2
How to Order
Part Number Explanation
Commercial Surface Mount Chips
EXAMPLE: 08055A101JAT2A
0805
Size
(L" x W")
0101*
0201
0402
0603
0805
1206
1210
1812
1825
2220
2225
5
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
D = 35V
5 = 50V
1 = 100V
2 = 200V
7 = 500V
A
Dielectric
A = NP0(C0G)
C = X7R
D = X5R
F = X8R
G = Y5V
U = U Series
W = X6S
Z = X7S
101
Capacitance
2 Sig. Fig +
No. of Zeros
Examples:
100 = 10 pF
101 = 100 pF
102 = 1000 pF
223 = 22000 pF
224 = 220000 pF
105 = 1μF
106 = 10μF
107 = 100μF
For values below
10 pF, use “R”
in place of
Decimal point, e.g.,
9.1 pF = 9R1.
J*
Tolerance
B = ±.10 pF
C = ±.25 pF
D = ±.50 pF
F = ±1%
(≥ 10 pF)
G = ±2%
(≥ 10 pF)
J = ±5%
K = ±10%
M = ±20%
Z = +80%,
-20%
P = +100%,
-0%
A
Failure
Rate
A = N/A
4 = Automotive
T
Terminations
T = Plated Ni
and Sn
7 = Gold Plated
U = Conductive
Expoxy for
Hybrid
Applications
Z = FLEXITERM®
X = FLEXITERM®
with 5% min
lead (X7R &
X8R only)
Contact
Factory For
1 = Pd/Ag Term
2
Packaging
Available
2 = 7" Reel
4 = 13" Reel
K = 30K per
13" Reel
(0603 only)
7 = Bulk Cass.
9 = Bulk
U = 4mm TR
(01005)
Contact
Factory For
Multiples
A**
Special
Code
A = Std
K = 30K (0603 2mm pitch)
22K (0805/1206
<0.030"/ 0.76mm)
H = 18K (0603/0805/1206
<0.037” / 0.94mm)
J = 15K (0805/1206
<0.050” / 1.27mm)
1 = 12K (0805/1206
<0.055 / 1.4mm)
**Non std options upon
approval from the factory
High Voltage MLC Chips
EXAMPLE: 1808AA271KA11A
Contact Factory for
Special Voltages
* B, C & D tolerance for ≤10 pF values.
Standard Tape and Reel material (Paper/Embossed) depends upon chip
size and thickness.
See individual part tables for tape material type for each capacitance value.
1808
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
3640
A
Voltage
C= 600V/630V
A = 1000V
S= 1500V
G= 2000V
W= 2500V
H= 3000V
J= 4000V
K= 5000V
A
Temperature
Coefficient
A = C0G
C = X7R
271
Capacitance
Code
(2 significant digits
+ no. of zeros)
Examples:
K
Capacitance
Tolerance
A
Failure
Rate
A=Not
Applicable
T1
Packaging/
Marking
1 = 7" Reel
3 = 13" Reel
9 = Bulk
A
Special
Code
A = Standard
10 pF = 100
100 pF = 101
1,000 pF = 102
22,000 pF = 223
220,000 pF = 224
1 μF = 105
C0G: J = ±5%
K = ±10%
M = ±20%
X7R: K = ±10%
M = ±20%
Z = +80%,
-20%
F = 63V
* = 75V
E = 150V
V = 250V
9 = 300V
X = 350V
8 = 400V
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
For Tin/Lead Terminations, please refer to LD Series
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
For Tin/Lead Terminations, please refer to LD Series
Termination
1= Pd/Ag
T = Plated Ni
and Sn
B = 5% Min Pb
Z = FLEXITERM®
X = FLEXITERM®
with 5% min
lead (X7R only)
*EIA 01005
Not RoHS Compliant
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
3
How to Order
Part Number Explanation
Capacitor Array
EXAMPLE: W2A43C103MAT2A
Low Inductance Capacitors (LICC)
EXAMPLE: 0612ZD105MAT2A
Interdigitated Capacitors (IDC)
EXAMPLE: W3L16D225MAT3A
Low Inductance Decoupling Capacitor Arrays (LICA)
EXAMPLE: LICA3T183M3FC4AA
0612
Size
0306
0508
0612
LD16
LD17
LD18
Z
Voltage
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
D
Dielectric
C = X7R
D = X5R
105
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
M
Capacitance
Tolerance
K = ±10%
M = ±20%
A
Failure Rate
A = N/A
T
Terminations
T = Plated Ni
and Sn
B = 5% min
lead
2
Packaging
Available
2 = 7" Reel
4 = 13" Reel
A
Thickness
See Page 71
for Codes
W
Style
W = RoHS
L = SnPb
3
Case
Size
2 = 0508
3 = 0612
L
Low
Inductance
ESL = 50pH
ESL = 60pH
1
Number
of
Terminals
1 = 8 Terminals
6
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
D
Dielectric
C = X7R
D = X5R
225
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
M
Capacitance
Tolerance
M = ±20
T
Termination
T = Plated Ni
and Sn
B = 5% min
Lead
3
Packaging
Available
1=7" Reel
3=13" Reel
A
Thickness
Max. Thickness
mm (in.)
A=0.95 (0.037)
S=0.55 (0.022)
A
Failure
Rate
A = N/A
LICA
Style
&
Size
3
Voltage
5V = 9
10V = Z
25V = 3
T
Dielectric
D = X5R
T = T55T
S = High K
T55T
102
Cap/Section
(EIA Code)
102 = 1000 pF
103 = 10 nF
104 = 100 nF
M
Capacitance
Tolerance
M = ±20%
P = GMV
3
Height
Code
6 = 0.500mm
3 = 0.650mm
1 = 0.875mm
5 = 1.100mm
7 = 1.600mm
F
Termination
F = C4 Solder
Balls- 97Pb/3Sn
H = C4 Solder
Balls–Low ESR
P = Cr-Cu-Au
N = Cr-Ni-Au
X = None
C
Reel Packaging
M = 7" Reel
R = 13" Reel
6 = 2"x2" Waffle Pack
8 = 2"x2" Black Waffle
Pack
7 = 2"x2" Waffle Pack
w/ termination
facing up
A = 2"x2" Black Waffle
Pack
w/ termination
facing up
C = 4"x4" Waffle Pack
w/ clear lid
A
Inspection
Code
A = Standard
B = Established
Reliability
Testing
A
Code
Face
A = Bar
B = No Bar
C = Dot, S55S
Dielectrics
D = Triangle
4
# of
Caps/Part
1 = one
2 = two
4 = four
W
Style
W = RoHS
L = SnPb
2
Case
Size
1 = 0405
2 = 0508
3 = 0612
A
Array
4
Number
of Caps
3
Voltage
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
C
Dielectric
A = NP0
C = X7R
D = X5R
103
Capacitance
Code (In pF)
2 Sig Digits +
Number of
Zeros
M
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
2A
Packaging &
Quantity
Code
2A = 7" Reel
(4000)
4A = 13" Reel
(10000)
2F = 7" Reel
(1000)
T
Termination
Code
T = Plated Ni and Sn
Z = FLEXITERM®
B = 5% min lead
X = FLEXITERM®
with 5% min lead
A
Failure
Rate
A = Commercial
4 = Automotive
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
NOTE: Contact factory for
availability of Termination and
Tolerance Options for Specific
Part Numbers.
Not RoHS Compliant
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
4
Typical Capacitance Change
Envelope: 0 ± 30 ppm/°C
% Capacitance
+0.5
0
-0.5
-55 -35 -15 +5 +25 +45 +65 +85+105 +125
Temperature °C
Temperature Coefficient
Insulation Resistance (Ohm-Farads)
1,000
10,000
100
0020 40 60 80
Temperature °C
Insulation Resistance vs Temperature
100
Impedance,
10 100 1000
Frequency, MHz
Variation of Impedance with Chip Size�
Impedance vs. Frequency�
1000 pF - C0G (NP0)�
1.0
0.1
10 1206
0805
1812
1210
Impedance,
10 100 1000
Frequency, MHz
Variation of Impedance with Ceramic Formulation�
Impedance vs. Frequency�
1000 pF - C0G (NP0) vs X7R�
0805�
0.10
0.01
1.00
X7R
NPO
10.00
% Capacitance
+1
+2
0
-1
-2
1KHz 10 KHz 100 KHz 1 MHz 10 MHz
Frequency
Capacitance vs. Frequency
Impedance,
1,000
10,000
100
110 100 1000
Frequency, MHz
Variation of Impedance with Cap Value�
Impedance vs. Frequency�
0805 - C0G (NP0)�
10 pF vs. 100 pF vs. 1000 pF
10 pF
100 pF
1000 pF
1.0
0.1
10.0
100,000
C0G (NP0) Dielectric
General Specifications
C0G (NP0) is the most popular formulation of the
“temperature-compensating,” EIA Class I ceramic
materials. Modern C0G (NP0) formulations contain
neodymium, samarium and other rare earth oxides.
C0G (NP0) ceramics offer one of the most stable capacitor
dielectrics available. Capacitance change with temperature
is 0 ±30ppm/°C which is less than ±0.3% C from -55°C
to +125°C. Capacitance drift or hysteresis for C0G (NP0)
ceramics is negligible at less than ±0.05% versus up to
±2% for films. Typical capacitance change with life is less
than ±0.1% for C0G (NP0), one-fifth that shown by most
other dielectrics. C0G (NP0) formulations show no aging
characteristics.
0805
Size
(L" x W")
5
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
500V = 7
A
Dielectric
C0G (NP0) = A
101
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
J
Capacitance
Tolerance
B = ±.10 pF (<10pF)
C = ±.25 pF (<10pF)
D = ±.50 pF (<10pF)
F = ±1% (≥ 10 pF)
G = ±2% (≥ 10 pF)
J = ±5%
K = ±10%
A
Failure
Rate
A = Not
Applicable
T
Terminations
T = Plated Ni
and Sn
7 = Gold Plated
2
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Bulk Cass.
9 = Bulk
U = 4mm TR
(01005)
Contact
Factory
For
Multiples
A
Special
Code
A = Std.
Product
PART NUMBER (see page 2 for complete part number explanation)
Contact
Factory For
1 = Pd/Ag Term
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values.
5
C0G (NP0) Dielectric
Specifications and Test Methods
Parameter/Test NP0 Specification Limits Measuring Conditions
Operating Temperature Range -55ºC to +125ºC Temperature Cycle Chamber
Capacitance Within specified tolerance Freq.: 1.0 MHz ± 10% for cap ≤ 1000 pF
Q<30 pF: Q≥ 400+20 x Cap Value 1.0 kHz ± 10% for cap > 1000 pF
≥30 pF: Q≥ 1000 Voltage: 1.0Vrms ± .2V
Insulation Resistance 100,000MΩ or 1000MΩ - μF, Charge device with rated voltage for
whichever is less 60 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Note: Charge device with 150% of rated
voltage for 500V devices.
Appearance No defects Deflection: 2mm
Capacitance Test Time: 30 seconds
Resistance to Variation ±5% or ±.5 pF, whichever is greater
Flexure Q Meets Initial Values (As Above)
Stresses
Insulation ≥ Initial Value x 0.3
Resistance
Solderability ≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC
with fresh solder for 5.0 ± 0.5 seconds
Appearance No defects, <25% leaching of either end terminal
Capacitance
Variation ≤ ±2.5% or ±.25 pF, whichever is greater
Dip device in eutectic solder at 260ºC for 60
Q Meets Initial Values (As Above) seconds. Store at room temperature for 24 ± 2
Resistance to
hours before measuring electrical properties.
Solder Heat Insulation Meets Initial Values (As Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes
Capacitance
Variation ≤ ±2.5% or ±.25 pF, whichever is greater Step 2: Room Temp ≤ 3 minutes
Q Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutes
Thermal
Shock Insulation Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutes
Resistance
Dielectric Meets Initial Values (As Above) Repeat for 5 cycles and measure after
Strength 24 hours at room temperature
Appearance No visual defects
Capacitance
Variation ≤ ±3.0% or ± .3 pF, whichever is greater Charge device with twice rated voltage in
≥ 30 pF: Q≥ 350 test chamber set at 125ºC ± 2ºC
Load Life Q≥10 pF, <30 pF: Q≥ 275 +5C/2 for 1000 hours (+48, -0).
(C=Nominal Cap) <10 pF: Q≥ 200 +10C
Insulation ≥ Initial Value x 0.3 (See Above) Remove from test chamber and stabilize at
Resistance room temperature for 24 hours
Dielectric Meets Initial Values (As Above) before measuring.
Strength
Appearance No visual defects
Capacitance
Variation ≤ ±5.0% or ± .5 pF, whichever is greater Store in a test chamber set at 85ºC ± 2ºC/
30 pF: Q≥ 350 85% ± 5% relative humidity for 1000 hours
Load Q ≥10 pF, <30 pF: Q≥ 275 +5C/2 (+48, -0) with rated voltage applied.
Humidity <10 pF: Q≥ 200 +10C
Insulation ≥ Initial Value x 0.3 (See Above) Remove from chamber and stabilize at
Resistance room temperature for 24 ± 2 hours
Dielectric Meets Initial Values (As Above) before measuring.
Strength
1mm/sec
90 mm
6
C0G (NP0) Dielectric
Capacitance Range
Letter ABCEGJKMNPQXYZ
Max. 0.33 0.22 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.009) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
SIZE 0101* 0201 0402 0603 0805 1206
Soldering Reflow Only Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave
Packaging All Paper All Paper All Paper All Paper Paper/Embossed Paper/Embossed
(L) Length mm 0.40 ± 0.02 0.60 ± 0.03 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20
(in.) (0.016 ± 0.0008) (0.024 ± 0.001) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008)
(W) Width mm 0.20 ± 0.02 0.30 ± 0.03 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
(in.) (0.008 ± 0.0008) (0.011 ± 0.001) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008)
(t) Terminal mm 0.10 ± 0.04 0.15 ± 0.05 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25
(in.) (0.004 ± 0.016) (0.006 ± 0.002) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 16 25 50 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500
Cap 0.5 A C C C G G G G J J J J J J J J J J J
(pF) 1.0 B A C C C G G G G J J J J J J J J J J J
1.2 B A C C C G G G G J J J J J J J J J J J
1.5 B A A C C C G G G G J J J J J J J J J J J
1.8 B A A C C C G G G G J J J J J J J J J J J
2.2 B A A C C C G G G G J J J J J J J J J J J
2.7 B A A C C C G G G G J J J J J J J J J J J
3.3 B A A C C C G G G G J J J J J J J J J J J
3.9 B A A C C C G G G G J J J J J J J J J J J
4.7 B A A C C C G G G G J J J J J J J J J J J
5.6 B A A C C C G G G G J J J J J J J J J J J
6.8 B A A C C C G G G G J J J J J J J J J J J
8.2 B A A C C C G G G G J J J J J J J J J J J
10 B AACCCGGGGJ J JJ JJ JJ J J J
12 B AACCCGGGGJ J JJ JJ JJ J J J
15 B AACCCGGGGJ J JJ JJ JJ J J J
18 B AACCCGGGGJ J JJ JJ JJ J J J
22 B AACCCGGGGJ J JJ JJ JJ J J J
27 AACCCGGGGJ J JJ JJ JJ J J J
33 AACCCGGGGJ J JJ JJ JJ J J J
39 A CCCGGGGJ J JJ JJ JJ J J J
47 A CCCGGGGJ J JJ JJ JJ J J J
56 A CCCGGGGJ J JJ JJ JJ J J J
68 A CCCGGGGJ J JJ JJ JJ J J J
82 A CCCGGGGJ J JJ JJ JJ J J J
100 A C C C G G G G J J J J J J J J J J J
120 C C C G G G G J J J J J J J J J J J
150 C C C G G G G J J J J J J J J J J J
180 C C C G G G G J J J J J J J J J J J
220 C C C G G G G J J J J J J J J J J M
270 C C C G G G G J J J J M J J J J J M
330 C C C G G G G J J J J M J J J J J M
390 C C C G G G J J J J M J J J J J M
470 C C C G G G J J J J M J J J J J M
560 G G G J J J J M J J J J J M
680 G G G J J J J J J J J J P
820 G G G J J J J J J J J M
1000 G G G J J J J J J J J Q
1200 JJ J J JJJ Q
1500 JJ J J JJMQ
1800 JJ J J JMM
2200 JJN J JMP
2700 JJN J JMP
3300 JJ J JMP
3900 JJ J JMP
4700 JJ J JMP
5600 JJM
6800 MM
8200 MM
Cap 0.010 MM
(μF) 0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC 16 25 50 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500
SIZE 0101* 0201 0402 0603 0805 1206
L
W
T
t
PREFERRED SIZES ARE SHADED
*EIA 01005
7
7
C0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE 1210 1812 1825 2220 2225
Soldering Reflow Only Reflow Only Reflow Only Reflow Only Reflow Only
Packaging Paper/Embossed All Embossed All Embossed All Embossed All Embossed
(L) Length mm 3.20 ± 0.20 4.50 ± 0.30 4.50 ± 0.30 5.70 ± 0.40 5.72 ± 0.25
(in.) (0.126 ± 0.008) (0.177 ± 0.012) (0.177 ± 0.012) (0.225 ± 0.016) (0.225 ± 0.010)
(W) Width mm 2.50 ± 0.20 3.20 ± 0.20 6.40 ± 0.40 5.00 ± 0.40 6.35 ± 0.25
(in.) (0.098 ± 0.008) (0.126 ± 0.008) (0.252 ± 0.016) (0.197 ± 0.016) (0.250 ± 0.010)
(t) Terminal mm 0.50 ± 0.25 0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39 0.64 ± 0.39
(in.) (0.020 ± 0.010) (0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015) (0.025 ± 0.015)
WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200 50 100 200
Cap 0.5
(pF) 1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10 J
12 J
15 J
18 J
22 J
27 J
33 J
39 J
47 J
56 J
68 J
82 J
100 J
120 J
150 J
180 J
220 J
270 J
330 J
390 M
470 M
560 J J J J M
680 J J J J M
820 J J J J M
1000 J J J J M K K K K M M M M M M P
1200 J J J M M K K K K M M M M M M P
1500 J J J M M K K K K M M M M M M P
1800 J J J M K K K K M M M M M M P
2200 J J J Q K K K K P M M M M M P
2700 J J J Q K K K P Q M M M M M P
3300 J J J K K K P Q M M M X M M P
3900 J J M K K K P Q M M M X M M P
4700 J J M K K K P Q M M M X X X M M P
5600 J J K K M P X M M M X X X M M P
6800 J J K K M X M M M X X X M M P
8200 J J K M M M M X X X M M P
Cap 0.010 J J K M M M M X X X M M P
(μF) 0.012 J J K M M M X X X M M P
0.015 M M M M X X X M M Y
0.018 M M P M X X X M M Y
0.022 M M P X X M Y Y
0.027 M M P X X P Y Y
0.033 M M P X X P
0.039 M M P Y P
0.047 M M P Y P
0.068 M M P
0.082 M M Q
0.1 Q
WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200 50 100 200
SIZE 1210 1812 1825 2220 2225
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
RF/Microwave C0G (NP0)
Capacitors (RoHS)
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
8
A
B
DD
E
C
A
BC
A
B
DD
E
C
A
B
DD
E
C
GENERAL INFORMATION
“U” Series capacitors are C0G (NP0) chip capacitors spe -
cially designed for “Ultra” low ESR for applications in the
communications market. Max ESR and effective capacitance
are met on each value producing lot to lot uniformity.
Sizes available are EIA chip sizes 0402, 0603, 0805, and
1210.
Size A B C D E
0402 0.039±0.004 (1.00±0.1) 0.020±0.004 (0.50±0.1) 0.024 (0.6) max N/A N/A
0603 0.060±0.010 (1.52±0.25) 0.030±0.010 (0.76±0.25) 0.036 (0.91) max 0.010±0.005 (0.25±0.13) 0.030 (0.76) min
0805 0.079±0.008 (2.01±0.2) 0.049±0.008 (1.25±0.2) 0.040±0.005 (1.02±0.127) 0.020±0.010 (0.51±0.255) 0.020 (0.51) min
1210 0.126±0.008 (3.2±0.2) 0.098±0.008 (2.49±0.2) 0.050±0.005 (1.27±0.127) 0.025±0.015 (0.635±0.381) 0.040 (1.02) min
ELECTRICAL CHARACTERISTICS
Capacitance Values and Tolerances:
Size 0402 - 0.2 pF to 22 pF @ 1 MHz
Size 0603 - 1.0 pF to 100 pF @ 1 MHz
Size 0805 - 1.6 pF to 160 pF @ 1 MHz
Size 1210 - 2.4 pF to 1000 pF @ 1 MHz
Temperature Coefficient of Capacitance (TC):
0±30 ppm/°C (-55° to +125°C)
Insulation Resistance (IR):
1012 Ω min. @ 25°C and rated WVDC
1011 Ω min. @ 125°C and rated WVDC
Working Voltage (WVDC):
Size Working Voltage
0402 - 50, 25 WVDC
0603 - 200, 100, 50 WVDC
0805 - 200, 100 WVDC
1210 - 200, 100 WVDC
Dielectric Working Voltage (DWV):
250% of rated WVDC
Equivalent Series Resistance Typical (ESR):
0402 - See Performance Curve, page 9
0603 - See Performance Curve, page 9
0805 - See Performance Curve, page 9
1210 - See Performance Curve, page 9
Marking: Laser marking EIA J marking standard
(except 0603) (capacitance code and
tolerance upon request).
MILITARY SPECIFICATIONS
Meets or exceeds the requirements of MIL-C-55681
0805
Case Size
0402
0603
0805
1210
1
Voltage Code
3 = 25V
5 = 50V
1 = 100V
2 = 200V
U
Dielectric =
Ultra Low ESR
100
Capacitance
J
Capacitance
Tolerance Code
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
A
Failure Rate
Code
A = Not Applicable
T
Termination
T= Plated Ni and
Sn
2
Packaging
Code
A
Special Code
A = Standard
HOW TO ORDER
EIA Capacitance Code in pF.
First two digits = significant figures or “R” for
decimal place.
Third digit = number of zeros or after “R” sig-
nificant figures.
2 = 7" Reel
4 = 13" Reel
9 = Bulk
DIMENSIONS: inches (millimeters)
0402 0603 0805 1210
inches (mm)
NOTE: Contact factory for availability of Termination and Toler-
ance Options for Specific Part Numbers.
LEAD-FREE COMPATIBLE
COMPONENT
RF/Microwave C0G (NP0)
Capacitors (RoHS)
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
9
3.9 pF
4.7 pF
5.1 pF
6.8 pF
10.0 pF
15.0 pF
1
0.1
0.010500 1000 1500 2000 2500
Frequency (MHz)
ESR (ohms)
TYPICAL ESR vs. FREQUENCY�
0603 “U” SERIES
10 pF
15 pF
3.3 pF
1
0.1
0.010500 1000 1500 2000 2500
Frequency (MHz)
ESR (ohms)
TYPICAL ESR vs. FREQUENCY�
0402 “U” SERIES
10.0 pF
100 pF
1
0.1
0.010500 1000 1500 2000 2500
Frequency (MHz)
ESR (ohms)
TYPICAL ESR vs. FREQUENCY
0805 “U” SERIES
10 pF
100 pF
300 pF
1
0.1
0.010500 1000 1500 2000
Frequency (MHz)
ESR (ohms)
TYPICAL ESR vs. FREQUENCY
1210 “U” SERIES
CAPACITANCE RANGE
ULTRA LOW ESR, “U” SERIES
ESR Measured on the Boonton 34A
Available Size
Cap (pF) Tolerance 0402 0603 0805 1210
0.2 B,C 50V N/A N/A N/A
0.3
0.4
0.5 B,C
0.6 B,C,D
0.7
0.8
0.9 B,C,D
Available Size
Cap (pF) Tolerance 0402 0603 0805 1210
1.0 B,C,D 50V 200V 200V 200V
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2 B,C,D
6.8 B,C,J,K,M
Available Size
Cap (pF) Tolerance 0402 0603 0805 1210
7.5 B,C,J,K,M 50V 200V 200V 200V
8.2
9.1 B,C,J,K,M
10 F,G,J,K,M
11
12
13
15
18 200V
20 100V
22
24
27
30 50V
33 N/A
36
39
43
47
51
56
68
75
82
91
Available Size
Cap (pF) Tolerance 0402 0603 0805 1210
100 F,G,J,K,M N/A 100V 200V 200V
110 50V
120 50V
130 N/A 200V
140 100V
150
160 100V
180 N/A
200
220
270
300
330
360
390
430 200V
470 100V
510
560
620
680
750
820
910
1000 F,G,J,K,M
LEAD-FREE COMPATIBLE
COMPONENT
RF/Microwave C0G (NP0) Capacitors
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
TYPICAL
SERIES RESONANT FREQUENCY
“U” SERIES CHIP
1210 0805
0603
0402
10
1.0
0.11.0 10 100 1000
Capacitance (pF)
Frequency (GHz)
10
RF/Microwave C0G (NP0)
Capacitors (Sn/Pb)
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
GENERAL INFORMATION
“U” Series capacitors are C0G (NP0) chip capacitors specially
designed for “Ultra” low ESR for applications in the commu-
nications market. Max ESR and effective capacitance
are met on each value producing lot to lot uniformity.
Sizes available are EIA chip sizes 0402, 0603, 0805, and
1210.
Size A B C D E
0402 0.039±0.004 (1.00±0.1) 0.020±0.004 (0.50±0.1) 0.024 (0.6) max N/A N/A
0603 0.060±0.010 (1.52±0.25) 0.030±0.010 (0.76±0.25) 0.036 (0.91) max 0.010±0.005 (0.25±0.13) 0.030 (0.76) min
0805 0.079±0.008 (2.01±0.2) 0.049±0.008 (1.25±0.2) 0.040±0.005 (1.02±0.127) 0.020±0.010 (0.51±0.254) 0.020 (0.51) min
1210 0.126±0.008 (3.2±0.2) 0.098±0.008 (2.49±0.2) 0.050±0.005 (1.27±0.127) 0.025±0.015 (0.635±0.381) 0.040 (1.02) min
Capacitance Values and Tolerances:
Size 0402 - 0.2 pF to 22 pF @ 1 MHz
Size 0603 - 1.0 pF to 100 pF @ 1 MHz
Size 0805 - 1.6 pF to 160 pF @ 1 MHz
Size 1210 - 2.4 pF to 1000 pF @ 1 MHz
Temperature Coefficient of Capacitance (TC):
0±30 ppm/°C (-55° to +125°C)
Insulation Resistance (IR):
1012 Ω min. @ 25°C and rated WVDC
1011 Ω min. @ 125°C and rated WVDC
Working Voltage (WVDC):
Size Working Voltage
0402 - 50, 25 WVDC
0603 - 200, 100, 50 WVDC
0805 - 200, 100 WVDC
1210 - 200, 100 WVDC
Dielectric Working Voltage (DWV):
250% of rated WVDC
Equivalent Series Resistance Typical (ESR):
0402 - See Performance Curve, page 12
0603 - See Performance Curve, page 12
0805 - See Performance Curve, page 12
1210 - See Performance Curve, page 12
Marking: Laser marking EIA J marking standard
(except 0603) (capacitance code and
tolerance upon request).
MILITARY SPECIFICATIONS
Meets or exceeds the requirements of MIL-C-55681
A
B
DD
E
C
A
BC
A
B
DD
E
C
A
B
DD
E
C
LD05
Case Size
LD02 = 0402
LD03 = 0603
LD05 = 0805
LD10 = 1210
1
Voltage Code
3 = 25V
5 = 50V
1 = 100V
2 = 200V
U
Dielectric =
Ultra Low
ESR
100
Capacitance
J
Capacitance
Tolerance
Code
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
A
Failure Rate
Code
A = Not Applica-
ble
B
Termination
B = 5% min lead
2
Packaging
Code
2 = 7" Reel
4 = 13" Reel
9 = Bulk
A
Special Code
A = Standard
HOW TO ORDER
EIA Capacitance Code in pF.
First two digits = significant figures
or “R” for decimal place.
Third digit = number of zeros or after
“R” significant figures.
DIMENSIONS: inches (millimeters)
0402 0603 0805 1210
inches (mm)
ELECTRICAL CHARACTERISTICS
11
Not RoHS Compliant
ULTRA LOW ESR, “U” SERIES
3.9 pF
4.7 pF
5.1 pF
6.8 pF
10.0 pF
15.0 pF
1
0.1
0.010500 1000 1500 2000 2500
Frequency (MHz)
ESR (ohms)
TYPICAL ESR vs. FREQUENCY�
0603 “U” SERIES
10 pF
15 pF
3.3 pF
1
0.1
0.010500 1000 1500 2000 2500
Frequency (MHz)
ESR (ohms)
TYPICAL ESR vs. FREQUENCY�
0402 “U” SERIES
10.0 pF
100 pF
1
0.1
0.010500 1000 1500 2000 2500
Frequency (MHz)
ESR (ohms)
TYPICAL ESR vs. FREQUENCY
0805 “U” SERIES
10 pF
100 pF
300 pF
1
0.1
0.010500 1000 1500 2000
Frequency (MHz)
ESR (ohms)
TYPICAL ESR vs. FREQUENCY
1210 “U” SERIES
ESR Measured on the Boonton 34A
RF/Microwave C0G (NP0)
Capacitors (Sn/Pb)
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
CAPACITANCE RANGE
Available Size
Cap (pF) Tolerance LD02 LD03 LD05 LD10
0.2 B,C 50V N/A N/A N/A
0.3
0.4
0.5 B,C
0.6 B,C,D
0.7
0.8
0.9 B,C,D
Available Size
Cap (pF) Tolerance LD02 LD03 LD05 LD10
1.0 B,C,D 50V 200V 200V 200V
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2 B,C,D
6.8 B,C,J,K,M
Available Size
Cap (pF) Tolerance LD02 LD03 LD05 LD10
7.5 B,C,J,K,M 50V 200V 200V 200V
8.2
9.1 B,C,J,K,M
10 F,G,J,K,M
11
12
13
15
18 200V
20 100V
22
24
27
30 50V
33 N/A
36
39
43
47
51
56
68
75
82
91
Available Size
Cap (pF) Tolerance LD02 LD03 LD05 LD10
100 F,G,J,K,M N/A 100V 200V 200V
110 50V
120 50V
130 N/A 200V
140 100V
150
160 100V
180 N/A
200
220
270
300
330
360
390
430 200V
470 100V
510
560
620
680
750
820
910
1000 F,G,J,K,M
12
“U” SERIES KITS
Designer Kits
Communication Kits “U” Series
0402
Kit 4000 UZ
Cap. Cap.
Value Tolerance Value Tolerance
pF pF
1.0 6.8
1.2 7.5 B (±0.1pF)
1.5 8.2
1.8 10.0
2.0 12.0
2.4 B (±0.1pF) 15.0
2.7 18.0
3.0 22.0 J (±5%)
3.3 27.0
3.9 33.0
4.7 39.0
5.6 47.0
***25 each of 24 values
***25 each of 15 values
Kit 5000 UZ
Cap. Cap.
Value Tolerance Value Tolerance
pF pF
0.5 4.7
1.0 5.6 B (±0.1pF)
1.5 6.8
1.8 B (±0.1pF) 8.2
2.2 10.0
2.4 12.0 J (±5%)
3.0 15.0
3.6
0805
***25 each of 30 values
Kit 3000 UZ
Cap. Cap.
Value Tolerance Value Tolerance
pF pF
1.0 15.0
1.5 18.0
2.2 22.0
2.4 24.0
2.7 27.0
3.0 33.0
3.3 B (±0.1pF) 36.0
3.9 39.0 J (±5%)
4.7 47.0
5.6 56.0
7.5 68.0
8.2 82.0
9.1 100.0
10.0 J (±5%) 130.0
12.0 160.0
1210
***25 each of 30 values
Kit 3500 UZ
Cap. Cap.
Value Tolerance Value Tolerance
pF pF
2.2 36.0
2.7 39.0
4.7 47.0
5.1 B (±0.1pF) 51.0
6.8 56.0
8.2 68.0
9.1 82.0
10.0 100.0 J (±5%)
13.0 120.0
15.0 130.0
18.0 J (±5%) 240.0
20.0 300.0
24.0 390.0
27.0 470.0
30.0 680.0
13
0603
0805
Size
0603
0805
1206
5
Voltage
16V = Y
25V = 3
50V = 5
100V = 1
F
Dielectric
X8R = F
X8L = L
104
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
e.g. 10μF = 106
K
Capacitance
Tolerance
J = ± 5%
K = ±10%
M = ± 20%
4
Failure
Rate
4 = Automotive
A = Not
Applicable
T
Terminations
T = Plated Ni
and Sn
Z =
FLEXITERM®
U =
Conductive
Epoxy for
Hybrid apps
2
Packaging
2 = 7" Reel
4 = 13" Reel
A
Special
Code
A = Std.
Product
X8R/X8L Dielectric
General Specifications
AVX has developed a range of multilayer ceramic capacitors designed for use in applications up to 150ºC.
These capacitors are manufactured with an X8R and an X8L dielectric material. X8R material has
capacitance variation of ±15% between -55ºC and +150ºC. The X8L material has capacitance variation of
±15% between -55ºC to 125ºC and +15/-40% from +125ºC to +150ºC.
The need for X8R and X8L performance has been driven by customer requirements for parts that operate
at elevated temperatures. They provide a highly reliable capacitor with low loss and stable capacitance
over temperature.
They are ideal for automotive under the hood sensors, and various industrial applications. Typical industrial
application would be drilling monitoring system. They can also be used as bulk capacitors for high
temperature camera modules.
Both X8R and X8L dielectric capacitors are automotive AEC-Q200 qualified. Optional termination systems, tin,
FLEXITERM®and conductive epoxy for hybrid applications are available. Providing this series with our
FLEXITERM®termination system provides further advantage to customers by way of enhanced resistance to
both, temperature cycling and mechanical damage.
PART NUMBER (see page 2 for complete part number explanation)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
14
SIZE 0603 0805 1206
WVDC
25V 50V 25V 50V 25V 50V
331 Cap 330 G G J J
471 (pF) 470 G G J J
681 680 G G J J
102 1000 G G J J J J
152 1500 G G J J J J
222 2200 G G J J J J
332 3300 G G J J J J
472 4700 G G J J J J
682 6800 G G J J J J
103 Cap 0.01 G G J J J J
153 (μF) 0.015 G G J J J J
223 0.022 G G J J J J
333 0.033 G G J J J J
473 0.047 G G J J J J
683 0.068 G N N M M
104 0.1 N N M M
154 0.15 N N M M
224 0.22 N M M
334 0.33 M M
474 0.47 M
684 0.68
105 1
WVDC
25V 50V 25V 50V 25V 50V
SIZE 0603 0805 1206
SIZE 0603 0805 1206
WVDC
25V 50V 100V 25V 50V 100V 16V 25V 50V 100V
331 Cap 330 G G J J
471 (pF) 470 G G J J
681 680 G G J J
102 1000 G G J J
152 1500 G G J J J J
222 2200 G G J J J J
332 3300 G G J J J J
472 4700 G G J J J J
682 6800 G G J J J J
103 Cap 0.01 G G J J J J
153 (μF) 0.015 G G J J J J J
223 0.022 G G J J J J J
333 0.033 G G J J N J J
473 0.047 G G J J N J J
683 0.068 G G J J J J
104 0.1 G G J J J M
154 0.15 J N J J J Q
224 0.22 N N J J J Q
334 0.33 N J M P Q
474 0.47 N M M P
684 0.68 M
105 1 M
WVDC
25V 50V 100V 25V 50V 100V 16V 25V 50V 100V
SIZE 0603 0805 1206
= AEC-Q200
Qualified
X8R X8L
LEAD-FREE COMPATIBLE
COMPONENT
15
X8R/X8L Dielectric
General Specifications
All market sectors with a 150°C requirement
• Automotive on engine applications
• Oil exploration applications
• Hybrid automotive applications
– Battery control
– Inverter / converter circuits
– Motor control applications
– Water pump
• Hybrid commercial applications
– Emergency circuits
– Sensors
– Temperature regulation
ADVANTAGES OF X8R AND X8L MLC CAPACITORS
• Both ranges are qualified to the highest automotive
AEC-Q200 standards
• Excellent reliability compared to other capacitor
technologies
• RoHS compliant
Low ESR / ESL compared to other technologies
Tin solder finish
• FLEXITERM®available
Epoxy termination for hybrid available
100V range available
-50.00
-40.00
-30.00
-20.00
-10.00
0.00
10.00
-55 -35 -15 0 20 25 35 45 65 85 105 125 130 135 140 150
Cap change
%
Temperature (°C)
X8R/X8L Dielectric
0805, 50V, X8R/X8L Typical Temperature Coefficient
X8R
X8L
ENGINEERING TOOLS FOR HIGH VOLTAGE MLC CAPACITORS
• Samples
• Technical Articles
• Application Engineering
• Application Support
APPLICATIONS FOR X8R AND X8L CAPACITORS
16
X8R/X8L Dielectric
Specifications and Test Methods
Parameter/Test X8R/X8L Specification Limits Measuring Conditions
Operating Temperature Range -55ºC to +150ºC Temperature Cycle Chamber
Capacitance Within specified tolerance Freq.: 1.0 kHz ± 10%
Dissipation Factor ≤ 2.5% for ≥ 50V DC rating Voltage: 1.0Vrms ± .2V
≤ 3.5% for 25V DC and 16V DC rating
Insulation Resistance 100,000MΩ or 1000MΩ - μF, Charge device with rated voltage for
whichever is less 120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Note: Charge device with 150% of rated
voltage for 500V devices.
Appearance No defects Deflection: 2mm
Capacitance Test Time: 30 seconds
Resistance to Variation ≤ ±12%
Flexure Dissipation Meets Initial Values (As Above)
Stresses Factor
Insulation ≥ Initial Value x 0.3
Resistance
Solderability ≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC
with fresh solder for 5.0 ± 0.5 seconds
Appearance No defects, <25% leaching of either end terminal
Capacitance
Variation ≤ ±7.5%
Dip device in eutectic solder at 260ºC for 60
Dissipation Meets Initial Values (As Above) seconds. Store at room temperature for 24 ± 2
Resistance to Factor hours before measuring electrical properties.
Solder Heat Insulation Meets Initial Values (As Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes
Capacitance
Variation ≤ ±7.5% Step 2: Room Temp ≤ 3 minutes
Dissipation Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutes
Thermal Factor
Shock Insulation Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutes
Resistance
Dielectric Meets Initial Values (As Above) Repeat for 5 cycles and measure after
Strength 24 ± 2 hours at room temperature
Appearance No visual defects
Capacitance
Variation ≤ ±12.5%
Dissipation ≤ Initial Value x 2.0 (See Above)
Load Life Factor
Insulation ≥ Initial Value x 0.3 (See Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Appearance No visual defects
Capacitance
Variation ≤ ±12.5%
Load Dissipation ≤ Initial Value x 2.0 (See Above)
Humidity Factor
Insulation ≥ Initial Value x 0.3 (See Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Charge device with 1.5 rated voltage (≤ 10V) in
test chamber set at 150ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
1mm/sec
90 mm
17
X7R Dielectric
General Specifications
X7R formulations are called “temperature stable” ceramics and
fall into EIA Class II materials. X7R is the most popular of these
intermediate dielectric constant materials. Its temperature varia-
tion of capacitance is within ±15% from -55°C to +125°C. This
capacitance change is non-linear.
Capacitance for X7R varies under the influence of electrical op-
erating conditions such as voltage and frequency.
X7R dielectric chip usage covers the broad spectrum of
industrial applications where known changes in capacitance
due to applied voltages are acceptable.
PART NUMBER (see page 2 for complete part number explanation)
% Cap Change
10
-60 -40 -20 0 20 40 60 80 100 120 140
Temperature °C
X7R Dielectric�
Typical Temperature Coefficient
5
0
-5
-10
-15
-20
-25
% Capacitance
+10
+20
+30
0
-10
-20
-30
1KHz 10 KHz 100 KHz 1 MHz 10 MHz
Frequency
Capacitance vs. Frequency
Insulation Resistance (Ohm-Farads)
1,000
10,000
100
0020 120
40 60 80
Temperature °C
Insulation Resistance vs Temperature
100
Impedance,
10 100 1000
Frequency, MHz
Variation of Impedance with Cap Value�
Impedance vs. Frequency�
1,000 pF vs. 10,000 pF - X7R�
0805�
0.10
0.01
1.00
1,000 pF
10,000 pF
10.00
Impedance,
110
100 1,000
Frequency, MHz
Variation of Impedance with Chip Size�
Impedance vs. Frequency�
100,000 pF - X7R�
0.1
.01
1.0
1206
0805
10
1210
Impedance,
110
100 1,000
Frequency, MHz
Variation of Impedance with Chip Size�
Impedance vs. Frequency�
10,000 pF - X7R�
0.1
.01
1.0
1206
0805
10
1210
0805
Size
(L" x W")
5
Voltage
4V = 4
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
500V = 7
C
Dielectric
X7R = C
103
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
M
Capacitance
Tolerance
J = ± 5%*
K = ±10%
M = ± 20%
*≤1μF only,
contact factory for
additional values
2
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Bulk Cass.
9 = Bulk
Contact
Factory For
Multiples
A
Special
Code
A = Std. Product
T
Terminations
T = Plated Ni
and Sn
7 = Gold Plated*
Z= FLEXITERM®**
A
Failure
Rate
A = Not
Applicable
*Optional termination
**See FLEXITERM®
X7R section
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values.
18
X7R Dielectric
Specifications and Test Methods
Parameter/Test X7R Specification Limits Measuring Conditions
Operating Temperature Range -55ºC to +125ºC Temperature Cycle Chamber
Capacitance Within specified tolerance
≤ 2.5% for ≥ 50V DC rating Freq.: 1.0 kHz ± 10%
Dissipation Factor ≤ 3.0% for 25V DC rating Voltage: 1.0Vrms ± .2V
≤ 3.5% for 25V and 16V DC rating
≤ 5.0% for ≤ 10V DC rating
Insulation Resistance 100,000MΩ or 1000MΩ - μF, Charge device with rated voltage for
whichever is less 120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Note: Charge device with 150% of rated
voltage for 500V devices.
Appearance No defects Deflection: 2mm
Capacitance Test Time: 30 seconds
Resistance to Variation ≤ ±12%
Flexure Dissipation Meets Initial Values (As Above)
Stresses Factor
Insulation ≥ Initial Value x 0.3
Resistance
Solderability ≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC
with fresh solder for 5.0 ± 0.5 seconds
Appearance No defects, <25% leaching of either end terminal
Capacitance
Variation ≤ ±7.5%
Dip device in eutectic solder at 260ºC for 60
Dissipation Meets Initial Values (As Above) seconds. Store at room temperature for 24 ± 2
Resistance to Factor hours before measuring electrical properties.
Solder Heat Insulation Meets Initial Values (As Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes
Capacitance
Variation ≤ ±7.5% Step 2: Room Temp ≤ 3 minutes
Dissipation Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutes
Thermal Factor
Shock Insulation Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutes
Resistance
Dielectric Meets Initial Values (As Above) Repeat for 5 cycles and measure after
Strength 24 ± 2 hours at room temperature
Appearance No visual defects
Capacitance
Variation ≤ ±12.5%
Dissipation ≤ Initial Value x 2.0 (See Above)
Load Life Factor
Insulation ≥ Initial Value x 0.3 (See Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Appearance No visual defects
Capacitance
Variation ≤ ±12.5%
Load Dissipation ≤ Initial Value x 2.0 (See Above)
Humidity Factor
Insulation ≥ Initial Value x 0.3 (See Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Charge device with 1.5 rated voltage (≤ 10V) in
test chamber set at 125ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
1mm/sec
90 mm
19
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE 0201 0402 0603 0805 1206
Soldering Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave
Packaging All Paper All Paper All Paper Paper/Embossed Paper/Embossed
(L) Length mm 0.60 ± 0.03 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20
(in.) (0.024 ± 0.001) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008)
(W) Width mm 0.30 ± 0.03 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
(in.) (0.011 ± 0.001) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008)
(t) Terminal mm 0.15 ± 0.05 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25
(in.) (0.006 ± 0.002) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 10 16 25 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500
Cap 100 A A A
(pF) 150 A A A
220 A A A C
330 AAA C GGG JJJJJJ K
470 AA C GGG JJJJJJ K
680 AA C GGG JJJJJJ K
1000 A A C G G G JJJJJJ K
1500 A C G G JJJJJJ JJJJJJM
2200 A C G G JJJJJJ JJJJJJM
3300 A C C G G JJJJJJ JJJJJJM
4700 A C C G G JJJJJJ JJJJJJM
6800 A C C G G JJJJJJ JJJJJJP
Cap 0.010 A C C G G JJJJJJ JJJJJJP
(μF 0.015 C G G JJJJJJ JJJJJM
0.022 C G G JJJJJN JJJJJM
0.033 G G JJJJN JJJJJM
0.047 G G G JJJJN JJJJJM
0.068 G G G JJJJN JJJJJP
0.10 C GGGG JJJJN JJJJMP
0.15 G G J J J N N JJJJQ
0.22 G G J* J J N N N JJJJQ
0.33 NNNNN J JMPQ
0.47 J* NNNNN MMMPQ
0.68 NNN MMQQQ
1.0 J* J* N N N M M Q Q Q
1.5 PQQ
2.2 J* P* Q Q Q
3.3
4.7 P* P* Q* Q* Q*
10 P* Q* Q*
22 Q*
47
100
WVDC 10 16 25 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500
SIZE 0201 0402 0603 0805 1206
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
*Optional Specifications – Contact factory
20
X7R Dielectric
Capacitance Range
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
PREFERRED SIZES ARE SHADED
SIZE 1210 1812 1825 2220 2225
Soldering Reflow Only Reflow Only Reflow Only Reflow Only Reflow Only
Packaging Paper/Embossed All Embossed All Embossed All Embossed All Embossed
(L) Length mm 3.20 ± 0.20 4.50 ± 0.30 4.50 ± 0.30 5.70 ± 0.40 5.72 ± 0.25
(in.) (0.126 ± 0.008) (0.177 ± 0.012) (0.177 ± 0.012) (0.225 ± 0.016) (0.225 ± 0.010)
(W) Width mm 2.50 ± 0.20 3.20 ± 0.20 6.40 ± 0.40 5.00 ± 0.40 6.35 ± 0.25
(in.) (0.098 ± 0.008) (0.126 ± 0.008) (0.252 ± 0.016) (0.197 ± 0.016) (0.250 ± 0.010)
(t) Terminal mm 0.50 ± 0.25 0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39 0.64 ± 0.39
(in.) (0.020 ± 0.010) (0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015) (0.025 ± 0.015)
WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 25 50 100 200 50 100
Cap 100
(pF) 150
220
330
470
680
1000
1500 JJJJJJM
2200 JJJJJJM
3300 JJJJJJM
4700 JJJJJJM
6800 JJJJJJM
Cap 0.010 JJJJJJMKKKKMM XXXMP
(μF 0.015 JJJJJJPKKKPMM XXXMP
0.022 JJJJJJQKKKPMM XXXMP
0.033 JJJJJJQKKKXMM XXXMP
0.047 JJJJJJ KKKZMM XXXMP
0.068 JJJJJM KKKZMM XXXMP
0.10 JJJJJM KKKZMM XXXMP
0.15 JJJJMZ KKP MM XXXMP
0.22 JJJJPZ KKP MM XXXMP
0.33 JJJJQ KMX MM XXXMP
0.47 MMMMQ K P MM X X X M P
0.68 M M P X X M Q M P X X M P
1.0NNPXZMXMPXXMP
1.5NNZZZ ZZ M XX MX
2.2XXZZZ ZZ XX M
3.3XXZZ Z XZ
4.7XXZZ Z XZ
10 Z Z Z* Z
22 Z* Z* Z
47
100
WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 25 50 100 200 50 100
SIZE 1210 1812 1825 2220 2225
L
W
T
t
*Optional Specifications – Contact factory
21
X7S formulations are called “temperature stable” ceramics and
fall into EIA Class II materials. Its temperature variation of
capacitance s within ±22% from –55°C to +125°C. This
capacitance change is non-linear.
Capacitance for X7S varies under the influence of electrical
operating conditions such as voltage and frequency.
X7S dielectric chip usage covers the broad spectrum of
industrial applications where known changes in capacitance due
to applied voltages are acceptable.
X7S Dielectric
General Specifications
PART NUMBER (see page 2 for complete part number explanation)
GENERAL DESCRIPTION
TYPICAL ELECTRICAL CHARACTERISTICS
1206
Size
(L" x W")
Z
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
2 = 200V
Z
Dielectric
Z = X7S
105
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
M
Capacitance
Tolerance
K = ±10%
M = ±20%
A
Failure
Rate
A = N/A
T
Terminations
T = Plated Ni
and Sn
2
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Bulk Cass.
A
Special
Code
A = Std.
Product
% Capacitance
+10
+20
+30
0
-10
-20
-30
1KHz 10 KHz 100 KHz 1 MHz 10 MHz
Frequency
Capacitance vs. Frequency
Insulation Resistance (Ohm-Farads)
1,000
10,000
100
0020 120
40 60 80
Temperature °C
Insulation Resistance vs Temperature
100
Impedance,
10 100 1000
Frequency, MHz
Variation of Impedance with Cap Value
Impedance vs. Frequency
1,000 pF vs. 10,000 pF - X7S
0805
0.10
0.01
1.00
1,000 pF
10,000 pF
10.00
Impedance,
110
100 1,000
Frequency, MHz
Variation of Impedance with Chip Size
Impedance vs. Frequency
100,000 pF - X7S
0.1
.01
1.0
1206
0805
10
1210
Impedance,
110
100 1,000
Frequency, MHz
Variation of Impedance with Chip Size
Impedance vs. Frequency
10,000 pF - X7S
0.1
.01
1.0
1206
0805
10
1210
10
5
0
-5
-10
-15
-20
-25 -60 -40 -20 0 20 40
Temperature (°C)
% Cap Change
60 80 100 120 140
X7S Dielectric
Typical Temperature Coefficient
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
LEAD-FREE COMPATIBLE
COMPONENT
22
X7S Dielectric
Specifications and Test Methods
Parameter/Test X7S Specification Limits Measuring Conditions
Operating Temperature Range -55ºC to +125ºC Temperature Cycle Chamber
Capacitance Within specified tolerance
≤ 2.5% for ≥ 50V DC rating Freq.: 1.0 kHz ± 10%
Dissipation Factor ≤ 3.0% for 25V DC rating Voltage: 1.0Vrms ± .2V
≤ 3.5% for 16V DC rating For Cap > 10 μF, 0.5Vrms @ 120Hz
≤ 5.0% for ≤ 10V DC rating
Insulation Resistance 100,000MΩ or 1000MΩ - μF, Charge device with rated voltage for
whichever is less 120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Appearance No defects Deflection: 2mm
Capacitance Test Time: 30 seconds
Resistance to Variation ≤ ±12%
Flexure Dissipation Meets Initial Values (As Above)
Stresses Factor
Insulation ≥ Initial Value x 0.3
Resistance
Solderability ≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC
with fresh solder for 5.0 ± 0.5 seconds
Appearance No defects, <25% leaching of either end terminal
Capacitance
Variation ≤ ±7.5%
Dip device in eutectic solder at 260ºC for 60
Dissipation Meets Initial Values (As Above) seconds. Store at room temperature for 24 ± 2
Resistance to Factor hours before measuring electrical properties.
Solder Heat Insulation Meets Initial Values (As Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes
Capacitance
Variation ≤ ±7.5% Step 2: Room Temp ≤ 3 minutes
Dissipation Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutes
Thermal Factor
Shock Insulation Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutes
Resistance
Dielectric Meets Initial Values (As Above) Repeat for 5 cycles and measure after
Strength 24 ± 2 hours at room temperature
Appearance No visual defects
Capacitance
Variation ≤ ±12.5%
Dissipation ≤ Initial Value x 2.0 (See Above)
Load Life Factor
Insulation ≥ Initial Value x 0.3 (See Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Appearance No visual defects
Capacitance
Variation ≤ ±12.5%
Load Dissipation ≤ Initial Value x 2.0 (See Above)
Humidity Factor
Insulation ≥ Initial Value x 0.3 (See Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Charge device with 1.5 rated voltage (≤ 10V) in
test chamber set at 125ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
1mm/sec
90 mm
23
X7S Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE 0402 0603 0805 1206 1210
Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Reflow Only
Packaging All Paper All Paper Paper/Embossed Paper/Embossed Paper/Embossed
(L) Length mm 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20
(in.) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008)
(W) Width mm 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20
(in.) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008)
(t) Terminal mm 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25 0.50 ± 0.25
(in.) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 6.3 6.3 25 4 6.3 10 6.3
Cap 100
(pF) 150
220
330
470
680
1000
1500
2200
3300
4700
6800
Cap 0.010
(μF 0.015
0.022
0.033 C
0.047 C
0.068 C
0.10 C
0.15
0.22 G
0.33 G
0.47 G
0.68 G
1.0 G
1.5 N Q
2.2 N Q
3.3 N Q
4.7 N Q Q
10
22 Z
47
100
WVDC 6.3 6.3 25 4 6.3 10 6.3
SIZE 0402 0603 0805 1206 1210
L
W
T
t
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
24
• General Purpose Dielectric for Ceramic Capacitors
• EIA Class II Dielectric
• Temperature variation of capacitance is within ±15%
from -55°C to +85°C
• Well suited for decoupling and filtering applications
• Available in High Capacitance values (up to 100μF)
X5R Dielectric
General Specifications
PART NUMBER (see page 2 for complete part number explanation)
GENERAL DESCRIPTION
% Capacitance
-60 -40 -20 0 +20 +40 +60 +80
Temperature °C
Temperature Coefficient
20
15
10
5
0
-5
-10
-15
-20
TYPICAL ELECTRICAL CHARACTERISTICS
Insulation Resistance (Ohm-Farads)
1,000
10,000
100
0
Insulation Resistance vs Temperature
020 120
40 60 80
Temperature °C100
1210
Size
(L" x W")
4
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
D = 35V
5 = 50V
D
Dielectric
D = X5R
107
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
M
Capacitance
Tolerance
K = ±10%
M = ±20%
A
Failure
Rate
A = N/A
T
Terminations
T = Plated Ni
and Sn
2
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Bulk Cass.
9 = Bulk
U = 4mm TR
(01005)
A
Special
Code
A = Std.
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values. LEAD-FREE COMPATIBLE
COMPONENT
25
X5R Dielectric
Specifications and Test Methods
Parameter/Test X5R Specification Limits Measuring Conditions
Operating Temperature Range -55ºC to +85ºC Temperature Cycle Chamber
Capacitance Within specified tolerance
≤ 2.5% for ≥ 50V DC rating Freq.: 1.0 kHz ± 10%
Dissipation Factor ≤ 3.0% for 25V DC rating Voltage: 1.0Vrms ± .2V
≤ 12.5% Max. for 16V DC rating and lower For Cap > 10 μF, 0.5Vrms @ 120Hz
Contact Factory for DF by PN
Insulation Resistance 10,000MΩ or 500MΩ - μF, Charge device with rated voltage for
whichever is less 120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Appearance No defects Deflection: 2mm
Capacitance Test Time: 30 seconds
Resistance to Variation ≤ ±12%
Flexure Dissipation Meets Initial Values (As Above)
Stresses Factor
Insulation ≥ Initial Value x 0.3
Resistance
Solderability ≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC
with fresh solder for 5.0 ± 0.5 seconds
Appearance No defects, <25% leaching of either end terminal
Capacitance
Variation ≤ ±7.5%
Dip device in eutectic solder at 260ºC for 60
Dissipation Meets Initial Values (As Above) seconds. Store at room temperature for 24 ± 2
Resistance to Factor hours before measuring electrical properties.
Solder Heat Insulation Meets Initial Values (As Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes
Capacitance
Variation ≤ ±7.5% Step 2: Room Temp ≤ 3 minutes
Dissipation Meets Initial Values (As Above) Step 3: +85ºC ± 2º 30 ± 3 minutes
Thermal Factor
Shock Insulation Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutes
Resistance
Dielectric Meets Initial Values (As Above) Repeat for 5 cycles and measure after
Strength 24 ± 2 hours at room temperature
Appearance No visual defects
Capacitance
Variation ≤ ±12.5%
Dissipation ≤ Initial Value x 2.0 (See Above)
Load Life Factor
Insulation ≥ Initial Value x 0.3 (See Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Appearance No visual defects
Capacitance
Variation ≤ ±12.5%
Load Dissipation ≤ Initial Value x 2.0 (See Above)
Humidity Factor
Insulation ≥ Initial Value x 0.3 (See Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Charge device with 1.5X rated voltage in
test chamber set at 85ºC ± 2ºC for 1000 hours
(+48, -0). Note: Contact factory for *optional
specification part numbers that are tested at
< 1.5X rated voltage.
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
1mm/sec
90 mm
26
X5R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE 0101* 0201 0402 0603 0805 1206 1210 1812
Soldering Reflow Only Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Reflow Only Reflow Only
Packaging All Paper All Paper All Paper All Paper Paper/Embossed Paper/Embossed Paper/Embossed All Embossed
(L) Length mm 0.40 ± 0.02 0.60 ± 0.03 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20 4.50 ± 0.30
(in.) (0.016 ± 0.0008) (0.024 ± 0.001) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.177 ± 0.012)
(W) Width mm 0.20 ± 0.02 0.30 ± 0.03 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20 3.20 ± 0.20
(in.) (0.008 ± 0.0008) (0.011 ± 0.001) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.126 ± 0.008)
(t) Terminal mm 0.10 ± 0.04 0.15 ± 0.05 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25 0.50 ± 0.25 0.61 ± 0.36
(in.) (0.004 ± 0.016) (0.006 ± 0.002) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010) (0.020 ± 0.010) (0.024 ± 0.014)
WVDC 6.3 4 6.3 10 16 25 4 6.3 10 16 25 50 4 6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 6.3 10 25 50
Cap 100 A
(pF) 150 A
220 A C
330 A C
470 A C
680 A C
1000 B A A C
1500 A C
2200 A A C
3300 A C
4700 A C G
6800 A C G
Cap 0.010 B A C G
(μF) 0.015 C G G G
0.022 A
*
CC GGG N
0.033 C G G G N
0.047 A
*
CC GGG N
0.068 C G G N
0.10 A
*
CCC G G N N
0.15 GNN
0.22 A
*
A
*
C
*
GG NN Q
0.33 GG N
0.47 C
*
C
*
GNQQ X
0.68 GN
1.0 C
*
C
*
C
*
GGGJ
*
NN P* QQ XXX
1.5
2.2 C
*
C
*
G
*
G
*
J
*
J
*
NNN QQ Z X
3.3 J
*
J
*
J
*
J
*
NN QQ
4.7 E
*
J
*
J
*
J
*
NNN
*
N* QQQQ QZ
10 KJ
*
N
*
N
*
N
**
QQQQ
*
XZZ
*
ZZ
22 N*
*
Q
*
Q
*
Q
*
ZZZZ
*
47 *Q
*
Z
*
100 Z
*
Z*
WVDC 4 6.3 10 16 25 4 6.3 10 16 25 50 4 6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 6.3 10 25 50
SIZE 0101* 0201 0402 0603 0805 1206 1210 1812
= Under Development
= *Optional Specifications Contact factory
L
W
T
t
NOTE: Contact factory for non-specified capacitance values
*EIA 01005
Letter ABCEGJKMNPQXYZ
Max. 0.33 0.22 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.009) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
27
Y5V Dielectric
General Specifications
Y5V formulations are for general-purpose use in a limited
temperature range. They have a wide temperature
characteristic of +22% –82% capacitance change over the
operating temperature range of –30°C to +85°C.
These characteristics make Y5V ideal for decoupling
applications within limited temperature range.
0805
Size
(L" x W")
3
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
G
Dielectric
Y5V = G
104
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Z
Capacitance
Tolerance
Z = +80 –20%
A
Failure
Rate
A = Not
Applicable
T
Terminations
T = Plated Ni
and Sn
2
Packaging
2 = 7" Reel
4 = 13" Reel
A
Special
Code
A = Std.
Product
PART NUMBER (see page 2 for complete part number explanation)
% Capacitance
+20
+10
0
-55 -35 -15 +5 +25 +45 +65 +85 +105 +125
Temperature °C
Temperature Coefficient
-60
-50
-40
-30
-20
-10
-70
-80
c/c (%)
+20
+40
0
0% DC Bias Voltage
Capacitance Change�
vs. DC Bias Voltage
-60
-40
-20
-100
-80
20 40 60 80 100
Insulation Resistance (Ohm-Farads)
1,000
10,000
100
0+20 +30 +40 +60+50 +70 +80 +90
Temperature °C
Insulation Resistance vs. Temperature
|Z| (Ohms)
10,000
1,000
10,000 Frequency (Hz)
0.1 F - 0603�
Impedance vs. Frequency
1
10
100
0.01
0.1
100,000 1,000,000 10,000,000
|Z| (Ohms)
1,000
10,000 Frequency (Hz)
0.22 F - 0805�
Impedance vs. Frequency
1
10
100
0.01
0.1
100,000 1,000,000 10,000,000
|Z| (Ohms)
1,000
10,000 Frequency (Hz)
1 F - 1206�
Impedance vs. Frequency
1
10
100
0.01
0.1
100,000 1,000,000 10,000,000
LEAD-FREE COMPATIBLE
COMPONENT
28
Y5V Dielectric
Specifications and Test Methods
Parameter/Test Y5V Specification Limits Measuring Conditions
Operating Temperature Range -30ºC to +85ºC Temperature Cycle Chamber
Capacitance Within specified tolerance
≤ 5.0% for ≥ 50V DC rating Freq.: 1.0 kHz ± 10%
Dissipation Factor ≤ 7.0% for 25V DC rating Voltage: 1.0Vrms ± .2V
≤ 9.0% for 16V DC rating For Cap > 10 μF, 0.5Vrms @ 120Hz
≤ 12.5% for ≤ 10V DC rating
Insulation Resistance 10,000MΩ or 500MΩ - μF, Charge device with rated voltage for
whichever is less 120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Appearance No defects Deflection: 2mm
Capacitance Test Time: 30 seconds
Resistance to Variation ≤ ±30%
Flexure Dissipation Meets Initial Values (As Above)
Stresses Factor
Insulation ≥ Initial Value x 0.1
Resistance
Solderability ≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC
with fresh solder for 5.0 ± 0.5 seconds
Appearance No defects, <25% leaching of either end terminal
Capacitance
Variation ≤ ±20%
Dip device in eutectic solder at 260ºC for 60
Dissipation Meets Initial Values (As Above) seconds. Store at room temperature for 24 ± 2
Resistance to Factor hours before measuring electrical properties.
Solder Heat Insulation Meets Initial Values (As Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Appearance No visual defects Step 1: -30ºC ± 2º 30 ± 3 minutes
Capacitance
Variation ≤ ±20% Step 2: Room Temp ≤ 3 minutes
Dissipation Meets Initial Values (As Above) Step 3: +85ºC ± 2º 30 ± 3 minutes
Thermal Factor
Shock Insulation Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutes
Resistance
Dielectric Meets Initial Values (As Above) Repeat for 5 cycles and measure after
Strength 24 ±2 hours at room temperature
Appearance No visual defects
Capacitance
Variation ≤ ±30%
Dissipation ≤ Initial Value x 1.5 (See Above)
Load Life Factor
Insulation ≥ Initial Value x 0.1 (See Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Appearance No visual defects
Capacitance
Variation ≤ ±30%
Load Dissipation ≤ Initial Value x 1.5 (See above)
Humidity Factor
Insulation ≥ Initial Value x 0.1 (See Above)
Resistance
Dielectric Meets Initial Values (As Above)
Strength
Charge device with twice rated voltage in
test chamber set at 85ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
1mm/sec
90 mm
29
Y5V Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE 0201 0402 0603 0805 1206 1210
Soldering
Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Reflow Only
Packaging
All Paper All Paper All Paper Paper/Embossed Paper/Embossed Paper/Embossed
(L) Length mm 0.60 ± 0.03 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20
(in.) (0.024 ± 0.001) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008)
(W) Width mm 0.30 ± 0.03 0.50 ± 0.10 .81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20
(in.) (0.011 ± 0.001) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008)
(t) Terminal mm 0.15 ± 0.05 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25 .50 ± 0.25
(in.) (0.006 ± 0.002) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 6.3 10 6 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50
Cap 820
(pF) 1000 A
2200 A
4700 A
Cap 0.010 A A
(μF) 0.022 A
0.047 A C
0.10 C C G G K
0.22 G
0.33 G
0.47 C G G
1.0 C C G G N N N M M M N
2.2 C N
4.7 NPNN
10.0 NQQXQQ
22.0 QX
47.0
WVDC 6.3 10 6 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50
SIZE 0201 0402 0603 0805 1206 1210
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
L
W
T
t
30
* Contact factory for availability.
MLCC Gold Termination – AU Series
General Specifications
AVX Corporation will support those customers for
commercial and military Multilayer Ceramic Capacitors with
a termination consisting of Gold. This termination is
indicated by the use of a “7” or “G” in the 12th position of
the AVX Catalog Part Number. This fulfills AVX’s
commitment to providing a full range of products to our
customers. Please contact the factory if you require
additional information on our MLCC Gold Termination.
AU03
Size
AU01 - 0201
AU02 - 0402
AU03 - 0603
AU05 - 0805
AU06 - 1206
AU10 - 1210
AU12 - 1812
AU13 - 1825
AU14 - 2225
AU16 - 0306
AU17 - 0508
AU18 - 0612
Y
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
35V = D
50V = 5
100V = 1
200V = 2
500V = 7
C
Dielectric
C0G (NP0) = A
X7R = C
X5R = D
104
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
K
Capacitance
Tolerance
B = ±.10 pF (<10pF)
C = ±.25 pF (<10pF)
D = ±.50 pF (<10pF)
F = ±1% (≥ 10 pF)
G = ±2% (≥ 10 pF)
J = ±5%
K = ±10%
M = ±20%
A
Failure
Rate
A = Not
Applicable
72
Packaging
2 = 7" Reel
4 = 13" Reel
9 = Bulk
U = 4mm TR
(01005)
Contact
Factory
For
Multiples*
A
Special
Code
A = Std.
Product
PART NUMBER
Terminations
G* = 1.9 μ" to
7.87 μ"
7 = 100 μ"
minimum
LEAD-FREE COMPATIBLE
COMPONENT
31
MLCC Gold Termination – AU Series
Capacitance Range (NP0 Dielectric)
PREFERRED SIZES ARE SHADED
SIZE AU01 AU02 AU03 AU05 AU06
Soldering Reflow/Epoxy/ Reflow/Epoxy/ Reflow/Epoxy/ Reflow/Epoxy/ Reflow/Epoxy/
Wire Bond* Wire Bond* Wire Bond Wire Bond Wire Bond
Packaging All Paper All Paper All Paper Paper/Embossed Paper/Embossed
(L) Length mm 0.60 ± 0.03 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20
(in.) (0.024 ± 0.001 (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008)
(W) Width mm 0.30 ± 0.03 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
(in.) (0.011 ± 0.001) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008)
(t) Terminal mm 0.15 ± 0.05 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25
(in.) (0.006 ± 0.002) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 16 25 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500
Cap 0.5 A A C C C G G G G J J J J J J J J J J J
(pF) 1.0 A A C C C G G G G J J J J J J J J J J J
1.2AACCCGGGG JJJJ JJ JJJJJ
1.5AACCCGGGG JJJJ JJ JJJJJ
1.8AACCCGGGG JJJJ JJ JJJJJ
2.2AACCCGGGG JJJJ JJ JJJJJ
2.7AACCCGGGG JJJJ JJ JJJJJ
3.3AACCCGGGG JJJJ JJ JJJJJ
3.9AACCCGGGG JJJJ JJ JJJJJ
4.7AACCCGGGG JJJJ JJ JJJJJ
5.6AACCCGGGG JJJJ JJ JJJJJ
6.8AACCCGGGG JJJJ JJ JJJJJ
8.2AACCCGGGG JJJJ JJ JJJJJ
10AACCCGGGG JJJJ JJ JJJJJ
12AACCCGGGG JJJJ JJ JJJJJ
15AACCCGGGG JJJJ JJ JJJJJ
18AACCCGGGG JJJJ JJ JJJJJ
22AACCCGGGG JJJJ JJ JJJJJ
27AACCCGGGG JJJJ JJ JJJJJ
33AACCCGGGG JJJJ JJ JJJJJ
39AACCCGGGG JJJJ JJ JJJJJ
47AACCCGGGG JJJJ JJ JJJJJ
56AACCCGGGG JJJJ JJ JJJJJ
68AACCCGGGG JJJJ JJ JJJJJ
82AACCCGGGG JJJJ JJ JJJJJ
100AACCCGGGG JJJJ JJ JJJJJ
120 CCCGGGG JJJJ JJ JJJJJ
150 CCCGGGG JJJJ JJ JJJJJ
180 CCCGGGG JJJJ JJ JJJJJ
220 CCCGGGG JJJJ JJ JJJJM
270 CCCGGGG JJJJMJ JJJJM
330 CCCGGGG JJJJMJ JJJJM
390 C C C G G G J J J J M J J J J J M
470 C C C G G G J J J J M J J J J J M
560 GGG JJJJMJ JJJJM
680 G G G J J J J J J J J J P
820 G G G J J J J J J J J M
1000 G G G J J J J J J J J Q
1200 JJJ J JJJQ
1500 JJJ J JJMQ
1800 JJJ J JMM
2200 JJN J JMP
2700 JJN J JMP
3300 JJ J JMP
3900 JJ J JMP
4700 JJ J JMP
5600 JJM
6800 MM
8200 MM
Cap 0.010 MM
(μF) 0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC 16 25 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500
SIZE AU01 AU02 AU03 AU05 AU06
L
W
T
t
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
* Contact factory
32
MLCC Gold Termination – AU Series
Capacitance Range (NP0 Dielectric)
PREFERRED SIZES ARE SHADED
SIZE AU10 AU12 AU13 AU14
Soldering Reflow/Epoxy/ Reflow/Epoxy/ Reflow/Epoxy/ Reflow/Epoxy/
Wire Bond* Wire Bond* Wire Bond* Wire Bond*
Packaging Paper/Embossed All Embossed All Embossed All Embossed
(L) Length mm 3.20 ± 0.20 4.50 ± 0.30 4.50 ± 0.30 5.72 ± 0.25
(in.) (0.126 ± 0.008) (0.177 ± 0.012) (0.177 ± 0.012) (0.225 ± 0.010)
(W) Width mm 2.50 ± 0.20 3.20 ± 0.20 6.40 ± 0.40 6.35 ± 0.25
(in.) (0.098 ± 0.008) (0.126 ± 0.008) (0.252 ± 0.016) (0.250 ± 0.010)
(t) Terminal mm 0.50 ± 0.25 0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39
(in.) (0.020 ± 0.010) (0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015)
WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200
Cap 0.5
(pF) 1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10 J
12 J
15 J
18 J
22 J
27 J
33 J
39 J
47 J
56 J
68 J
82 J
100 J
120 J
150 J
180 J
220 J
270 J
330 J
390 M
470 M
560 J J J J M
680 J J J J M
820 J J J J M
1000 J J J J M K K K K M M M M M M P
1200 J J J M M K K K K M M M M M M P
1500 J J J M M K K K K M M M M M M P
1800 J J J M K K K K M M M M M M P
2200 J J J Q K K K K P M M M M M P
2700 J J J Q K K K P Q M M M M M P
3300 J J J K K K P Q M M M M M P
3900 J J M K K K P Q M M M M M P
4700 J J M K K K P Q M M M M M P
5600 J J K K M P X M M M M M P
6800 J J K K M X M M M M M P
8200 J J K M M M M M M P
Cap 0.010 J J K M M M M M M P
(μF) 0.012 J J K M M M M M P
0.015 M M M M M M Y
0.018 M M P M M M Y
0.022 M M P M Y Y
0.027 M M P P Y Y
0.033 M M P P
0.039 M M P P
0.047 M M P P
0.068 M M P
0.082 M M Q
0.1 Q
WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200
SIZE AU10 AU12 AU13 AU14
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
* Contact factory
33
PREFERRED SIZES ARE SHADED
SIZE AU02 AU03 AU05 AU06
Soldering Reflow/Epoxy Reflow/Epoxy Reflow/Epoxy Reflow/Epoxy
Wire Bond* Wire Bond* Wire Bond* Wire Bond*
Packaging All Paper All Paper Paper/Embossed Paper/Embossed
(L) Length mm 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20
(in.) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008)
(W) Width mm 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
(in.) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008)
(t) Terminal mm 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25
(in.) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500
Cap 100
(pF) 150
220 C
330 C G G G J J J J J J K
470 C G G G J J J J J J K
680 C G G G J J J J J J K
1000 C G G G J J J J J J K
1500 C G G J J J J J J J J J J J J M
2200 C G G J J J J J J J J J J J J M
3300 C C G G J J J J J J J J J J J J M
4700 C C G G J J J J J J J J J J J J M
6800 C C G G J J J J J J J J J J J J P
Cap 0.010 C G G J J J J J J J J J J J J P
(μF 0.015 C G G J J J J J J J J J J J M
0.022 C G G J J J J J N J J J J J M
0.033 G G J J J J N J J J J J M
0.047 G G G J J J J N J J J J J M
0.068 G G G J J J J N J J J J J P
0.10 C* G G G G J J J J N J J J J M P
0.15 G G J J J N N J J J J Q
0.22 G G J J N N N J J J J Q
0.33 NNNNN J J MP Q
0.47 J* N N N N N M M M P Q
0.68 NNN MM QQ Q
1.0 J* J* N N N* M M Q Q Q
1.5 PQ Q
2.2 J* P* Q Q Q
3.3
4.7 P* P* Q* Q* Q*
10 P* Q* Q*
22 Q*
47
100
WVDC 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500
SIZE AU02 AU03 AU05 AU06
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
= Under Development
MLCC Gold Termination – AU Series
Capacitance Range (X7R Dielectric)
* Contact factory
34
MLCC Gold Termination – AU Series
Capacitance Range (X7R Dielectric)
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
PREFERRED SIZES ARE SHADED
SIZE AU10 AU12 AU13 AU14
Soldering Reflow/Epoxy/ Reflow/Epoxy/ Reflow/Epoxy/ Reflow/Epoxy/
Wire Bond* Wire Bond* Wire Bond* Wire Bond*
Packaging Paper/Embossed All Embossed All Embossed All Embossed
(L) Length mm 3.20 ± 0.20 4.50 ± 0.30 4.50 ± 0.30 5.72 ± 0.25
(in.) (0.126 ± 0.008) (0.177 ± 0.012) (0.177 ± 0.012) (0.225 ± 0.010)
(W) Width mm 2.50 ± 0.20 3.20 ± 0.20 6.40 ± 0.40 6.35 ± 0.25
(in.) (0.098 ± 0.008) (0.126 ± 0.008) (0.252 ± 0.016) (0.250 ± 0.010)
(t) Terminal mm 0.50 ± 0.25 0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39
(in.) (0.020 ± 0.010) (0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015)
WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 50 100
Cap 100
(pF) 150
220
330
470
680
1000
1500 JJJJJJM
2200 JJJJJJM
3300 JJJJJJM
4700 JJJJJJM
6800 JJJJJJM
Cap 0.010 JJJJJJMKKKKMMMP
(μF 0.015 JJJJJJPKKKPMMMP
0.022 JJJJJJQKKKPMMMP
0.033 JJJJJJQKKKXMMMP
0.047 JJJJJJ KKKZMMMP
0.068 JJJJJM KKKZMMMP
0.10 JJJJJM KKKZMMMP
0.15 JJJJMZ KKP MMMP
0.22 JJJJPZ KKP MMMP
0.33 JJJJQ KMX MMMP
0.47 MMMMQ K P MMM P
0.68 M M P X X M Q MPMP
1.0NNP X Z MX MPMP
1.5NNZZZ ZZ M MX
2.2XXZZZ ZZ M
3.3XXZZ Z
4.7XXZZ Z
10ZZZ
22 Z Z
47
100
WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 50 100
SIZE AU10 AU12 AU13 AU14
L
W
T
t
* Contact factory
35
MLCC Gold Termination – AU Series
Capacitance Range (X5R Dielectric)
PREFERRED SIZES ARE SHADED
SIZE AU01 AU02 AU03 AU05 AU06 AU10 AU12
Soldering Reflow/Epoxy/ Reflow/Epoxy/ Reflow/Epoxy/ Reflow/Epoxy/ Reflow/Epoxy/ Reflow/Epoxy/
Wire Bond* Wire Bond* Wire Bond* Wire Bond* Wire Bond* Wire Bond*
Packaging All Paper All Paper All Paper Paper/Embossed Paper/Embossed Paper/Embossed
(L) Length mm 0.60 ± 0.03 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20
(in.) (0.024 ± 0.001) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008)
(W) Width mm 0.30 ± 0.03 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20
(in.) (0.011 ± 0.001) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008)
(t) Terminal mm 0.15 ± 0.05 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25 0.50 ± 0.25
(in.) (0.006 ± 0.002) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 6.3 10 16 25 4 6.3 10 16 25 50 4 6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 6.3 10 25 50
Cap 100 A A A A
(pF) 150 A A A A
220 A A A A C
330 A A A A C
470 A A A A C
680 A A A A C
1000 A A A A C
1500 A A A C
2200 A A A C
3300 A A C
4700 A A C G
6800 A A C G
Cap 0.010 A A C G
(μF) 0.015 A C G G G
0.022 A C C G G G N
0.033 A C G G G N
0.047 A C C G G G N
0.068 C G G N
0.10 A C C C C G G N N
0.15 G N N
0.22 C* G G N N Q
0.33 G G N
0.47 C* C* G N Q Q X
0.68 G N
1.0 C* C* C* G G G J* N N N N P* Q Q X X X
1.5 N
2.2 C* C* G* G* J* J* N N N N Q Q Z X
3.3 J* J* J* J* N N Q Q
4.7 E* J* J* J* N N N* N* Q Q Q Q Q Z
10 K* J* P* P* P* * Q Q Q Q* X Z Z Z
22 P* * Q* Q* Q* Z Z Z Z
47 Q* Z*
100 Z* Z*
WVDC 6.3 10 16 25 4 6.3 10 16 25 50 4 6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 6.3 10 25 50
SIZE AU01 AU02 AU03 AU05 AU06 AU10 AU12
L
W
T
t
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
= Under Development
= *Optional Specifications Contact factory
NOTE: Contact factory for non-specified capacitance values
* Contact factory
36
MLCC Gold Termination – AU Series
0612/0508/0306/Gold LICC (Low Inductance Chip Capacitors)
SIZE 0306 0508 0612
Packaging Embossed Embossed Embossed
Length mm 0.81 ± 0.15 1.27 ± 0.25 1.60 ± 0.25
(in.) (0.032 ± 0.006) (0.050 ± 0.010) (0.063 ± 0.010)
Width mm 1.60 ± 0.15 2.00 ± 0.25 3.20 ± 0.25
(in.) (0.063 ± 0.006) (0.080 ± 0.010) (0.126 ± 0.010)
WVDC 4 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50
CAP 0.001
(μF) 0.0022
0.0047
0.010
0.015
0.022
0.047
0.068
0.10
0.15
0.22
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
0306
Code Thickness
A0.61 (0.024)
0508
Code Thickness
S0.56 (0.022)
V0.76 (0.030)
A1.02 (0.040)
0612
Code Thickness
S0.56 (0.022)
V0.76 (0.030)
W1.02 (0.040)
A1.27 (0.050)
Solid = X7R = X5R
= X7S
mm (in.)
= X6S
mm (in.)mm (in.)
PHYSICAL DIMENSIONS AND
PAD LAYOUT
Wt
T
L
LW t
0612 1.60 ± 0.25 3.20 ± 0.25 0.13 min.
(0.063 ± 0.010) (0.126 ± 0.010) (0.005 min.)
0508 1.27 ± 0.25 2.00 ± 0.25 0.13 min.
(0.050 ± 0.010) (0.080 ± 0.010) (0.005 min.)
0306 0.81 ± 0.15 1.60 ± 0.15 0.13 min.
(0.032 ± 0.006) (0.063 ± 0.006) (0.005 min.)
PHYSICAL CHIP DIMENSIONS
mm (in)
“A”CC
“B”
PAD LAYOUT DIMENSIONS mm (in)
ABC
0612 0.76 (0.030) 3.05 (0.120) .635 (0.025)
0508 0.51 (0.020) 2.03 (0.080) 0.51 (0.020)
0306 0.31 (0.012) 1.52 (0.060) 0.51 (0.020)
T - See Range Chart for Thickness and Codes
37
MLCC Tin/Lead Termination “B”
General Specifications
AVX Corporation will support those customers for
commercial and military Multilayer Ceramic Capacitors with
a termination consisting of 5% minimum lead. This
termination is indicated by the use of a “B” in the 12th
position of the AVX Catalog Part Number. This fulfills AVX’s
commitment to providing a full range of products to our
customers. AVX has provided in the following pages a full
range of values that we are currently offering in this special
“B” termination. Please contact the factory if you require
additional information on our MLCC Tin/Lead Termination
“B” products.
NP0 Refer to page 4 for Electrical Graphs
X7R Refer to page 17 for Electrical Graphs
X7S Refer to page 21 for Electrical Graphs
X5R Refer to page 24 for Electrical Graphs
Y5V Refer to page 27 for Electrical Graphs
LD05
Size
LD02 - 0402
LD03 - 0603
LD04 - 0504*
LD05 - 0805
LD06 - 1206
LD10 - 1210
LD12 - 1812
LD13 - 1825
LD14 - 2225
LD20 - 2220
5
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
35V = D
50V = 5
100V = 1
200V = 2
500V = 7
A
Dielectric
C0G (NP0) = A
X7R = C
X5R = D
X8R = F
101
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
J
Capacitance
Tolerance
B = ±.10 pF (<10pF)
C = ±.25 pF (<10pF)
D = ±.50 pF (<10pF)
F = ±1% (≥ 10 pF)
G = ±2% (≥ 10 pF)
J = ±5%
K = ±10%
M = ±20%
A
Failure
Rate
A = Not
Applicable
B
Terminations
B = 5% min lead
X = FLEXITERM®
with 5% min
lead**
**X7R only
PART NUMBER (see page 2 for complete part number explanation)
*LD04 has the same CV ranges as LD03.
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values. See FLEXITERM®section
for CV options
Not RoHS Compliant
2
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Bulk Cass.
9 = Bulk
Contact Factory
For
Multiples
A
Special
Code
A = Std.
Product
38
MLCC Tin/Lead Termination “B”
Capacitance Range (NP0 Dielectric)
PREFERRED SIZES ARE SHADED
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
SIZE LD02 LD03 LD05 LD06
Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave
Packaging All Paper All Paper Paper/Embossed Paper/Embossed
(L) Length mm 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20
(in.) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008)
(W) Width mm 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
(in.) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008)
(t) Terminal mm 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25
(in.) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500
Cap 0.5 C C C G G G G J J J J J J J J J J J
(pF) 1.0 C C C G G G G J J J J J J J J J J J
1.2 C C C G G G G J J J J J J J J J J J
1.5 C C C G G G G J J J J J J J J J J J
1.8 C C C G G G G J J J J J J J J J J J
2.2 C C C G G G G J J J J J J J J J J J
2.7 C C C G G G G J J J J J J J J J J J
3.3 C C C G G G G J J J J J J J J J J J
3.9 C C C G G G G J J J J J J J J J J J
4.7 C C C G G G G J J J J J J J J J J J
5.6 C C C G G G G J J J J J J J J J J J
6.8 C C C G G G G J J J J J J J J J J J
8.2 C C C G G G G J J J J J J J J J J J
10 C C C G G G G J J J J J J J J J J J
12 C C C G G G G J J J J J J J J J J J
15 C C C G G G G J J J J J J J J J J J
18 C C C G G G G J J J J J J J J J J J
22 C C C G G G G J J J J J J J J J J J
27 C C C G G G G J J J J J J J J J J J
33 C C C G G G G J J J J J J J J J J J
39 C C C G G G G J J J J J J J J J J J
47 C C C G G G G J J J J J J J J J J J
56 C C C G G G G J J J J J J J J J J J
68 C C C G G G G J J J J J J J J J J J
82 C C C G G G G J J J J J J J J J J J
100 C C C G G G G J J J J J J J J J J J
120 C C C G G G G J J J J J J J J J J J
150 C C C G G G G J J J J J J J J J J J
180 C C C G G G G J J J J J J J J J J J
220 C C C G G G G J J J J J J J J J J M
270 C C C G G G G J J J J M J J J J J M
330 C C C G G G G J J J J M J J J J J M
390CCCGGG JJ JJMJ JJ JJM
470CCCGGG JJ JJMJ JJ JJM
560 G G G J J J J M J J J J J M
680 G G G J J J J J J J J J P
820 G G G J J J J J J J J M
1000 G G G J J J J J J J J Q
1200 JJ J JJJ JQ
1500 JJ J JJJMQ
1800 JJ J JJMM
2200 JJN JJMP
2700 JJN JJMP
3300 JJ JJMP
3900 JJ JJMP
4700 JJ JJMP
5600 JJM
6800 MM
8200 MM
Cap 0.010 MM
(μF) 0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500
SIZE LD02 LD03 LD05 LD06
L
W
T
t
39
MLCC Tin/Lead Termination “B”
Capacitance Range (NP0 Dielectric)
PREFERRED SIZES ARE SHADED
SIZE LD10 LD12 LD13 LD14
Soldering Reflow Only Reflow Only Reflow Only Reflow Only
Packaging Paper/Embossed All Embossed All Embossed All Embossed
(L) Length mm 3.20 ± 0.20 4.50 ± 0.30 4.50 ± 0.30 5.72 ± 0.25
(in.) (0.126 ± 0.008) (0.177 ± 0.012) (0.177 ± 0.012) (0.225 ± 0.010)
(W) Width mm 2.50 ± 0.20 3.20 ± 0.20 6.40 ± 0.40 6.35 ± 0.25
(in.) (0.098 ± 0.008) (0.126 ± 0.008) (0.252 ± 0.016) (0.250 ± 0.010)
(t) Terminal mm 0.50 ± 0.25 0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39
(in.) (0.020 ± 0.010) (0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015)
WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200
Cap 0.5
(pF) 1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10 J
12 J
15 J
18 J
22 J
27 J
33 J
39 J
47 J
56 J
68 J
82 J
100 J
120 J
150 J
180 J
220 J
270 J
330 J
390 M
470 M
560 J J J J M
680 J J J J M
820 J J J J M
1000 J J J J M K K K K M M M M M M P
1200 J J J M M K K K K M M M M M M P
1500 J J J M M K K K K M M M M M M P
1800 J J J M K K K K M M M M M M P
2200 J J J Q K K K K P M M M M M P
2700 J J J Q K K K P Q M M M M M P
3300 J J J K K K P Q M M M M M P
3900 J J M K K K P Q M M M M M P
4700 J J M K K K P Q M M M M M P
5600 J J K K M P X M M M M M P
6800 J J K K M X M M M M M P
8200 J J K M M M M M M P
Cap 0.010 J J K M M M M M M P
(μF) 0.012 J J K M M M M M P
0.015 M M M M M M Y
0.018 M M P M M M Y
0.022 M M P M Y Y
0.027 M M P P Y Y
0.033 M M P P
0.039 M M P P
0.047 M M P P
0.068 M M P
0.082 M M Q
0.1 Q
WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200
SIZE LD10 LD12 LD13 LD14
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
40
MLCC Tin/Lead Termination “B”
Capacitance Range (X8R Dielectric)
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
SIZE LD03 LD05 LD06
WVDC
25V 50V 25V 50V 25V 50V
271 Cap 270 G G
331 (pF) 330 G G J J
471 470 G G J J
681 680 G G J J
102 1000 G G J J J J
152 1500 G G J J J J
182 1800 G G J J J J
222 2200 G G J J J J
272 2700 G G J J J J
332 3300 G G J J J J
392 3900 G G J J J J
472 4700 G G J J J J
562 5600 G G J J J J
682 6800 G G J J J J
822 8200 G G J J J J
103 Cap 0.01 G G J J J J
123 (μF) 0.012 G G J J J J
153 0.015 G G J J J J
183 0.018 G G J J J J
223 0.022 G G J J J J
273 0.027 G G J J J J
333 0.033 G G J J J J
393 0.039 G G J J J J
473 0.047 G G J J J J
563 0.056 G N N M M
683 0.068 G N N M M
823 0.082 N N M M
104 0.1 N N M M
124 0.12 N N M M
154 0.15 N N M M
184 0.18 N M M
224 0.22 N M M
274 0.27 MM
334 0.33 MM
394 0.39 M
474 0.47 M
684 0.68
824 0.82
105 1
WVDC
25V 50V 25V 50V 25V 50V
SIZE LD03 LD05 LD06
41
PREFERRED SIZES ARE SHADED
SIZE LD02 LD03 LD05 LD06
Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave
Packaging All Paper All Paper Paper/Embossed Paper/Embossed
(L) Length mm 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20
(in.) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008)
(W) Width mm 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
(in.) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008)
(t) Terminal mm 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25
(in.) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500
Cap 100
(pF) 150
220 C
330 C G G G J J J J J J K
470 C G G G J J J J J J K
680 C G G G J J J J J J K
1000 C G G G J J J J J J K
1500 C G G J J J J J J J J J J J J M
2200 C G G J J J J J J J J J J J J M
3300 C C G G J J J J J J J J J J J J M
4700 C C G G J J J J J J J J J J J J M
6800 C C G G J J J J J J J J J J J J P
Cap 0.010 C G G J J J J J J J J J J J J P
(μF 0.015 C G G J J J J J J J J J J J M
0.022 C G G J J J J J N J J J J J M
0.033 G G J J J J N J J J J J M
0.047 G G G J J J J N J J J J J M
0.068 G G G J J J J N J J J J J P
0.10 C* G G G G J J J J N J J J J M P
0.15 G G J J J N N J J J J Q
0.22 G G J J N N N J J J J Q
0.33 NNNNN J J MP Q
0.47 J* N N N N N M M M P Q
0.68 NNN MM QQ Q
1.0 J* J* N N N* M M Q Q Q
1.5 PQ Q
2.2 J* P* Q Q Q
3.3
4.7 P* P* Q* Q* Q*
10 P* Q* Q*
22 Q*
47
100
WVDC 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500
SIZE LD02 LD03 LD05 LD06
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
= Under Development
MLCC Tin/Lead Termination “B”
Capacitance Range (X7R Dielectric)
42
MLCC Tin/Lead Termination “B”
Capacitance Range (X7R Dielectric)
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
PREFERRED SIZES ARE SHADED
SIZE LD10 LD12 LD13 LD20 LD14
Soldering Reflow Only Reflow Only Reflow Only Reflow Only Reflow Only
Packaging Paper/Embossed All Embossed All Embossed All Embossed All Embossed
(L) Length mm 3.20 ± 0.20 4.50 ± 0.30 4.50 ± 0.30 5.70 ± 0.40 5.72 ± 0.25
(in.) (0.126 ± 0.008) (0.177 ± 0.012) (0.177 ± 0.012) (0.225 ± 0.016) (0.225 ± 0.010)
(W) Width mm 2.50 ± 0.20 3.20 ± 0.20 6.40 ± 0.40 5.00 ± 0.40 6.35 ± 0.25
(in.) (0.098 ± 0.008) (0.126 ± 0.008) (0.252 ± 0.016) (0.197 ± 0.016) (0.250 ± 0.010)
(t) Terminal mm 0.50 ± 0.25 0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39 0.64 ± 0.39
(in.) (0.020 ± 0.010) (0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015) (0.025 ± 0.015)
WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 25 50 100 200 50 100
Cap 100
(pF) 150
220
330
470
680
1000
1500 JJJJJJM
2200 JJJJJJM
3300 JJJJJJM
4700 JJJJJJM
6800 JJJJJJM
Cap 0.010 JJJJJJMKKKKMM XXXMP
(μF 0.015 JJJJJJPKKKPMM XXXMP
0.022 JJJJJJQKKKPMM XXXMP
0.033 JJJJJJQKKKXMM XXXMP
0.047 JJJJJJ KKKZMM XXXMP
0.068 JJJJJM KKKZMM XXXMP
0.10 JJJJJM KKKZMM XXXMP
0.15 JJJJMZ KKP MM XXXMP
0.22 JJJJPZ KKP MM XXXMP
0.33 JJJJQ KMX MM XXXMP
0.47 MMMMQ K P MM X X X M P
0.68 M M P X X M Q M P X X M P
1.0NNPXZMXMPXXMP
1.5NNZZZ ZZ M XX MX
2.2XXZZZ ZZ XX M
3.3XXZZ Z XZ
4.7XXZZ Z XZ
10ZZZ Z
22 Z Z Z
47
100
WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 25 50 100 200 50 100
SIZE LD10 LD12 LD13 LD20 LD14
L
W
T
t
43
MLCC Tin/Lead Termination “B”
Capacitance Range (X5R Dielectric)
PREFERRED SIZES ARE SHADED
SIZE LD02 LD03 LD05 LD06 LD10 LD12
Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave
Packaging All Paper All Paper Paper/Embossed Paper/Embossed Paper/Embossed
(L) Length mm 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20
(in.) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008)
(W) Width mm 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20
(in.) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008)
(t) Terminal mm 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25 0.50 ± 0.25
(in.) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 4 6.3 10 16 25 50 4 6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 6.3 10 25 50
Cap 100
(pF) 150
220 C
330 C
470 C
680 C
1000 C
1500 C
2200 C
3300 C
4700 C G
6800 C G
Cap 0.010 C G
(μF) 0.015 C G G G
0.022 C C G G G N
0.033 C G G G N
0.047 C C G G G N
0.068 C G G N
0.10 C C C G G N N
0.15 G N N
0.22 C* G G N N Q
0.33 G G N
0.47 C* C* G N Q Q X
0.68 G N
1.0 C* C* C* G G G J* N N P* Q Q X X X
1.5
2.2 C* C* G* G* J* J* N N N Q Q Z X
3.3 J* J* J* J* N N Q Q
4.7 E* J* J* J* N N N* N* Q Q Q Q Q Z
10 K* J* N* N* N* * Q Q Q Q* X Z Z Z
22 P* * Q* Q* Q* Z Z Z Z
47 Q* Z*
100 Z* Z*
WVDC 4 6.3 10 16 25 50 4 6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 6.3 10 25 50
SIZE LD02 LD03 LD05 LD06 LD10 LD12
L
W
T
t
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
= Under Development
= *Optional Specifications Contact factory
NOTE: Contact factory for non-specified capacitance values
44
NOTE: Contact factory for availability of tolerance options for specific part numbers.
AVX introduces the LT series comprising a range of low
profile products in our X5R and X7R dielectric. X5R is a
Class II dielectric with temperature varation of
capacitance within ±15% from –55°C to +85°C. Offerings
include 0201, 0402, 0603, 0805 1206, and 1210
packages in compact, low profile designs. The LT series
is ideal for decoupling and filtering applications where
height clearance is limited.
AVX is also expanding the low profile products in our X7R
dielectric. X7R is a Class II dielectric with temperature
variation of capacitance within ±15% from -55ºC to
+125ºC. Please contact the factory for availability of any
additional values not listed.
MLCC Low Profile
General Specifications
PART NUMBER (see page 2 for complete part number explanation)
GENERAL DESCRIPTION
LT05
Size
LT01 - 0201
LT02 - 0402
LT03 - 0603
LT05 - 0805
LT06 - 1206
LT10 - 1210
Z
Voltage
4V = 4
6.3V = 6
10V = Z
16V = Y
25V = 3
D
Dielectric
X5R = D
X7R = C
475
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
K
Capacitance
Tolerance
K = ±10%
M = ±20%
A
Failure
Rate
A = Not
Applicable
T
Terminations
T = Plated Ni
and Sn
2
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Bulk Cass.
9 = Bulk
Contact
Factory
For
Multiples
S
Special
Code
See table below
Letter J ZQCS XW
Max. 0.15 0.22 0.25 0.36 0.56 0.95 1.02
Thickness (0.006) (0.009) (0.010) (0.014) (0.022) (0.038) (0.040)
PAPER
SIZE LT01 LT02 LT03 LT05 LT06 LT10
WVDC 4 4 6.3 10 16 4 6.3 16 25 6.3 10 16 25 10 16 25 16 25
Cap 104 0.10 Z Q S
(μF) 0.22 X
0.47 XX
105 1.0 C S S X X X
1.5
2.2 S S X X
4.7 SX SX WWW
106 10 X/W X X W W
22
47
WVDC 4 4 6.3 10 16 4 6.3 16 25 6.3 10 16 25 10 16 25 16 25
SIZE LT01 LT02 LT03 LT05 LT06 LT10
EMBOSSED
= X7R
LEAD-FREE COMPATIBLE
COMPONENT
45
UltraThin Ceramic Capacitors
UT023D103MAT2C
The Ultrathin (UT) series of ceramic capacitors is a new product offering from AVX. The UT
series was designed to meet the stringent thickness requirements of our customers. AVX
developed a new termination process (FCT - Fine Copper Termination) that provides
unbeatable flatness and repeatability. The series includes products < 0.35mm in height
and is targeted for applications such as Smart cards, Memory modules, High Density SIM
cards, Mobile phones, MP3 players, and embedded solutions.
HOW TO ORDER
UT
Style
Ultra
Thin
02
Case
Size
0402
3
Rated
Voltage
25V
D
Temperature
Characteristic
X5R
103
Coded
Cap
0.01μF
M
Cap
Tolerance
± 20%
A
Termination
Style
Commercial
T
Termination
100% Sn
2
Packaging
7" Reel = 15,000 pcs
13" Reel = 50,000 pcs
C
Thickness
0.30mm max
LW TBL
1.00 ± 0.10 0.50 ± 0.10 0.25 ± 0.05 0.25 ± 0.10
(0.039±0.004) (0.020 ± 0.004) (0.010 ± 0.002) (0.010 ± 0.004)
PART DIMENSIONS inches (mm)
PERFORMANCE CHARACTERISTICS
RECOMMENDED SOLDER
PAD DIMENSIONS mm (inches)
0.50
(0.020)
0.50
(0.020)
0.60
(0.024)
1.70
(0.067)
Top View
BL L
End View Side View
WL
BL
T
Capacitance Value 0.01μF
Capacitance Tolerance ±20%
Dissipation Factor Range 3.0%
Operating Temperature -55°C to +85°C
Temperature Coefficient ±15%
Rated Voltage 25V
Insulation Resistance at 25ºC and Rated Voltage 100,000 Mohms
Test Frequency 1 Vrms @ 1 KHz
% Capacitance
20
15
10
5
0
-5
-10
-15
-20-80 -60
Temperature Coefficient
Temperature ºC
-40 -20 0 20 40 60 80 100
LEAD-FREE COMPATIBLE
COMPONENT
46
GENERAL DESCRIPTION
AVX Corporation has supported the Automotive Industry requirements for
Multilayer Ceramic Capacitors consistently for more than 10 years. Products
have been developed and tested specifically for automotive applications and
all manufacturing facilities are QS9000 and VDA 6.4 approved.
As part of our sustained investment in capacity and state of the art
technology, we are now transitioning from the established Pd/Ag electrode
system to a Base Metal Electrode system (BME).
AVX is using AECQ200 as the qualification vehicle for this transition. A detailed
qualification package is available on request and contains results on a range
of part numbers including:
X7R dielectric components containing BME electrode and copper
terminations with a Ni/Sn plated overcoat.
X7R dielectric components, BME electrode with epoxy finish for conduc-
tive glue mounting.
X7R dielectric components BME electrode and soft terminations with a
Ni/Sn plated overcoat.
NP0 dielectric components containing Pd/Ag electrode and silver termina-
tion with a Ni/Sn plated overcoat.
Automotive MLCC
Automotive
HOW TO ORDER
0805
Size
0402
0603
0805
1206
1210
1812
5
Voltage
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
500V = 7
2
Packaging
2 = 7" Reel
4 = 13" Reel
A
Dielectric
NP0 = A
X7R = C
X8R = F
104
Capacitance
Code (In pF)
2 Significant
Digits + Number
of Zeros
e.g. 10μF = 106
K
Capacitance
Tolerance
F = ±1%
(≥10pF)*
G = ±2%
(≥10pF)*
J = ±5%
(≤1μF)
K = ±10%
M = ±20%
*NPO only
4
Failure Rate
4 = Automotive
A
Special Code
A = Std. Product
Commercial Automotive
Administrative Standard Part Numbers. Specific Automotive Part Number. Used to control
No restriction on who purchases these parts. supply of product to Automotive customers.
Design Minimum ceramic thickness of 0.020" Minimum Ceramic thickness of 0.029" (0.74mm)
on all X7R product.
Dicing Side & End Margins = 0.003" min Side & End Margins = 0.004" min
Cover Layers = 0.005" min
Lot Qualification As per EIA RS469 Increased sample plan –
(Destructive Physical stricter criteria.
Analysis - DPA)
Visual/Cosmetic Quality Standard process and inspection 100% inspection
Application Robustness Standard sampling for accelerated Increased sampling for accelerated wave solder on
wave solder on X7R dielectrics X7R and NP0 followed by lot by lot reliability testing.
COMMERCIAL VS AUTOMOTIVE MLCC PROCESS COMPARISON
All Tests have Accept/Reject Criteria 0/1
T
Terminations
T = Plated Ni and Sn
Z = FLEXITERM®**
U = Conductive Epoxy**
**X7R & X8R only
NOTE: Contact factory for non-specified capacitance values.
0402 case size available in T termination only.
Contact factory for availability of Tolerance Options for Specific Part Numbers.
47
FLEXITERM® FEATURES
Automotive MLCC
NP0/X7R Dielectric
a) Bend Test
The capacitor is soldered to the PC Board as shown:
Typical bend test results are shown below:
Style Conventional Term Soft Term
0603 >2mm >5
0805 >2mm >5
1206 >2mm >5
b) Temperature Cycle testing
FLEXITERM®has the ability to withstand at least 1000
cycles between –55°C and +125°C
1mm/sec
90 mm
ELECTRODE AND TERMINATION OPTIONS
X7R DIELECTRIC
NP0 DIELECTRIC
NP0 Ag/Pd Electrode
Nickel Barrier Termination
PCB Application
Figure 1 Termination Code T
X7R Dielectric
PCB Application
Figure 2 Termination Code T
X7R Nickel Electrode
Soft Termination
PCB Application
Figure 3 Termination Code Z
Sn
Ni
A
g
Cu
Epoxy
Ni
Sn
Ni
Sn
Ni
Cu
Ni
Cu
Termination
Conductive
Epoxy
Ni
Conductive Epoxy Termination
Hybrid Application
Figure 4 Termination Code U
48
Automotive MLCC - NP0
Capacitance Range
0603 0805 1206 1210 1812
25V 50V 100V 25V 50V 100V 25V 50V 100V 200V 500V 25V 50V 100V 200V 50V 100V
100 10pF G G G J J J J J J J J
120 12 G G G J J J J J J J J
150 15 G G G J J J J J J J J
180 18 G G G J J J J J J J
220 22 G G G J J J J J J J
270 27 G G G J J J J J J J
330 33 G G G J J J J J J J
390 39 G G G J J J J J J J
470 47 G G G J J J J J J J
510 51 G G G J J J J J J J
560 56 G G G J J J J J J J
680 68 G G G J J J J J J J
820 82 G G G J J J J J J J
101 100 G G G J J J J J J J
121 120 G G G J J J J J J J
151 150 G G G J J J J J J J
181 180 G G G J J J J J J J
221 220 G G G J J J J J J J
271 270 G G G J J J J J J J
331 330 G G G J J J J J J J
391 390 G G J J J J J J J
471 470 G G J J J J J J J
561 560 J J J J J J J
681 680 J J J J J J J
821 820 J J J J J J J
102 1000 J J J J J J J J J J J
122 1200 J J J J J J M M
152 1500 J M M M J J M M
182 1800 J M M M J J M M
222 2200 J M M M J J M M
272 2700 J M Q J J M
332 3300 J M Q J J P K K
392 3900 JJ P K K
472 4700 JJ P K K
103 10nF
25V 50V 100V 25V 50V 100V 25V 50V 100V 200V 500V 25V 50V 100V 200V 50V 100V
0603 0805 1206 1210 1812
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
= Under Development
49
Automotive MLCC - X7R
Capacitance Range
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
0402 0603 0805 1206 1210 1812 2220
16V 25V 50V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 500V 16V 25V 50V 100V 50V 100V 25V 50V
221 Cap .22
271 (nF) .27
331 .33
391 .39
471 .47
561 .56
681 .68
821 .82
102 1 GGGGG JJJJJJJJJJJKKKKKK
182 1.8 GGGG JJJJJJJJJJJKKKKKK
222 2.2 GGGG JJJJJJJJJJJKKKKKK
332 3.3 GGGG JJJJJJJJJJJKKKKKK
472 4.7 GGGG JJJJJJJJJJJKKKKKK
103 10 GGGG JJJJJJJJJJJKKKKKK
123 12 GGG JJJM JJJJJ KKKKKK
153 15 GGG JJJM JJJJJ KKKKKK
183 18 GGG JJJM JJJJJ KKKKKK
223 22 GGG JJJM JJJJJ KKKKKK
273 27 GGG JJJM JJJJJ KKKKKK
333 33 GGG JJJM JJJJJ KKKKKK
473 47 GGG J J JM J J JMJ KKKKKK
563 56 G G G J J J M J J J M J K K K M K K
683 68 G G G J J J M J J J M J K K K M K K
823 82 G G G J J J M J J J M J K K K M K K
104 100 G G G J J M M J J J M J K K K M K K
124 120 J J M J J M M K K K P K K
154 150 M N M J J M M K K K P K K
224 220 M N M J M M Q M M M P M M
334 330 N N M J M P Q P P P Q X X
474 470 N N M M M P Q P P P Q X X
684 680 N N M Q Q Q P P Q X X X
105 Cap 1 N N M Q Q Q P Q Q X X X
155 (μF) 1.5 QQ PQZZXX
225 2.2 QQ XZZZZZ
335 3.3 XZZ Z
475 4.7 XZZ Z
106 10 Z
226 22 Z
16V 25V 50V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 500V 16V 25V 50V 100V 50V 100V 25V 50V
0402 0603 0805 1206 1210 1812 2220
= Under Development
50
Automotive MLCC - X8R
Capacitance Range
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
SIZE 0603 0805 1206
WVDC
25V 50V 25V 50V 25V 50V
271 Cap 270 G G
331 (pF) 330 G G J J
471 470 G G J J
681 680 G G J J
102 1000 G G J J J J
152 1500 G G J J J J
182 1800 G G J J J J
222 2200 G G J J J J
272 2700 G G J J J J
332 3300 G G J J J J
392 3900 G G J J J J
472 4700 G G J J J J
562 5600 G G J J J J
682 6800 G G J J J J
822 8200 G G J J J J
103 Cap 0.01 G G J J J J
123 (μF) 0.012 G G J J J J
153 0.015 G G J J J J
183 0.018 G G J J J J
223 0.022 G G J J J J
273 0.027 G G J J J J
333 0.033 G G J J J J
393 0.039 G G J J J J
473 0.047 G G J J J J
563 0.056 G N N M M
683 0.068 G N N M M
823 0.082 N N M M
104 0.1 N N M M
124 0.12 N N M M
154 0.15 N N M M
184 0.18 N M M
224 0.22 N M M
274 0.27 MM
334 0.33 MM
394 0.39 M
474 0.47 M
684 0.68
824 0.82
105 1
WVDC
25V 50V 25V 50V 25V 50V
SIZE 0603 0805 1206
= AEC-Q200 Qualified
51
APS Series
APS for COTS+ Applications
GENERAL DESCRIPTION
As part of our continuing support to high reliability customers, AVX
has launched an Automotive Plus Series of parts (APS) qualified and manufactured
in accordance with automotive AEC-Q200 standard. Each production batch is qual-
ity tested to an enhanced requirement and shipped with a certificate of conformance.
On a quarterly basis a reliability package is issued to all APS customers.
A detailed qualification package is available on request and contains results on a
range of part numbers including:
X7R dielectric components containing BME electrode and copper terminations
with a Ni/Sn plated overcoat.
X7R dielectric components BME electrode and soft terminations with a Ni/Sn
plated overcoat (FLEXITERM®).
• X7R for Hybrid applications.
NP0 dielectric components containing Pd/Ag electrode and silver termination with
a Ni/Sn plated overcoat.
We are also able to support customers who require an AEC-Q200 grade component
finished with Tin/Lead.
HOW TO ORDER
AP03
Size
AP03=0603
AP05=0805
AP06=1206
AP10=1210
AP12=1812
5
Voltage
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
500V = 7
2
Packaging
2 = 7" Reel
4 = 13" Reel
A
Dielectric
NP0 = A
X7R = C
104
Capacitance
Code (In pF)
2 Significant Digits +
Number of Zeros
e.g. 10μF = 106
K
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
Q
Failure Rate
Q = APS
A
Special Code
A = Std. Product
T
Terminations
T = Plated Ni and Sn**
Z = FLEXITERM®**
U = Conductive Epoxy**
B = 5% min lead
X = FLEXITERM®with
5% min lead
Z, U, X for X7R only
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
**RoHS compliant
Not RoHS Compliant
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
52
NP0 Automotive Plus Series / APS
Capacitance Range
AEC-Q200 qualified
TS 16949, ISO 9001 certified
0603 0805 1206 1210 1812
25V 50V 100V 25V 50V 100V 25V 50V 100V 200V 500V 25V 50V 100V 200V 50V 100V
100 10pF G G G J J J J J J J J
120 12 G G G J J J J J J J J
150 15 G G G J J J J J J J J
180 18 G G G J J J J J J J
220 22 G G G J J J J J J J
270 27 G G G J J J J J J J
330 33 G G G J J J J J J J
390 39 G G G J J J J J J J
470 47 G G G J J J J J J J
510 51 G G G J J J J J J J
560 56 G G G J J J J J J J
680 68 G G G J J J J J J J
820 82 G G G J J J J J J J
101 100 G G G J J J J J J J
121 120 G G G J J J J J J J
151 150 G G G J J J J J J J
181 180 G G G J J J J J J J
221 220 G G G J J J J J J J
271 270 G G G J J J J J J J
331 330 G G G J J J J J J J
391 390 G G J J J J J J J
471 470 G G J J J J J J J
561 560 J J J J J J J
681 680 J J J J J J J
821 820 J J J J J J J
102 1000 J J J J J J J J J J J
122 1200 J J J J J M M
152 1500 J M M J J M M
182 1800 J M M J J M M
222 2200 J M M J J M M
272 2700 J M Q J J M
332 3300 J M Q J J P K K
392 3900 JJ P K K
472 4700 JJ P K K
103 10nF
25V 50V 100V 25V 50V 100V 25V 50V 100V 200V 500V 25V 50V 100V 200V 50V 100V
0603 0805 1206 1210 1812
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
53
X7R Automotive Plus Series / APS
Capacitance Range
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
= Under Development
0603 0805 1206 1210 1812 2220
16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 500V 16V 25V 50V 100V 50V 100V 25V 50V
102 Cap 1 GGGGGJJJJJJJJJJJKKKKKK
182 (nF) 1.8 GGGG JJJJJJJJJJJKKKKKK
222 2.2GGGG JJJJJJJJJJJKKKKKK
332 3.3GGGG JJJJJJJJJJJKKKKKK
472 4.7GGGG JJJJJJJJJJJKKKKKK
103 10GGGG JJJJJJJJJJJKKKKKK
123 12GGG J J JM J J J J J KKKKKK
153 15GGG J J JM J J J J J KKKKKK
183 18GGG J J JM J J J J J KKKKKK
223 22GGG J J JM J J J J J KKKKKK
273 27GGG J J JM J J J J J KKKKKK
333 33GGG J J JM J J J J J KKKKKK
473 47GGG J J JM J J JMJ KKKKKK
563 56 G G G J J J M J J J M J K K K M K K
683 68 G G G J J J M J J J M J K K K M K K
823 82 G G G J J J M J J J M J K K K M K K
104 100 G G G J J M M J J J M J K K K M K K
124 120 J J M J J M M K K K P K K
154 150 M N M J J M M K K K P K K
224 220 M N M J M M Q M M M P M M
334 330 N N M J M P Q P P P Q X X
474 470 N N M M M P Q P P P Q X X
684 680 N N M Q Q Q P P Q X X X
105 Cap 1 N N M Q Q Q P Q Q X X X
155(μF)1.5 QQ PQZZXX
225 2.2 QQ XZZZZZ
335 3.3 XZZ Z
475 4.7 XZZ Z
106 10 Z
226 22 Z
16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 500V 16V 25V 50V 100V 50V 100V 25V 50V
0603 0805 1206 1210 1812 2220
AEC-Q200 qualified
TS 16949, ISO 9001 certified
54
GENERAL DESCRIPTION
With increased requirements from the automotive industry for additional
component robustness, AVX recognized the need to produce a MLCC with
enhanced mechanical strength. It was noted that many components may be
subject to severe flexing and vibration when used in various under the hood
automotive and other harsh environment applications.
To satisfy the requirement for enhanced mechanical strength, AVX had to
find a way of ensuring electrical integrity is maintained whilst external forces
are being applied to the component. It was found that the structure of the
termination needed to be flexible and after much research and development,
AVX launched FLEXITERM®. FLEXITERM®is designed to enhance the
mechanical flexure and temperature cycling performance of a standard
ceramic capacitor with an X7R dielectric. The industry standard for
flexure is 2mm minimum. Using FLEXITERM®, AVX provides up to
5mm of flexure without internal cracks. Beyond 5mm, the capacitor
will generally fail “open”.
As well as for automotive applications FLEXITERM®will provide Design
Engineers with a satisfactory solution when designing PCB’s which may be
subject to high levels of board flexure.
MLCC with FLEXITERM®
General Specifications
APPLICATIONS
High Flexure Stress Circuit Boards
e.g. Depanelization: Components near edges
of board.
Variable Temperature Applications
Soft termination offers improved reliability per-
formance in applications where there is tem-
perature variation.
e.g. All kind of engine sensors: Direct
connection to battery rail.
Automotive Applications
• Improved reliability.
Excellent mechanical performance and
thermo mechanical performance.
PRODUCT ADVANTAGES
High mechanical performance able to withstand, 5mm bend test
guaranteed.
Increased temperature cycling performance, 3000 cycles and beyond.
Flexible termination system.
Reduction in circuit board flex failures.
Base metal electrode system.
Automotive or commercial grade products available.
HOW TO ORDER
0805
Style
0603
0805
1206
1210
1812
2220
5
Voltage
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
2 = 200V
2
Packaging
2 = 7" reel
4 = 13" reel
C
Dielectric
C = X7R
F = X8R
104
Capacitance
Code (In pF)
2 Sig Digits +
Number of Zeros
e.g., 104 = 100nF
K
Capacitance
Tolerance
J = ±5%*
K = ±10%
M = ±20%
*≤1μF only
A
Special Code
A = Std. Product
Z
Terminations
Z = FLEXITERM®
For FLEXITERM®
with Tin/Lead
termination see
AVX LD Series
A
Failure
Rate
A=Commercial
4 = Automotive
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
Not RoHS Compliant
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
55
MLCC with FLEXITERM®
Specifications and Test Methods
PERFORMANCE TESTING BOARD BEND TEST PROCEDURE
According to AEC-Q200
BEND TESTPLATE
CONTROL PANEL
CONNECTOR
DIGITAL
CALIPER
MOUNTING
ASSEMBLY
LOADING
KNIFE
CONTROL
PANEL
BOARD BEND TEST RESULTS
AEC-Q200 Vrs AVX FLEXITERM®Bend Test
12 0603
10
8
6
4
2
0NPO X7R X7R soft term
12 1206
Substrate Bend (mm) Substrate Bend (mm)
Substrate Bend (mm)Substrate Bend (mm)
10
8
6
4
2
0NPO X7R X7R soft term
12 0805
10
8
6
4
2
0NPO X7R X7R soft term
12 1210
10
8
6
4
2
0NPO X7R X7R soft term
TEMPERATURE CYCLE TEST PROCEDURE
1 hour 12mins
+1250 C
+250 C
-550 C
AVX ENHANCED SOFT
TERMINATION BEND TEST
PROCEDURE
Bend Test
The capacitor is soldered to the printed circuit
board as shown and is bent up to 10mm at
1mm per second:
Typical bend test results are shown below:
Style Conventional Termination FLEXITERM®
0603 >2mm >5mm
0805 >2mm >5mm
1206 >2mm >5mm
AEC-Q200 Qualification:
Created by the Automotive Electronics
Council
Specification defining stress
test qualification for
passive components
Testing:
Key tests used to compare
soft termination to
AEC-Q200 qualification:
Bend Test
Temperature Cycle Test
Test Procedure as per AEC-Q200:
The test is conducted to determine the resistance of the
component when it is exposed to extremes of alternating
high and low temperatures.
Sample lot size quantity 77 pieces
TC chamber cycle from -55ºC to +125ºC for 1000 cycles
Interim electrical measurements at 250, 500, 1000 cycles
Measure parameter capacitance dissipation factor,
insulation resistance
Test Procedure as per AEC-Q200:
Sample size: 20 components
Span: 90mm Minimum deflection spec: 2 mm
Components soldered onto FR4 PCB (Figure 1)
Board connected electrically to the test equipment
(Figure 2)
Fig 1 - PCB layout with electrical connections
Fig 2 - Board Bend test
equipment
Test Temperature Profile (1 cycle)
TABLE SUMMARY
The board is placed on 2 supports 90mm
apart (capacitor side down)
The row of capacitors is aligned with the
load stressing knife
The load is applied and the deflection where
the part starts to crack is recorded (Note:
Equipment detects the start of the crack
using a highly sensitive current detection
circuit)
The maximum deflection capability is 10mm
Max. = 10mm
Max. = 10mm
90mm
56
% Failure
10
8
6
4
2
00 500 1000 1500
0603
2000 2500 3000
% Failure
10
8
6
4
2
00 500 1000 1500
1206
2000 2500 3000
% Failure
10
8
6
4
2
00 500 1000 1500
0805
2000 2500 3000
% Failure
10
8
6
4
2
00 500 1000 1500
1210
2000
Soft Term - No Defects up to 3000 cycles
2500 3000
BEYOND 1000 CYCLES: TEMPERATURE CYCLE TEST RESULTS
AEC-Q200 specification states
1000 cycles compared to AVX
3000 temperature cycles.
MLCC with FLEXITERM®
Specifications and Test Methods
FLEXITERM® TEST SUMMARY
WITHOUT SOFT TERMINATION WITH SOFT TERMINATION
Major fear is of latent board flex failures. Far superior mechanical performance.
Generally open failure mode beyond
5mm flexure.
Qualified to AEC-Q200 test/specification with the exception
of using AVX 3000 temperature cycles (up to +150°C bend
test guaranteed greater than 5mm).
FLEXITERM®provides improved performance compared to
standard termination systems.
Board bend test improvement by a factor of 2 to 4 times.
Temperature Cycling:
– 0% Failure up to 3000 cycles
– No ESR change up to 3000 cycles
57
MLCC with FLEXITERM®
X8R Dielectric Capacitance Range
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
SIZE 0603 0805 1206
WVDC
25V 50V 25V 50V 25V 50V
271 Cap 270 G G
331 (pF) 330 G G J J
471 470 G G J J
681 680 G G J J
102 1000 G G J J J J
152 1500 G G J J J J
182 1800 G G J J J J
222 2200 G G J J J J
272 2700 G G J J J J
332 3300 G G J J J J
392 3900 G G J J J J
472 4700 G G J J J J
562 5600 G G J J J J
682 6800 G G J J J J
822 8200 G G J J J J
103 Cap 0.01 G G J J J J
123 (μF) 0.012 G G J J J J
153 0.015 G G J J J J
183 0.018 G G J J J J
223 0.022 G G J J J J
273 0.027 G G J J J J
333 0.033 G G J J J J
393 0.039 G G J J J J
473 0.047 G G J J J J
563 0.056 G N N M M
683 0.068 G N N M M
823 0.082 N N M M
104 0.1 N N M M
124 0.12 N N M M
154 0.15 N N M M
184 0.18 N M M
224 0.22 N M M
274 0.27 MM
334 0.33 MM
394 0.39 M
474 0.47 M
684 0.68
824 0.82
105 1
WVDC
25V 50V 25V 50V 25V 50V
SIZE 0603 0805 1206
= AEC-Q200 Qualified
58
MLCC with FLEXITERM®
X7R Dielectric Capacitance Range
0603 0805 1206 1210 1812 2220
16V 25V 50V 100V 200V 10V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 16V 25V 50V 100V 25V 50V 100V
101
121
151
181
221
271 J J J J J J
331JJJJ JJJJJJJ
391JJJJ JJJJJJJ
471JJJJ JJJJJJJ
561JJJJ JJJJJJJ
681JJJJ JJJJJJJ
821JJJJ JJJJJJJ
102JJJJ JJJJJJJJJJJJ
122JJJJ JJJJJJJJJJJ
152JJJJ JJJJJJJJJJJ
182JJJJ JJJJJJJJJJJ
222JJJJ JJJJJJJJJJJ
272JJJJ JJJJJJJJJJJ
332JJJJ JJJJJJJJJJJ
392JJJJ JJJJJJJJJJJ
472JJJJ JJJJJJJJJJJ
562JJJJ JJJJJJJJJJJ
682JJJJ JJJJJJJJJJJ
822JJJJ JJJJJJJJJJJ
103JJJJ JJJJJJJJJJJ
123JJJ JJJJM JJJJJ
153JJJ JJJJM JJJJJ
183JJJ JJJJM JJJJJ
223JJJ JJJJM JJJJJ K
273JJJ JJJJM JJJJJ K
333 J J J J J J J M J J J J J K
393JJJ JJJJM JJJMJ K
473JJJ JJJJM JJJMJ K
563JJJ JJJJN JJJMJKKKMKKKK
683JJJ JJJJN JJJMJKKKMKKKK
823JJJ JJJJN JJJPJKKKMKKKK
104JJJ JJJJN JJJQJKKKPKKKKXXX
124 J J J N N J J P Q K K K Q K K K K
154 M M N N N J J P Q K K K Q K K K M X X X
184 M M N N N J M P Q M M M Q K K K M
224 M M N N N J M P Q M M M Q M M M X X X X
274 N N N N N J M P Q P P P Q M M M X
334 N N N N N J M P Q P P P Q M M M X X X X
394 N N N N N M M P Q P P P Q X X X X
474 N N N N N M M P Q P P P Q X X X X X X X
564 N N N M Q Q Q P Q Q Q X X X Z
684 N N N M Q Q Q P X X X X X X Z X X X
824 N N N M Q Q Q P Z Z Z X X X Z
105 N N N M Q Q Q P Z Z Z X X X Z X X X
155 QQ PZZ Z ZZX XX
185 QQ ZZZZ ZZ
225 QQ ZZZZ ZZX XX
335 ZZZ Z Z
475 ZZZ Z Z
106 ZZ
226 Z
16V 25V 50V 100V 200V 10V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 16V 25V 50V 100V 25V 50V 100V
0603 0805 1206 1210 1812 2220
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
Not RoHS Compliant
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
59
FLEXISAFE MLC Chips
For Ultra Safety Critical Applications
AVX have developed a range of components specifically for safety
critical applications.
Utilizing the award-winning FLEXITERM™ layer in conjunction with the
cascade design previously used for high voltage MLCCs, a range of
ceramic capacitors is now available for customers who require
components designed with an industry leading set of safety features.
The FLEXITERM™ layer protects the component from any damage to
the ceramic resulting from mechanical stress during PCB assembly or
use with end customers. Board flexure type mechanical damage
accounts for the majority of MLCC failures. The addition of the cascade
structure protects the component from low insulation resistance failure
resulting from other common causes for failure; thermal stress damage,
repetitive strike ESD damage and placement damage. With the inclusion
of the cascade design structure to complement the FLEXITERM™ layer,
the FLEXISAFE range of capacitors has unbeatable safety features.
FS03
Size
FS03 = 0603
FS05 = 0805
FS06 = 1206
FS10 = 1210
5
Voltage
16V = Y
25V = 3
50V = 5
100V = 1
C
Dielectric
X7R = C
104
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
e.g. 10μF =106
K
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
HOW TO ORDER
Q
Failure
Rate
A = Commercial
4 = Automotive
Q = APS
Z
Terminations
Z = FLEXITERMTM
X = FLEXITERMTM
with 5%
min lead
2
Packaging
2 = 7" Reel
4 = 13" Reel
A
Special
Code
A = Std. Product
FLEXISAFE X7R RANGE
Capacitance 0603 0805 1206 1210
Code nF 16 25 50 100 16 25 50 16 25 50 16 25 50
102 1
182 1.8
222 2.2
332 3.3
472 4.7
103 10
123 12
153 15
183 18
223 22
273 27
333 33
473 47
563 56
683 68
823 82
104 100
124 120
154 150
224 220
334 330
474 470
Qualified In Qualification
60
Capacitor Array
Capacitor Array (IPC)
AVX capacitor arrays offer designers the opportunity to
lower placement costs, increase assembly line output
through lower component count per board and to reduce
real estate requirements.
Reduced Costs
Placement costs are greatly reduced by effectively placing
one device instead of four or two. This results in increased
throughput and translates into savings on machine time.
Inventory levels are lowered and further savings are made
on solder materials, etc.
Space Saving
Space savings can be quite dramatic when compared to
the use of discrete chip capacitors. As an example, the
0508 4-element array offers a space reduction of >40% vs.
4 x 0402 discrete capacitors and of >70% vs. 4 x 0603
discrete capacitors. (This calculation is dependent on the
spacing of the discrete components.)
Increased Throughput
Assuming that there are 220 passive components placed in a
mobile phone:
A reduction in the passive count to 200 (by replacing
discrete components with arrays) results in an increase in
throughput of approximately 9%.
A reduction of 40 placements increases throughput by 18%.
For high volume users of cap arrays using the very latest
placement equipment capable of placing 10 components per
second, the increase in throughput can be very significant and
can have the overall effect of reducing the number of place-
ment machines required to mount components:
If 120 million 2-element arrays or 40 million 4-element arrays
were placed in a year, the requirement for placement
equipment would be reduced by one machine.
During a 20Hr operational day a machine places 720K
components. Over a working year of 167 days the machine
can place approximately 120 million. If 2-element arrays are
mounted instead of discrete components, then the number
of placements is reduced by a factor of two and in the
scenario where 120 million 2-element arrays are placed there
is a saving of one pick and place machine.
Smaller volume users can also benefit from replacing
discrete components with arrays. The total number of place-
ments is reduced thus creating spare capacity on placement
machines. This in turn generates the opportunity to increase
overall production output without further investment in new
equipment.
W2A (0508) Capacitor Arrays
The 0508 4-element capacitor array gives a PCB space saving of over 40%
vs four 0402 discretes and over 70% vs four 0603 discrete capacitors.
W3A (0612) Capacitor Arrays
The 0612 4-element capacitor array gives a PCB space saving of over 50%
vs four 0603 discretes and over 70% vs four 0805 discrete capacitors.
AREA = 7.0mm2 (0.276 in2) AREA = 3.95mm2 (0.156 in2)
5.0 (0.197)
1.4
(0.055) 1.0
(0.039)
2.1 (0.083)
1.88
(0.074)
4 pcs 0402 Capacitors = 1 pc 0508 Array
AREA = 13.8mm2 (0.543 in2) AREA = 6.4mm2 (0.252 in2)
6.0 (0.236)
2.3
(0.091) 1.5
(0.059)
3.2 (0.126)
2.0
(0.079)
4 pcs 0603 Capacitors = 1 pc 0612 Array
BENEFITS OF USING CAPACITOR
ARRAYS
61
Capacitor Array
Capacitor Array (IPC)
GENERAL DESCRIPTION
AVX is the market leader in the development and manufacture of
capacitor arrays. The smallest array option available from AVX, the
0405 2-element device, has been an enormous success in the
Telecommunications market. The array family of products also
includes the 0612 4-element device as well as 0508 2-element and
4-element series, all of which have received widespread acceptance
in the marketplace.
AVX capacitor arrays are available in X5R, X7R and NP0 (C0G)
ceramic dielectrics to cover a broad range of capacitance values.
Voltage ratings from 6.3 Volts up to 100 Volts are offered. AVX
also now offers a range of automotive capacitor arrays qualified to
AEC-Q200 (see separate table).
Key markets for capacitor arrays are Mobile and Cordless Phones,
Digital Set Top Boxes, Computer Motherboards and Peripherals
as well as Automotive applications, RF Modems, Networking
Products, etc.
HOW TO ORDER
W
Style
W = RoHS
L = SnPb
2
Case
Size
1 = 0405
2 = 0508
3 = 0612
5 = 0306
A
Array
4
Number
of Caps
3
Voltage
6 = 6V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
C
Dielectric
A = NP0
C = X7R
D = X5R
103
Capacitance
Code
2 Sig Digits +
Number of
Zeros
M
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
2A
Packaging &
Quantity
Code
2A = 7" Reel
(4000)
4A = 13" Reel
(10000)
2F = 7" Reel
(1000)
A
Failure
Rate
A = Commercial
4 = Automotive
T
Termination
Code
T = Plated Ni
and Sn**
Z = FLEXITERM®**
B = 5% min lead
X = FLEXITERM®with
5% min lead
0405 - 2 Element
0508 - 2 Element
0508 - 4 Element
0612 - 4 Element
AVX Capacitor Array - W2A41A***K
S21 Magnitude
-40
-35
-30
-25
-20
-15
-10
-5
0
0.01 0.1 1 10
Frequency (GHz)
S21 mag. (dB)
5pF 10pF
15pF 22pF
33pF 39pF
68pF
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
**RoHS compliant
Not RoHS Compliant
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style
62
SIZE 0405 0508 0508 0612
# Elements 2 2 4 4
Soldering Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave
Packaging All Paper All Paper Paper/Embossed Paper/Embossed
Length mm 1.00 ± 0.15 1.30 ± 0.15 1.30 ± 0.15 1.60 ± 0.150
(in.) (0.039 ± 0.006) (0.051 ± 0.006) (0.051 ± 0.006) (0.063 ± 0.006)
Width mm 1.37 ± 0.15 2.10 ± 0.15 2.10 ± 0.15 3.20 ± 0.20
(in.) (0.054 ± 0.006) (0.083 ± 0.006) (0.083 ± 0.006) (0.126 ± 0.008)
Max. mm 0.66 0.94 0.94 1.35
Thickness (in.) (0.026) (0.037) (0.037) (0.053)
WVDC
16 25 50 16 25 50 100 16 25 50 100 16 25 50 100
1R0 Cap 1.0
1R2 (pF) 1.2
1R5 1.5
1R8 1.8
2R2 2.2
2R7 2.7
3R3 3.3
3R9 3.9
4R7 4.7
5R6 5.6
6R8 6.8
8R2 8.2
100 10
120 12
150 15
180 18
220 22
270 27
330 33
390 39
470 47
560 56
680 68
820 82
101 100
121 120
151 150
181 180
221 220
271 270
331 330
391 390
471 470
561 560
681 680
821 820
102 1000
122 1200
152 1500
182 1800
222 2200
272 2700
332 3300
392 3900
472 4700
562 5600
682 6800
822 8200
Capacitor Array
Capacitance Range – NP0/C0G
63
SIZE 0306 0405 0508 0508 0612
# Elements 4 2 2 4 4
Soldering Reflow Only Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave
Packaging All Paper All Paper All Paper Paper/Embossed Paper/Embossed
Length mm 1.60 ± 0.15 1.00 ± 0.15 1.30 ± 0.15 1.30 ± 0.15 1.60 ± 0.150
(in.) (0.063 ± 0.006) (0.039 ± 0.006) (0.051 ± 0.006) (0.051 ± 0.006) (0.063 ± 0.006)
Width mm 0.81 ± 0.15 1.37 ± 0.15 2.10 ± 0.15 2.10 ± 0.15 3.20 ± 0.20
(in.) (0.032 ± 0.006) (0.054 ± 0.006) (0.083 ± 0.006) (0.083 ± 0.006) (0.126 ± 0.008)
Max. mm 0.50 0.66 0.94 0.94 1.35
Thickness (in.) (0.020) (0.026) (0.037) (0.037) (0.053)
WVDC 6 10 16 25 6 10
16 25 50 6 10 16 25 50 100 6 10 16 25 50 100 6 10 16 25 50 100
101 Cap 100
121 (pF) 120
151 150
181 180
221 220
271 270
331 330
391 390
471 470
561 560
681 680
821 820
102 1000
122 1200
152 1500
182 1800
222 2200
272 2700
332 3300
392 3900
472 4700
562 5600
682 6800
822 8200
103 Cap 0.010
123 (μF) 0.012
153 0.015
183 0.018
223 0.022
273 0.027
333 0.033
393 0.039
473 0.047
563 0.056
683 0.068
823 0.082
104 0.10
124 0.12
154 0.15
184 0.18
224 0.22
274 0.27
334 0.33
474 0.47
564 0.56
684 0.68
824 0.82
105 1.0
125 1.2
155 1.5
185 1.8
225 2.2
335 3.3
475 4.7
106 10
226 22
476 47
107 100
Capacitor Array
Capacitance Range – X7R/X5R
= Currently available X7R
= Currently available X5R
= Under development X7R, contact factory for advance samples
= Under development X5R, contact factory for advance samples
64
Automotive Capacitor Array (IPC)
0508 - 4 Element
0612 - 4 Element
As the market leader in the development and manufacture of capacitor
arrays AVX is pleased to offer a range of AEC-Q200 qualified arrays to
compliment our product offering to the Automotive industry. Both the
AVX 0612 and 0508 4-element capacitor array styles are qualified to the
AEC-Q200 automotive specifications.
AEC-Q200 is the Automotive Industry qualification standard and a
detailed qualification package is available on request.
All AVX automotive capacitor array production facilities are certified to
ISO/TS 16949:2002.
*Contact factory for availability by part number for K = ±10% and J = ±5% tolerance.
HOW TO ORDER
W
Style
W = RoHS
L = SnPb
3
Case
Size
1 = 0405
2 = 0508
3 = 0612
A
Array
4
Number
of Caps
Y
Voltage
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
C
Dielectric
A = NP0
C = X7R
F = X8R
104
Capacitance
Code (In pF)
Significant
Digits +
Number of
Zeros
e.g. 10μF=106
K
Capacitance
Tolerance
*J = ±5%
*K = ±10%
M = ±20%
4
Failure Rate
4 = Automotive
2A
Packaging
& Quantity
Code
2A = 7" Reel
(4000)
4A = 13" Reel
(10000)
2F =
7" Reel
(1000)
T
Terminations
T = Plated Ni and Sn**
Z = FLEXITERM®**
B = 5% min lead
X = FLEXITERM®with
5% min lead
SIZE 0508 0508 0612 0405
No. of Elements
24 42
WVDC
16 25 50 100 16 25 50 100 10 16 25 50 100 16
101 Cap 100
121 (pF) 120
151 150
181 180
221 220
271 270
331 330
391 390
471 470
561 560
681 680
821 820
102 1000
122 1200
152 1500
182 1800
222 2200
272 2700
332 3300
392 3900
472 4700
562 5600
682 6800
822 8200
103 Cap 0.010
123 (μF) 0.012
153 0.015
183 0.018
223 0.022
273 0.027
333 0.033
393 0.039
473 0.047
563 0.056
683 0.068
823 0.082
104 0.10
124 0.12
154 0.15
224 0.22
SIZE 0405 0508 0508 0612
No. of Elements 2
24 4
WVDC 50
50 16 25 50 100 16 25 50 100
1R0 Cap 1.0
1R2 (pF) 1.2
1R5 1.5
1R8 1.8
2R2 2.2
2R7 2.7
3R3 3.3
3R9 3.9
4R7 4.7
5R6 5.6
6R8 6.8
8R2 8.2
100 10
120 12
150 15
180 18
220 22
270 27
330 33
390 39
470 47
560 56
680 68
820 82
101 100
121 120
151 150
181 180
221 220
271 270
331 330
391 390
471 470
561 560
681 680
821 820
102 1000
122 1200
152 1500
182 1800
222 2200
272 2700
332 3300
392 3900
472 4700
562 5600
682 6800
822 8200
X7R X8RNP0/C0G
= X7R
= Under development
= X8R
= Under development
= NPO/COG
**RoHS compliant
Not RoHS Compliant
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
65
Capacitor Array
PAD LAYOUT DIMENSIONS
LWTBWBLPS
1.00 ± 0.15 1.37 ± 0.15 0.66 MAX 0.36 ± 0.10 0.20 ± 0.10 0.64 REF 0.32 ± 0.10
(0.039 ± 0.006) (0.054 ± 0.006) (0.026 MAX) (0.014 ± 0.004) (0.008 ± 0.004
)
(0.025 REF) (0.013 ± 0.004)
ABCDE
0.46 0.74 1.20 0.30 0.64
(0.018) (0.029) (0.047) (0.012) (0.025)
0405 - 2 Element
LWTBWBLPS
1.30 ± 0.15 2.10 ± 0.15 0.94 MAX 0.43 ± 0.10 0.33 ± 0.08 1.00 REF 0.50 ± 0.10
(0.051 ± 0.006) (0.083 ± 0.006) (0.037 MAX) (0.017 ± 0.004) (0.013 ± 0.003
)
(0.039 REF) (0.020 ± 0.004)
ABCDE
0.68 1.32 2.00 0.46 1.00
(0.027) (0.052) (0.079) (0.018) (0.039)
0508 - 2 Element
LWTBWBLPXS
1.30 ± 0.15 2.10 ± 0.15 0.94 MAX 0.25 ± 0.06 0.20 ± 0.08 0.50 REF 0.75 ± 0.10 0.25 ± 0.10
(0.051 ± 0.006) (0.083 ± 0.006) (0.037 MAX) (0.010 ± 0.003) (0.008 ± 0.003
)
(0.020 REF) (0.030 ± 0.004) (0.010 ± 0.004)
ABCDE
0.56 1.32 1.88 0.30 0.50
(0.022) (0.052) (0.074) (0.012) (0.020)
0508 - 4 Element
LWTBWBLPXS
1.60 ± 0.20 3.20 ± 0.20 1.35 MAX 0.41 ± 0.10 0.18 0.76 REF 1.14 ± 0.10 0.38 ± 0.10
(0.063 ± 0.008) (0.126 ± 0.008) (0.053 MAX) (0.016 ± 0.004) (0.007
)
(0.030 REF) (0.045 ± 0.004) (0.015 ± 0.004)
ABCDE
0.89 1.65 2.54 0.46 0.76
(0.035) (0.065) (0.100) (0.018) (0.030)
0612 - 4 Element
0405 - 2 Element
0508 - 2 Element
0508 - 4 Element
0612 - 4 Element
PART DIMENSIONS
A
B
C
D
E
L
BL
BW C/L
OF CHIP
C
L
T
W
P
SS
0405 - 2 Element PAD LAYOUT
A
B
C
D
E
L
BL
BW C/L
OF CHIP
C
L
T
W
P
SS
0508 - 2 Element PAD LAYOUT 0508 - 4 Element PAD LAYOUT
A
B
C
D
E
L
BL
BW C/L OF CHIP
C
L
T
W
XX
PSS
0612 - 4 Element PAD LAYOUT
A
B
C
D
E
L
BL
BW C/L OF CHIP
C
L
T
W
XX
PSS
PART & PAD LAYOUT DIMENSIONS millimeters (inches)
+0.25
-0.08
+0.010
-0.003
66
Low Inductance Capacitors
Introduction
The signal integrity characteristics of a Power Delivery
Network (PDN) are becoming critical aspects of board level
and semiconductor package designs due to higher operating
frequencies, larger power demands, and the ever shrinking
lower and upper voltage limits around low operating voltages.
These power system challenges are coming from mainstream
designs with operating frequencies of 300MHz or greater,
modest ICs with power demand of 15 watts or more, and
operating voltages below 3 volts.
The classic PDN topology is comprised of a series of
capacitor stages. Figure 1 is an example of this architecture
with multiple capacitor stages.
An ideal capacitor can transfer all its stored energy to a load
instantly. A real capacitor has parasitics that prevent
instantaneous transfer of a capacitor’s stored energy. The
true nature of a capacitor can be modeled as an RLC
equivalent circuit. For most simulation purposes, it is possible
to model the characteristics of a real capacitor with one
capacitor, one resistor, and one inductor. The RLC values in
this model are commonly referred to as equivalent series
capacitance (ESC), equivalent series resistance (ESR), and
equivalent series inductance (ESL).
The ESL of a capacitor determines the speed of energy
transfer to a load. The lower the ESL of a capacitor, the faster
that energy can be transferred to a load. Historically, there
has been a tradeoff between energy storage (capacitance)
and inductance (speed of energy delivery). Low ESL devices
typically have low capacitance. Likewise, higher capacitance
devices typically have higher ESLs. This tradeoff between
ESL (speed of energy delivery) and capacitance (energy
storage) drives the PDN design topology that places the
fastest low ESL capacitors as close to the load as possible.
Low Inductance MLCCs are found on semiconductor
packages and on boards as close as possible to the load.
LOW INDUCTANCE CHIP CAPACITORS
The key physical characteristic determining equivalent series
inductance (ESL) of a capacitor is the size of the current loop
it creates. The smaller the current loop, the lower the ESL. A
standard surface mount MLCC is rectangular in shape with
electrical terminations on its shorter sides. A Low Inductance
Chip Capacitor (LICC) sometimes referred to as Reverse
Geometry Capacitor (RGC) has its terminations on the longer
side of its rectangular shape.
When the distance between terminations is reduced, the size
of the current loop is reduced. Since the size of the current
loop is the primary driver of inductance, an 0306 with a
smaller current loop has significantly lower ESL then an 0603.
The reduction in ESL varies by EIA size, however, ESL is
typically reduced 60% or more with an LICC versus a
standard MLCC.
INTERDIGITATED CAPACITORS
The size of a current loop has the greatest impact on the ESL
characteristics of a surface mount capacitor. There is a
secondary method for decreasing the ESL of a capacitor.
This secondary method uses adjacent opposing current
loops to reduce ESL. The InterDigitated Capacitor (IDC)
utilizes both primary and secondary methods of reducing
inductance. The IDC architecture shrinks the distance
between terminations to minimize the current loop size, then
further reduces inductance by creating adjacent opposing
current loops.
An IDC is one single capacitor with an internal structure that
has been optimized for low ESL. Similar to standard MLCC
versus LICCs, the reduction in ESL varies by EIA case size.
Typically, for the same EIA size, an IDC delivers an ESL that
is at least 80% lower than an MLCC.
VR
Slowest Capacitors Fastest Capacitors
Low Inductance Decoupling Capacitors
Semiconductor Product
Bulk Board-Level Package-Level Die-Level
Figure 1 Classic Power Delivery Network (PDN) Architecture
67
Low Inductance Capacitors
Introduction
LAND GRID ARRAY (LGA) CAPACITORS
Land Grid Array (LGA) capacitors are based on the first Low
ESL MLCC technology created to specifically address the
design needs of current day Power Delivery Networks (PDNs).
This is the 3rd low inductance capacitor technology
developed by AVX. LGA technology provides engineers with
new options. The LGA internal structure and manufacturing
technology eliminates the historic need for a device to be
physically small to create small current loops to minimize
inductance.
The first family of LGA products are 2 terminal devices. A
2 terminal 0306 LGA delivers ESL performance that is equal
to or better than an 0306 8 terminal IDC. The 2 terminal 0805
LGA delivers ESL performance that approaches the 0508
8 terminal IDC. New designs that would have used 8 terminal
IDCs are moving to 2 terminal LGAs because the layout is
easier for a 2 terminal device and manufacturing yield is better
for a 2 terminal LGA versus an 8 terminal IDC.
LGA technology is also used in a 4 terminal family of products
that AVX is sampling and will formerly introduce in 2008.
Beyond 2008, there are new multi-terminal LGA product
families that will provide even more attractive options for PDN
designers.
LOW INDUCTANCE CHIP ARRAYS (LICA®)
The LICA®product family is the result of a joint development
effort between AVX and IBM to develop a high performance
MLCC family of decoupling capacitors. LICA was introduced
in the 1980s and remains the leading choice of designers in
high performance semiconductor packages and high
reliability board level decoupling applications.
LICA®products are used in 99.999% uptime semiconductor
package applications on both ceramic and organic
substrates. The C4 solder ball termination option is the
perfect compliment to flip-chip packaging technology.
Mainframe class CPUs, ultimate performance multi-chip
modules, and communications systems that must have the
reliability of 5 9’s use LICA®.
LICA®products with either Sn/Pb or Pb-free solder balls are
used for decoupling in high reliability military and aerospace
applications. These LICA®devices are used for decoupling of
large pin count FPGAs, ASICs, CPUs, and other high power
ICs with low operating voltages.
When high reliability decoupling applications require the very
lowest ESL capacitors, LICA®products are the best option.
Figure 2 MLCC, LICC, IDC, and LGA technologies deliver different levels of equivalent series inductance (ESL).
470 nF 0306 Impedance Comparison
0.001
0.01
0.1
1
1 10 100 1000
Frequency (MHz)
Impedance (ohms)
0306 2T-LGA
0306 LICC
0306 8T-IDC
0603 MLCC
68
GENERAL DESCRIPTION
The key physical characteristic determining equivalent series
inductance (ESL) of a capacitor is the size of the current loop
it creates. The smaller the current loop, the lower the ESL.
A standard surface mount MLCC is rectangular in shape with
electrical terminations on its shorter sides. A Low Inductance
Chip Capacitor (LICC) sometimes referred to as Reverse
Geometry Capacitor (RGC) has its terminations on the longer
sides of its rectangular shape. The image on the right shows
the termination differences between an MLCC and an LICC.
When the distance between terminations is reduced, the size
of the current loop is reduced. Since the size of the current
loop is the primary driver of inductance, an 0306 with a
smaller current loop has significantly lower ESL then an
0603. The reduction in ESL varies by EIA size, however, ESL
is typically reduced 60% or more with an LICC versus a
standard MLCC.
AVX LICC products are available with a lead-free finish of
plated Nickel/Tin.
Low Inductance Capacitors (RoHS)
0612/0508/0306/0204 LICC (Low Inductance Chip Capacitors)
HOW TO ORDER
MLCC LICC
0.001
0.01
0.1
1
10
1 10 100 1000
Frequency (MHz)
Impedance (Ohms)
LICC_0612
MLCC_1206
0.001
0.01
0.1
1
10
110 100 1000
Frequency (MHz)
Impedance (Ohms)
LICC_0508
MLCC_0805
0612
Size
0204
0306
0508
0612
Z
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
D
Dielectric
C = X7R
D = X5R
W = X6S
Z = X7S
105
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
M
Capacitance
Tolerance
K = ±10%
M = ±20%
A
Failure Rate
A = N/A
T
Terminations
T = Plated Ni
and Sn
2
Packaging
Available
2 = 7" Reel
4 = 13" Reel
A*
Thickness
Thickness
mm (in)
0.35 (0.014)
0.56 (0.022)
0.61 (0.024)
0.76 (0.030)
1.02 (0.040)
1.27 (0.050)
TYPICAL IMPEDANCE CHARACTERISTICS
PERFORMANCE CHARACTERISTICS
Capacitance Tolerances
K = ±10%; M = ±20%
Operation
X7R = -55°C to +125°C
Temperature Range
X5R = -55°C to +85°C
X7S = -55°C to +125°C
Temperature Coefficient
X7R, X5R = ±15%; X7S = ±22%
Voltage Ratings
4, 6.3, 10, 16, 25 VDC
Dissipation Factor
4V, 6.3V = 6.5% max; 10V = 5.0% max;
16V = 3.5% max; 25V = 3.0% max
Insulation Resistance
100,000MΩ min, or 1,000MΩ per
(@+25°C, RVDC)
μF min.,whichever is less
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
LEAD-FREE COMPATIBLE
COMPONENT
69
Low Inductance Capacitors (RoHS)
0612/0508/0306/0204 LICC (Low Inductance Chip Capacitors)
SIZE 0204 0306 0508 0612
Packaging Embossed Embossed Embossed
Length mm 0.81 ± 0.15 1.27 ± 0.25 1.60 ± 0.25
(in.) (0.032 ± 0.006) (0.050 ± 0.010) (0.063 ± 0.010)
Width mm 1.60 ± 0.15 2.00 ± 0.25 3.20 ± 0.25
(in.) (0.063 ± 0.006) (0.080 ± 0.010) (0.126 ± 0.010)
WVDC 4 6.3 10 16 4 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50
CAP 0.001
(μF) 0.0022
0.0047
0.010
0.015
0.022
0.047
0.068
0.10
0.15
0.22
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
0306
Code Thickness
A0.61 (0.024)
0508
Code Thickness
S0.56 (0.022)
V0.76 (0.030)
A1.02 (0.040)
0612
Code Thickness
S0.56 (0.022)
V0.76 (0.030)
W1.02 (0.040)
A1.27 (0.050)
Solid = X7R = X5R = X7S
mm (in.)
0204
Code Thickness
C0.35 (0.014)
= X6S
mm (in.) mm (in.)mm (in.)
PHYSICAL DIMENSIONS AND
PAD LAYOUT
Wt
T
L
LW t
0612 1.60 ± 0.25 3.20 ± 0.25 0.13 min.
(0.063 ± 0.010) (0.126 ± 0.010) (0.005 min.)
0508 1.27 ± 0.25 2.00 ± 0.25 0.13 min.
(0.050 ± 0.010) (0.080 ± 0.010) (0.005 min.)
0306 0.81 ± 0.15 1.60 ± 0.15 0.13 min.
(0.032 ± 0.006) (0.063 ± 0.006) (0.005 min.)
0204 0.50 ± 0.05 1.00 ± 0.05 0.18 ± 0.08
(0.020 ± 0.002) (0.040 ± 0.002) (0.007 ± 0.003)
PHYSICAL CHIP DIMENSIONS
mm (in)
“A”CC
“B”
PAD LAYOUT DIMENSIONS mm (in)
ABC
0612 0.76 (0.030) 3.05 (0.120) .635 (0.025)
0508 0.51 (0.020) 2.03 (0.080) 0.51 (0.020)
0306 0.31 (0.012) 1.52 (0.060) 0.51 (0.020)
0204
T - See Range Chart for Thickness and Codes
70
GENERAL DESCRIPTION
The key physical characteristic determining equivalent
series inductance (ESL) of a capacitor is the size of the
current loop it creates. The smaller the current loop, the
lower the ESL.
A standard surface mount MLCC is rectangular in shape
with electrical terminations on its shorter sides. A Low
Inductance Chip Capacitor (LICC) sometimes referred to
as Reverse Geometry Capacitor (RGC) has its
terminations on the longer sides of its rectangular shape.
The image on the right shows the termination differences
between an MLCC and an LICC.
When the distance between terminations is reduced, the
size of the current loop is reduced. Since the size of the
current loop is the primary driver of inductance, an 0306
with a smaller current loop has significantly lower ESL
then an 0603. The reduction in ESL varies by EIA size,
however, ESL is typically reduced 60% or more with an
LICC versus a standard MLCC.
AVX LICC products are available with a lead termination
for high reliability military and aerospace applications that
must avoid tin whisker reliability issues.
Low Inductance Capacitors (SnPb)
0612/0508/0306/0204 Tin Lead Termination “B”
HOW TO ORDER
MLCC LICC
LD18
Size
LD15 = 0204
LD16 = 0306
LD17 = 0508
LD18 = 0612
Z
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
D
Dielectric
C = X7R
D = X5R
W = X6S
105
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
M
Capacitance
Tolerance
K = ±10%
M = ±20%
A
Failure Rate
A = N/A
B
Terminations
B = 5% min lead
2
Packaging
Available
2 = 7" Reel
4 = 13" Reel
A*
Thickness
Thickness
mm (in)
0.35 (0.014)
0.56 (0.022)
0.61 (0.024)
0.76 (0.030)
1.02 (0.040)
1.27 (0.050)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
PERFORMANCE CHARACTERISTICS
Capacitance Tolerances
K = ±10%; M = ±20%
Operation
X7R = -55°C to +125°C
Temperature Range
X5R = -55°C to +85°C
X7S = -55°C to +125°C
Temperature Coefficient
X7R, X5R = ±15%; X7S = ±22%
Voltage Ratings
4, 6.3, 10, 16, 25 VDC
Dissipation Factor
4V,
6.3V = 6.5% max; 10V = 5.0% max;
16V = 3.5% max; 25V = 3.0% max
Insulation Resistance
100,000MΩ min, or 1,000MΩ per
(@+25°C, RVDC)
μF min.,whichever is less
0.001
0.01
0.1
1
10
1 10 100 1000
Frequency (MHz)
Impedance (Ohms)
LICC_0612
MLCC_1206
0.001
0.01
0.1
1
10
110 100 1000
Frequency (MHz)
Impedance (Ohms)
LICC_0508
MLCC_0805
TYPICAL IMPEDANCE CHARACTERISTICS
Not RoHS Compliant
71
PREFERRED SIZES ARE SHADED
SIZE LD15 LD16 LD17 LD18
Soldering Reflow Only Reflow Only Reflow/Wave
Packaging All Paper All Paper Paper/Embossed
(L) Length mm 0.81 ± 0.15 1.27 ± 0.25 1.60 ± 0.25
(in.) (0.032 ± 0.006) (0.050 ± 0.010) (0.063 ± 0.010)
(W) Width mm 1.60 ± 0.15 2.00 ± 0.25 3.20 ± 0.25
(in.) (0.063 ± 0.006) (0.080 ± 0.010) (0.126 ± 0.010)
WVDC 4 6.3 10 16 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50
Cap 1000 A A A A S S S S V S S S S V
(pF) 2200 A A A A S S S S V S S S S V
4700 A A A A S S S S V S S S S V
Cap 0.010 A A A A S S S S V S S S S V
(μF) 0.015 A A A A S S S S V S S S S W
0.022 A A A A S S S S V S S S S W
0.047 A A A S S S V A S S S S W
0.068 A A A S S S A A S S S V W
0.10 C C A A A S S V A A S S S V W
0.15 A A S S V S S S W W
0.22 A A S S A S S V
0.47 V V A S S V
0.68 A A V V W
1.0 A A V V A
1.5 A W W
2.2 AA
3.3 A
4.7
10
WVDC 4 6.3 10 16 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50
SIZE 0204 0306 0508 0612
Low Inductance Capacitors (SnPb)
0612/0508/0306/0204 Tin Lead Termination “B”
PHYSICAL DIMENSIONS AND
PAD LAYOUT
Wt
T
L
LW t
0612 1.60 ± 0.25 3.20 ± 0.25 0.13 min.
(0.063 ± 0.010) (0.126 ± 0.010) (0.005 min.)
0508 1.27 ± 0.25 2.00 ± 0.25 0.13 min.
(0.050 ± 0.010) (0.080 ± 0.010) (0.005 min.)
0306 0.81 ± 0.15 1.60 ± 0.15 0.13 min.
(0.032 ± 0.006) (0.063 ± 0.006) (0.005 min.)
0204 0.50 ± 0.05 1.00 ± 0.05 0.18 ± 0.08
(0.020 ± 0.002) (0.040 ± 0.002) (0.007 ± 0.003)
PHYSICAL CHIP DIMENSIONS
mm (in)
“A”CC
“B”
PAD LAYOUT DIMENSIONS mm (in)
ABC
0612 0.76 (0.030) 3.05 (0.120) .635 (0.025)
0508 0.51 (0.020) 2.03 (0.080) 0.51 (0.020)
0306 0.31 (0.012) 1.52 (0.060) 0.51 (0.020)
0204
T - See Range Chart for Thickness and Codes
LD16 - 0306
Code Thickness
A0.61 (0.024)
LD17 - 0508
Code Thickness
S0.56 (0.022)
V0.76 (0.030)
A1.02 (0.040)
LD18 - 0612
Code Thickness
S0.56 (0.022)
V0.76 (0.030)
W1.02 (0.040)
A1.27 (0.050)
Solid = X7R = X5R = X7S
mm (in.)
LD15 - 0204
Code Thickness
C0.35 (0.014)
= X6S
mm (in.) mm (in.)mm (in.)
72
GENERAL DESCRIPTION
Inter-Digitated Capacitors (IDCs) are used for both semiconductor
package and board level decoupling. The equivalent series
inductance (ESL) of a single capacitor or an array of capacitors in
parallel determines the response time of a Power Delivery Network
(PDN). The lower the ESL of a PDN, the faster the response time.
A designer can use many standard MLCCs in parallel to reduce
ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC
devices are available in versions with a maximum height of 0.95mm
or 0.55mm.
IDCs are typically used on packages of semiconductor products
with power levels of 15 watts or greater. Inter-Digitated Capacitors
are used on CPU, GPU, ASIC, and ASSP devices produced on
0.13μ, 90nm, 65nm, and 45nm processes. IDC devices are used
on both ceramic and organic package substrates. These low ESL
surface mount capacitors can be placed on the bottom side or the
top side of a package substrate. The low profile 0.55mm maximum
height IDCs can easily be used on the bottom side of BGA
packages or on the die side of packages under a heat spreader.
IDCs are used for board level decoupling of systems with speeds of
300MHz or greater. Low ESL IDCs free up valuable board space by
reducing the number of capacitors required versus standard
MLCCs. There are additional benefits to reducing the number of
capacitors beyond saving board space including higher reliability
from a reduction in the number of components and lower
placement costs based on the need for fewer capacitors.
The Inter-Digitated Capacitor (IDC) technology was developed by
AVX. This is the second family of Low Inductance MLCC products
created by AVX. IDCs are a cost effective alternative to AVX’s first
generation low ESL family for high-reliability applications known as
LICA (Low Inductance Chip Array).
AVX IDC products are available with a lead-free finish of plated
Nickel/Tin.
HOW TO ORDER
0.001 1 10 100 1000
Frequency (MHz)
Impedance (Ohms)
0.01
0.1
1
10
LICC_0612
IDC_0612
MLCC_1206
PERFORMANCE CHARACTERISTICS
Capacitance Tolerance
±20% Preferred
Operation
X7R = -55°C to +125°C
Temperature Range
X5R = -55°C to +85°C
X7S = -55°C to +125°C
Temperature Coefficient
±15% (0VDC), ±22% (X7S)
Voltage Ratings
4, 6.3, 10, 16, 25 VDC
Dissipation Factor
≤ 6.3V = 6.5% max;
10V = 5.0% max;
≥ 16V = 3.5% max
Insulation Resistance
100,000MΩ min, or 1,000MΩ per
(@+25°C, RVDC)
μF min.,whichever is less
Dielectric Strength
No problems observed after 2.5 x RVDC
for 5 seconds at 50mA max current
CTE (ppm/C)
12.0
Thermal Conductivity
4-5W/M K
Terminations
Plated Nickel and Solder
Available
W
Style
3
IDC
Case
Size
2 = 0508
3 = 0612
4 = 0306
L
Low
Inductance
1
Number
of
Terminals
1 = 8 Terminals
6
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
D
Dielectric
C = X7R
D = X5R
Z = X7S
225
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
M
Capacitance
Tolerance
M = ±20%
T
Termination
T = Plated Ni
and Sn
3
Packaging
Available
1=7" Reel
3=13" Reel
A
Thickness
Max. Thickness
mm (in.)
A=Standard
S=0.55 (0.022)
A
Failure
Rate
A = N/A
0612
0508
IDC Low Inductance Capacitors (RoHS)
0306/0612/0508 IDC (InterDigitated Capacitors)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
TYPICAL IMPEDANCE
LEAD-FREE COMPATIBLE
COMPONENT
0306
+ – + –
+ – + –
73
IDC Low Inductance Capacitors (RoHS)
0306/0612/0508 IDC (InterDigitated Capacitors)
SIZE 0306 Thin 0508 0508 Thin 0612 0612 THICK 0612
Max. mm 0.55 0.55. 0.95 0.55 0.95 1.22
Thickness (in.) (0.022) (0.022) (0.037) (0.022) (0.037) (0.048)
WVDC 4 6.3 4 6.3 10 16 25 4 6.3 10 16 25 4 6.3 10 16 4 6.3 10 16 25 4 6.3 10 16
Cap
(μF) 0.010
0.022
0.033
0.047
0.068
0.10
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
= X7R
= X5R
= X7S
Consult factory for
additional requirements
PAD LAYOUT
DIMENSIONS
SIZE ABCDE
0306 0.38 0.89 1.27 0.20 0.40
(0.015) (0.035) (0.050) (0.008) (0.015)
0508 0.64 1.27 1.91 0.28 0.50
(0.025) (0.050) (0.075) (0.011) (0.020)
0612 0.89 1.65 2.54 0.45 0.80
(0.035) (0.065) (0.010) (0.018) (0.031)
PHYSICAL CHIP DIMENSIONS millimeters (inches)
SIZE W L BW BL P
0306 1.60 ± 0.20 0.82 ± 0.10 0.25 ± 0.10 0.20 ± 0.10 0.40 ± 0.05
(0.063 ± 0.008) (0.032 ± 0.006 (0.010 ± 0.004) (0.008± 0.004) (0.015 ± 0.002)
0508 2.03 ± 0.20 1.27 ± 0.20 0.30 ± 0.10 0.25 ± 0.15 0.50 ± 0.05
(0.080 ± 0.008) (0.050 ± 0.008) (0.012 ± 0.004) (0.010± 0.006) (0.020 ± 0.002)
0612 3.20 ± 0.20 1.60 ± 0.20 0.50 ± 0.10 0.25 ± 0.15 0.80 ± 0.10
(0.126 ± 0.008) (0.063 ± 0.008) (0.020 ± 0.004) (0.010 ± 0.006) (0.031 ± 0.004)
PHYSICAL DIMENSIONS AND PAD LAYOUT
A
B
C
D
E
L
BL
BW
T
W
P
74
HOW TO ORDER
0.001 1 10 100 1000
Frequency (MHz)
Impedance (Ohms)
0.01
0.1
1
10
LICC_0612
IDC_0612
MLCC_1206
L
Style
3
IDC
Case
Size
2 = 0508
3 = 0612
4 = 0306
L
Low
Inductance
1
Number
of
Terminals
1 = 8 Terminals
6
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
D
Dielectric
C = X7R
D = X5R
Z = X7S
225
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
M
Capacitance
Tolerance
M = ±20%
B
Termination
B = 5% min.
Lead
3
Packaging
Available
1=7" Reel
3=13" Reel
A
Thickness
Max. Thickness
mm (in.)
A=Standard
S=0.55 (0.022)
A
Failure
Rate
A = N/A
IDC Low Inductance Capacitors (SnPb)
0306/0612/0508 IDC with Sn/Pb Termination
GENERAL DESCRIPTION
Inter-Digitated Capacitors (IDCs) are used for both semiconductor
package and board level decoupling. The equivalent series
inductance (ESL) of a single capacitor or an array of capacitors in
parallel determines the response time of a Power Delivery Network
(PDN). The lower the ESL of a PDN, the faster the response time.
A designer can use many standard MLCCs in parallel to reduce
ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC
devices are available in versions with a maximum height of 0.95mm
or 0.55mm.
IDCs are typically used on packages of semiconductor products
with power levels of 15 watts or greater. Inter-Digitated Capacitors
are used on CPU, GPU, ASIC, and ASSP devices produced on
0.13μ, 90nm, 65nm, and 45nm processes. IDC devices are used
on both ceramic and organic package substrates. These low ESL
surface mount capacitors can be placed on the bottom side or the
top side of a package substrate. The low profile 0.55mm maximum
height IDCs can easily be used on the bottom side of BGA
packages or on the die side of packages under a heat spreader.
IDCs are used for board level decoupling of systems with speeds of
300MHz or greater. Low ESL IDCs free up valuable board space by
reducing the number of capacitors required versus standard
MLCCs. There are additional benefits to reducing the number of
capacitors beyond saving board space including higher reliability
from a reduction in the number of components and lower
placement costs based on the need for fewer capacitors.
The Inter-Digitated Capacitor (IDC) technology was developed by
AVX. This is the second family of Low Inductance MLCC products
created by AVX. IDCs are a cost effective alternative to AVX’s first
generation low ESL family for high-reliability applications known as
LICA (Low Inductance Chip Array).
AVX IDC products are available with a lead termination for high
reliability military and aerospace applications that must avoid tin
whisker reliability issues.
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
TYPICAL IMPEDANCE
Not RoHS Compliant
0612
0508
0306
+ – + –
+ – + –
PERFORMANCE CHARACTERISTICS
Capacitance Tolerance
±20% Preferred
Operation
X7R = -55°C to +125°C
Temperature Range
X5R = -55°C to +85°C
X7S = -55°C to +125°C
Temperature Coefficient
±15% (0VDC), ±22% (X7S)
Voltage Ratings
4, 6.3, 10, 16, 25 VDC
Dissipation Factor
≤ 6.3V = 6.5% max;
10V = 5.0% max;
≥ 16V = 3.5% max
Insulation Resistance
100,000MΩ min, or 1,000MΩ per
(@+25°C, RVDC)
μF min.,whichever is less
Dielectric Strength
No problems observed after 2.5 x RVDC
for 5 seconds at 50mA max current
CTE (ppm/C)
12.0
Thermal Conductivity
4-5W/M K
Terminations
Plated Nickel and Solder
Available
75
IDC Low Inductance Capacitors (SnPb)
0306/0612/0508 IDC with Sn/Pb Termination
SIZE 0306 Thin 0508 0508 Thin 0612 0612 THICK 0612
Max. mm 0.55 0.55. 0.95 0.55 0.95 1.22
Thickness (in.) (0.022) (0.022) (0.037) (0.022) (0.037) (0.048)
WVDC 4 6.3 4 6.3 10 16 25 4 6.3 10 16 25 4 6.3 10 16 4 6.3 10 16 25 4 6.3 10 16
Cap
(μF) 0.010
0.022
0.033
0.047
0.068
0.10
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
= X7R
= X5R
= X7S
Consult factory for
additional requirements
PAD LAYOUT
DIMENSIONS
SIZE ABCDE
0306 0.38 0.89 1.27 0.20 0.40
(0.015) (0.035) (0.050) (0.008) (0.015)
0508 0.64 1.27 1.91 0.28 0.50
(0.025) (0.050) (0.075) (0.011) (0.020)
0612 0.89 1.65 2.54 0.45 0.80
(0.035) (0.065) (0.010) (0.018) (0.031)
PHYSICAL CHIP DIMENSIONS millimeters (inches)
SIZE W L BW BL P
0306 1.60 ± 0.20 0.82 ± 0.10 0.25 ± 0.10 0.20 ± 0.10 0.40 ± 0.05
(0.063 ± 0.008) (0.032 ± 0.006 (0.010 ± 0.004) (0.008± 0.004) (0.015 ± 0.002)
0508 2.03 ± 0.20 1.27 ± 0.20 0.30 ± 0.10 0.25 ± 0.15 0.50 ± 0.05
(0.080 ± 0.008) (0.050 ± 0.008) (0.012 ± 0.004) (0.010± 0.006) (0.020 ± 0.002)
0612 3.20 ± 0.20 1.60 ± 0.20 0.50 ± 0.10 0.25 ± 0.15 0.80 ± 0.10
(0.126 ± 0.008) (0.063 ± 0.008) (0.020 ± 0.004) (0.010 ± 0.006) (0.031 ± 0.004)
PHYSICAL DIMENSIONS AND PAD LAYOUT
A
B
C
D
E
L
BL
BW
T
W
P
76
LGA Low Inductance Capacitors
0204/0306/0805 Land Grid Arrays
Land Grid Array (LGA) capacitors are the latest family of low inductance MLCCs from AVX.
These new LGA products are the third low inductance family developed by AVX. The in-
novative LGA technology sets a new standard for low inductance MLCC performance.
Electronic Products awarded its 2006 Product of the Year Award to the LGA Decoupling
capacitor.
Our initial 2 terminal versions of LGA technology deliver the performance of an 8 terminal
IDC low inductance MLCC with a number of advantages including:
Simplified layout of 2 large solder pads compared to 8 small pads for IDCs
Opportunity to reduce PCB or substrate contribution to system ESL by using multi-
ple parallel vias in solder pads
Advanced FCT manufacturing process used to create uniformly flat terminations on
the capacitor that resist “tombstoning”
Better solder joint reliability
APPLICATIONS
Semiconductor Packages
Microprocessors/CPUs
Graphics Processors/GPUs
Chipsets
FPGAs
ASICs
Board Level Device Decoupling
Frequencies of 300 MHz or more
ICs drawing 15W or more
Low voltages
High speed buses
0306 2 TERMINAL LGA COMPARISON WITH 0306 8 TERMINAL IDC
0.001
0.01
0.1
1
1 10 100 1000
Frequency (MHz)
Impedance (Ω)
77
LGA Low Inductance Capacitors
0204/0306/0805 Land Grid Arrays
Series L W T BW BL
LG12 (0204) 0.5 ± 0.05 1.00 ± 0.10 0.50 ± 0.05 0.8 ± 0.10 0.13 ± 0.08
(0.020±0.002) (0.039 ± 0.004) (0.020 ± 0.002) (0.031 ± 0.004) (0.005 ± 0.003)
LG22 (0306) 0.76 ± 0.10 1.60 ± 0.10 0.50 ± 0.05 1.50 ±0.10 0.28 ± 0.08
(0.030 ± 0.004) (0.063 ± 0.004) (0.020 ± 0.002) (0.059 ± 0.004) (0.011 ± 0.003)
LGC2 (0805) 2.06 ± 0.10 1.32 ± 0.10 0.50 ± 0.05 1.14 ± 0.10 0.90 ±0.08
(0.081 ± 0.004) (0.052 ± 0.004) (0.020 ± 0.002) (0.045 ± 0.004) (0.035 ± 0.003)
PART DIMENSIONS mm (inches)
RECOMMENDED SOLDER PAD DIMENSIONS mm (inches)
PL
G
PW1
Series PL PW1 G
LG12 (0204) 0.50 (0.020) 1.00 (0.039) 0.20 (0.008)
LG22 (0306) 0.65 (0.026) 1.50 (0.059) 0.20 (0.008)
LGC2 (0805) 1.25 (0.049) 1.40 (0.055) 0.20 (0.008)
HOW TO ORDER
LG
Style
1
Case
Size
1 = 0204
2 = 0306
C
= 0805
2
Number of
Terminals
2
6
Working
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Z
Temperature
Characteristic
C = X7R
D = X5R
Z = X7S
W = X6S
104
Coded
Cap
M
Cap
Tolerance
M = 20%
A
Termination
Style
A = “U” Land
T
Termination
100% Sn*
*Contact factory for
other termination
finishes
2
Packaging
Tape & Reel
2 = 7" Reel
4 = 13" Reel
S
Thickness
S = 0.55mm
max
1
Number of
Capacitors
SIZE LG12 (0204) LG22 (0306) LGC2 (0805)
Length mm (in.) 0.50 (0.020) 0.76 (0.030) 2.06 (0.081)
Width mm (in.) 1.00 (0.039) 1.60 (0.063) 1.32 (0.052)
Temp. Char. X5R (D) X7S (Z) X6S (W) X7R (C) X5R (D) X7S (Z) X6S (W) X7R (C) X5R (D) X7S (Z) X6S (W)
Working Voltage 6.3 4 6.3 4 6.3 4 10 6.3 4 6.3 4 6.3 4 6.3 4 6.3 4 6.3 4 6.3 4 6.3 4
(6) (4) (6) (4) (6) (4) (Z) (6) (4) (6) (4) (6) (4) (6) (4) (6) (4) (6) (4) (6) (4) (6) (4)
Cap (μF) 0.010 (103)
0.022 (223)
0.047 (473)
0.100 (104)
0.220 (224)
0.330 (334)
0.470 (474)
1.000 (105)
2.200 (225)
= X7R = X5R = X7S = X6S
T
L
BL
BW L
W
BL
Standard
Geometry LGA
LGC2
Top View
Side 1
Side 2
T
L
BL
W
BW
L
BL
Reverse
Geometry LGA
LG12, LG22
Top View
Side 1
Side 2
LEAD-FREE COMPATIBLE
COMPONENT
78
LGA Low Inductance Capacitors
0204/0306/0805 Land Grid Arrays – Tin/Lead Termination “B”
Series L W T BW BL
PG12 (0204) 0.5 ± 0.05 1.00 ± 0.10 0.50 ± 0.05 0.8 ± 0.10 0.13 ± 0.08
(0.020±0.002) (0.039 ± 0.004) (0.020 ± 0.002) (0.031 ± 0.004) (0.005 ± 0.003)
PG22 (0306) 0.76 ± 0.10 1.60 ± 0.10 0.50 ± 0.05 1.50 ±0.10 0.28 ± 0.08
(0.030 ± 0.004) (0.063 ± 0.004) (0.020 ± 0.002) (0.059 ± 0.004) (0.011 ± 0.003)
PGC2 (0805) 2.06 ± 0.10 1.32 ± 0.10 0.50 ± 0.05 1.14 ± 0.10 0.90 ±0.08
(0.081 ± 0.004) (0.052 ± 0.004) (0.020 ± 0.002) (0.045 ± 0.004) (0.035 ± 0.003)
PART DIMENSIONS mm (inches)
RECOMMENDED SOLDER PAD DIMENSIONS mm (inches)
PL
G
PW1
Series PL PW1 G
PG12 (0204) 0.50 (0.020) 1.00 (0.039) 0.20 (0.008)
PG22 (0306) 0.65 (0.026) 1.50 (0.059) 0.20 (0.008)
PGC2 (0805) 1.25 (0.049) 1.40 (0.055) 0.20 (0.008)
HOW TO ORDER
PG
Style
1
Case
Size
1 = 0204
2 = 0306
C
= 0805
2
Number of
Terminals
2
6
Working
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Z
Temperature
Characteristic
C = X7R
D = X5R
Z = X7S
W = X6S
104
Coded
Cap
M
Cap
Tolerance
M = 20%
A
Termination
Style
A = “U” Land
B
Termination
5% Min Lead
2
Packaging
Tape & Reel
2 = 7" Reel
4 = 13" Reel
S
Thickness
S = 0.55mm
max
T
L
BL
BW L
W
BL
Standard
Geometry LGA
LGC2
Top View
Side 1
Side 2
T
L
BL
W
BW
L
BL
Reverse
Geometry LGA
LG12, LG22
Top View
Side 1
Side 2
Reverse
Geometry LGA
PG12, PG22
Standard
Geometry LGA
PGC2
Not RoHS Compliant
1
Number of
Capacitors
SIZE LG12 (0204) LG22 (0306) LGC2 (0805)
Length mm (in.) 0.50 (0.020) 0.76 (0.030) 2.06 (0.081)
Width mm (in.) 1.00 (0.039) 1.60 (0.063) 1.32 (0.052)
Temp. Char. X5R (D) X7S (Z) X6S (W) X7R (C) X5R (D) X7S (Z) X6S (W) X7R (C) X5R (D) X7S (Z) X6S (W)
Working Voltage 6.3 4 6.3 4 6.3 4 10 6.3 4 6.3 4 6.3 4 6.3 4 6.3 4 6.3 4 6.3 4 6.3 4
(6) (4) (6) (4) (6) (4) (Z) (6) (4) (6) (4) (6) (4) (6) (4) (6) (4) (6) (4) (6) (4) (6) (4)
Cap (μF) 0.010 (103)
0.022 (223)
0.047 (473)
0.100 (104)
0.220 (224)
0.330 (334)
0.470 (474)
1.000 (105)
2.200 (225)
= X7R = X5R = X7S = X6S
79
LICA®arrays utilize up to four separate capacitor sections in one ceramic body (see
Configurations and Capacitance Options). These designs exhibit a number of technical
advancements:
Low Inductance features–
Low resistance platinum electrodes in a low aspect ratio pattern
Double electrode pickup and perpendicular current paths
C4 “flip-chip” technology for minimal interconnect inductance
HOW TO ORDER
"W" = ±.06mm
0.925 ±0.03mm
0.925 ±0.03mm
Vertical and
Horizontal
Pitch=0.4 ±.02mm
0.8 ±.03 (2 pics)
0.6 ±.100mm
L = ±.06mm
Code Face
to Denote
Orientation
(Optional)
"Hb" ±.06
"Ht" = (Hb +.096 ±.02mm typ)
C4 Ball diameter:
.164 ±.03mm
}
Code Width Length Height
(Body Height) (W) (L) Body (H
b
)
1 1.600mm 1.850mm 0.875mm
3 1.600mm 1.850mm 0.650mm
5 1.600mm 1.850mm 1.100mm
6 1.600mm 1.850mm 0.500mm
7 1.600mm 1.850mm 1.600mm
TERMINATION OPTIONS
SOLDER BALLS
T55T/S55S Units
Co Nanofarads
1.45 x Co Nanofarads
0.7 x Co Nanofarads
15 Percent
20 Milliohms
0.2 Ohms
300 Megaohms
500 Volts
8.5 ppm/°C 25-100°
30 Pico-Henries
DC to 5 Gigahertz
-55° to 125°C
Low Inductance Capacitors
LICA®(Low Inductance Decoupling Capacitor Arrays)
TABLE 1
Typical Parameters
Capacitance, 25°C
Capacitance, 55°C
Capacitance, 85°C
Dissipation Factor 25°
ESR (Nominal)
DC Resistance
IR (Minimum @25°) (Design Dependent)
Dielectric Breakdown, Min
Thermal Coefficient of Expansion
Inductance: (Design Dependent) (Nominal)
Frequency of Operation
Ambient Temp Range
“Centrality”*
*NOTE: The C4 pattern
will be within
0.1mm of the
center of the
LICA body, in
both axes.
Pin A1 is the lower left hand ball.
TERMINATION OPTION R OR N
LICA
Style
&
Size
3
Voltage
5V = 9
10V = Z
25V = 3
T
Dielectric
D = X5R
T = T55T
S = High K
T55T
102
Cap/Section
(EIA Code)
102 = 1000 pF
103 = 10 nF
104 = 100 nF
M
Capacitance
Tolerance
M = ±20%
P = GMV
3
Height
Code
6 = 0.500mm
3 = 0.650mm
1 = 0.875mm
5 = 1.100mm
7 = 1.600mm
F
Termination
F = C4 Solder
Balls- 97Pb/3Sn
H = C4 Solder Balls
Low ESR
G = Lead Free SAC
R = Cr-Cu-Au
N = Cr-Ni-Au
V = Eutectic Lead-
Tin Bump-
37%Pb/63%Sn
X = None
C
Reel Packaging
M = 7" Reel
R = 13" Reel
6 = 2"x2" Waffle Pack
8 = 2"x2" Black Waffle
Pack
7 = 2"x2" Waffle Pack
w/ termination
facing up
A = 2"x2" Black Waffle
Pack
w/ termination
facing up
C = 4"x4" Waffle Pack
w/ clear lid
A
Inspection
Code
A = Standard
B = COTS+
X = MIL-PRF-123
A
Code
Face
A = Bar
B = No Bar
C = Dot, S55S
Dielectrics
D = Triangle
4
# of
Caps/Part
1 = one
2 = two
4 = four
NOTE: Contact factory for availability of Termination
and Tolerance Options for Specific Part Numbers.
TERMINATION OPTION F, H, G OR V
SOLDER BALL AND PAD DIMENSIONS
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
80
0
-14
-28
-42
-56
-70 330 300 3000
linear1.sch1.DB[S21]
Freq (MHz)
Maximum
+45%
60°C 85°C25°C 50°C
Capacitance Change
LICA T55T/S55S
CERAMIC
0%
Maximum
-30%
DB
CAP
CA
D C B A
B1
D1
CAP 1
B2
D2
CAP 2
C1 A1 C2 A2
D1 C1 B1 A1
D2 C2 B2 A2
B1
D1
CAP 1
B2
D2
CAP 2
C1 A1 C2 A2
B3
D3
CAP 3
B4
D4
CAP 4
C3 A3 C4 A4
D1 C1 B1 A1
D2 C2 B2 A2
D3 C3 B3 A3
D4 C4 B4 A4
CONFIGURATIONLICA COMMON PART NUMBER LIST
TEMPERATURE VS CAPACITANCE CHANGE
Sprocket Holes: 1.55mm, 4mm pitch
Wells for LICA® part, C4 side down
1.75mm x 2.01mm x 1.27mm deep
on 4mm centers 0.64mm Push Holes
Code Face
to Denote
Orientation
(Typical)
76 pieces/foot
1.75mm
WAFFLE PACK OPTIONS FOR LICA®
FLUOROWARE®
H20-080
Option "C"
400 pcs. per
4" x 4" package
Option "6"
100 pcs.
per 2" x 2"
package
Code Face
to Denote
Orientation
Code Face
to Denote
Orientation
Note: Standard configuration is
Termination side down
LICA®PACKAGING SCHEME “M” AND “R”
8mm conductive plastic tape on reel:
“M”=7" reel max. qty. 3,000, “R”=13" reel max. qty. 8,000
Schematic Code Face
Schematic Code Face
Schematic Code Face
Part Number Voltage Thickness (mm) Capacitors per
Package
LICA3T193M3FC4AA 25 0.650 4
LICA3T153P3FC4AA 25 0.650 4
LICA3T134M1FC1AA 25 0.875 1
LICA3T104P1FC1AA 25 0.875 1
LICA3T333M1FC4AA 25 0.875 4
LICA3T263P3FC4AA 25 0.650 4
LICA3T244M5FC1AA 25 1.100 1
LICA3T194P5FC1AA 25 1.100 1
LICA3T394M7FC1AB 25 1.600 1
LICA3T314P7FC1AB 25 1.600 1
Extended Range
LICAZT623M3FC4AB 10 0.650 4
LICA3T104M3FC1A 25 0.650 1
LICA3T803P3FC1A 25 0.650 1
LICA3T423M3FC2A 25 0.650 2
LICA3T333P3FC2A 25 0.650 2
LICA3S253M3FC4A 25 0.650 4
LICAZD753M3FC4AD 10 0.650 4
LICAZD504M3FC1AB 10 0.650 1
LICAZD604M7FC1AB 10 1.600 1
LICA3D193M3FC4AB 25 0.650 4
Low Inductance Capacitors
LICA®(Low Inductance Decoupling Capacitor Arrays)
TYPICAL S21 FOR LICA AT SINGLE VIA
81
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
*** AVX offers nonstandard chip sizes. Contact factory for details.
High Voltage MLC Chips
For 600V to 5000V Applications
HOW TO ORDER
SIZE 0805 1206 1210* 1808* 1812* 1825* 2220* 2225* 3640*
(L) Length 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20 4.57 ± 0.25 4.50 ± 0.30 4.50 ± 0.30 5.70 ± 0.40 5.72 ± 0.25 9.14 ± 0.25
(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)
(W) Width 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20 2.03 ± 0.25 3.20 ± 0.20 6.40 ± 0.30 5.00 ± 0.40 6.35 ± 0.25 10.2 ± 0.25
(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)
(T) Thickness 1.30 1.52 1.70 2.03 2.54 2.54 3.30 2.54 2.54
Max. (0.051) (0.060) (0.067) (0.080) (0.100) (0.100) (0.130) (0.100) (0.100)
(t) terminal min. 0.50 ± 0.25 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.76 (0.030)
max. (0.020 ± 0.010) 0.75 (0.030) 0.75 (0.030) 1.02 (0.040) 1.02 (0.040) 1.02 (0.040) 1.02 (0.040) 1.02 (0.040) 1.52 (0.060)
High value, low leakage and small size are difficult parameters to obtain in
capacitors for high voltage systems. AVX special high voltage MLC chip
capacitors meet these performance characteristics and are designed for
applications such as snubbers in high frequency power converters,
resonators in SMPS, and high voltage coupling/dc blocking. These high
voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to make
high voltage MLC chip products. Special precautions must be taken in
applying these chips in surface mount assemblies. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak
temperature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors may
require protective surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either
thru-hole or SMT configurations (for details see section on high voltage
leaded MLC chips).
*Reflow Soldering Only
W
L
T
t
1808
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
3640
***
A
Voltage
600V/630V = C
1000V = A
1500V = S
2000V = G
2500V = W
3000V = H
4000V = J
5000V = K
A
Temperature
Coefficient
C0G = A
X7R = C
271
Capacitance Code
(2 significant digits
+ no. of zeros)
Examples:
10 pF = 100
100 pF = 101
1,000 pF = 102
22,000 pF = 223
220,000 pF = 224
1 μF = 105
K
Capacitance
Tolerance
C0G:J = ±5%
K = ±10%
M = ±20%
X7R:K = ±10%
M = ±20%
Z = +80%,
-20%
A
Test Level
A = Standard
1
Termination*
1 = Pd/Ag
T = Plated
Ni and Sn
(RoHS Compliant)
1
Packaging
1 = 7" Reel
3 = 13" Reel
9 = Bulk
A
Special
Code
A = Standard
*Note: Terminations with 5% minimum lead (Pb) is available, see pages 83 and 84 for LD style.
Leaded terminations are available, see pages 85 and 86.
NEW 630V RANGE
DIMENSIONS millimeters (inches)
82
VOLTAGE 0805 1206 1210 1808 1812 1825 2220 2225 3640
600/630 min. 10pF 10 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF 1000 pF 1000 pF
max. 330pF 1200 pF 2700 pF 3300 pF 5600 pF 0.012 μF 0.012 μF 0.018 μF 0.047 μF
min. 10pF 10 pF 10 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF 1000 pF
1000 max. 180pF 560 pF 1500 pF 2200 pF 3300 pF 8200 pF 0.010 μF 0.010 μF 0.022 μF
min. 10 pF 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF 100 pF
1500 max. 270 pF 680 pF 820 pF 1800 pF 4700 pF 4700 pF 5600 pF 0.010 μF
min. 10 pF 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF 100 pF
2000 max. 120 pF 270 pF 330 pF 1000 pF 1800 pF 2200 pF 2700 pF 6800 pF
min. 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF
2500 max. 180 pF 470 pF 1200 pF 1500 pF 1800 pF 3900 pF
min. 10 pF 10 pF 10 pF 10 pF 10 pF 100 pF
3000 max. 120 pF 330 pF 820 pF 1000 pF 1200 pF 2700 pF
min. 10 pF 10 pF 10 pF 10 pF 10 pF 100 pF
4000 max. 47 pF 150 pF 330 pF 470 pF 560 pF 1200 pF
min. 10 pF 10 pF 10 pF
5000 max. 220 pF 270 pF 820 pF
HIGH VOLTAGE C0G CAPACITANCE VALUES
VOLTAGE 0805 1206 1210 1808 1812 1825 2220 2225 3640
600/630 min. 100pF 1000 pF 1000 pF 1000 pF 1000 pF 0.010 μF 0.010 μF 0.010 μF 0.010 μF
max. 6800pF 0.022 μF 0.056 μF 0.068 μF 0.120 μF 0.270 μF 0.270 μF 0.330 μF 0.560 μF
min. 100pF 100 pF 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF 0.010 μF
1000 max. 1500pF 6800 pF 0.015 μF 0.018 μF 0.039 μF 0.100 μF 0.120 μF 0.150 μF 0.220 μF
min. 100 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF 1000 pF 1000 pF
1500 max. 2700 pF 5600 pF 6800 pF 0.015 μF 0.056 μF 0.056 μF 0.068 μF 0.100 μF
min. 10 pF 100 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF 1000 pF
2000 max. 1500 pF 3300 pF 3300 pF 8200 pF 0.022 μF 0.027 μF 0.033 μF 0.027 μF
min. 10 pF 10 pF 100 pF 100 pF 100 pF 1000 pF
2500 max. 2200 pF 5600 pF 0.015 μF 0.018 μF 0.022 μF 0.022 μF
min. 10 pF 10 pF 100 pF 100 pF 100 pF 1000 pF
3000 max. 1800 pF 3900 pF 0.010 μF 0.012 μF 0.015 μF 0.018 μF
min. 100 pF
4000 max. 6800 pF
min. 100 pF
5000 max. 3300 pF
HIGH VOLTAGE X7R MAXIMUM CAPACITANCE VALUES
X7R Dielectric
Performance Characteristics
Capacitance Range 10 pF to 0.047 μF
(25°C, 1.0 ±0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)
Capacitance Tolerances ±5%, ±10%, ±20%
Dissipation Factor 0.1% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)
Operating Temperature Range -55°C to +125°C
Temperature Characteristic 0 ±30 ppm/°C (0 VDC)
Voltage Ratings 600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)
Insulation Resistance (+25°C, at 500 VDC) 100K MΩ min. or 1000 MΩ - μF min., whichever is less
Insulation Resistance (+125°C, at 500 VDC) 10K MΩ min. or 100 MΩ - μF min., whichever is less
Dielectric Strength Minimum 120% rated voltage for 5 seconds at 50 mA max. current
C0G Dielectric
Performance Characteristics
Capacitance Range 10 pF to 0.56 μF (25°C, 1.0 ±0.2 Vrms at 1kHz)
Capacitance Tolerances ±10%; ±20%; +80%, -20%
Dissipation Factor 2.5% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz)
Operating Temperature Range -55°C to +125°C
Temperature Characteristic ±15% (0 VDC)
Voltage Ratings 600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)
Insulation Resistance (+25°C, at 500 VDC) 100K MΩ min. or 1000 MΩ - μF min., whichever is less
Insulation Resistance (+125°C, at 500 VDC) 10K MΩ min. or 100 MΩ - μF min., whichever is less
Dielectric Strength Minimum 120% rated voltage for 5 seconds at 50 mA max. current
High Voltage MLC Chips
For 600V to 5000V Applications
83
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
*** AVX offers nonstandard chip sizes. Contact factory for details.
* Reflow soldering only.
High Voltage MLC Chips
Tin/Lead Termination “B”
For 600V to 5000V Applications
HOW TO ORDER
AVX Corporation will support those customers for commercial and military
Multilayer Ceramic Capacitors with a termination consisting of 5% minimum
lead. This termination is indicated by the use of a “B” in the 12th position
of the AVX Catalog Part Number. This fulfills AVX’s commitment to providing
a full range of products to our customers. AVX has provided in the following
pages, a full range of values that we are offering in this “B” termination.
Larger physical sizes than normally encountered chips are used to make
high voltage MLC chip product. Special precautions must be taken in
applying these chips in surface mount assemblies. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak
temperature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors may
require protective surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either
thru-hole or SMT configurations (for details see section on high voltage
leaded MLC chips).
W
L
T
t
A
Temperature
Coefficient
C0G = A
X7R = C
271
Capacitance Code
(2 significant digits
+ no. of zeros)
Examples:
10 pF = 100
100 pF = 101
1,000 pF = 102
22,000 pF = 223
220,000 pF = 224
1 μF = 105
K
Capacitance
Tolerance
C0G: J = ±5%
K = ±10%
M = ±20%
X7R: K = ±10%
M = ±20%
Z = +80%, -20%
A
Test
Level
A = Standard
B
Termination
B = 5% Min Pb
1
Packaging
1 = 7" Reel
3 = 13" Reel
9 = Bulk
A
Special Code
A = Standard
A
Voltage
600V/630V = C
1000V = A
1500V = S
2000V = G
2500V = W
3000V = H
4000V = J
5000V = K
NEW 630V RANGE
LD08
AVX
Style
LD05 - 0805
LD06 - 1206
LD10 - 1210
LD08 - 1808
LD12 - 1812
LD13 - 1825
LD20 - 2220
LD14 - 2225
LD40 - 3640
***
SIZE LD05 (0805) LD06 (1206) LD10* (1210) LD08* (1808) LD12* (1812) LD13* (1825) LD20* (2220) LD14* (2225) LD40* (3640)
(L) Length 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20 4.57 ± 0.25 4.50 ± 0.30 4.50 ± 0.30 5.70 ± 0.40 5.72 ± 0.25 9.14 ± 0.25
(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)
(W) Width 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20 2.03 ± 0.25 3.20 ± 0.20 6.40 ± 0.30 5.00 ± 0.40 6.35 ± 0.25 10.2 ± 0.25
(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)
(T) Thickness 1.30 1.52 1.70 2.03 2.54 2.54 3.30 2.54 2.54
Max. (0.051) (0.060) (0.067) (0.080) (0.100) (0.100) (0.130) (0.100) (0.100)
(t) terminal min. 0.50 ± 0.25 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.76 (0.030)
max. (0.020 ± 0.010) 0.75 (0.030) 0.75 (0.030) 1.02 (0.040) 1.02 (0.040) 1.02 (0.040) 1.02 (0.040) 1.02 (0.040) 1.52 (0.060)
DIMENSIONS millimeters (inches)
Not RoHS Compliant
84
X7R Dielectric
Performance Characteristics
C0G Dielectric
Performance Characteristics
Capacitance Range 10 pF to 0.047 μF
(25°C, 1.0 ±0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)
Capacitance Tolerances ±5%, ±10%, ±20%
Dissipation Factor 0.1% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)
Operating Temperature Range -55°C to +125°C
Temperature Characteristic 0 ±30 ppm/°C (0 VDC)
Voltage Ratings 600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)
Insulation Resistance (+25°C, at 500 VDC) 100K MΩ min. or 1000 MΩ - μF min., whichever is less
Insulation Resistance (+125°C, at 500 VDC) 10K MΩ min. or 100 MΩ - μF min., whichever is less
Dielectric Strength Minimum 120% rated voltage for 5 seconds at 50 mA max. current
Capacitance Range 10 pF to 0.56 μF (25°C, 1.0 ±0.2 Vrms at 1kHz)
Capacitance Tolerances ±10%; ±20%; +80%, -20%
Dissipation Factor 2.5% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz)
Operating Temperature Range -55°C to +125°C
Temperature Characteristic ±15% (0 VDC)
Voltage Ratings 600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)
Insulation Resistance (+25°C, at 500 VDC) 100K MΩ min. or 1000 MΩ - μF min., whichever is less
Insulation Resistance (+125°C, at 500 VDC) 10K MΩ min. or 100 MΩ - μF min., whichever is less
Dielectric Strength Minimum 120% rated voltage for 5 seconds at 50 mA max. current
High Voltage MLC Chips
Tin/Lead Termination “B”
For 600V to 5000V Applications
VOLTAGE LD05 (0805) LD06 (1206) LD10 (1210) LD08 (1808) LD12 (1812) LD13 (1825) LD20 (2220) LD14 (2225) LD40 (3640)
600/630 min. 10pF 10 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF 1000 pF 1000 pF
max. 330pF 1200 pF 2700 pF 3300 pF 5600 pF 0.012 μF 0.012 μF 0.018 μF 0.047 μF
min. 10pF 10 pF 10 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF 1000 pF
1000 max. 180pF 560 pF 1500 pF 2200 pF 3300 pF 8200 pF 0.010 μF 0.010 μF 0.022 μF
min. 10 pF 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF 100 pF
1500 max. 270 pF 680 pF 820 pF 1800 pF 4700 pF 4700 pF 5600 pF 0.010 μF
min. 10 pF 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF 100 pF
2000 max. 120 pF 270 pF 330 pF 1000 pF 1800 pF 2200 pF 2700 pF 6800 pF
min. 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF
2500 max. 180 pF 470 pF 1200 pF 1500 pF 1800 pF 3900 pF
min. 10 pF 10 pF 10 pF 10 pF 10 pF 100 pF
3000 max. 120 pF 330 pF 820 pF 1000 pF 1200 pF 2700 pF
min. 10 pF 10 pF 10 pF 10 pF 10 pF 100 pF
4000 max. 47 pF 150 pF 330 pF 470 pF 560 pF 1200 pF
min. 10 pF 10 pF 10 pF
5000 max. 220 pF 270 pF 820 pF
HIGH VOLTAGE C0G CAPACITANCE VALUES
HIGH VOLTAGE X7R MAXIMUM CAPACITANCE VALUES
VOLTAGE 0805 1206 1210 1808 1812 1825 2220 2225 3640
600/630 min. 100pF 1000 pF 1000 pF 1000 pF 1000 pF 0.010 μF 0.010 μF 0.010 μF 0.010 μF
max. 6800pF 0.022 μF 0.056 μF 0.068 μF 0.120 μF 0.270 μF 0.270 μF 0.330 μF 0.560 μF
min. 100pF 100 pF 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF 0.010 μF
1000 max. 1500pF 6800 pF 0.015 μF 0.018 μF 0.039 μF 0.100 μF 0.120 μF 0.150 μF 0.220 μF
min. 100 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF 1000 pF 1000 pF
1500 max. 2700 pF 5600 pF 6800 pF 0.015 μF 0.056 μF 0.056 μF 0.068 μF 0.100 μF
min. 10 pF 100 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF 1000 pF
2000 max. 1500 pF 3300 pF 3300 pF 8200 pF 0.022 μF 0.027 μF 0.033 μF 0.027 μF
min. 10 pF 10 pF 100 pF 100 pF 100 pF 1000 pF
2500 max. 2200 pF 5600 pF 0.015 μF 0.018 μF 0.022 μF 0.022 μF
min. 10 pF 10 pF 100 pF 100 pF 100 pF 1000 pF
3000 max. 1800 pF 3900 pF 0.010 μF 0.012 μF 0.015 μF 0.018 μF
min. 100 pF
4000 max. 6800 pF
min. 100 pF
5000 max. 3300 pF
85
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
*** AVX offers nonstandard chip sizes. Contact factory for details.
High Voltage MLC Chips FLEXITERM®
For 600V to 3000V Applications
HOW TO ORDER
SIZE 0805 1206 1210* 1808* 1812* 1825* 2220* 2225*
(L) Length 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20 4.57 ± 0.25 4.50 ± 0.30 4.50 ± 0.30 5.7 ± 0.40 5.72 ± 0.25
(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010)
(W) Width 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20 2.03 ± 0.25 3.20 ± 0.20 6.40 ± 0.30 5.0 ± 0.40 6.35 ± 0.25
(0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010)
(T) Thickness 1.30 1.52 1.70 2.03 2.54 2.54 3.30 2.54
Max. (0.051) (0.060) (0.067) (0.080) (0.100) (0.100) (0.130) (0.100)
(t) terminal min. 0.50 ± 0.25 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010)
max. (0.020 ± 0.010) 0.75 (0.030) 0.75 (0.030) 1.02 (0.040) 1.02 (0.040) 1.02 (0.040) 1.02 (0.040) 1.02 (0.040)
High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC
chips capacitors meet these performance characteristics and are de-
signed for applications such as snubbers in high frequency power con-
verters, resonators in SMPS, and high voltage coupling/DC blocking.
These high voltage chip designs exhibit low ESRs at high frequencies.
To make high voltage chips, larger physical sizes than are normally en-
countered are necessary. These larger sizes require that special precau-
tions be taken in applying these chips in surface mount assemblies. In
response to this, and to follow from the success of the FLEXITERM®
range of low voltage parts, AVX is delighted to offer a FLEXITERM®high
voltage range of capacitors, FLEXITERM®.
The FLEXITERM®layer is designed to en-
hance the mechanical flexure and tem-
perature cycling performance of a
standard ceramic capacitor, giving cus-
tomers a solution where board flexure or
temperature cycle damage are concerns.
*Reflow Soldering Only
W
L
T
t
1808
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
***
A
Voltage
600V/630V = C
1000V = A
1500V = S
2000V = G
2500V = W
3000V = H
C
Temperature
Coefficient
C0G = A
X7R = C
272
Capacitance Code
(2 significant digits
+ no. of zeros)
Examples:
10 pF = 100
100 pF = 101
1,000 pF = 102
22,000 pF = 223
220,000 pF = 224
1 μF = 105
K
Capacitance
Tolerance
C0G: J = ±5%
K = ±10%
M = ±20%
X7R: K = ±10%
M = ±20%
Z = +80%,
-20%
A
Test Level
Z
Termination*
Z = FLEXITERM®
100% Tin
(RoHS Compliant)
1
Packaging
1 = 7" Reel
3 = 13" Reel
9 = Bulk
A
Special
Code
A = Standard
DIMENSIONS millimeters (inches)
LEAD-FREE COMPATIBLE
COMPONENT
86
VOLTAGE 0805 1206 1210 1808 1812 1825 2220 2225
600/630 min. 10pF 10 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF 1000 pF
max. 330pF 1200 pF 2700 pF 3300 pF 5600 pF 0.012 μF 0.012 μF 0.018 μF
min. 10pF 10 pF 10 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF
1000 max. 180pF 560 pF 1500 pF 2200 pF 3300 pF 8200 pF 0.010 μF 0.010 μF
min. 10 pF 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF
1500 max. 270 pF 680 pF 820 pF 1800 pF 4700 pF 4700 pF 5600 pF
min. 10 pF 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF
2000 max. 120 pF 270 pF 330 pF 1000 pF 1800 pF 2200 pF 2700 pF
min. 10 pF 10 pF 10 pF 100 pF 100 pF
2500 max. 180 pF 470 pF 1200 pF 1500 pF 1800 pF
min. 10 pF 10 pF 10 pF 10 pF 10 pF
3000 max. 120 pF 330 pF 820 pF 1000 pF 1200 pF
min. 10 pF 10 pF 10 pF 10 pF 10 pF
4000 max. 47 pF 150 pF 330 pF 470 pF 560 pF
min. 10 pF 10 pF
5000 max. 220 pF 270 pF
HIGH VOLTAGE C0G CAPACITANCE VALUES
HIGH VOLTAGE X7R MAXIMUM CAPACITANCE VALUES
X7R Dielectric
Performance Characteristics
Capacitance Range 10 pF to 0.018 μF
(25°C, 1.0 ±0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)
Capacitance Tolerances ±5%, ±10%, ±20%
Dissipation Factor 0.1% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)
Operating Temperature Range -55°C to +125°C
Temperature Characteristic 0 ±30 ppm/°C (0 VDC)
Voltage Ratings 600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)
Insulation Resistance (+25°C, at 500 VDC) 100K MΩ min. or 1000 MΩ - μF min., whichever is less
Insulation Resistance (+125°C, at 500 VDC) 10K MΩ min. or 100 MΩ - μF min., whichever is less
Dielectric Strength Minimum 120% rated voltage for 5 seconds at 50 mA max. current
Capacitance Range 10 pF to 0.33 μF (25°C, 1.0 ±0.2 Vrms at 1kHz)
Capacitance Tolerances ±10%; ±20%; +80%, -20%
Dissipation Factor 2.5% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz)
Operating Temperature Range -55°C to +125°C
Temperature Characteristic ±15% (0 VDC)
Voltage Ratings 600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)
Insulation Resistance (+25°C, at 500 VDC) 100K MΩ min. or 1000 MΩ - μF min., whichever is less
Insulation Resistance (+125°C, at 500 VDC) 10K MΩ min. or 100 MΩ - μF min., whichever is less
Dielectric Strength Minimum 120% rated voltage for 5 seconds at 50 mA max. current
High Voltage MLC Chips FLEXITERM®
For 600V to 5000V Applications
VOLTAGE 0805 1206 1210 1808 1812 1825 2220 2225
600/630 min. 100pF 1000 pF 1000 pF 1000 pF 1000 pF 0.010 μF 0.010 μF 0.010 μF
max. 6800pF 0.022 μF 0.056 μF 0.068 μF 0.120 μF 0.270 μF 0.270 μF 0.330 μF
min. 100pF 100 pF 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF
1000 max. 1500pF 6800 pF 0.015 μF 0.018 μF 0.039 μF 0.100 μF 0.120 μF 0.150 μF
min. 100 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF 1000 pF
1500 max. 2700 pF 5600 pF 6800 pF 0.015 μF 0.056 μF 0.056 μF 0.068 μF
min. 10 pF 100 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF
2000 max. 1500 pF 3300 pF 3300 pF 8200 pF 0.022 μF 0.027 μF 0.033 μF
min. 10 pF 10 pF 100 pF 100 pF 100 pF
2500 max. 2200 pF 5600 pF 0.015 μF 0.018 μF 0.022 μF
min. 10 pF 10 pF 100 pF 100 pF 100 pF
3000 max. 1800 pF 3900 pF 0.010 pF 0.012 μF 0.015 μF
C0G Dielectric
Performance Characteristics
87
MIL-PRF-55681/Chips
Part Number Example
CDR01 thru CDR06
T
W
L
Dt
MILITARY DESIGNATION PER MIL-PRF-55681
Part Number Example
CDR01 BP 101 B K S M
MIL Style
Voltage-temperature
Limits
Capacitance
Rated Voltage
Capacitance Tolerance
Termination Finish
Failure Rate
MIL Style: CDR01, CDR02, CDR03, CDR04, CDR05,
CDR06
Voltage Temperature Limits:
BP = 0 ± 30 ppm/°C without voltage; 0 ± 30 ppm/°C with
rated voltage from -55°C to +125°C
BX = ±15% without voltage; +15 –25% with rated voltage
from -55°C to +125°C
Capacitance: Two digit figures followed by multiplier
(number of zeros to be added) e.g., 101 = 100 pF
Rated Voltage: A = 50V, B = 100V
Capacitance Tolerance: J ± 5%, K ± 10%, M ± 20%
Termination Finish:
M = Palladium Silver U = Base Metallization/Barrier
N = Silver Nickel Gold Metal/Solder Coated*
S = Solder-coated W = Base Metallization/Barrier
Metal/Tinned (Tin or Tin/
Lead Alloy)
*Solder shall have a melting point of 200°C or less.
Failure Rate Level: M = 1.0%, P = .1%, R = .01%,
S = .001%
Packaging: Bulk is standard packaging. Tape and reel
per RS481 is available upon request.
CROSS REFERENCE: AVX/MIL-PRF-55681/CDR01 THRU CDR06*
Per AVX Length (L) Width (W) Thickness (T) D Termination Band (t)
MIL-PRF-55681 Style Min. Max. Min. Max. Min. Max.
CDR01 0805 .080 ± .015 .050 ± .015 .022 .055 .030 .010
CDR02 1805 .180 ± .015 .050 ± .015 .022 .055 .010 .030
CDR03 1808 .180 ± .015 .080 ± .018 .022 .080 .010 .030
CDR04 1812 .180 ± .015 .125 ± .015 .022 .080 .010 .030
CDR05 1825 .180 +.020 .250 +.020 .020 .080 .010 .030
-.015 -.015
CDR06 2225 .225 ± .020 .250 ± .020 .020 .080 .010 .030
*For CDR11, 12, 13, and 14 see AVX Microwave Chip Capacitor Catalog
NOTE: Contact factory for availability of Termination and Tolerance Options for
Specific Part Numbers.
Not RoHS Compliant
88
MIL-PRF-55681/Chips
Military Part Number Identification
CDR01 thru CDR06
CDR01 thru CDR06 to MIL-PRF-55681
Military Rated temperature WVDC
Type Capacitance Capacitance and voltage-
Designation in pF tolerance temperature limits
AVX Style 0805/CDR01
CDR01BP100B--- 10 J,K BP 100
CDR01BP120B--- 12 J BP 100
CDR01BP150B--- 15 J,K BP 100
CDR01BP180B--- 18 J BP 100
CDR01BP220B--- 22 J,K BP 100
CDR01BP270B--- 27 J BP 100
CDR01BP330B--- 33 J,K BP 100
CDR01BP390B--- 39 J BP 100
CDR01BP470B--- 47 J,K BP 100
CDR01BP560B--- 56 J BP 100
CDR01BP680B--- 68 J,K BP 100
CDR01BP820B--- 82 J BP 100
CDR01BP101B--- 100 J,K BP 100
CDR01B--121B--- 120 J,K BP,BX 100
CDR01B--151B--- 150 J,K BP,BX 100
CDR01B--181B--- 180 J,K BP,BX 100
CDR01BX221B--- 220 K,M BX 100
CDR01BX271B--- 270 K BX 100
CDR01BX331B--- 330 K,M BX 100
CDR01BX391B--- 390 K BX 100
CDR01BX471B--- 470 K,M BX 100
CDR01BX561B--- 560 K BX 100
CDR01BX681B--- 680 K,M BX 100
CDR01BX821B--- 820 K BX 100
CDR01BX102B--- 1000 K,M BX 100
CDR01BX122B--- 1200 K BX 100
CDR01BX152B--- 1500 K,M BX 100
CDR01BX182B--- 1800 K BX 100
CDR01BX222B--- 2200 K,M BX 100
CDR01BX272B--- 2700 K BX 100
CDR01BX332B--- 3300 K,M BX 100
CDR01BX392A--- 3900 K BX 50
CDR01BX472A--- 4700 K,M BX 50
AVX Style 1805/CDR02
CDR02BP221B--- 220 J,K BP 100
CDR02BP271B--- 270 J BP 100
CDR02BX392B--- 3900 K BX 100
CDR02BX472B--- 4700 K,M BX 100
CDR02BX562B--- 5600 K BX 100
CDR02BX682B--- 6800 K,M BX 100
CDR02BX822B--- 8200 K BX 100
CDR02BX103B--- 10,000 K,M BX 100
CDR02BX123A--- 12,000 K BX 50
CDR02BX153A--- 15,000 K,M BX 50
CDR02BX183A--- 18,000 K BX 50
CDR02BX223A--- 22,000 K,M BX 50
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
Military Rated temperature WVDC
Type Capacitance Capacitance and voltage-
Designation in pF tolerance temperature limits
AVX Style 1808/CDR03
CDR03BP331B--- 330 J,K BP 100
CDR03BP391B--- 390 J BP 100
CDR03BP471B--- 470 J,K BP 100
CDR03BP561B--- 560 J BP 100
CDR03BP681B--- 680 J,K BP 100
CDR03BP821B-- 820 J BP 100
CDR03BP102B--- 1000 J,K BP 100
CDR03BX123B-- 12,000 K BX 100
CDR03BX153B--- 15,000 K,M BX 100
CDR03BX183B--- 18,000 K BX 100
CDR03BX223B--- 22,000 K,M BX 100
CDR03BX273B--- 27,000 K BX 100
CDR03BX333B--- 33,000 K,M BX 100
CDR03BX393A--- 39,000 K BX 50
CDR03BX473A--- 47,000 K,M BX 50
CDR03BX563A--- 56,000 K BX 50
CDR03BX683A--- 68,000 K,M BX 50
AVX Style 1812/CDR04
CDR04BP122B--- 1200 J BP 100
CDR04BP152B--- 1500 J,K BP 100
CDR04BP182B--- 1800 J BP 100
CDR04BP222B--- 2200 J,K BP 100
CDR04BP272B--- 2700 J BP 100
CDR04BP332B--- 3300 J,K BP 100
CDR04BX393B--- 39,000 K BX 100
CDR04BX473B--- 47,000 K,M BX 100
CDR04BX563B--- 56,000 K BX 100
CDR04BX823A--- 82,000 K BX 50
CDR04BX104A--- 100,000 K,M BX 50
CDR04BX124A--- 120,000 K BX 50
CDR04BX154A--- 150,000 K,M BX 50
CDR04BX184A--- 180,000 K BX 50
AVX Style 1825/CDR05
CDR05BP392B--- 3900 J,K BP 100
CDR05BP472B--- 4700 J,K BP 100
CDR05BP562B--- 5600 J,K BP 100
CDR05BX683B--- 68,000 K,M BX 100
CDR05BX823B--- 82,000 K BX 100
CDR05BX104B--- 100,000 K,M BX 100
CDR05BX124B--- 120,000 K BX 100
CDR05BX154B--- 150,000 K,M BX 100
CDR05BX224A--- 220,000 K,M BX 50
CDR05BX274A--- 270,000 K BX 50
CDR05BX334A--- 330,000 K,M BX 50
AVX Style 2225/CDR06
CDR06BP682B--- 6800 J,K BP 100
CDR06BP822B--- 8200 J,K BP 100
CDR06BP103B--- 10,000 J,K BP 100
CDR06BX394A--- 390,000 K BX 50
CDR06BX474A--- 470,000 K,M BX 50
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
89
MIL-PRF-55681/Chips
Part Number Example
CDR31 thru CDR35
T
W
L
Dt
MILITARY DESIGNATION PER MIL-PRF-55681
Part Number Example
(example) CDR31 BP 101 B K S M
MIL Style
Voltage-temperature
Limits
Capacitance
Rated Voltage
Capacitance Tolerance
Termination Finish
Failure Rate
MIL Style: CDR31, CDR32, CDR33, CDR34, CDR35
Voltage Temperature Limits:
BP = 0 ± 30 ppm/°C without voltage; 0 ± 30 ppm/°C with
rated voltage from -55°C to +125°C
BX = ±15% without voltage; +15 –25% with rated voltage
from -55°C to +125°C
Capacitance: Two digit figures followed by multiplier
(number of zeros to be added) e.g., 101 = 100 pF
Rated Voltage: A = 50V, B = 100V
Capacitance Tolerance: B ± .10 pF, C ± .25 pF, D ± .5
pF, F ± 1%, J ± 5%, K ± 10%,
M ± 20%
Termination Finish:
M = Palladium Silver U = Base Metallization/Barrier
N = Silver Nickel Gold Metal/Solder Coated*
S = Solder-coated W = Base Metallization/Barrier
Y = 100% Tin Metal/Tinned (Tin or Tin/
Lead Alloy)
*Solder shall have a melting point of 200°C or less.
Failure Rate Level: M = 1.0%, P = .1%, R = .01%,
S = .001%
Packaging: Bulk is standard packaging. Tape and reel
per RS481 is available upon request.
Per MIL-PRF-55681 AVX Length (L) Width (W) Thickness (T) D Termination Band (t)
(Metric Sizes) Style (mm) (mm) Max. (mm) Min. (mm) Max. (mm) Min. (mm)
CDR31 0805 2.00 1.25 1.3 .50 .70 .30
CDR32 1206 3.20 1.60 1.3 .70 .30
CDR33 1210 3.20 2.50 1.5 .70 .30
CDR34 1812 4.50 3.20 1.5 .70 .30
CDR35 1825 4.50 6.40 1.5 .70 .30
NOTE: Contact factory for availability of Termination and Tolerance Options for
Specific Part Numbers.
CROSS REFERENCE: AVX/MIL-PRF-55681/CDR31 THRU CDR35
Not RoHS Compliant
90
MIL-PRF-55681/Chips
Military Part Number Identification CDR31
CDR31 to MIL-PRF-55681/7
Military Rated temperature WVDC
Type Capacitance Capacitance and voltage-
Designation 1/in pF tolerance temperature limits
AVX Style 0805/CDR31 (BP)
CDR31BP1R0B--- 1.0 B,C BP 100
CDR31BP1R1B--- 1.1 B,C BP 100
CDR31BP1R2B--- 1.2 B,C BP 100
CDR31BP1R3B--- 1.3 B,C BP 100
CDR31BP1R5B--- 1.5 B,C BP 100
CDR31BP1R6B--- 1.6 B,C BP 100
CDR31BP1R8B--- 1.8 B,C BP 100
CDR31BP2R0B--- 2.0 B,C BP 100
CDR31BP2R2B--- 2.2 B,C BP 100
CDR31BP2R4B--- 2.4 B,C BP 100
CDR31BP2R7B--- 2.7 B,C,D BP 100
CDR31BP3R0B--- 3.0 B,C,D BP 100
CDR31BP3R3B--- 3.3 B,C,D BP 100
CDR31BP3R6B--- 3.6 B,C,D BP 100
CDR31BP3R9B--- 3.9 B,C,D BP 100
CDR31BP4R3B--- 4.3 B,C,D BP 100
CDR31BP4R7B--- 4.7 B,C,D BP 100
CDR31BP5R1B--- 5.1 B,C,D BP 100
CDR31BP5R6B--- 5.6 B,C,D BP 100
CDR31BP6R2B--- 6.2 B,C,D BP 100
CDR31BP6R8B--- 6.8 B,C,D BP 100
CDR31BP7R5B--- 7.5 B,C,D BP 100
CDR31BP8R2B--- 8.2 B,C,D BP 100
CDR31BP9R1B--- 9.1 B,C,D BP 100
CDR31BP100B--- 10 F,J,K BP 100
CDR31BP110B--- 11 F,J,K BP 100
CDR31BP120B--- 12 F,J,K BP 100
CDR31BP130B--- 13 F,J,K BP 100
CDR31BP150B--- 15 F,J,K BP 100
CDR31BP160B--- 16 F,J,K BP 100
CDR31BP180B--- 18 F,J,K BP 100
CDR31BP200B--- 20 F,J,K BP 100
CDR31BP220B--- 22 F,J,K BP 100
CDR31BP240B--- 24 F,J,K BP 100
CDR31BP270B--- 27 F,J,K BP 100
CDR31BP300B--- 30 F,J,K BP 100
CDR31BP330B--- 33 F,J,K BP 100
CDR31BP360B--- 36 F,J,K BP 100
CDR31BP390B--- 39 F,J,K BP 100
CDR31BP430B--- 43 F,J,K BP 100
CDR31BP470B--- 47 F,J,K BP 100
CDR31BP510B--- 51 F,J,K BP 100
CDR31BP560B--- 56 F,J,K BP 100
CDR31BP620B--- 62 F,J,K BP 100
CDR31BP680B--- 68 F,J,K BP 100
CDR31BP750B--- 75 F,J,K BP 100
CDR31BP820B--- 82 F,J,K BP 100
CDR31BP910B--- 91 F,J,K BP 100
Military Rated temperature WVDC
Type Capacitance Capacitance and voltage-
Designation 1/in pF tolerance temperature limits
AVX Style 0805/CDR31 (BP) cont’d
CDR31BP101B--- 100 F,J,K BP 100
CDR31BP111B--- 110 F,J,K BP 100
CDR31BP121B--- 120 F,J,K BP 100
CDR31BP131B--- 130 F,J,K BP 100
CDR31BP151B--- 150 F,J,K BP 100
CDR31BP161B--- 160 F,J,K BP 100
CDR31BP181B--- 180 F,J,K BP 100
CDR31BP201B--- 200 F,J,K BP 100
CDR31BP221B--- 220 F,J,K BP 100
CDR31BP241B--- 240 F,J,K BP 100
CDR31BP271B--- 270 F,J,K BP 100
CDR31BP301B--- 300 F,J,K BP 100
CDR31BP331B--- 330 F,J,K BP 100
CDR31BP361B--- 360 F,J,K BP 100
CDR31BP391B--- 390 F,J,K BP 100
CDR31BP431B--- 430 F,J,K BP 100
CDR31BP471B--- 470 F,J,K BP 100
CDR31BP511A--- 510 F,J,K BP 50
CDR31BP561A--- 560 F,J,K BP 50
CDR31BP621A--- 620 F,J,K BP 50
CDR31BP681A--- 680 F,J,K BP 50
AVX Style 0805/CDR31 (BX)
CDR31BX471B--- 470 K,M BX 100
CDR31BX561B--- 560 K,M BX 100
CDR31BX681B--- 680 K,M BX 100
CDR31BX821B--- 820 K,M BX 100
CDR31BX102B--- 1,000 K,M BX 100
CDR31BX122B--- 1,200 K,M BX 100
CDR31BX152B--- 1,500 K,M BX 100
CDR31BX182B--- 1,800 K,M BX 100
CDR31BX222B--- 2,200 K,M BX 100
CDR31BX272B--- 2,700 K,M BX 100
CDR31BX332B--- 3,300 K,M BX 100
CDR31BX392B--- 3,900 K,M BX 100
CDR31BX472B--- 4,700 K,M BX 100
CDR31BX562A--- 5,600 K,M BX 50
CDR31BX682A--- 6,800 K,M BX 50
CDR31BX822A--- 8,200 K,M BX 50
CDR31BX103A--- 10,000 K,M BX 50
CDR31BX123A--- 12,000 K,M BX 50
CDR31BX153A--- 15,000 K,M BX 50
CDR31BX183A--- 18,000 K,M BX 50
1/ The complete part number will include additional symbols to indicate capacitance
tolerance, termination and failure rate level.
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
91
MIL-PRF-55681/Chips
Military Part Number Identification CDR32
CDR32 to MIL-PRF-55681/8
Military Rated temperature WVDC
Type Capacitance Capacitance and voltage-
Designation 1/in pF tolerance temperature limits
AVX Style 1206/CDR32 (BP)
CDR32BP1R0B--- 1.0 B,C BP 100
CDR32BP1R1B--- 1.1 B,C BP 100
CDR32BP1R2B--- 1.2 B,C BP 100
CDR32BP1R3B--- 1.3 B,C BP 100
CDR32BP1R5B--- 1.5 B,C BP 100
CDR32BP1R6B--- 1.6 B,C BP 100
CDR32BP1R8B--- 1.8 B,C BP 100
CDR32BP2R0B--- 2.0 B,C BP 100
CDR32BP2R2B--- 2.2 B,C BP 100
CDR32BP2R4B--- 2.4 B,C BP 100
CDR32BP2R7B--- 2.7 B,C,D BP 100
CDR32BP3R0B--- 3.0 B,C,D BP 100
CDR32BP3R3B--- 3.3 B,C,D BP 100
CDR32BP3R6B--- 3.6 B,C,D BP 100
CDR32BP3R9B--- 3.9 B,C,D BP 100
CDR32BP4R3B--- 4.3 B,C,D BP 100
CDR32BP4R7B--- 4.7 B,C,D BP 100
CDR32BP5R1B--- 5.1 B,C,D BP 100
CDR32BP5R6B--- 5.6 B,C,D BP 100
CDR32BP6R2B--- 6.2 B,C,D BP 100
CDR32BP6R8B--- 6.8 B,C,D BP 100
CDR32BP7R5B--- 7.5 B,C,D BP 100
CDR32BP8R2B--- 8.2 B,C,D BP 100
CDR32BP9R1B--- 9.1 B,C,D BP 100
CDR32BP100B--- 10 F,J,K BP 100
CDR32BP110B--- 11 F,J,K BP 100
CDR32BP120B--- 12 F,J,K BP 100
CDR32BP130B--- 13 F,J,K BP 100
CDR32BP150B--- 15 F,J,K BP 100
CDR32BP160B--- 16 F,J,K BP 100
CDR32BP180B--- 18 F,J,K BP 100
CDR32BP200B--- 20 F,J,K BP 100
CDR32BP220B--- 22 F,J,K BP 100
CDR32BP240B--- 24 F,J,K BP 100
CDR32BP270B--- 27 F,J,K BP 100
CDR32BP300B--- 30 F,J,K BP 100
CDR32BP330B--- 33 F,J,K BP 100
CDR32BP360B--- 36 F,J,K BP 100
CDR32BP390B--- 39 F,J,K BP 100
CDR32BP430B--- 43 F,J,K BP 100
CDR32BP470B--- 47 F,J,K BP 100
CDR32BP510B--- 51 F,J,K BP 100
CDR32BP560B--- 56 F,J,K BP 100
CDR32BP620B--- 62 F,J,K BP 100
CDR32BP680B--- 68 F,J,K BP 100
CDR32BP750B--- 75 F,J,K BP 100
CDR32BP820B--- 82 F,J,K BP 100
CDR32BP910B--- 91 F,J,K BP 100
Military Rated temperature WVDC
Type Capacitance Capacitance and voltage-
Designation 1/in pF tolerance temperature limits
AVX Style 1206/CDR32 (BP) cont’d
CDR32BP101B--- 100 F,J,K BP 100
CDR32BP111B--- 110 F,J,K BP 100
CDR32BP121B--- 120 F,J,K BP 100
CDR32BP131B--- 130 F,J,K BP 100
CDR32BP151B--- 150 F,J,K BP 100
CDR32BP161B--- 160 F,J,K BP 100
CDR32BP181B--- 180 F,J,K BP 100
CDR32BP201B--- 200 F,J,K BP 100
CDR32BP221B--- 220 F,J,K BP 100
CDR32BP241B--- 240 F,J,K BP 100
CDR32BP271B--- 270 F,J,K BP 100
CDR32BP301B--- 300 F,J,K BP 100
CDR32BP331B--- 330 F,J,K BP 100
CDR32BP361B--- 360 F,J,K BP 100
CDR32BP391B--- 390 F,J,K BP 100
CDR32BP431B--- 430 F,J,K BP 100
CDR32BP471B--- 470 F,J,K BP 100
CDR32BP511B--- 510 F,J,K BP 100
CDR32BP561B--- 560 F,J,K BP 100
CDR32BP621B--- 620 F,J,K BP 100
CDR32BP681B--- 680 F,J,K BP 100
CDR32BP751B--- 750 F,J,K BP 100
CDR32BP821B--- 820 F,J,K BP 100
CDR32BP911B--- 910 F,J,K BP 100
CDR32BP102B--- 1,000 F,J,K BP 100
CDR32BP112A--- 1,100 F,J,K BP 50
CDR32BP122A--- 1,200 F,J,K BP 50
CDR32BP132A--- 1,300 F,J,K BP 50
CDR32BP152A--- 1,500 F,J,K BP 50
CDR32BP162A--- 1,600 F,J,K BP 50
CDR32BP182A--- 1,800 F,J,K BP 50
CDR32BP202A--- 2,000 F,J,K BP 50
CDR32BP222A--- 2,200 F,J,K BP 50
AVX Style 1206/CDR32 (BX)
CDR32BX472B--- 4,700 K,M BX 100
CDR32BX562B--- 5,600 K,M BX 100
CDR32BX682B--- 6,800 K,M BX 100
CDR32BX822B--- 8,200 K,M BX 100
CDR32BX103B--- 10,000 K,M BX 100
CDR32BX123B--- 12,000 K,M BX 100
CDR32BX153B--- 15,000 K,M BX 100
CDR32BX183A--- 18,000 K,M BX 50
CDR32BX223A--- 22,000 K,M BX 50
CDR32BX273A--- 27,000 K,M BX 50
CDR32BX333A--- 33,000 K,M BX 50
CDR32BX393A--- 39,000 K,M BX 50
1/ The complete part number will include additional symbols to indicate capacitance
tolerance, termination and failure rate level.
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
92
MIL-PRF-55681/Chips
Military Part Number Identification CDR33/34/35
CDR33/34/35 to MIL-PRF-55681/9/10/11
Military Rated temperature WVDC
Type Capacitance Capacitance and voltage-
Designation 1/in pF tolerance temperature limits
AVX Style 1210/CDR33 (BP)
CDR33BP102B--- 1,000 F,J,K BP 100
CDR33BP112B--- 1,100 F,J,K BP 100
CDR33BP122B--- 1,200 F,J,K BP 100
CDR33BP132B--- 1,300 F,J,K BP 100
CDR33BP152B--- 1,500 F,J,K BP 100
CDR33BP162B--- 1,600 F,J,K BP 100
CDR33BP182B--- 1,800 F,J,K BP 100
CDR33BP202B--- 2,000 F,J,K BP 100
CDR33BP222B--- 2,200 F,J,K BP 100
CDR33BP242A--- 2,400 F,J,K BP 50
CDR33BP272A--- 2,700 F,J,K BP 50
CDR33BP302A--- 3,000 F,J,K BP 50
CDR33BP332A--- 3,300 F,J,K BP 50
AVX Style 1210/CDR33 (BX)
CDR33BX153B--- 15,000 K,M BX 100
CDR33BX183B--- 18,000 K,M BX 100
CDR33BX223B--- 22,000 K,M BX 100
CDR33BX273B--- 27,000 K,M BX 100
CDR33BX393A--- 39,000 K,M BX 50
CDR33BX473A--- 47,000 K,M BX 50
CDR33BX563A--- 56,000 K,M BX 50
CDR33BX683A--- 68,000 K,M BX 50
CDR33BX823A--- 82,000 K,M BX 50
CDR33BX104A--- 100,000 K,M BX 50
AVX Style 1812/CDR34 (BP)
CDR34BP222B--- 2,200 F,J,K BP 100
CDR34BP242B--- 2,400 F,J,K BP 100
CDR34BP272B--- 2,700 F,J,K BP 100
CDR34BP302B--- 3,000 F,J,K BP 100
CDR34BP332B--- 3,300 F,J,K BP 100
CDR34BP362B--- 3,600 F,J,K BP 100
CDR34BP392B--- 3,900 F,J,K BP 100
CDR34BP432B--- 4,300 F,J,K BP 100
CDR34BP472B--- 4,700 F,J,K BP 100
CDR34BP512A--- 5,100 F,J,K BP 50
CDR34BP562A--- 5,600 F,J,K BP 50
CDR34BP622A--- 6,200 F,J,K BP 50
CDR34BP682A--- 6,800 F,J,K BP 50
CDR34BP752A--- 7,500 F,J,K BP 50
CDR34BP822A--- 8,200 F,J,K BP 50
CDR34BP912A--- 9,100 F,J,K BP 50
CDR34BP103A--- 10,000 F,J,K BP 50
Military Rated temperature WVDC
Type Capacitance Capacitance and voltage-
Designation 1/in pF tolerance temperature limits
AVX Style 1812/CDR34 (BX)
CDR34BX273B--- 27,000 K,M BX 100
CDR34BX333B--- 33,000 K,M BX 100
CDR34BX393B--- 39,000 K,M BX 100
CDR34BX473B--- 47,000 K,M BX 100
CDR34BX563B--- 56,000 K,M BX 100
CDR34BX104A--- 100,000 K,M BX 50
CDR34BX124A--- 120,000 K,M BX 50
CDR34BX154A--- 150,000 K,M BX 50
CDR34BX184A--- 180,000 K,M BX 50
AVX Style 1825/CDR35 (BP)
CDR35BP472B--- 4,700 F,J,K BP 100
CDR35BP512B--- 5,100 F,J,K BP 100
CDR35BP562B--- 5,600 F,J,K BP 100
CDR35BP622B--- 6,200 F,J,K BP 100
CDR35BP682B--- 6,800 F,J,K BP 100
CDR35BP752B--- 7,500 F,J,K BP 100
CDR35BP822B--- 8,200 F,J,K BP 100
CDR35BP912B--- 9,100 F,J,K BP 100
CDR35BP103B--- 10,000 F,J,K BP 100
CDR35BP113A--- 11,000 F,J,K BP 50
CDR35BP123A--- 12,000 F,J,K BP 50
CDR35BP133A--- 13,000 F,J,K BP 50
CDR35BP153A--- 15,000 F,J,K BP 50
CDR35BP163A--- 16,000 F,J,K BP 50
CDR35BP183A--- 18,000 F,J,K BP 50
CDR35BP203A--- 20,000 F,J,K BP 50
CDR35BP223A--- 22,000 F,J,K BP 50
AVX Style 1825/CDR35 (BX)
CDR35BX563B--- 56,000 K,M BX 100
CDR35BX683B--- 68,000 K,M BX 100
CDR35BX823B--- 82,000 K,M BX 100
CDR35BX104B--- 100,000 K,M BX 100
CDR35BX124B--- 120,000 K,M BX 100
CDR35BX154B--- 150,000 K,M BX 100
CDR35BX184A--- 180,000 K,M BX 50
CDR35BX224A--- 220,000 K,M BX 50
CDR35BX274A--- 270,000 K,M BX 50
CDR35BX334A--- 330,000 K,M BX 50
CDR35BX394A--- 390,000 K,M BX 50
CDR35BX474A--- 470,000 K,M BX 50
1/ The complete part number will include additional symbols to indicate capacitance
tolerance, termination and failure rate level.
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
93
Packaging of Chip Components
Automatic Insertion Packaging
TAPE & REEL QUANTITIES
All tape and reel specifications are in compliance with RS481.
8mm 12mm
Paper or Embossed Carrier 0612, 0508, 0805, 1206,
1210
Embossed Only 1812, 1825
1808 2220, 2225
Paper Only 0201, 0306, 0402, 0603
Qty. per Reel/7" Reel 2,000, 3,000 or 4,000, 10,000, 15,000 3,000 500, 1,000
Contact factory for exact quantity Contact factory for exact quantity
Qty. per Reel/13" Reel 5,000, 10,000, 50,000 10,000 4,000
Contact factory for exact quantity
REEL DIMENSIONS
Tape A B* CD* N W1W2W3
Size(1) Max. Min. Min. Min. Max.
7.90 Min.
8mm 14.4 (0.311)
(0.567) 10.9 Max.
330 1.5 20.2 50.0 (0.429)
(12.992) (0.059) (0.795) (1.969) 11.9 Min.
12mm 18.4 (0.469)
(0.724) 15.4 Max.
(0.607)
Metric dimensions will govern.
English measurements rounded and for reference only.
(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.
13.0 +0.50
-0.20
(0.512 +0.020)-0.008
8.40 +1.5
-0.0
(0.331 +0.059 )-0.0
12.4 +2.0
-0.0
(0.488 +0.079 )-0.0
94
Tape Size B1D1E2FP
1RT
2WA
0 B0 K0
Max. Min. Min. Min. Max.
See Note 5 See Note 2
8mm 4.35 1.00 6.25 3.50 ± 0.05 4.00 ± 0.10 25.0 2.50 Max. 8.30 See Note 1
(0.171) (0.039) (0.246) (0.138 ± 0.002) (0.157 ± 0.004) (0.984) (0.098) (0.327)
12mm 8.20 1.50 10.25 5.50 ± 0.05 4.00 ± 0.10 30.0 6.50 Max. 12.3 See Note 1
(0.323) (0.059) (0.404) (0.217 ± 0.002) (0.157 ± 0.004) (1.181) (0.256) (0.484)
8mm 4.35 1.00 6.25 3.50 ± 0.05 2.00 ± 0.10 25.0 2.50 Max. 8.30 See Note 1
1/2 Pitch (0.171) (0.039) (0.246) (0.138 ± 0.002) (0.079 ± 0.004) (0.984) (0.098) (0.327)
12mm 8.20 1.50 10.25 5.50 ± 0.05 8.00 ± 0.10 30.0 6.50 Max. 12.3 See Note 1
Double (0.323) (0.059) (0.404) (0.217 ± 0.002) (0.315 ± 0.004) (1.181) (0.256) (0.484)
Pitch
Embossed Carrier Configuration
8 & 12mm Tape Only
P0
B0
P1
P2
D0
T2
T
TOP COVER
TAPE
DEFORMATION
BETWEEN
EMBOSSMENTS
CENTER LINES
OF CAVITY MAX. CAVITY
SIZE - SEE NOTE 1
D1 FOR COMPONENTS
2.00 mm x 1.20 mm AND
LARGER (0.079 x 0.047)
10 PITCHES CUMULATIVE
TOLERANCE ON TAPE
±0.2mm (±0.008)
B1
E1
F
EMBOSSMENT
User Direction of Feed
E2W
K0
T1
S1
A0
B1 IS FOR TAPE READER REFERENCE ONLY
INCLUDING DRAFT CONCENTRIC AROUND B0
8 & 12mm Embossed Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONS
VARIABLE DIMENSIONS
NOTES:
1. The cavity defined by A0, B0, and K0shall be configured to provide the following:
Surround the component with sufficient clearance such that:
a) the component does not protrude beyond the sealing plane of the cover tape.
b) the component can be removed from the cavity in a vertical direction without mechanical
restriction, after the cover tape has been removed.
c) rotation of the component is limited to 20º maximum (see Sketches D & E).
d) lateral movement of the component is restricted to 0.5mm maximum (see Sketch F).
2. Tape with or without components shall pass around radius “R” without damage.
3. Bar code labeling (if required) shall be on the side of the reel opposite the round sprocket holes.
Refer to EIA-556.
4. B1dimension is a reference dimension for tape feeder clearance only.
5. If P1= 2.0mm, the tape may not properly index in all tape feeders.
Tape Size D0EP
0P2S1 Min. T Max. T1
8mm 1.75 ± 0.10 4.0 ± 0.10 2.0 ± 0.05 0.60 0.60 0.10
and (0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002) (0.024) (0.024) (0.004)
12mm Max.
0.50mm (0.020)
Maximum
0.50mm (0.020)
Maximum
Top View, Sketch "F"�
Component Lateral Movements
Chip Orientation
1.50 +0.10
-0.0
(0.059 +0.004 )-0.0
95
Tape Size P1 E2 Min. F W A0 B0T
See Note 4
8mm 4.00 ± 0.10 6.25 3.50 ± 0.05 See Note 1
(0.157 ± 0.004) (0.246) (0.138 ± 0.002)
12mm 4.00 ± 0.010 10.25 5.50 ± 0.05 12.0 ± 0.30
(0.157 ± 0.004) (0.404) (0.217 ± 0.002) (0.472 ± 0.012)
8mm 2.00 ± 0.05 6.25 3.50 ± 0.05
1/2 Pitch (0.079 ± 0.002) (0.246) (0.138 ± 0.002)
12mm 8.00 ± 0.10 10.25 5.50 ± 0.05 12.0 ± 0.30
Double (0.315 ± 0.004) (0.404) (0.217 ± 0.002) (0.472 ± 0.012)
Pitch
Paper Carrier Configuration
8 & 12mm Tape Only
P0
B0
P1
P2
D0
T
TOP
COVER
TAPE
BOTTOM
COVER
TAPE
CENTER LINES
OF CAVITY
CAVITY SIZE
SEE NOTE 1
10 PITCHES CUMULATIVE
TOLERANCE ON TAPE
±0.20mm (±0.008)
E1
F
G
User Direction of Feed
E2W
T1
T1A0
8 & 12mm Paper Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size D0EP
0P2T1G. Min. R Min.
8mm 1.75 ± 0.10 4.00 ± 0.10 2.00 ± 0.05 0.10 0.75 25.0 (0.984)
and (0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002) (0.004) (0.030) See Note 2
12mm Max. Min. Min.
VARIABLE DIMENSIONS
1.10mm
(0.043) Max.
for Paper Base
Tape and
1.60mm
(0.063) Max.
for Non-Paper
Base Compositions
NOTES:
1. The cavity defined by A0, B0, and T shall be configured to provide sufficient clearance
surrounding the component so that:
a) the component does not protrude beyond either surface of the carrier tape;
b) the component can be removed from the cavity in a vertical direction without
mechanical restriction after the top cover tape has been removed;
c) rotation of the component is limited to 20º maximum (see Sketches A & B);
d) lateral movement of the component is restricted to 0.5mm maximum
(see Sketch C).
2. Tape with or without components shall pass around radius “R” without damage.
3. Bar code labeling (if required) shall be on the side of the reel opposite the sprocket
holes. Refer to EIA-556.
4. If P1= 2.0mm, the tape may not properly index in all tape feeders.
0.50mm (0.020)
Maximum
0.50mm (0.020)
Maximum
Top View, Sketch "C"�
Component Lateral
1.50 +0.10
-0.0
(0.059 +0.004 )-0.0
8.00 +0.30
-0.10
(0.315 +0.012 )-0.004
8.00 +0.30
-0.10
(0.315 +0.012 )-0.004
Bar Code Labeling Standard
AVX bar code labeling is available and follows latest version of EIA-556
96
Bulk Case Packaging
CASE QUANTITIES
Part Size 0402 0603 0805 1206
Qty. 10,000 (T=.023") 5,000 (T=.023")
(pcs / cassette) 80,000 15,000 8,000 (T=.031") 4,000 (T=.032")
6,000 (T=.043") 3,000 (T=.044")
BENEFITS BULK FEEDER
• Easier handling
• Smaller packaging volume
(1/20 of T/R packaging)
• Easier inventory control
• Flexibility
• Recyclable
CASE DIMENSIONS
Shutter
Slider
Attachment Base
110mm
12mm
36mm
Case
Cassette
Gate
Shooter
Chips
Expanded Drawing Mounter
Head