdrive

– 38 – ns 50-mV overdrive

TRESP2 Response time, low-power mode, 50-mV

overdrive

– 70 – ns 50-mV overdrive

TRESP3 Response time, ultra-low-power mode,

50-mV overdrive

– 2.3 – µs 200-mV overdrive

Table 19. Temperature Sensor Specifications

Parameter Description Min Typ Max Unit Details/Conditions

TSENSACC Temperature-sensor accuracy –5 ±1 5 °C –40 to +85 °C

Table 20. SAR ADC DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

A_RES Resolution – – 12 bits –

A_CHNIS_S Number of channels - single-ended – – 8 – 8 full-speed

A-CHNKS_D Number of channels - differential – – 4 – Diff inputs use

neighboring I/O

A-MONO Monotonicity – – – – Yes

A_GAINERR Gain error – – ±0.1 % With external reference

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CSD

A_OFFSET Input offset voltage – – 2 mV Measured with 1-V

VREF

A_ISAR Current consumption – – 1 mA –

A_VINS Input voltage range - single-ended VSS –V

DDA V–

A_VIND Input voltage range - differential VSS – VDDA V–

A_INRES Input resistance – – 2.2 k–

A_INCAP Input capacitance – – 10 pF –

VREFSAR Trimmed internal reference to SAR –1 – 1 % Percentage of Vbg

(1.024 V)

Table 20. SAR ADC DC Specifications (continued)

Parameter Description Min Typ Max Unit Details/Conditions

Table 21. SAR ADC AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

A_PSRR Power-supply rejection ratio 70 – – dB Measured at 1-V

reference

A_CMRR Common-mode rejection ratio 66 – – dB –

A_SAMP Sample rate – – 1 Msps –

Fsarintref SAR operating speed without external ref.

bypass – – 100 Ksps 12-bit resolution

A_SNR Signal-to-noise ratio (SNR) 65 – – dB FIN = 10 kHz

A_BW Input bandwidth without aliasing – – A_SAMP/2 kHz –

A_INL Integral nonlinearity. VDD = 1.71V to 5.5V, 1

Msps –1.7 – 2 LSB VREF = 1 V to VDD

A_INL Integral nonlinearity. VDDD = 1.71 V to 3.6 V,

1 Msps –1.5 – 1.7 LSB VREF = 1.71 V to VDD

A_INL Integral nonlinearity. VDD = 1.71 V to 5.5 V,

500 Ksps –1.5 – 1.7 LSB VREF = 1 V to VDD

A_dnl Differential nonlinearity. VDD = 1.71 V to 5.5 V,

1 Msps –1 – 2.2 LSB VREF = 1 V to VDD

A_DNL Differential nonlinearity. VDD = 1.71 V to 3.6 V,

1 Msps –1 – 2 LSB VREF = 1.71 V to VDD

A_DNL Differential nonlinearity. VDD = 1.71 V to 5.5 V,

500 Ksps –1 – 2.2 LSB VREF = 1 V to VDD

A_THD Total harmonic distortion – – –65 dB FIN = 10 kHz

Table 22. CSD Block Specifications

Parameter Description Min Typ Max Unit Details/Conditions

VCSD Voltage range of operation 1.71 – 5.5 V –

IDAC1 DNL for 8-bit resolution –1 – 1 LSB –

IDAC1 INL for 8-bit resolution –3 – 3 LSB –

IDAC2 DNL for 7-bit resolution –1 – 1 LSB –

IDAC2 INL for 7-bit resolution –3 – 3 LSB –

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Digital Peripherals

Timer

Counter

SNR Ratio of counts of finger to noise 5 – – Ratio Capacitance range of

9 pF to 35 pF, 0.1-pF

sensitivity. Radio is not

operating during the

scan

IDAC1_CRT1 Output current of IDAC1 (8 bits) in High

range

–612 – µA –

IDAC1_CRT2 Output current of IDAC1 (8 bits) in Low range – 306 – µA –

IDAC2_CRT1 Output current of IDAC2 (7 bits) in High

range

–305 – µA –

IDAC2_CRT2 Output current of IDAC2 (7 bits) in Low range – 153 – µA –

Table 22. CSD Block Specifications (continued)

Parameter Description Min Typ Max Unit Details/Conditions

Table 23. Timer DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

ITIM1 Block current consumption at 3 MHz – – 42 µA 16-bit timer

ITIM2 Block current consumption at 12 MHz – – 130 µA 16-bit timer

ITIM3 Block current consumption at 48 MHz – – 535 µA 16-bit timer

Table 24. Timer AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

TTIMFREQ Operating frequency FCLK –48MHz –

TCAPWINT Capture pulse width (internal) 2 × TCLK ––ns –

TCAPWEXT Capture pulse width (external) 2 × TCLK ––ns –

TTIMRES Timer resolution TCLK ––ns –

TTENWIDINT Enable pulse width (internal) 2 × TCLK ––ns –

TTENWIDEXT Enable pulse width (external) 2 × TCLK ––ns –

TTIMRESWINT Reset pulse width (internal) 2 × TCLK ––ns –

TTIMRESEXT Reset pulse width (external) 2 × TCLK ––ns –

Table 25. Counter DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

ICTR1 Block current consumption at 3 MHz – – 42 µA 16-bit counter

ICTR2 Block current consumption at 12 MHz – – 130 µA 16-bit counter

ICTR3 Block current consumption at 48 MHz – – 535 µA 16-bit counter

Table 26. Counter AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

TCTRFREQ Operating frequency FCLK –48MHz –

TCTRPWINT Capture pulse width (internal) 2 × TCLK ––ns –

TCTRPWEXT Capture pulse width (external) 2 × TCLK ––ns –

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Pulse Width Modulation (PWM)

LCD Direct Drive

TCTRES Counter Resolution TCLK ––ns –

TCENWIDINT Enable pulse width (internal) 2 × TCLK ––ns –

TCENWIDEXT Enable pulse width (external) 2 × TCLK ––ns –

TCTRRESWINT Reset pulse width (internal) 2 × TCLK ––ns –

TCTRRESWEXT Reset pulse width (external) 2 × TCLK –– ns –

Table 26. Counter AC Specifications (continued)

Parameter Description Min Typ Max Unit Details/Conditions

Table 27. PWM DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

IPWM1 Block current consumption at 3 MHz – – 42 µA 16-bit PWM

IPWM2 Block current consumption at 12 MHz – – 130 µA 16-bit PWM

IPWM3 Block current consumption at 48 MHz – – 535 µA 16-bit PWM

Table 28. PWM AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

TPWMFREQ Operating frequency FCLK –48MHz –

TPWMPWINT Pulse width (internal) 2 × TCLK ––ns –

TPWMEXT Pulse width (external) 2 × TCLK ––ns –

TPWMKILLINT Kill pulse width (internal) 2 × TCLK ––ns –

TPWMKILLEXT Kill pulse width (external) 2 × TCLK ––ns –

TPWMEINT Enable pulse width (internal) 2 × TCLK ––ns –

TPWMENEXT Enable pulse width (external) 2 × TCLK ––ns –

TPWMRESWINT Reset pulse width (internal) 2 × TCLK ––ns –

TPWMRESWEXT Reset pulse width (external) 2 × TCLK ––ns –

Table 29. LCD Direct Drive DC Specifications

Spec ID Parameter Description Min Typ Max Unit Details/Conditions

SID228 ILCDLOW Operating current in low-power mode – 17.5 – µA 16 × 4 small segment

display at 50 Hz

SID229 CLCDCAP LCD capacitance per segment/common

driver

– 500 5000 pF –

SID230 LCDOFFSET Long-term segment offset – 20 – mV –

SID231 ILCDOP1 LCD system operating current

VBIAS = 5 V

– 2 – mA 32 × 4 segments.

50 Hz at 25 °C

SID232 ILCDOP2 LCD system operating current

VBIAS = 3.3 V

– 2 – mA 32 × 4 segments

50 Hz at 25 °C

Table 30. LCD Direct Drive AC Specifications

Spec ID Parameter Description Min Typ Max Unit Details/Conditions

SID233 FLCD LCD frame rate 10 50 150 Hz –

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Serial Communication

Table 31. Fixed I2C DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

II2C1 Block current consumption at 100 kHz – – 50 µA –

II2C2 Block current consumption at 400 kHz – – 155 µA –

II2C3 Block current consumption at 1 Mbps – – 390 µA –

II2C4 I2C enabled in Deep-Sleep mode – – 1.4 µA –

Table 32. Fixed I2C AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

FI2C1 Bit rate – – 400 kHz –

Table 33. Fixed UART DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

IUART1 Block current consumption at 100 kbps – – 55 µA –

IUART2 Block current consumption at 1000 kbps – – 312 µA –

Table 34. Fixed UART AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

FUART Bit rate – – 1 Mbps –

Table 35. Fixed SPI DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

ISPI1 Block current consumption at 1 Mbps – – 360 µA –

ISPI2 Block current consumption at 4 Mbps – – 560 µA –

ISPI3 Block current consumption at 8 Mbps – – 600 µA –

Table 36. Fixed SPI AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

FSPI SPI operating frequency (master; 6x over sampling) – – 8 MHz –

Table 37. Fixed SPI Master Mode AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

TDMO MOSI valid after SCLK driving edge – – 18 ns –

TDSI MISO valid before SCLK capturing edge

Full clock, late MISO sampling used 20 – – ns Full clock, late MISO sampling

THMO Previous MOSI data hold time 0 – – ns Referred to Slave capturing edge

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Memory

Table 38. Fixed SPI Slave Mode AC Specifications

Parameter Description Min Typ Max Unit

TDMI MOSI valid before SCLK capturing edge 40 – – ns

TDSO MISO valid after SCLK driving edge – – 42 + 3 × TCPU ns

TDSO_ext MISO Valid after SCLK driving edge in

external clock mode. VDD < 3.0V – – 50 ns

THSO Previous MISO data hold time 0 – – ns

TSSELSCK SSEL valid to first SCK valid edge 100 – – ns

Table 39. Flash DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

VPE Erase and program voltage 1.71 – 5.5 V –

TWS48 Number of Wait states at 32 MHz–48 MHz 2 – – –CPU execution from flash

TWS32 Number of Wait states at 16 MHz–32 MHz 1 – – –CPU execution from flash

TWS16 Number of Wait states for 0 MHz–16 MHz 0 – – –CPU execution from flash

Table 40. Flash AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

TROWWRITE[5] Row (block) write time (erase and program) – – 20 ms Row (block) = 256 bytes

TROWERASE[5] Row erase time – – 13 ms –

TROWPROGRAM[5] Row program time after erase – – 7 ms –

TBULKERASE[5] Bulk erase time (256 KB) – – 35 ms –

TDEVPROG[5] Total device program time – – 25 seconds –

FEND Flash endurance 100 K – – cycles –

FRET Flash retention. TA  55 °C, 100 K P/E cycles. 20 – – years –

FRET2 Flash retention. TA  85 °C, 10 K P/E cycles. 10 – – years –

Note

5. It can take as much as 20 ms to write to flash. During this time, the device should not be reset, or flash operations will be interrupted and cannot be relied on to have

completed. Reset sources include the XRES pin, software resets, CPU lockup states and privilege violations, improper power supply levels, and watchdogs. Make

certain that these are not inadvertently activated.

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System Resources

Power-on-Reset (POR)

Voltage Monitors (LVD)

Table 41. POR DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

VRISEIPOR Rising trip voltage 0.80 – 1.45 V –

VFALLIPOR Falling trip voltage 0.75 – 1.40 V –

VIPORHYST Hysteresis 15 – 200 mV –

Table 42. POR AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

TPPOR_TR Precision power-on reset (PPOR) response

time in Active and Sleep modes

––1µs –

Table 43. Brown-Out Detect

Parameter Description Min Typ Max Unit Details/Conditions

VFALLPPOR BOD trip voltage in Active and Sleep modes 1.64 – – V –

VFALLDPSLP BOD trip voltage in Deep Sleep 1.4 – – V –

Table 44. Hibernate Reset

Parameter Description Min Typ Max Unit Details/Conditions

VHBRTRIP BOD trip voltage in Hibernate 1.1 – – V –

Table 45. Voltage Monitor DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

VLVI1 LVI_A/D_SEL[3:0] = 0000b 1.71 1.75 1.79 V –

VLVI2 LVI_A/D_SEL[3:0] = 0001b 1.76 1.80 1.85 V –

VLVI3 LVI_A/D_SEL[3:0] = 0010b 1.85 1.90 1.95 V –

VLVI4 LVI_A/D_SEL[3:0] = 0011b 1.95 2.00 2.05 V –

VLVI5 LVI_A/D_SEL[3:0] = 0100b 2.05 2.10 2.15 V –

VLVI6 LVI_A/D_SEL[3:0] = 0101b 2.15 2.20 2.26 V –

VLVI7 LVI_A/D_SEL[3:0] = 0110b 2.24 2.30 2.36 V –

VLVI8 LVI_A/D_SEL[3:0] = 0111b 2.34 2.40 2.46 V –

VLVI9 LVI_A/D_SEL[3:0] = 1000b 2.44 2.50 2.56 V –

VLVI10 LVI_A/D_SEL[3:0] = 1001b 2.54 2.60 2.67 V –

VLVI11 LVI_A/D_SEL[3:0] = 1010b 2.63 2.70 2.77 V –

VLVI12 LVI_A/D_SEL[3:0] = 1011b 2.73 2.80 2.87 V –

VLVI13 LVI_A/D_SEL[3:0] = 1100b 2.83 2.90 2.97 V –

VLVI14 LVI_A/D_SEL[3:0] = 1101b 2.93 3.00 3.08 V –

VLVI15 LVI_A/D_SEL[3:0] = 1110b 3.12 3.20 3.28 V –

VLVI16 LVI_A/D_SEL[3:0] = 1111b 4.39 4.50 4.61 V –

LVI_IDD Block current – – 100 µA –

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SWD Interface

Internal Main Oscillator

Internal Low-Speed Oscillator

Table 46. Voltage Monitor AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

TMONTRIP Voltage monitor trip time – – 1 µs –

Table 47. SWD Interface Specifications

Parameter Description Min Typ Max Unit Details/Conditions

F_SWDCLK1 3.3 V  VDD  5.5 V – – 14 MHz SWDCLK 1/3 CPU clock frequency

F_SWDCLK2 1.71 V  VDD  3.3 V – – 7 MHz SWDCLK 1/3 CPU clock frequency

T_SWDI_SETUP T = 1/f SWDCLK 0.25 × T – – ns –

T_SWDI_HOLD T = 1/f SWDCLK 0.25 × T – – ns –

T_SWDO_VALID T = 1/f SWDCLK – – 0.5 × T ns –

T_SWDO_HOLD T = 1/f SWDCLK 1 – – ns –

Table 48. IMO DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

IIMO1 IMO operating current at 48 MHz – – 1000 µA –

IIMO2 IMO operating current at 24 MHz – – 325 µA –

IIMO3 IMO operating current at 12 MHz – – 225 µA –

IIMO4 IMO operating current at 6 MHz – – 180 µA –

IIMO5 IMO operating current at 3 MHz – – 150 µA –

Table 49. IMO AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

FIMOTOL3 Frequency variation from 3 to 48 MHz – – ±2 % With API-called calibration

FIMOTOL3 IMO startup time – 12 – µs –

Table 50. ILO DC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

IILO2 ILO operating current at 32 kHz – 0.3 1.05 µA –

Table 51. ILO AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

TSTARTILO1 ILO startup time – – 2 ms –

FILOTRIM1 32-kHz trimmed frequency 15 32 50 kHz –

Table 52. Recommended ECO Trim Value

Parameter Description Value Details/Conditions

ECOTRIM 24-MHz trim value

(firmware configuration)

0x00009595 Recommended trim value that needs to be loaded to register

CY_SYS_XTAL_BLERD_BB_XO_CAPTRIM_REG

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 28 of 42

Table 53. UDB AC Specifications

Parameter Description Min Typ Max Unit Details/Conditions

Data Path performance

FMAX-TIMER Max frequency of 16-bit timer in a UDB pair – – 48 MHz –

FMAX-ADDER Max frequency of 16-bit adder in a UDB pair – – 48 MHz –

FMAX_CRC Max frequency of 16-bit CRC/PRS in a UDB

pair

– – 48 MHz –

PLD Performance in UDB

FMAX_PLD Max frequency of 2-pass PLD function in a

UDB pair

– – 48 MHz –

Clock to Output Performance

TCLK_OUT_UDB1 Prop. delay for clock in to data out at 25 °C,

Typical

–15 –ns –

TCLK_OUT_UDB2 Prop. delay for clock in to data out, Worst

case

–25 –ns –

Table 54. BLE Subsystem

Parameter Description Min Typ Max Unit Details/Conditions

RF Receiver Specification

RXS, IDLE RX sensitivity with idle transmitter – –89 – dBm –

RX sensitivity with idle transmitter excluding

Balun loss

– –91 – dBm Guaranteed by design

simulation

RXS, DIRTY RX sensitivity with dirty transmitter – –87 –70 dBm RF-PHY Specification

(RCV-LE/CA/01/C)

RXS, HIGHGAIN RX sensitivity in high-gain mode

with idle transmitter

––91–dBm –

PRXMAX Maximum input power –10 –1 – dBm RF-PHY Specification

(RCV-LE/CA/06/C)

CI1 Cochannel interference,

Wanted signal at –67 dBm and Interferer at FRX

– 9 21 dB RF-PHY Specification

(RCV-LE/CA/03/C)

CI2 Adjacent channel interference

Wanted signal at –67 dBm and Interferer at FRX

±1 MHz

– 3 15 dB RF-PHY Specification

(RCV-LE/CA/03/C)

CI3 Adjacent channel interference

Wanted signal at –67 dBm and Interferer at FRX

±2 MHz

– –29 – dB RF-PHY Specification

(RCV-LE/CA/03/C)

CI4 Adjacent channel interference

Wanted signal at –67 dBm and Interferer at

FRX ±3 MHz

– –39 – dB RF-PHY Specification

(RCV-LE/CA/03/C)

CI5 Adjacent channel interference

Wanted Signal at –67 dBm and Interferer at

Image frequency (FIMAGE)

– –20 – dB RF-PHY Specification

(RCV-LE/CA/03/C)

CI3 Adjacent channel interference

Wanted signal at –67 dBm and Interferer at

Image frequency (FIMAGE ± 1 MHz)

– –30 – dB RF-PHY Specification

(RCV-LE/CA/03/C)

OBB1 Out-of-band blocking,

Wanted signal at –67 dBm and Interferer at

F = 30 MHz–2000 MHz

–30 –27 – dBm RF-PHY Specification

(RCV-LE/CA/04/C)

OBB2 Out-of-band blocking,

Wanted signal at –67 dBm and Interferer at

F = 2003 MHz–2399 MHz

–35 –27 – dBm RF-PHY Specification

(RCV-LE/CA/04/C)

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 29 of 42

OBB3 Out-of-band blocking,

Wanted signal at –67 dBm and Interferer at

F = 2484 MHz–2997 MHz

–35 –27 – dBm RF-PHY Specification

(RCV-LE/CA/04/C)

OBB4 Out-of-band blocking,

Wanted signal a –67 dBm and Interferer at

F = 3000 MHz–12750 MHz

–30 –27 – dBm RF-PHY Specification

(RCV-LE/CA/04/C)

IMD Intermodulation performance

Wanted signal at –64 dBm and 1-Mbps BLE,

third, fourth, and fifth offset channel

–50 – – dBm RF-PHY Specification

(RCV-LE/CA/05/C)

RXSE1 Receiver spurious emission

30 MHz to 1.0 GHz

– – –57 dBm 100-kHz measurement

bandwidth

ETSI EN300 328 V1.8.1

RXSE2 Receiver spurious emission

1.0 GHz to 12.75 GHz

– – –47 dBm 1-MHz measurement

bandwidth

ETSI EN300 328 V1.8.1

RF Transmitter Specifications

TXP, ACC RF power accuracy – ±1 – dB –

TXP, RANGE RF power control range – 20 – dB –

TXP, 0dBm Output power, 0-dB Gain setting (PA7) – 0 – dBm –

TXP, MAX Output power, maximum power setting (PA10) – 3 – dBm –

TXP, MIN Output power, minimum power setting (PA1) – –18 – dBm –

F2AVG Average frequency deviation for 10101010

pattern

185 – – kHz RF-PHY Specification

(TRM-LE/CA/05/C)

F1AVG Average frequency deviation for 11110000

pattern

225 250 275 kHz RF-PHY Specification

(TRM-LE/CA/05/C)

EO Eye opening = F2AVG/F1AVG 0.8 – – RF-PHY Specification

(TRM-LE/CA/05/C)

FTX, ACC Frequency accuracy –150 – 150 kHz RF-PHY Specification

(TRM-LE/CA/06/C)

FTX, MAXDR Maximum frequency drift –50 – 50 kHz RF-PHY Specification

(TRM-LE/CA/06/C)

FTX, INITDR Initial frequency drift –20 – 20 kHz RF-PHY Specification

(TRM-LE/CA/06/C)

FTX, DR Maximum drift rate –20 – 20 kHz/

50 µs

RF-PHY Specification

(TRM-LE/CA/06/C)

IBSE1 In-band spurious emission at 2-MHz offset – – –20 dBm RF-PHY Specification

(TRM-LE/CA/03/C)

IBSE2 In-band spurious emission at 3-MHz offset – – –30 dBm RF-PHY Specification

(TRM-LE/CA/03/C)

TXSE1 Transmitter spurious emissions (average),

<1.0 GHz

– – –55.5 dBm FCC-15.247

TXSE2 Transmitter spurious emissions (average),

>1.0 GHz

– – –41.5 dBm FCC-15.247

RF Current Specifications

IRX Receive current in normal mode – 18.7 – mA –

IRX_RF Radio receive current in normal mode – 16.4 – mA Measured at VDDR

IRX, HIGHGAIN Receive current in high-gain mode – 21.5 – mA –

ITX, 3dBm TX current at 3-dBm setting (PA10) – 20 – mA –

ITX, 0dBm TX current at 0-dBm setting (PA7) – 16.5 – mA –

ITX_RF, 0dBm Radio TX current at 0 dBm setting (PA7) – 15.6 – mA Measured at VDDR

Table 54. BLE Subsystem (continued)

Parameter Description Min Typ Max Unit Details/Conditions

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 30 of 42

ITX_RF, 0dBm Radio TX current at 0 dBm excluding Balun loss – 14.2 – mA Guaranteed by design

simulation

ITX,-3dBm TX current at –3-dBm setting (PA4) – 15.5 – mA –

ITX,-6dBm TX current at –6-dBm setting (PA3) – 14.5 – mA –

ITX,-12dBm TX current at –12-dBm setting (PA2) – 13.2 – mA –

ITX,-18dBm TX current at –18-dBm setting (PA1) – 12.5 – mA –

Iavg_1sec, 0dBm Average current at 1-second BLE connection

interval

– 17.1 – µA TXP: 0 dBm; ±20-ppm

master and slave clock

accuracy.

For empty PDU

exchange.

Iavg_4sec, 0dBm Average current at 4-second BLE connection

interval

– 6.1 – µA TXP: 0 dBm; ±20-ppm

master and slave clock

accuracy.

For empty PDU

exchange.

General RF Specifications

FREQ RF operating frequency 2400 – 2482 MHz –

CHBW Channel spacing – 2 – MHz –

DR On-air data rate – 1000 – kbps –

IDLE2TX BLE.IDLE to BLE. TX transition time – 120 140 µs –

IDLE2RX BLE.IDLE to BLE. RX transition time – 75 120 µs –

RSSI Specifications

RSSI, ACC RSSI accuracy – ±5 – dB –

RSSI, RES RSSI resolution – 1 – dB –

RSSI, PER RSSI sample period – 6 – µs –

Table 54. BLE Subsystem (continued)

Parameter Description Min Typ Max Unit Details/Conditions

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 31 of 42

Environmental Specifications

Environmental Compliance

This Cypress BLE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free (HF)

directives. The Cypress module and components used to produce this module are RoHS and HF compliant.

RF Certification

The CYBLE-214015-01 module is certified under the following RF certification standards:

■FCC ID: WAP4008

■CE

■IC: 7922A-4008

■MIC: 203-JN0505

■KC: MSIP-CRM-Cyp-4008

Environmental Conditions

Table 55 describes the operating and storage conditions for the Cypress BLE module.

Table 55. Environmental Conditions for CYBLE-214015-01

ESD and EMI Protection

Exposed components require special attention to ESD and electromagnetic interference (EMI).

A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings in the enclosure

near the module should be surrounded by a grounded conductive layer to provide ESD protection and a low-impedance path to ground.

Device Handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability.

Description Minimum Specification Maximum Specification

Operating temperature –40 °C 85 °C

Operating humidity (relative, non-condensation) 5% 85%

Thermal ramp rate – 3 °C/minute

Storage temperature –40 °C 85 °C

Storage temperature and humidity – 85 ° C at 85%

ESD: Module integrated into system

Components[6] –15 kV Air

2.2 kV Contact

Note

6. This does not apply to the RF pins (ANT, XTALI, and XTALO). RF pins (ANT, XTALI, and XTALO) are tested for 500-V HBM.

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 32 of 42

Regulatory Information

FCC

FCC NOTICE:

The device CYBLE-214015-01 complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter

approval as detailed in FCC public Notice DA00-1407. Transmitter Operation is subject to the following two conditions: (1) This device

may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause

undesired operation.

CAUTION:

The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by

Cypress Semiconductor may void the user's authority to operate the equipment.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.

These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment

generates and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,ê may cause

harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment

off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

■Reorient or relocate the receiving antenna.

■Increase the separation between the equipment and receiver.

■Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

■Consult the dealer or an experienced radio/TV technician for help

LABELING REQUIREMENTS:

The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes a clearly visible

label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor FCC identifier for this product as well

as the FCC Notice above. The FCC identifier is FCC ID: WAP4008.

In any case the end product must be labeled exterior with "Contains FCC ID: WAP4008"

ANTENNA WARNING:

This device is tested with a standard SMA connector and with the antennas listed in Tab le 7 on page 14. When integrated in the OEMs

product, these fixed antennas require installation preventing end-users from replacing them with non-approved antennas. Any antenna

not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for

emissions.

RF EXPOSURE:

To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure to install the approved

antenna in the previous.

The preceding statement must be included as a CAUTION statement in manuals, for products operating with the approved antennas

in Table 7 on page 14, to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal

instructions about the integrated radio module is not allowed.

The radiated output power of CYBLE-214015-01 is far below the FCC radio frequency exposure limits. Nevertheless, use

CYBLE-214015-01 in such a manner that minimizes the potential for human contact during normal operation.

End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with

transmitter operating conditions for satisfying RF exposure compliance.

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 33 of 42

Industry Canada (IC) Certification

CYBLE-214015-01 is licensed to meet the regulatory requirements of Industry Canada (IC),

License: IC: 7922A-4008

Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure

compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from

www.ic.gc.ca.

This device has been designed to operate with the antennas listed in Table 7 on page 14, having a maximum gain of 0.5 dBi. Antennas

not included in this list or having a gain greater than 0.5 dBi are strictly prohibited for use with this device. The required antenna

impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna

or transmitter.

IC NOTICE:

The device CYBLE-214015-01 complies with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter

approval as detailed in RSS-GEN. Operation is subject to the following two conditions: (1) This device may not cause harmful

interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.

IC RADIATION EXPOSURE STATEMENT FOR CANADA

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1)

this device may not cause interference, and (2) this device must accept any interference, including interference that may cause

undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est

autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l’utilisateur de l’appareil doit accepter

tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

LABELING REQUIREMENTS:

The Original Equipment Manufacturer (OEM) must ensure that IC labelling requirements are met. This includes a clearly visible label

on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor IC identifier for this product as well as the IC

Notice above. The IC identifier is 7922A-4008. In any case, the end product must be labeled in its exterior with “Contains IC:

7922A-4008”.

European R&TTE Declaration of Conformity

Hereby, Cypress Semiconductor declares that the Bluetooth module CYBLE-214015-01 complies with the essential requirements and

other relevant provisions of Directive 1999/5/EC. As a result of the conformity assessment procedure described in Annex III of the

Directive 1999/5/EC, the end-customer equipment should be labeled as follows:

All versions of the CYBLE-214015-01 in the specified reference design can be used in the following countries: Austria, Belgium,

Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxem-

bourg, Malta, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, The Netherlands, the United Kingdom, Switzerland, and Norway.

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 34 of 42

MIC Japan

CYBLE-214015-01 is certified as a module with type certification number 203-JN0505. End products that integrate CYBLE-214015-01

do not need additional MIC Japan certification for the end product.

End product can display the certification label of the embedded module.

KC Korea

CYBLE-214015-01 is certified for use in Korea with certificate number MSIP-CRM-Cyp-4008.

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 35 of 42

Packaging

The CYBLE-214015-01 is offered in tape and reel packaging. Figure 10 details the tape dimensions used for the CYBLE-214015-01.

Figure 10. CYBLE-214015-01 Tape Dimensions

Figure 11 details the orientation of the CYBLE-214015-01 in the tape as well as the direction for unreeling.

Figure 11. Component Orientation in Tape and Unreeling Direction

Table 56. Solder Reflow Peak Temperature

Module Part Number Package Maximum Peak Temperature Maximum Time at PeakTemperature No. of Cycles

CYBLE-214015-01 32-pad SMT 260 °C 30 seconds 2

Table 57. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2

Module Part Number Package MSL

CYBLE-214015-01 32-pad SMT MSL 3

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 36 of 42

Figure 12 details reel dimensions used for the CYBLE-214015-01.

Figure 12. Reel Dimensions

The CYBLE-214015-01 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The

center-of-mass for the CYBLE-214015-01 is detailed in Figure 13.

Figure 13. CYBLE-214015-01 Center of Mass

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 37 of 42

Ordering Information

Table 58 lists the CYBLE-214015-01 part number and features. Tab le 59 lists the reel shipment quantities for the CYBLE-214015-01.

The CYBLE-214015-01 is offered in tape and reel packaging. The CYBLE-214015-01 ships with a maximum of 500 units/reel.

Part Numbering Convention

The part numbers are of the form CYBLE-ABCDEF-GH where the fields are defined as follows.

For additional information and a complete list of Cypress Semiconductor BLE products, contact your local Cypress sales

representative. To locate the nearest Cypress office, visit our website.

Table 58. Ordering Information

MPN

Features

Package

Max CPU Speed (MHz)

Flash (KB)

SRAM (KB)

UDB

Opamp (CTBm)

CapSense

Direct LCD Drive

12-bit SAR ADC

LP Comparators

TCPWM Blocks

SCB Blocks

PWMs (using UDBs)

I2S (using UDB)

GPIO

CYBLE-214015-01 48 256 32 4 4 ✓ ✓ 1 Msps 1 4 2 4 ✓25 32-SMT

Table 59. Tape and Reel Package Quantity and Minimum Order Amount

Description Minimum Reel Quantity Maximum Reel Quantity Comments

Reel Quantity 500 500 Ships in 500 unit reel quantities.

Minimum Order Quantity (MOQ) 500 –

Order Increment (OI) 500 –

U.S. Cypress Headquarters Address 198 Champion Court, San Jose, CA 95134

U.S. Cypress Headquarter Contact Info (408) 943-2600

Cypress website address http://www.cypress.com

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 38 of 42

Acronyms

Table 60. Acronyms Used in this Document

Acronym Description

ABUS analog local bus

ADC analog-to-digital converter

AG analog global

AHB

AMBA (advanced microcontroller bus

architecture) high-performance bus, an ARM

data transfer bus

ALU arithmetic logic unit

AMUXBUS analog multiplexer bus

API application programming interface

APSR application program status register

ARM®advanced RISC machine, a CPU architecture

ATM automatic thump mode

BLE Bluetooth Low Energy

Bluetooth

SIG Bluetooth Special Interest Group

BW bandwidth

CAN Controller Area Network, a communications

protocol

CE European Conformity

CSA Canadian Standards Association

CMRR common-mode rejection ratio

CPU central processing unit

CRC cyclic redundancy check, an error-checking

protocol

DAC digital-to-analog converter, see also IDAC, VDAC

DFB digital filter block

DIO digital input/output, GPIO with only digital

capabilities, no analog. See GPIO.

DMIPS Dhrystone million instructions per second

DMA direct memory access, see also TD

DNL differential nonlinearity, see also INL

DNU do not use

DR port write data registers

DSI digital system interconnect

DWT data watchpoint and trace

ECC error correcting code

ECO external crystal oscillator

EEPROM electrically erasable programmable read-only

memory

EMI electromagnetic interference

EMIF external memory interface

EOC end of conversion

EOF end of frame

EPSR execution program status register

ESD electrostatic discharge

ETM embedded trace macrocell

FCC Federal Communications Commission

FET field-effect transistor

FIR finite impulse response, see also IIR

FPB flash patch and breakpoint

FS full-speed

GPIO general-purpose input/output, applies to a PSoC

HCI host controller interface

HVI high-voltage interrupt, see also LVI, LVD

IC integrated circuit

IDAC current DAC, see also DAC, VDAC

IDE integrated development environment

I2C, or IIC Inter-Integrated Circuit, a communications

protocol

IC Industry Canada

IIR infinite impulse response, see also FIR

ILO internal low-speed oscillator, see also IMO

IMO internal main oscillator, see also ILO

INL integral nonlinearity, see also DNL

I/O input/output, see also GPIO, DIO, SIO, USBIO

IPOR initial power-on reset

IPSR interrupt program status register

IRQ interrupt request

ITM instrumentation trace macrocell

KC Korea Certification

LCD liquid crystal display

LIN Local Interconnect Network, a communications

protocol.

LR link register

LUT lookup table

LVD low-voltage detect, see also LVI

LVI low-voltage interrupt, see also HVI

LVTTL low-voltage transistor-transistor logic

Table 60. Acronyms Used in this Document (continued)

Acronym Description

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 39 of 42

MAC multiply-accumulate

MCU microcontroller unit

MIC Ministry of Internal Affairs and Communications

(Japan)

MISO master-in slave-out

NC no connect

NMI nonmaskable interrupt

NRZ non-return-to-zero

NVIC nested vectored interrupt controller

NVL nonvolatile latch, see also WOL

Opamp operational amplifier

PAL programmable array logic, see also PLD

PC program counter

PCB printed circuit board

PGA programmable gain amplifier

PHUB peripheral hub

PHY physical layer

PICU port interrupt control unit

PLA programmable logic array

PLD programmable logic device, see also PAL

PLL phase-locked loop

PMDD package material declaration data sheet

POR power-on reset

PRES precise power-on reset

PRS pseudo random sequence

PS port read data register

PSoC®Programmable System-on-Chip™

PSRR power supply rejection ratio

PWM pulse-width modulator

QDID qualification design ID

RAM random-access memory

RISC reduced-instruction-set computing

RMS root-mean-square

RTC real-time clock

RTL register transfer language

RTR remote transmission request

RX receive

SAR successive approximation register

SC/CT switched capacitor/continuous time

SCL I2C serial clock

Table 60. Acronyms Used in this Document (continued)

Acronym Description

SDA I2C serial data

S/H sample and hold

SINAD signal to noise and distortion ratio

SIO special input/output, GPIO with advanced

features. See GPIO.

SMT

surface-mount technology; a method for

producing electronic circuitry in which the

components are placed directly onto the surface

of PCBs

SOC start of conversion

SOF start of frame

SPI Serial Peripheral Interface, a communications

protocol

SR slew rate

SRAM static random access memory

SRES software reset

STN super twisted nematic

SWD serial wire debug, a test protocol

SWV single-wire viewer

TD transaction descriptor, see also DMA

THD total harmonic distortion

TIA transimpedance amplifier

TN twisted nematic

TRM technical reference manual

TTL transistor-transistor logic

TUV Germany: Technischer Überwachungs-Verein

(Technical Inspection Association)

TX transmit

UART Universal Asynchronous Transmitter Receiver, a

communications protocol

UDB universal digital block

USB Universal Serial Bus

USBIO USB input/output, PSoC pins used to connect to

a USB port

VDAC voltage DAC, see also DAC, IDAC

WDT watchdog timer

WOL write once latch, see also NVL

WRES watchdog timer reset

XRES external reset I/O pin

XTAL crystal

Table 60. Acronyms Used in this Document (continued)

Acronym Description

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 40 of 42

Document Conventions

Units of Measure

Table 61. Units of Measure

Symbol Unit of Measure

°C degrees Celsius

dB decibel

dBm decibel-milliwatts

fF femtofarads

Hz hertz

KB 1024 bytes

kbps kilobits per second

Khr kilohour

kHz kilohertz

kkilo ohm

ksps kilosamples per second

LSB least significant bit

Mbps megabits per second

MHz megahertz

Mmega-ohm

Msps megasamples per second

µA microampere

µF microfarad

µH microhenry

µs microsecond

µV microvolt

µW microwatt

mA milliampere

ms millisecond

mV millivolt

nA nanoampere

ns nanosecond

nV nanovolt

ohm

pF picofarad

ppm parts per million

ps picosecond

s second

sps samples per second

sqrtHz square root of hertz

Vvolt

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Page 41 of 42

Document History Page

Document Title: CYBLE-214015-01, EZ-BLE™ PSoC® Bluetooth 4.2 Module

Document Number: 002-15923

Revision ECN Orig. of

Change

Submission

Date Description of Change

** 5428716 DSO 09/07/2016 Preliminary datasheet for CYBLE-214015-01 module.

PRELIMINARY CYBLE-214015-01

Document Number: 002-15923 Rev. ** Revised September 7, 2016 Page 42 of 42

any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide.

Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other intellectual

property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress hereby

grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to modify and

reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users (either

directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as provided

by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation of the

Software is prohibited.

TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE

OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent

permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any

product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is

the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products

are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or

systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the

device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably

expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim,

damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other

liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.

Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in

the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.

Sales, Solutions, and Legal Information

Worldwide Sales and Design Support

Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office

closest to you, visit us at Cypress Locations.

Products

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Interface cypress.com/interface

Internet of Things cypress.com/iot

Lighting & Power Control cypress.com/powerpsoc

Memory cypress.com/memory

PSoC cypress.com/psoc

Touch Sensing cypress.com/touch

USB Controllers cypress.com/usb

Wireless/RF cypress.com/wireless

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PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP

Cypress Developer Community

Technical Support

cypress.com/support