EMIF06-USD04F3 6-line low capacitance IPADTM for micro-SD card with EMI filtering and ESD protection Datasheet - production data Description The EMIF06-USD04F3 is a highly integrated device based on IPAD technology offering two functions: ESD protection to comply with IEC standard, and EMI filtering to reject mobile phone frequencies. Figure 1. Pin configuration (bump side) Flip Chip (15 bumps) 4 3 2 1 A Features B * EMI low-pass filter C * ESD protection 8 kV (IEC 61000-4-2) D * Integrated pull up resistors to prevent bus floating when no card is connected * 208 MHz clock frequency compatible with SDR104 mode (SD3.0) * Lead-free package Benefits * Low power consumption * Easy layout thanks to smart pin-out configuration * Very low PCB space consumption * High reliability offered by monolithic integration * Reduction of parasitic elements thanks to CSP integration Complies with the following standards: * IEC 61000-4-2 level 4: - 15 kV (air discharge) - 8 kV (contact discharge) TM: IPAD is a trademark of STMicroelectronics January 2015 This is information on a product in full production. DocID023184 Rev 4 1/8 www.st.com Characteristics 1 EMIF06-USD04F3 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 C) Symbol VPP Parameter Value ESD discharge IEC 61000-4-2, level 4 (on pins Vcc, SDclk, SDcmd, SDdat0, SDdat1, SDdat2, SDdat3 Air discharge, external pins Contact discharge, external pins ESD discharge IEC 61000-4-2, level 1 (on pins dat0, dat1, clk, cmd,dat3, dat2) Air discharge, internal pins Contact discharge, internal pins Tj Maximum junction temperature Top Tstg 15 8 kV 2 2 125 C Operating temperature range - 30 to + 85 C Storage temperature range - 55 to + 150 C Figure 2. EMIF06-USD04F3 Schematic Table 2. Pin configuration 2/8 Unit Pin Signal Pin Signal A1 dat0 C1 Cmd A2 dat1 A3 SDdat1 C3 GND A4 SDdat0 C4 SDcmd B1 clk D1 dat3 B2 Vcc D2 dat2 B3 GND D3 SDdat2 B4 SDclk D4 SDdat3 DocID023184 Rev 4 EMIF06-USD04F3 Characteristics Table 3. Electrical characteristics (values, Tamb = 25 C) Symbol Parameter Test conditions Min. Typ. Max. Unit 20 V 100 nA VBR Breakdown voltage IR = 1 mA IRM Leakage current at VRM VRM = 3 V Serial resistance Tolerance 10%, matching 2% 40 Tolerance 10%, matching 2% 50 k Tolerance 10% 15 k V = 0 V, F = 10 MHz, VOSC = 30 mV 10 12 V = 1.8 V, F = 10 MHz, VOSC = 30 mV 7.5 10 R1, R2, R3, R4, R5, R6 R9, R10, R11, Pull-up resistance R12 R13 Cline Pull-up resistance on cmd Data line capacitance 14 V = 2.9 V, F = 10 MHz, VOSC = 30 mV pF 9 Figure 3. Electrical characteristics (definitions) I Symbol VBR = VRM = IRM = Parameter Breakdown voltage Stand-off voltage Leakage current at VRM Cline Line capacitance = VCL VBR VRM IRM V IPP Figure 4. Attenuation versus frequency S21(dB) 0 Figure 5. Analog crosstalk versus frequency XTalk(dB) 0 -10 -5 -20 -30 -10 -40 -50 -15 -60 -70 -20 -80 -90 -25 -100 F(Hz) -30 100 K Clk Data1 Data3 1M 10M Data0 Data2 Cmd2 -110 100M 1G -120 100 K Clk-Data0 DocID023184 Rev 4 F(Hz) 1M 100M 10M Data3-SDData0 1G 3/8 8 Characteristics EMIF06-USD04F3 Figure 6. ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 7. ESD response to IEC 61000-4-2 (-8 kV contact discharge) Figure 8. Line capacitance versus frequency and bias voltage (typical values) 12 Cline (pF) VBIAS = 0V 11 10 9 VBIAS = 1.8V 8 7 6 VBIAS = 2.9V 5 4 3 Vosc= 30 mVRMS TAMB = 25 C 2 1 F(MHz) 0 1 4/8 10 DocID023184 Rev 4 100 EMIF06-USD04F3 Package information * Epoxy meets UL94, V0 * Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 170 m 10 Figure 9. Package dimensions 400 m 40 500 m 50 255 m 40 1.54 mm 40 m 400 m 40 2 Package information 170 m 10 1.54 mm 40 m Figure 10. Footprint Copper pad Diameter: 220 m recommended 260 m maximum Solder mask opening: 300 m minimum Solder stencil opening: 220 m recommended Figure 11. Marking Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode y = year, ww = week DocID023184 Rev 4 x x z y w w 5/8 8 Package information EMIF06-USD04F3 O 1.55 0.05 xxz yww STE xxz yww 1.65 0.05 STE xxz yww 0.59 0.05 3.5 0.05 1.65 0.05 4.0 0.1 STE 8.0 +0.3/-0.1 Dot identifying Pin A1 location 2.0 0.05 0.20 0.02 4.0 0.1 All dimensionsare in mm User direction of unreeling 6/8 1.75 0.1 Figure 12. Tape and reel specification DocID023184 Rev 4 EMIF06-USD04F3 3 Ordering information Ordering information Figure 13. Ordering information scheme EMIF 06 - USD 04 F3 EMI filter Number of lines Application USD = Micro SD card Version 04 = Design version Package F = Flip chip 3= Lead-free, pitch = 400 m, bump = 255 m Table 4. Ordering information Note: Order code Marking Package Weight Base qty Delivery mode EMIF06-USD04F3 JZ Flip Chip 2.6 mg 5000 Tape and reel 7" More information is available in the STmicroelectronics Application notes: AN2348: "Flip Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" AN4541: "EMI Filters for SD3.0 card: High speed SD card protection and filtering devices" 4 Revision history Table 5. Document revision history Date Revision Changes 09-May-2012 1 First issue. 27-Jun-2012 2 Added tolerances in Figure 12. 30-Jun-2014 3 Updated Figure 4, Figure 5 and breakdown voltage value in Table 3. 06-Jan-2015 4 Added mention for new AN4541. DocID023184 Rev 4 7/8 8 EMIF06-USD04F3 IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2015 STMicroelectronics - All rights reserved 8/8 DocID023184 Rev 4