PACKAGE INFORMATION
Page
Index ----
DIP ----
PMFP ----
SO ----
VSO ----
Soldering ----
1998 Mar 17 2
Philips Semiconductors
Package information Package outlines
INDEX
NAME DESCRIPTION VERSION PAGE
DIP (dual in-line package)
DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
PMFP8 (plastic micro flat package)
PMFP8 plastic micro flat package; 8 leads (straight) SOT144-1
SO (small outline)
SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
SO8 plastic small outline package; 8 leads (straight); body width 3.9 mm SOT96-2
SO8 plastic small outline package; 8 leads; body width 7.5 mm SOT176-1
SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1
VSO (very small outline)
VSO40 plastic very small outline package; 40 leads; face down SOT158-2
1998 Mar 17 3
Philips Semiconductors
Package information Package outlines
DIP
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT97-1 92-11-17
95-02-04
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0450.17 0.020 0.13
b2
050G01 MO-001AN
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
1998 Mar 17 4
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cEe M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT38-1 92-10-02
95-01-19
A
min. A
max. bmax.
w
ME
e1
1.40
1.14
0.055
0.045
0.53
0.38 0.32
0.23 21.8
21.4
0.86
0.84
6.48
6.20
0.26
0.24
3.9
3.4
0.15
0.13
0.2542.54 7.62
0.30
8.25
7.80
0.32
0.31
9.5
8.3
0.37
0.33
2.2
0.087
4.7 0.51 3.7
0.15 0.021
0.015 0.013
0.009 0.010.100.0200.19
050G09 MO-001AE
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
16
1
9
8
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D(1)
Z
DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
1998 Mar 17 5
Philips Semiconductors
Package information Package outlines
PMFP
UNIT ce
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
DIMENSIONS (mm are the original dimensions)
SOT144-1 94-01-25
95-01-24
bn
max.
Lm
max.
HE
0.40
0.25 0.19
0.12 3.1
2.9 3.1
2.9 4.6
4.4
0.80 0.75 0.26 0.3
Q1Q2wt
0.40
0.30 0.1
0.40
0.30 0.95
0.90
0.70
L
wM
b
Q2
Q1
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
E(1)(1)
D
e
t n
pin 1 index
41
58
DE
c
m
X
detail X
PMFP8: plastic micro flat package; 8 leads (straight) SOT144-1
A2
A2
HE
1998 Mar 17 6
Philips Semiconductors
Package information Package outlines
SO
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S MS-012AA
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
95-02-04
97-05-22
1998 Mar 17 7
Philips Semiconductors
Package information Package outlines
UNIT A bpcD
(1)
2E(2) (1)
eH
ELQ Zwv
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.45
1.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.4
6.2 1.2 0.7
0.6 0.7
0.3
0.250.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT96-2
X
wM
bp
D
HE
Q
detail X
E
Z
e
c
L
vMA
A
4
5
1
8
pin 1 index
0.057
0.049 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.252
0.244 0.028
0.024 0.028
0.012
0.010.010.047
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads (straight); body width 3.9 mm SOT96-2
A2
95-02-04
97-05-22
1998 Mar 17 8
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) Z(1)
eH
ELL
pQywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.3
0.1 2.45
2.25 0.49
0.36 0.32
0.23 7.65
7.45 7.6
7.4 1.27 10.65
10.00 1.1
1.0 2.0
1.8 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.45
SOT176-1 95-02-25
97-05-22
X
4
8
θ
A
A1
A2
wM
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
5
1
(A )
3
A
y
0.25
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.30
0.29 0.30
0.29 0.050
1.45
0.057
0.25
0.01
0.419
0.394 0.043
0.039 0.079
0.071
0.01 0.004
0.043
0.018
0.01
0 5 10 mm
scale
pin 1 index
SO8: plastic small outline package; 8 leads; body width 7.5 mm SOT176-1
1998 Mar 17 9
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 10.5
10.1 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT162-1
8
16
wM
bp
D
detail X
Z
e
9
1
y
0.25
075E03 MS-013AA
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.41
0.40 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
0 5 10 mm
scale
SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
95-01-24
97-05-22
1998 Mar 17 10
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 18.1
17.7 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT136-1
X
14
28
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
c
L
vMA
e
15
1
(A )
3
A
y
0.25
075E06 MS-013AE
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.71
0.69 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1
95-01-24
97-05-22
1998 Mar 17 11
Philips Semiconductors
Package information Package outlines
VSO
UNIT A1A2A3bpcD
(1) E(2) eH
ELL
pQywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
0.3
0.1 2.45
2.25 0.25 0.42
0.30 0.22
0.14 15.6
15.2 7.6
7.5 0.762 12.3
11.8 1.15
1.05 0.6
0.3 7
0
o
o
0.1 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
1.7
1.5
SOT158-2
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
y
40 21
201
pin 1 index
0.012
0.004 0.096
0.089 0.017
0.012 0.0087
0.0055 0.61
0.60 0.30
0.29 0.03
2.25
0.089
0.48
0.46 0.045
0.041 0.024
0.012
0.004
0.2
0.008 0.004
0.067
0.059
0.010
Z(1)
0 5 10 mm
scale
92-11-17
95-01-24
VSO40: plastic very small outline package; 40 leads; face down SOT158-2
A
max.
2.70
0.11
