Data Sheet ASMT-YTD7-0AA02 Tricolor PLCC6 White Surface LED Description Features This family of SMT LEDs is packaged in the form of PLCC-6 with a separate heat path for each LED die, enabling it to be driven at a higher current. Individually addressable pin-outs give higher flexibility in circuitry design. With closely matched radiation pattern along the package's X-axis, these LEDs are suitable for indoor full color display applications. For easy pick-and-place, the LEDs are shipped in tape and reel. Every reel is shipped from a single intensity and color bin for better uniformity. NOTE: These LEDs are compatible with reflow soldering process. CAUTION! These LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Broadcom(R) Application Note AN-1142 for additional details. Standard PLCC-6 package (Plastic Leaded Chip Carrier) with individual addressable pin-out for higher flexibility of driving configuration LED package with diffused silicone encapsulation Using AlInGaP and InGaN dice technologies Typical viewing angle 110 Compatible with reflow soldering process JEDEC MSL 3 Water-Resistance (IPX6, see note) per IEC 60529:2001 The test is conducted at the component level by mounting the components on the PCB with proper porting to protect the leads. Customers should perform the necessary tests on the components for their final applications. Applications Full color display CAUTION! Customers should keep the LED in the moisture barrier bag (MBB) when not in use because prolonged exposure to the environment might cause the silver-plated leads to tarnish, which might cause difficulties in soldering. Broadcom AV02-3873EN October 9, 2018 ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED Package Dimensions 3 5 2 6 1 3.0 0.2 Package Marking 0.35 0.2 0.8 0.2 3.4 0.2 0.5 0.2 4 2.3 0.2 2.8 0.2 2.30 0.2 4 3 Red 2 1.8 0.2 5 Green 6 1 Blue 0.2 0.2 0.9 0.2 Lead Configuration 1 Cathode (Blue) 2 Cathode (Green) 3 Cathode (Red) 4 Anode (Red) 5 Anode (Green) 6 Anode (Blue) NOTE: 1. All dimensions are in millimeters (mm). 2. Unless otherwise specified, tolerance is 0.20 mm. 3. Encapsulation = silicone. 4. Terminal finish = silver plating. Broadcom AV02-3873EN 2 ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED Absolute Maximum Ratings TJ = 25C. Parameter Red Green and Blue Unit DC forward currenta 50 25 mA Peak forward current b 100 100 mA Power dissipation 125 90 mW Maximum junction temperature Tj max 110 C Operating temperature range -40 to + 100 C Storage temperature range -40 to +100 C a. Derate linearly as shown in Figure 7 to Figure 10. b. Duty Factor = 10%, frequency = 1 kHz. Optical Characteristics TJ = 25C. Luminous Intensity, IV (mcd) @ IF = 20 mAa Dominant Wavelength, d (nm) @IF = 20 mAb Peak Wavelength, P Viewing Angle, (nm) @IF = 20 mA 21/2 ()c Min. Typ. Max. Min. Typ. Max. Typ. Typ. Test Current (mA) Red 560 650 1125 617 623 627 630 120 20 Green 1400 1900 2850 525 529 537 522 120 Blue 285 384 560 465 469 475 465 120 Color a. The luminous intensity Iv is measured at the mechanical axis of the LED package at a single current pulse condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. b. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. c. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics TJ = 25C. Forward Voltage, VF (V) @IF = 20 mAa Color Reverse Voltage, VR (V) @ IR = 100 Ab Reverse Voltage, VR (V) @ IR = 10 Ab Thermal Resistance, RJ-S (C/W) Min. Typ. Max. Min. Min. 1 Chip On 3 Chips On Red 1.8 2.1 2.5 4.0 -- 280 330 Green 2.6 3.1 3.4 -- 4.0 240 357 Blue 2.6 3.1 3.4 -- 4.0 240 357 a. Tolerance = 0.1V. b. Indicates product final testing condition. Long-term reverse bias is not recommended. Broadcom AV02-3873EN 3 ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED Part Numbering System A S M T - Y T D 7 - 0 x1 Code Description Option x1 Package type D x2 Minimum intensity bin A A A 0 2 x2 x3 x4 x5 White surface Red: bin U2 Green: bin W2 Blue: bin T1 x3 Number of intensity bins A 3 intensity bins from minimum x4 Color bin combination 0 Red: Red: bin U2, V1, V2 Green: bin W2, X1, X2 Blue: bin T1, T2, U1 full distribution Green: bin A, B, C Blue: x5 Broadcom Test option 2 bin A, B, C, D Test current = 20 mA AV02-3873EN 4 ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED Bin Information Intensity Bins (CAT) Color Bins (BIN) - Red Luminous Intensity (mcd) Bin ID Min. Max. T1 285 355 T2 355 450 U1 450 560 U2 560 715 V1 715 900 V2 900 1125 W1 1125 1400 W2 1400 1800 X1 1800 2240 X2 2240 2850 Dominant Wavelength (nm) Bin ID Min. Max. Cx Cy -- 617.0 627.0 0.6850 0.3149 0.6815 0.3150 0.7000 0.2966 0.7037 0.2962 Tolerance: 1 nm. Color Bins (BIN) - Blue Dominant Wavelength (nm) Tolerance: 12% Color Bins (BIN) - Green Dominant Wavelength (nm) Bin ID A B C Min. 525.0 528.0 531.0 Max. 531.0 534.0 537.0 Cy Chromaticity coordinate (for Reference) Bin ID Min. Max. Cx Cy A 465.0 469.0 0.1355 0.0399 0.1751 0.0986 0.1680 0.1094 0.1267 0.0534 0.1314 0.0459 0.1034 Chromaticity Coordinate (for Reference) Cx Chromaticity Coordinate (for Reference) B 467.0 471.0 0.1142 0.8262 0.1718 0.1624 0.7178 0.1638 0.1167 0.2001 0.6983 0.1215 0.0626 0.1625 0.8012 0.1267 0.0534 0.1094 C 469.0 473.0 0.1387 0.8148 0.1680 0.1815 0.7089 0.1593 0.1255 0.2179 0.6870 0.1158 0.0736 0.1854 0.7867 0.1215 0.0626 0.1167 D 471.0 475.0 0.1625 0.8012 0.1638 0.2001 0.6983 0.1543 0.1361 0.2353 0.6747 0.1096 0.0868 0.2077 0.7711 Tolerance: 1 nm. Tolerance: 1 nm. Broadcom AV02-3873EN 5 ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED Figure 1: Relative Intensity vs. Wavelength Figure 2: Forward Current vs. Forward Voltage 100 1.0 Blue Green Red 0.6 0.4 0.2 0.0 80 FORWARD CURRENT - mA RELATIVE INTENSITY 0.8 60 480 580 WAVELENGTH - nm 680 Figure 3: Relative Intensity vs. Forward Current 1 2 3 FORWARD VOLTAGE - V 4 5 8.0 2.0 1.5 1.0 0.5 0 10 20 30 FORWARD CURRENT - mA 40 50 DOMINANT WAVELENGTH SHIFT - nm (NORMALIZED AT 20mA) Blue Green Red 2.5 RELATIVE INTENSITY 0 Figure 4: Dominant Wavelength Shift vs. Forward Current 3.0 0.0 Green/Blue 20 0 380 Red 40 Red Green 6.0 Blue 4.0 2.0 0.0 -2.0 -4.0 0 10 20 30 40 50 60 MONO PULSE CURRENT - mA Figure 5: Relative Intensity vs. Junction Temperature 0.50 FORWARD VOLTAGE SHIFT - V RELATIVE INTENSITY 10 Blue Green Red 1 0.1 Figure 6: Forward Voltage vs. Junction Temperature Red 0.40 Green 0.30 Blue 0.20 0.10 0.00 -0.10 -0.20 -0.30 -40 Broadcom -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE - C 100 120 -40 -20 0 20 40 60 80 100 120 JUNCTION TEMPERATURE, TJ - C AV02-3873EN 6 ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED Figure 7: Maximum Forward Current vs. Temperature for Red (1 Chip On) Figure 8: Maximum Forward Current vs. Temperature for Red (3 Chips On) 60 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 60 50 Ts 40 TA 30 20 10 0 0 20 40 60 80 TEMPERATURE (C) 100 TA 20 10 0 20 40 60 80 TEMPERATURE (C) 100 120 30 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 30 Figure 10: Maximum Forward Current vs. Temperature for Green and Blue (3 Chips On) 30 25 Ts 20 TA 15 10 5 0 Ts 40 0 120 Figure 9: Maximum Forward Current vs. Temperature for Green and Blue (1 Chip On) 50 0 NOTE: 20 40 60 80 TEMPERATURE (C) 100 120 25 Ts 20 TA 15 10 5 0 0 20 40 60 80 TEMPERATURE (C) 100 120 Maximum forward current graphs based on ambient temperature, TA are with reference to thermal resistance RJ-A as follows. For more details, see Thermal Management. Thermal Resistance from LED Junction to Ambient, RJ-A (C/W) Condition Red Green and Blue 1 chip on 450 410 3 chips on 630 690 Broadcom AV02-3873EN 7 ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED Figure 12: Radiation Pattern Along Y-Axis of the Package 1.0 1.0 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY Figure 11: Radiation Pattern Along X-Axis of the Package 0.6 0.4 Red Green Blue 0.2 0.0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT-DEGREE 0.6 0.4 0.0 90 Red Green Blue 0.2 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT-DEGREE 90 Figure 13: Illustration of Package Axis for Radiation Pattern Y X X Y Figure 14: Recommended Soldering Land Pattern 2.30 0.50 4.55 1.35 1.60 0.40 Maximize the size of copper pad of PIN 1, PIN 4, PIN5 for better heat dissipation. Copper pad Broadcom Solder mask AV02-3873EN 8 ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED Figure 15: Carrier Tape Dimensions Package Marking 4.00 0.10 4.00 0.10 2.00 0.05 +0.10 O 1.50 0 1.75 0.10 2.29 0.10 3.50 0.05 +0.30 8.00 -0.10 3.05 0.10 +0.10 O 1.00 0 3.81 0.10 0.229 0.01 Figure 16: Reeling Orientation USER FEED DIRECTION PACKAGE MARKING PRINTED LABEL Broadcom AV02-3873EN 9 ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED Figure 17: Reel Dimensions 8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) 13.1 0.5 O (0.516 0.020) 20.20 MIN. O (0.795 MIN.) 3.0 0.5 (0.118 0.020) 59.60 1.00 (2.346 0.039) 178.40 1.00 (7.024 0.039) 4.0 0.5 (0.157 0.020) Broadcom 6 PS 5.0 0.5 (0.197 0.020) AV02-3873EN 10 ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED Packing Label (i) Standard label (attached on moisture barrier bag) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant Halogen Free e4 Max Temp 260C MSL3 (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: (9D) Date Code: Date Code (V) Vendor ID: DeptID: Made In: Country of Origin (ii) Baby label (attached on plastic reel) (1P) PART #: Part Number BABY LABEL COSB001B V0.0 (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin (9D): DATE CODE: (1T) TAPE DATE: D/C: Date Code VF: CAT: INTENSITY BIN BIN: COLOR BIN Example of luminous intensity (lv) bin information on label: Example of color bin information on label: BIN: A B CAT: U2 W2 T1 Intensity bin for Blue: T1 Intensity bin for Green: W2 Intensity bin for Red: U2 Broadcom Color bin for Blue: B Color bin for Green: A NOTE: No color bin ID exists for the Red color because there is only one range (see Bin Information). AV02-3873EN 11 ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED Soldering Recommended reflow soldering condition. (ii) Lead-Free Reflow Soldering (i) Leaded Reflow Soldering 20 SEC. MAX. TEMPERATURE TEMPERATURE 10 to 30 SEC. 240C MAX. 3C/SEC. MAX. 183C 100-150C -6C/SEC. MAX. 3C/SEC. MAX. 120 SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. 60-150 SEC. Do not perform reflow soldering more than twice. Observe the necessary precautions for handling moisture-sensitive devices as stated in the following section. Recommended board reflow direction is as follows. 6C/SEC. MAX. 150C 3 C/SEC. MAX. TIME 217C 200C 255 - 260 C 3C/SEC. MAX. TIME Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering for rework only if this is unavoidable, and it must be strictly controlled to the following conditions: - Soldering iron tip temperature = 320C maximum - Soldering duration = 3 seconds maximum - Number of cycles = 1 only - Power of soldering iron = 50W maximum Do not touch the LED body with a hot soldering iron except the soldering terminals because it might damage the LED. For de-soldering, use a double flat tip. Confirm beforehand whether hand soldering will affect the functionality and performance of the LED. REFLOW DIRECTION Broadcom AV02-3873EN 12 ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED Precautionary Notes Handling Precautions Handling of Moisture-Sensitive Devices The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Observe special handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions for more information. This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and cause failures to the LED die or wire bond. Do not touch the silicone encapsulant. Uncontrolled forces acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs. The surface of the silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting pressure on the silicone. Ultrasonic cleaning is not recommended. For automated pick-and-place, Broadcom has tested the following nozzle size to work with this LED. However, due to the possibility of variations in other parameters, such as pick and place machine maker/ model and other settings of the machine, verify that the selected nozzle will not cause damage to the LED. Before use: - An unopened moisture barrier bag (MBB) can be stored at < 40C / 90% RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, it is safe to reflow the LEDs per the original MSL rating. - Do not open the MBB prior to assembly (for example, for IQC). Control after opening the MBB: - Read the HIC immediately upon opening the MBB. - Keep the LEDs at < 30C / 60% RH at all times, and all high temperature-related processes, including soldering, curing or rework, must be completed within 168 hours. Control for unfinished reel: Store unused LEDs in a sealed MBB with desiccant or desiccator at < 5% RH. Control of assembled boards: If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccator at < 5% RH to ensure that all LEDs have not exceeded their floor life of 168 hours. Baking is required if: - The HIC indicator is not BROWN at 10% and is AZURE at 5%. - The LEDs are exposed to condition of > 30C / 60% RH at any time. - The LED floor life exceeded 168 hours. The recommended baking condition is: 60C 5C for 20 hours. ID OD Baking should only be done once. ID = 1.7mm OD = 3.5mm Broadcom AV02-3873EN 13 ASMT-YTD7-0AA02 Data Sheet Storage The soldering terminals of these Broadcom LEDs are silver plated. If the LEDs are exposed too long in the ambient environment, the silver plating might become oxidized and, thus, affect its solderability performance. As such, keep unused LEDs in a sealed MBB with desiccant or in desiccator at <5 % RH. Application Precautions The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. LEDs exhibit slightly different characteristics at different drive currents, which might result in larger variations in their performance (that is, intensity, wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations. The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, make sure that the reverse bias voltage does not exceed the allowable limit of the LED. Do not use the LED in the vicinity of material with sulfur content or in an environment of high gaseous sulfur compound and corrosive elements. Examples of material that might contain sulfur are rubber gaskets, RTV (room temperature vulcanizing) silicone rubber, rubber gloves, and so on. Prolonged exposure to such an environment might affect the optical characteristics and product life. Avoid a rapid change in ambient temperature, especially in high humidity environments, because this will cause condensation on the LED. Although the LED is rated as IPx6 according to IEC60529, the degree of protection provided by enclosure, the test condition might not represent actual exposure during application. If the LED is intended to be used in an outdoor or a harsh environment, protect the LED against damage caused by rain water, dust, oil, corrosive gases, external mechanical stress, and so on. Thermal Management Tricolor PLCC6 White Surface LED where: TA = Ambient temperature (C) RJ-A = Thermal resistance from LED junction to ambient (C/W) IF = Forward current (A) VFmax = Maximum forward voltage (V) The complication of using this formula lies in TA and RJ-A. Actual TA is sometimes subjective and hard to determine. RJ-A varies from system to system depending on design and is usually not known. Another way of calculating TJ is by using the solder point temperature TS as follows: TJ = TS + RJ-S x IF x VFmax where: TS = LED solder point temperature as shown in the following illustration (C) RJ-S = Thermal resistance from junction to solder point (C/W) Ts point - pin 5 TS can be measured easily by mounting a thermocouple on the soldering joint as shown in preceding illustration, while RJ-S is provided in the data sheet. Verify the TS of the LED in the final product to ensure that the LEDs are operated within all maximum ratings stated in the data sheet. Eye Safety Precautions LEDs may pose optical hazards when in operation. Do not look directly at operating LEDs because it might be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipment. Optical, electrical, and reliability characteristics of the LED are affected by temperature. Keep the junction temperature (TJ) of the LED below allowable limits at all times. TJ can be calculated as follows: TJ = TA + RJ-A x IF x VFmax Broadcom AV02-3873EN 14 Disclaimer Broadcom's products are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical devices or applications. Customers are solely responsible, and waive all rights to make claims against Broadcom or its suppliers, for all loss, damage, expense, or liability in connection with such use. Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries, and/or the EU. Copyright (c) 2014-2018 Broadcom. All Rights Reserved. The term "Broadcom" refers to Broadcom Inc. and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.