SMD HIGH CURRENT INDUCTORS MODEL NO. : SSC-10050D3 SERIES FEATURES: LOW PROFILE, HIGH POWER, LOW LOSS.LOW DCR. CLOSED MAGNETIC CIRCUIT CONSTRUCTION FOR HIGH DENSITY BOARD ASSMEBLY . COMPACT SIZE WITH HIGH PERFORMANCE BY METAL DUST CORE AND COPPER RIBBON WIRE STRUCTURE . SOLUTION FOR STRONGER STRUCTURE AND MORE EFFICIENT NOISE SUPPRESSION. APPEARANCE: CUSTOM DESIGNS AVAILABLE. APPLICATION : DC/DC CONVERTER IN POWER REGULATION SYSTEM. CPU INDUCTOR IN NOTEBOOK COMPUTERS. VGA CARD. INDUCTOR FOR GENERAL PURPOSE AVAILBLE. ELECTRICAL SPECIFICATION: L1 L2 PART NO L0 INDUCTANCE L0(H) TYP. @0ADC INDUCTANCE (H)20% SSC-10050D3-R56 0.60 0.56 18 0.53 22 2.8 SSC-10050D3-0R7 0.75 0.7 18 0.65 22 2.8 MEASURING INDUCTANCE MEASURING CURRENT CURREN (H)20% (ADC) (ADC) DCR MAX (m) NOTE : MEASURING CONDITION(L): 100 KHZ, 1VRMS. L1 THAT WILL CAUSE AN APPROXIMATELY T OF 40. L2 THAT WILL CAUSE AN L0 TO DROP APPROXIMATELY 25%. ACOUSTIC NOISE: 60 dB MAX. @ FREQ. SPAN 0~20KHz, LESS THAN 35 dB UNDER AMBIENT . PHYSICAL DIMENSION : (UNIT:mm) TOLERANCE : 0.5 PERFORMANCE RECOMMENDED LAND PATTERNS Inductance(H) DC Current Characteristics 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 90 80 70 60 50 40 30 20 10 0 R56 0 5 10 15 20 T() Inductance(H) Temp. RiseT() 25 IDC(A) PACKING Tape and Reel Orientation USER DIRECTION OF FEED NOTE : Top view shown with cover tape removed. TAPE WIDTH 24mm REEL WIDTH COMPONENT 29.5mm PITCH UNITS 16mm TAPE SPECIFICATIONS: Carrier Tape Type : Conductive. Cover Tape Type : Antistatic. Cover Tape Adhesion to Carrier : 20 - 100 grams. REEL SPECIFICATIONS: Antistatic. Diameter (flange) : 13" (330.2mm) STANDARDS : All embossed carrier tape packaging will be accomplished in compliance with latest revision of EIA-481 "Taping of surface Mount Components for Automatic Placement". ENVIRONMENTAL PERFORMANCE ITEM TEST CONDITION PER 800 REEL 1 Thermal Shock One cycle shall consist of : (1) 30 minutes at temperature -40. (2) 15 seconds maximum at room ambient. (3) 30 minutes at temperature +125. (4) 15 seconds maximum at room ambient. Subject samples to 10 cycles. Test per applicable specification after a 4 hours stabilization at room ambient. 2 Vibration Inductance deviation within 3.0% after vibration for 1 hour. In each of three orientations at sweep vibration (105010Hz) with 1.5mm P-P amplitude. 3 Solderability Solder pot at 2305, with kester 1544 solder flux. 5 second 1 second. 4 Operating Dip parts into solder pot containing 63/37 molten alloy for Wetting must occur on a minimum of 90% of the terminations. -40 +125 ( TA) Temperature 5 Humidity Inductance deviation within5.0% After 96 hour in 9095% relative humidity at 402and 1 hour drying under normal condition. 6 2 Mechanical Shock Inductance deviation within5.0% after drop down with 981m/s (100G)shock. Attitude upon a rubber block method shock testing machine, for 1 time, in each of three orientations.