CRD300DA12E-XM3 - CREE - Datasheet.Live

are registered trademarks of Cree, Inc. Other trademarks, product, and company names are the property of their respective owners and do not imply specific product and/or

vendor endorsement, sponsorship or association.

Rev. A, 2019-06-01 CRD300DA12E-XM3 4600 Silicon Dr., Durham, NC 27703

CRD300DA12E-XM3

300 kW High Performance Three Phase Reference Design with Three CAB450M12XM3

1200 V, 450 A SiC Half Bridge Modules + Three CGD12HBXMP Gate Drivers

Technical Features

• Optimized for Cree’s All-SiC, Low Inductance,

Conduction Optimized XM3 Power Module

• Complete Stackup, including: Modules, Cooling,

Bussing, Gate Drivers, Voltage / Current Sensors,

and Controller

• High-Frequency, Ultra-Fast Switching Operation

with Ultra-Low Loss, Low Parasitic Bussing

Maximum Ratings (TC = 25 ˚C unless otherwise specified)

Symbol Parameter Value Unit Test Conditions

VDSmax Maximum Drain-Source Voltage 1200

VDC

DC Bus Voltage, Maximum 900

DC Bus Voltage, Recommended 800

IDC DC Bus Current Ripple, Maximum 300 A TA = 30 °C at 10 kHz

(Set by capacitor rating)

System Benefits

• Enables Compact, Lightweight Systems

• Increased Power Density

• High Eiciency Operation

• Reduced Thermal Requirements

• Reduced System Cost

Package

Applications

• High Power Density New Product Development

• High Frequency Converter Applications

• Vehicle Traction Inverters

• Active Front Ends

• Uninterruptible Power Supplies

• Industrial Motor Drives

• Energy Storage

• Grid-Tied Distributed Generation: Solar and Wind

• Smart-Grid / Flexible AC Transmission Systems

are registered trademarks of Cree, Inc. Other trademarks, product, and company names are the property of their respective owners and do not imply specific product and/or

vendor endorsement, sponsorship or association.

Rev. A, 2019-06-01 CRD300DA12E-XM3 4600 Silicon Dr., Durham, NC 27703

Symbol Parameter Min. Typ. Max. Unit Test Conditions

I𝝫(rms) AC Output Phase Current (RMS) 360 A

VAC, out = 480 Vrms

WEG coolant, 50% blend, 12 L/

min., fsw = 10 kHz,

VDC = 800 V, fout = 300 Hz,

DPF = 1.0,

Tcoolant = 25 °C, Ta = 25 °C

fSW Switching Frequency 20 80 kHz Based on gate drive power

fout Fundamental Output Frequency 550 Hz Controller limited

CDC DC Bus Capacitor Bank Capacity 300 μF 10 kHz

LDC DC Bus Capacitor Bank ESL 3.5 nH

RDC DC Bus Capacitor Bank ESR 0.4 mΩ 10 kHz

LσDC Bus Stray Inductance 1.8 nH

Electrical System Ratings (TC = 25˚C unless otherwise specified)

Symbol Parameter Min. Typ. Max. Unit Test Conditions

TaAmbient Temperature 25 40

°C

Higher ambient temperature

possible with power derating.

Tcoolant Coolant Temperature 25 90

Switching frequency and phase

current must be selected as to

not exceed T

J,Max.

Tstg Storage Temperature -40 85

Installation Altitude 2000 m Without voltage derating

Environmental Ratings

Symbol Parameter Min. Typ. Max. Unit Test Conditions

AArea 812 cm2

W Weight 6.2 kg

V Volume 9.3 L

P Coolant Operating Pressure 5 bar

∆p Pressure Drop 200 mbar 12 L/min, Tcoolant = 25°C

Mounting Torque

11.0

N-m

AC & DC Terminals, M10 bolts

2.0 4.0 5.0 Module Power Terminals

M5 Bolts

2.0 3.0 4.0 Module Baseplate

M4 Bolts

Thermal & Mechanical Characteristics

are registered trademarks of Cree, Inc. Other trademarks, product, and company names are the property of their respective owners and do not imply specific product and/or

vendor endorsement, sponsorship or association.

Rev. A, 2019-06-01 CRD300DA12E-XM3 4600 Silicon Dr., Durham, NC 27703

Input Connector Information

* Inputs 3 - 10 are dierential pairs.

Pin Number Parameter Description

1 VDC Power supply input pin (+12 V Nominal Input)

2 Common Common

3 HS-P (*) Positive line of 5 V dierential high-side PWM signal pair.

Terminated Into 120 Ω.

4 HS-N (*) Negative line of 5 V dierential high-side PWM signal pair.

Terminated into 120 Ω.

5 LS-P (*) Positive line of 5 V dierential low-side PWM signal pair.

Terminated into 120 Ω.

6 LS-N (*) Negative line of 5 V dierential low-side PWM signal pair.

Terminated into 120 Ω.

7 FAULT- P (*)

Positive line of 5 V dierential fault condition signal pair.

Drive strength 20 mA. A low state on FAULT indicates when a de-

saturation fault has occurred. The presence of a fault precludes

the gate drive output from going high.

8 FAULT- N (*) Negative line of 5 V dierential fault condition signal pair.

Drive strength 20 mA.

9 RTD-P (*)

Positive line of 5 V temperature dependent resistor output

signal pair. Drive strength 20 mA. Temperature measurement is

encoded via frequency.

10 RTD-N (*)

Negative line of 5 V temperature dependent resistor output

signal pair. Drive strength 20mA. Temperature measurement is

encoded via frequency.

11 PS-Dis

Pull down to disable power supply. Pull up or leave floating

to enable. Gate and source are connected with 10 kΩ when

disabled.

12 Common Common

13 PWM-EN

Pull down to disable PWM input logic. Pull up or leave floating

to enable. Gate driver output will be held low through turn-o

gate resistor if power supplies are enabled.

14 Common Common

15 Reset When a fault exists, bring this pin high to clear the fault.

16 Common Common

are registered trademarks of Cree, Inc. Other trademarks, product, and company names are the property of their respective owners and do not imply specific product and/or

vendor endorsement, sponsorship or association.

Rev. A, 2019-06-01 CRD300DA12E-XM3 4600 Silicon Dr., Durham, NC 27703

Performance References

• For information on the integrated modules, please reference the CAB450M12XM3 datasheet.

• For information on the integrated gate drivers, please reference the CGD12HBXMP datasheet.

• For higher ambient temperatures, the DC-Link voltage and DC-Link current must be de-rated according to the

included DC-Link capacitor ratings. Please refer to the 1100 V / 100 μF CX100µ1100d51KF6 datasheet provided by

Fischer & Tausche™ for more detailed information.

• The included cold plate is a Wieland© MicroCool® CP3012-XM3. In order to calculate the thermal resistance (°C/W)

and pressure drop (bar) versus flow rate (liters/min.), please refer to the CP3012-XM3 datasheet provided by Wieland

for more detailed information.

• The included current sensor board uses the LEM™ LF 510-S, please refer to the product datasheet provided by LEM™

for more detailed information.

Pin Number Name Type Description

Center +12V PWR +12V Input Power

Sleeve Ground - Controller Ground

Controller Connections

Controller input power supply input utilizes a CUI, PJ-102AH barrel jack connector.

Pin Number Name Type Description

1 NC - NO CONNECT

2 CANA-L I/O Isolated CAN Port A Low

3 GND-1 - Isolated Ground

4 NC - NO CONNECT

5 GND-1 - Isolated Ground

6 NC - NO CONNECT

7 CANA-H I/O Isolated CAN Port A High

8 NC - NO CONNECT

9 +5V-ISO PWR Isolated +5V Power

Supply Output

Isolated CAN port utilizes a NorComp, 182-009-113R181 male DE-9 connector.

are registered trademarks of Cree, Inc. Other trademarks, product, and company names are the property of their respective owners and do not imply specific product and/or

vendor endorsement, sponsorship or association.

Rev. A, 2019-06-01 CRD300DA12E-XM3 4600 Silicon Dr., Durham, NC 27703

Pin Number Name Type Description

1 CANBL I/O Non-isolated CAN port

B Low

2 CANBH I/O Non-isolated CAN port

B High

3 GND - Controller Ground

4 GND - Controller Ground

5 GND - Controller Ground

6 IEXT-m I External Current Sensor

Signal

7 -15V PWR External Current Sensor

Power -15V

8 +15V PWR External Current Sensor

Power +15V

9 GND - Controller Ground

10 +3V3 PWR +3.3V Power Supply

Output

11 GND - Controller Ground

12 +5V PWR +5V Power Supply

Output

13 GND PWR Controller Ground

14 QEA_A I Quadrature Encoder

Port A Input A

15 GND - Controller Ground

16 QEA_B I Quadrature Encoder

Port A Input B

17 GND - Controller Ground

18 QEA_I I Quadrature Encoder

Port A Input I

19 GND - Controller Ground

20 +5V PWR +5V Power Supply

Output

21 GND - Controller Ground

Auxiliary controller connector utilizes 3M, 10226-55G3PC connector.

are registered trademarks of Cree, Inc. Other trademarks, product, and company names are the property of their respective owners and do not imply specific product and/or

vendor endorsement, sponsorship or association.

Rev. A, 2019-06-01 CRD300DA12E-XM3 4600 Silicon Dr., Durham, NC 27703

Pin Number Name Type Description

1 VA-P I Positive High-Voltage Measurement Input Phase A

2 VA-M I Negative High-Voltage Measurement Input Phase A

3 VB-P I Positive High-Voltage Measurement Input Phase B

4 VB-M I Negative High-Voltage Measurement Input Phase B

5VC-P I Positive High-Voltage Measurement Input Phase C

6VC-M I Negative High-Voltage Measurement Input Phase C

The voltage sensor input utilizes a Phoenix Contact, 1719231 connector.

Performance References

Full circuit schematics provided upon delivery of the reference design.

are registered trademarks of Cree, Inc. Other trademarks, product, and company names are the property of their respective owners and do not imply specific product and/or

vendor endorsement, sponsorship or association.

Rev. A, 2019-06-01 CRD300DA12E-XM3 4600 Silicon Dr., Durham, NC 27703

Package Dimensions

are registered trademarks of Cree, Inc. Other trademarks, product, and company names are the property of their respective owners and do not imply specific product and/or

vendor endorsement, sponsorship or association.

Rev. A, 2019-06-01 CRD300DA12E-XM3 4600 Silicon Dr., Durham, NC 27703

Supporting Links & Tools

• CAB450M12XM3: 1200 V, 450 A SiC Half-Bridge Module

• CGD12HBXMP: XM3 Evaluation Gate Driver

• CGD12HB00D: Dierential Transceiver Board for CGD12HBXMP

• CRD300DA12E-XM3: 300 kW Inverter Kit for Conduction-Optimized XM3 (CPWR-AN30)

• KIT-CRD-CIL12N-XM3: Dynamic Performance Evaluation Board for the XM3 Module (CPWR-AN31)

• CPWR-AN28: Module Mounting Application Note

• CPWR-AN29: Thermal Interface Material Application Note

Important Notes

• This Cree-designed reference design hardware for Cree components is meant to be used as an evaluation tool

in a lab setting and to be handled and operated by highly qualified technicians or engineers. The hardware

is not designed to meet any particular safety standards and the tool is not a production qualified assembly.

• Each part that is used in this reference design and is manufactured by an entity other than Cree or one of

Cree’s ailiates is provided “as is” without warranty of any kind, including but not limited to any warranty

of non-infringement, merchantability, or fitness for a particular purpose, whether express or implied.

There is no representation that the operation of each such part will be uninterrupted or error free. ..........

• This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human

body nor in applications in which failure of the product could lead to death, personal injury or property damage, including

but not limited to equipment used in the operation of nuclear facilities, life-support machines, cardiac defibrillators or similar

emergency medical equipment, aircra navigation or communication or control systems, or air traic control systems.

• The SiC MOSFET module switches at speeds beyond what is customarily associated with IGBT-based modules. Therefore, special

precautions are required to realize optimal performance. The interconnection between the gate driver and module housing needs

to be as short as possible. This will aord optimal switching time and avoid the potential for device oscillation. Also, great care

is required to insure minimum inductance between the module and DC link capacitors to avoid excessive VDS overshoot. ..........